## Slide 1 ![The slide displays a title page with the following content arranged vertically: **Smart Mobility ARChitecture** **Hardware Specification** Centered below the title is the **SMARC module** logo (a green abstract shape next to blue text). Below this logo is the text: **SMARC 2.1.1 Specification 2020-05-20** Further down is the **SGeT** logo (green and pink letters) next to the text: **STANDARDIZATION** **GROUP FOR** **EMBEDDED** **TECHNOLOGIES** The footer contains three pieces of text separated by space: **SMARC 2.1.1 Specification** (left), **© 2020 SGET e.V.** (center), and **Page 1 of 109** (right).](.smarc-hardware-specification-v2-1-1/slide-001.jpg) ## Slide 2 ![1 INTRODUCTION 1.1 Legal © Copyright 2020, SGET Standardization Group for Embedded Technology e.V. Note that some content of this SGET document may be legally protected by patent rights not held by SGET. SGET is not obligated to identify the parts of this specification that require licensing or other legitimization. The contents of this SGET document are advisory only. Users of SGET documents are responsible for protecting themselves against liability for infringement of patents. All content and information within this document are subject to change without prior notice. SGET provides no warranty with regard to this SGET document or any other information contained herein and hereby expressly disclaims any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. SGET assumes no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for discrepancies between the product and this SGET document. In no event shall SGET be liable for any incidental, consequential, special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this SGET document or any other information contained herein or the use thereof. 1.2 Revision History Rev Date Originator Notes 1.0 Dec. 20, 2012 S. Milnor Initial release 1.1 May 29, 2014 S. Milnor Change notes for V1.0 to V1.1 can be found in the V1.1 document 2.0 June 2, 2016 C. Eder See section 9.1 'Changes V1.1 to V2.0' on page 94 2.1 March 23, 2020 C. Eder See section 9.2 'Changes V2.0 to V2.1' on page 95 2.1.1 May 20, 2020 C. Eder Removed wrong AC coupling comment in Table 8: Secondary HDMI Signals in section 3.5.1 HDMI Table 1: Revision History SMARC 2.1.1 Specification © 2020 SGET e.V. Page 2 of 109](.smarc-hardware-specification-v2-1-1/slide-002.jpg) ## Slide 3 ![**1.3 Table of Contents** **1 Introduction** 2 1.1 Legal 2 1.2 Revision History 2 1.3 Table of Contents 3 1.4 List of Figures 5 1.5 List of Tables 6 1.6 General Introduction 7 1.7 Purpose of This Document 7 1.8 Document and Standards References 8 **2 Module Overview** 10 2.1 Form Factor Feature Summary 10 2.2 Module Interface Summary 11 **3 Module Interface Required and Optional Features** 14 3.1 Required and Optional Feature Table 14 3.2 Feature Fill Order 16 3.3 Signal Direction and Type Definitions 17 3.4 Primary Display Interfaces 18 3.4.1 LVDS 19 3.4.2 eDP 21 3.4.3 MIPI DSI Display 23 3.4.4 LVDS / eDP / MIPI DSI Pin Sharing 24 3.5 Secondary Display Interface 25 3.5.1 HDMI 25 3.5.2 DP++ 26 3.5.3 Secondary HDMI / DP++ Pin Sharing 27 3.6 Third Display Interface 28 3.6.1 DP++ 28 3.7 Camera Interfaces 29 3.7.1 MIPI CSI 29 3.7.2 3rd and 4th MIPI CSI on optional feature connector 31 3.8 SDIO Card (4 bit) Interface 34 3.9 SPI Interfaces 35 3.9.1 SPI0 35 3.9.2 SPI1 35 3.9.3 QSPI 36 3.9.4 eSPI 37 3.9.5 eSPI/SPI1/QSPI Pin Sharing 38 3.10 Audio 39 3.10.1 I2S0 39 3.10.2 I2S2 40 3.10.3 HDA 40 3.10.4 I2S/HDA Pin Sharing 41 3.11 I2C Interfaces 42 3.12 Asynchronous Serial Ports 43 3.13 CAN Bus 44 3.14 USB Interfaces 45 3.14.1 USB Signal Assignments 45 3.14.2 USB Signals 46 3.14.3 USB(0:5)_EN_OC# Discussion 48 3.15 PCI Express 49 3.15.1 PCI Express Link Width 51 3.16 SERDES 52 3.16.1 PCI Express SERDES Pin Sharing 53 3.17 SATA 54 3.18 Ethernet 55 3.19 Watchdog 57 3.20 GPIO 58 3.20.1 Alternative GPIO Pin Usage 59 3.20.2 GPIO Pin Sharing 59 3.21 Management Pins 60 3.22 Boot Select 62 3.23 Power and GND 64 3.24 JTAG 65 3.25 Module Terminations 66 3.25.1 General 66 **4 Module Pin-Out Map** 67 4.1 Module Pin-Out 67 **5 Mechanical Definitions** 73 5.1 Carrier Connector 73 5.2 Connector Pin Numbering Convention 74 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 3 of 109](.smarc-hardware-specification-v2-1-1/slide-003.jpg) ## Slide 4 ![5.3 Module Outline – 82x50mm Module _________________________ 75 5.4 Module Outline – 82x80mm Module _________________________ 76 5.4.1 RF Connector Placement _________________________ 77 5.5 Module 'Z' Height Considerations _________________________ 78 5.6 Carrier Board Connector PCB Footprint _________________________ 79 5.7 GND Connection Mounting Holes _________________________ 80 5.8 Carrier Board Standoffs _________________________ 80 5.9 Thermal Attachment Points _________________________ 80 5.10 Heat Spreader – 82mm x 50mm Module _________________________ 81 5.11 Heat Spreader – 82mm x 80mm Module _________________________ 84 6 Module Power _________________________ 85 6.1 Input Voltage / Main Power Rail _________________________ 85 6.2 No Separate Standby Voltage _________________________ 85 6.3 RTC Voltage Rail _________________________ 85 6.4 Power Rail Definition _________________________ 86 6.5 Power Sequencing _________________________ 87 6.5.1 Power up sequence scenario 1 _________________________ 87 6.5.2 Power up sequence scenario 2 _________________________ 88 6.5.3 Power up sequence scenario 3 _________________________ 89 6.5.4 Power up sequence scenario 4 _________________________ 90 7 MODULE AND CARRIER SERIAL EEPROMS _________________________ 91 8 Appendix A: LVDS LCD Color Mappings _________________________ 92 8.1 LVDS LCD Color Mappings _________________________ 92 8.1.1 Single Channel Color Mapping _________________________ 93 9 Appendix B: Document Changes _________________________ 94 9.1 Changes V1.1 to V2.0 _________________________ 94 9.2 Changes V2.0 to V2.1 _________________________ 95 9.3 Pinout Comparison _________________________ 96 9.4 Signal Name Index _________________________ 104 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 4 of 109](.smarc-hardware-specification-v2-1-1/slide-004.jpg) ## Slide 5 ![1.4 List of Figures Figure 1: MIPI CSI feature connector placement (82x50mm Module) _ 33 Figure 2: MIPI CSI feature connector placement (82x80mm Module) _ 33 Figure 3: JTAG Connector ____________________ 65 Figure 4: 82x50mm Module Outline ________________ 75 Figure 5: Module Edge Finger Keep Out Area (82x50mm Module)___ 76 Figure 6: 82x80mm Module Outline __________________ 76 Figure 7: Module Edge Finger Keep Out Area (82x80mm Module)___ 76 Figure 8: u.FL connector ________________________ 77 Figure 9: RF connector placement (82x80mm Module)__________ 77 Figure 10: RF connector placement (82x50mm Module)____________ 77 Figure 11: Module Minimum 'Z' Height _________________________ 78 Figure 12: Carrier Board Connector PCB Footprint _________________ 79 Figure 13: Heat Spreader Isometric View __________________________ 81 Figure 14: Heat Spreader Plan View ________________________________ 82 Figure 15: Heat Sink Attachment Option ____________________________ 83 Figure 16: Heat Spreader - 82mm x 80mm Module ____________________ 84 Figure 17: Power sequence diagram sleep and power button __________ 87 Figure 18: Power sequence diagram sleep, no power button ___________ 88 Figure 19: Power sequence diagram power button ____________________ 89 Figure 20: Power sequence diagram, no power button _________________ 90 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 5 of 109](.smarc-hardware-specification-v2-1-1/slide-005.jpg) ## Slide 6 ![**Description:** This slide presents a 'List of Tables' from the 'SMARC 2.1.1 Specification.' It enumerates 51 tables, detailing their titles and corresponding page numbers, organized into two columns. The footer indicates the document is copyrighted by SGET e.V. in 2020 and is page 6 of 109. **Verbatim Text:** **1.5 List of Tables** Table 1: Revision History 2 Table 2: Required and Optional Features 16 Table 3: Signal Direction and Type Definitions 17 Table 4: LVDS Signals 20 Table 5: eDP Signals 22 Table 6: MIPI-DSI Signals 23 Table 7: LVDS / eDP / MIPI DSI Pin Sharing 24 Table 8: Secondary HDMI Signals 25 Table 9: DP++ Signals 26 Table 10: Secondary HDMI / DP++ Pin Sharing 27 Table 11: Third Display Interface DP++ Signals 28 Table 12: MIPI-CSI Signals 30 Table 13: MIPI-CSI Feature Connector Signals for 3rd Camera 31 Table 14: MIPI-CSI Feature Connector Signals for 4th Camera 32 Table 15: SDIO Signals 34 Table 16: SPI0 Signals 35 Table 17: SPI1 Signals 35 Table 18: QSPI Signals 36 Table 19: eSPI Signals 38 Table 20: eSPI/SPI1 Pin Sharing 38 Table 21: I2S0 Signals 39 Table 22: I2S2 Signals 40 Table 23: HDA Signals 40 Table 24: I2S/HDA Pin Sharing 41 Table 25: I2C Signals 42 Table 26: General Purpose I2C Signals 42 Table 27: Serial Port Signals 43 Table 28: CAN Bus Signals 44 Table 29: USB Signal Assignments 45 Table 30: USB Signals 47 Table 31: PCI Express Signals 50 Table 32: PCIe Link Configurations 51 Table 33: PCIe Clock and Reset Assignments 51 Table 34: SERDES Signals 52 Table 35: PCIe Lane C&D / SERDES Pin Sharing 53 Table 36: SATA Signals 54 Table 37: Ethernet Signals GBE0 and GBE1 56 Table 38: Watchdog Signals 57 Table 39: GPIO Signals 58 Table 40: Alternative Use of GPIO Signals 59 Table 41: GPIO Pin Sharing 59 Table 42: Management Signals 61 Table 43: Boot Select Signals 62 Table 44: Control of Boot Sources 63 Table 45: Power Signals 64 Table 46: JTAG Signals 65 Table 47: Module Pin-Out 72 Table 48: Carrier Connectors 73 Table 49: Heat Spreader Hole Reference 82 Table 50: Power Rail Definitions 86 Table 51: LVDS Color Mapping 93 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 6 of 109](.smarc-hardware-specification-v2-1-1/slide-006.jpg) ## Slide 7 ![**1.6 General Introduction** The SMARC (“Smart Mobility ARCHitecture”) is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs *may* be used as well. The Module power envelope is typically under 6W although designs up to about 15W are possible. Two Module sizes are defined: 82mm x 50mm and 82mm x 80mm. The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key). The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, Gigabit Ethernet and dual channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. **1.7 Purpose of This Document** This document defines the Module mechanical, electrical, signal and thermal parameters at a level of detail sufficient to provide a framework for SMARC Module and Carrier Board designs. **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 7 of 109](.smarc-hardware-specification-v2-1-1/slide-007.jpg) ## Slide 8 ![**1.8 Document and Standards References** * **CAN** (“Controller Area Network”) Bus Standards * ISO 11898-1:2015 Road vehicles - Controller area network (CAN) - Part 1: Data link layer and physical signaling, (https://www.iso.org) * ISO 11992-1:2019 Road vehicles - Interchange of digital information on electrical connections between towing and towed vehicles - Part 1: Physical and data-link layers (https://www.iso.org) * SAE J2411: Feb 14, 2000, Single Wire CAN Network for Vehicle Applications (https://www.sae.org) * **MIPI CSI-2** (Camera Serial Interface version 2) The MIPI CSI-2 standard is owned and maintained by the MIPI Alliance (“Mobile Industry Processor Alliance”) (www.mipi.org) * **MIPI CSI-3** (Camera Serial Interface version 3) The MIPI CSI-3 standard is owned and maintained by the MIPI Alliance (“Mobile Industry Processor Alliance”) (www.mipi.org) * **COM Express** – the formal title for the COM Express specification is “PICMG® COM.0 COM Express Module Base Specification”, Revision 3.0, March 31, 2017. This standard is owned and maintained by the PICMG (“PCI Industrial Computer Manufacturer’s Group”) (www.picmg.org) * **DisplayPort and Embedded DisplayPort** These standards are owned and maintained by VESA (“Video Electronics Standards Association”) (www.vesa.org) * **MIPI DSI** (Display Serial Interface) The DSI standard is owned and maintained by the MIPI Alliance (“Mobile Industry Processor Alliance”) (www.mipi.org) * **eMMC** (“Embedded Multi-Media Card”) The eMMC electrical standard is defined by JEDEC JESD84-B51A and the mechanical standard by JESD84-C44 (www.jedec.org) * **eSPI** (“Enhanced Serial Peripheral Interface”) The eSPI Interface Base Specification is defined by Intel (https://www.intel.com) * **Fieldbus** - this term refers to a number of network protocols used for real – time industrial control. Refer to the following web sites: https://www.profibus.com/download/ and www.can-cia.org * **GBE MDI** (“Gigabit Ethernet Medium Dependent Interface”) This is defined by IEEE 802.3. The 1000Base-T operation over copper twisted pair cabling is defined by IEEE 802.3ab (www.ieee.org) * **HDA** (HD Audio), High Definition Audio Specification, Intel, Revision 1.0a, June 17, 2010 (http://www.intel.com) * **HDMI Specification**, Version 2.1, November 28, 2017 (www.hdmi.org) * **I2C Specification**, Version 6.0, April 4th 2014, Philips Semiconductor (now NXP) (www.nxp.com) * **I2S Bus Specification**, Feb. 1986 and Revised June 5, 1996, Philips Semiconductor (now NXP) (www.nxp.com) * **IEEE1588 - 2008**. IEEE Standard for a Precision Clock Synchronization Protocol for Networked Measurement and Control Systems (http://standards.ieee.org) * **JTAG** (“Joint Test Action Group”) This is defined by IEEE 1149.1-2001 - IEEE Standard Test Access Port and Boundary Scan Architecture (https://ieeexplore.ieee.org) * **MXM3** Graphics Module Mobile PCI Express Module Electromechanical Specification, Version 3.1, NVidia Corporation * **PICMG® EEEP** Embedded EEPROM Specification, Rev. 1.0, August 2010 (www.picmg.org) * **PCI Express Specifications** (www.pci-sig.org) * **Serial ATA** Revision 3.1, July 18, 2011, Gold Revision, © Serial ATA International Organization (www.sata-io.org) SMARC 2.1.1 Specification © 2020 SGET e.V. Page 8 of 109](.smarc-hardware-specification-v2-1-1/slide-008.jpg) ## Slide 9 ![The slide lists four technical specifications and references: * **SD Specifications** Part 1 Physical Layer Simplified Specification, Version 6.00, Aug 29, 2018, SD Group and SD Card Association (“Secure Digital”) (www.sdcard.org) * **SM Bus** – “System Management Bus” Specification Version 3.1, March 19, 2018, System Management Interface Forum, Inc. (http://www.smbus.org ) * **SPI Bus** – “Serial Peripheral Interface” – de-facto serial interface standard defined by Motorola. A good description may be found on Wikipedia (http://en.wikipedia.org/wiki/Serial_Peripheral_Interface_Bus ) * **USB Specifications** (www.usb.org) The footer reads: SMARC 2.1.1 Specification © 2020 SGET e.V. Page 9 of 109](.smarc-hardware-specification-v2-1-1/slide-009.jpg) ## Slide 10 ![**2 MODULE OVERVIEW** **2.1 Form Factor Feature Summary** * Small form factor, low profile and low power edge-finger card format Module with pin-out optimized for ARM and x86 architecture processors; may also be used with low power, tablet oriented X86 and RISC devices. * Two Module sizes: * 82mm x 50mm * 82mm x 80mm * Carrier Board connector: 314 pin 0.5mm pitch R/A memory socket style connector * Originally defined for use with MXM3 graphics cards * SMARC Module pin-out is separate from and not related to MXM3 pin-out * Multiple sources for Carrier Board connector * Low cost * Low profile: * As low as 1.5mm (Carrier Board top to Module bottom) * Other stack height options available, including 2.7mm, 5mm, 8mm * Overall assembly height (Carrier Board top to tallest Module component) is less than 6mm * Excellent signal integrity – suitable for 2.5 GHz / 5 GHz / 8 GHz data rate signals such as PCIe Gen 1, Gen 2 and Gen 3. * Robust, vibration resistant connector * Module input voltage range: 3.0V to 5.25V * Allows operation from 3.6V nominal Lithium-ion battery packs * Allows operation from 3.3V fixed DC supply * Allows operation from 5.0V fixed DC supply * Single supply (no separate standby voltage) * Module power pins allow 5A max * Low power designs * Fanless * Passive cooling * Low standby power * Design for battery operation * 1.8V default I/O voltage **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 10 of 109](.smarc-hardware-specification-v2-1-1/slide-010.jpg) ## Slide 11 ![**2.2 Module Interface Summary** The interfaces listed below are available per the Module pin definition. Some features are optional and availability is Module design dependent. * **Display Interfaces** * Single or dual channel LVDS LCD 18 or 24 bit * Panel support signals (I2C, Power Enables, PWM) * Support for dual channel implementations * Multiplexing with eDP and MIPI DSI * HDMI port multiplexed with DP++ full featured implementation * Additional full featured DisplayPort++ * **Camera Interfaces** * Serial configuration: MIPI CSI (2 lane) + MIPI CSI (2 or 4 lane) * Two additional MIPI CSI interfaces available on optional connectors * **SDIO Interface** * 4 bit SD card / SDIO interface with support lines * **SPI Interfaces** * Two SPI interfaces * One maybe implemented as eSPI (x86) or QSPI (ARM) * **Audio Interfaces** * One I2S interface * One HDA interfaced multiplexed with second I2S interface * **I2C Interfaces** * Five I2C interfaces * Power Management * General Purpose * 2x Camera Interfaces * LCD Display ID * HDMI interface also has private I2C interface for HDMI use * **Asynchronous Serial Port Interfaces** * Four asynchronous serial ports * Two supporting 2 wire handshake (RXD, TXD, RTS#, CTS#) * Two supporting data only (RXD, TXD) * Logic level interface SMARC 2.1.1 Specification © 2020 SGET e.V. Page 11 of 109](.smarc-hardware-specification-v2-1-1/slide-011.jpg) ## Slide 12 ![**CAN Bus Interfaces** * Two CAN bus interfaces * Logic level signals from Module based CAN bus protocol controllers * RXD, TXD only **USB Interfaces** * Six ports total * Two sets of super speed signals for support of two USB 3.2 ports * Two ports supporting USB OTG (USB client or host) * USB support signals (VBUS enable / Over-current detects, OTG support signals) **PCI Express** * Four PCIe lanes * PCIe Gen1, Gen 2 or Gen 3 (Module dependent) * Three reference clock pairs * Three PCIe reset signals * Common PCIe wake signal (PCIE_WAKE#) * Two PCIE_CKREQ# signals for PCIE_A and PCIE_B **SERDES** * Alternative use of PCIE_C and PCIE_D as SERDES interface * One MDIO interface **SATA Interface** * One SATA interface * Gen 1, 2 or 3 (Module dependent) **Gigabit Ethernet** * Two analog GBE MDI interface * No magnetics on Module * LED support signals * CTREF (center tap reference voltage) for Carrier magnetics (if required by the Module GBE PHY) * Individual IEEE1588 trigger signal for each Ethernet interface to allow for enhanced real time applications. This utilizes a software definable pin (SDP) from the Ethernet controller. **Wireless** * Optional on module wireless functionality with designated area for antenna connections **Watchdog Timer Interface** **General Purpose I/O** * 14x GPIO signals **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 12 of 109](.smarc-hardware-specification-v2-1-1/slide-012.jpg) ## Slide 13 ![Here is the content of the slide, transcribed verbatim: * Specific alternate functions are assigned to some GPIOs * PWM / Tachometer capability * Camera support * HD Audio reset * System and Power Management Signals * Reset out and Reset in * Power button in * Power source status * Module power state status * System management pins * Battery and battery charger management pins * Carrier Power On control * Boot Source Select * Three pins to allow selection from Carrier Board * Select options to include boot from one of the following: * Module SPI * Module eMMC Flash * Module NAND / NOR Flash (vendor defined) * Module Remote Boot (Network or Serial Port, vendor defined) * Carrier SPI * Carrier SD Card * Carrier SATA * JTAG functions for CPU debug and test are optionally implemented on separate small form factor connector SMARC 2.1.1 Specification © 2020 SGET e.V. Page 13 of 109](.smarc-hardware-specification-v2-1-1/slide-013.jpg) ## Slide 14 ![**3 MODULE INTERFACE REQUIRED AND OPTIONAL FEATURES** **3.1 Required and Optional Feature Table** Required and optional features for an SMARC Module are summarized in the table below. * **“Shall”** indicates a mandatory requirement * **“Should”** indicates a recommended but not mandatory requirement * **“May”** indicates a lesser used optional interface * **“Alternate”** indicates an optional interface, implemented on pins shared with another use **Table:** Feature Sub Feature Requirement Notes :--- :--- :--- :--- LVDS LCD 18 bit single channel **Should** Default Display (serial LVDS) 24 bit single channel – 18 bit compatible **Should** 24 bit single channel – standard color map **May** 24 bit dual channel – 18 bit compatible **May** 24 bit dual channel – standard color map **May** HDMI HDMI display interface **Should** DP on HDMI Pins **May** DP++ DisplayPort++ **May** Camera CSI0 – 2 lane **May** CSI1 – 2 lane implementation **Should** CSI1 – 4 lane implementation **Should** SDIO SDIO (4 bit, for SD cards) **Should** **May** be Carrier boot device SPI SPI0 **Should** **May** be Carrier boot device eSPI **Should** **May** be Carrier boot device Audio I2S0 **Should** HDA **Should** I2C Power Management **Shall** General Purpose **Shall** Camera **Should** LCD Display I/D **Should** Serial Ports SER0 (4 wire) **Shall** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 14 of 109](.smarc-hardware-specification-v2-1-1/slide-014.jpg) ## Slide 15 ![**Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 15 of 109 **Table Content:** :--- :--- :--- :--- SER1 (2 wire) Shall SER2 (4 wire) Should SER3 (2 wire) Should CAN Bus CAN0 May CAN1 May USB USB0 - as USB 2.0 Client Should USB0 shall be implemented USB0 – as OTG May USB0 - as USB 2.0 Host May USB1 – as USB 2.0 Host Shall USB(2:5) - as USB 2.0 Host May USBss(2:3) May Fill order: first #2 then #3 USB3 - as USB 3.2 Client / OTG May PCIe PCIE_A (x1 Gen 1 Root) Should PCIE_B (x1 Gen 1 Root) May PCIE_C (x1 Gen 1 Root) May PCIE_D (x1 Gen 1 Root) May PCIE_ Target operation May PCIE Gen 2 and Gen 3 operation May SERDES Alternative use of PCIE_C and/or PCIE_D May SATA SATA Gen 1 Should May be Carrier boot device SATA Gen 2 operation May SATA Gen 3 operation May GBE GBE0 Should GBE1 May IEEE 1588 Trigger Signals (GBE(0:1)_SDP) May Watchdog WDT Out Should GPIO GPIO(0:11) Shall GPIO(12:13) Should GPIO(0:11) interrupt capability Shall GPIO(12:13) interrupt capability Should GPIO Camera Support (only when camera is supported) Shall As appropriate for Module Camera implementation GPIO5 PWM capability Should ](.smarc-hardware-specification-v2-1-1/slide-015.jpg) ## Slide 16 ![**Table 2: Required and Optional Features** * **GPIO6 Tachin capability:** Should * **Management:** * System and power management features (Shall) -) See section 3.21'Management Pins' for details * CARRIER_PWR_ON (Shall) * VIN_PWR_BAD# (Shall) * All other signals (Should) * **Boot Select:** Shall * **Force Recov:** Should -) See section 3.22 'Boot Select' for details * **JTAG:** JTAG connector on Module (May) -) Some vendors prefer test point access * **RTC:** Should **3.2 Feature Fill Order** Features shall be filled in a low – to – high order, based on the signal group names. For example, there are six possible USB ports, designated with signal prefixes USB0 to USB5. If a Module design implements only two USB, those would be USB0 and USB1. The PCIe links are designated PCIE_A, PCIE_B, PCIE_C and PCIE_D. If only one is implemented, it would be PCIE_A. USB 3.2 port number 2 is the first in the fill order as the counting of USB 3.2 lines starts with number 2. USB Super Speed operation is only defined for SMARC USB ports USB2 and USB3. Therefore, USB2 is the first in the fill order for USB Super Speed (aka USB 3.2) implementations on SMARC. **Important exception, introduced with SMARC 2.1:** The fill order for MIPI CSI is CSI1 (4 lane) first, then CSI0 (2 lane). **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 16 of 109](.smarc-hardware-specification-v2-1-1/slide-016.jpg) ## Slide 17 ![**3.3 Signal Direction and Type Definitions** **Term** **Description** --- --- I Input to the Module O Output from the Module I/O Bi-directional input/output OD Open drain PU PU (pull-up) resistor PD PD (pull-down) resistor CMOS Logic input or output GBE MDI Differential analog signaling for gigabit media dependent interface DP Low voltage differential signal for DisplayPort interface D-PHY Low voltage differential signal for MIPI CSI-2 cameras and DSI displays M-PHY Low voltage differential signal for MIPI CSI-3 cameras LVDS Low voltage differential signal for LCD displays PCIE Low voltage differential signal for PCIe SATA Low voltage differential signal for SATA TMDS HDMI Transition minimized differential signal for HDMI displays USB DC coupled differential signaling for traditional (non-Superspeed) USB signals USB SS Differential signal for SuperSpeed USB signals USB VBUS 5V 5V tolerant input for USB VBUS detection VDD_IN Main power source from Carrier to Module 3.3V 3.3V power domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high) 1.8V 1.8V power domain: Active while CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high) 3.3Vsb 3.3V standby power domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#) 1.8Vsb 1.8V standby power domain: Active while CARRIER_PWRON is high (regardless of CARRIER_SBY#) Sleep Module is in its lowest power state Runtime Module is full on. CARRIER_PWRON is high and CARRIER_SBY# is NOT active (i.e. both signals are high) Standby Module is in Standby State or higher Table 3: Signal Direction and Type Definitions SMARC 2.1.1 Specification © 2020 SGET e.V. Page 17 of 109](.smarc-hardware-specification-v2-1-1/slide-017.jpg) ## Slide 18 ![**3.4 Primary Display Interfaces** Pins used for LVDS LCD support *may* alternatively be used to support up to two Embedded DisplayPorts. The AC coupling required for eDP operation *shall* be done off-Module. Pins used for LVDS LCD support *may* alternatively be used to support a MIPI DSI (Display Serial Interface). There is no AC coupling required for DSI operation. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 18 of 109](.smarc-hardware-specification-v2-1-1/slide-018.jpg) ## Slide 19 ![**3.4.1 LVDS** Single channel, dual channel or two single channel LVDS display panel interfaces are defined. The implementation of two single channel LVDS display interfaces is not expected to be common but is defined as an option for Module vendors. The LVDS interfaces support 18 and 24 bit display implementations. In a Module implementation with two single LVDS channels, the panel EDID proms would be in conflict and measures need to be taken to avoid this. One possible solution is that the 2nd LVDS EDID prom could be read over the I2C_GP pin pair rather than the I2C_LCD pin pair. The Module *should* implement an 18 / 24 bit LVDS output stream for the Primary display. All 18 bit TFT panels use the same LVDS color mapping. Only 3 data pairs (LVDS(0:1)_ (0:2) +/-) and the clock pair are needed to drive an 18 bit TFT panel. Unfortunately, there are two 24 bit LVDS color mappings in the industry: * Most significant color bits on the 4th LVDS data pair (LVDS(0:1)_ (3) +/- here). This is the more common 24 bit mapping. It is not compatible with the 18 bit LVDS color mapping. * Least significant color bits on the 4th LVDS data pair. This is compatible with the 18 LVDS color mapping. Modules that implement LVDS *shall* implement single channel 18 bit LVDS; *should* implement a 24 bit “18 bit compatible” LVDS mapping and *may* implement the “MS bit on 4th LVDS pair” mapping. The second LVDS channel *may* be implemented. Details on LVDS color mappings are provided in Section 8 Appendix A: LVDS LCD Color Mappings. **Table Data:** * **Headers:** Signal Name, Pin #, Description, I/O Type, I/O Level, Power Domain, PU / PD, Comments * **Row 1:** LVDS0_0+, LVDS0_0-, LVDS0_1+, LVDS0_1-, LVDS0_2+, LVDS0_2-, LVDS0_3+, LVDS0_3- S125, S126, S128, S129, S131, S132, S137, S138 Primary LVDS Channel Differential Pair Data Lines O LVDS Runtime 100 ohm differential termination across the differential pairs at the endpoint of the signal path, usually on the display assembly. * **Row 2:** LVDS0_CK+, LVDS0_CK- S134, S135 Primary LVDS Channel Differential Pair Clock Lines O LVDS Runtime 100 ohm differential termination across the differential pair at the endpoint of the signal path, usually on the display assembly. * **Row 3:** LCD0_VDD_EN S133 Primary LVDS Channel Power Enable O CMOS 1.8V Runtime Active high **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 19 of 109](.smarc-hardware-specification-v2-1-1/slide-019.jpg) ## Slide 20 ![**Table 4: LVDS Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- LCD0_BKLT_EN S127 Primary LVDS Channel Backlight Enable O CMOS 1.8V Runtime Active high LCD0_BKLT_PWM S141 Primary LVDS Channel Brightness Control O CMOS 1.8V Runtime Through Pulse Width Modulation (PWM) LVDS1_0+ LVDS1_0- LVDS1_1+ LVDS1_1- LVDS1_2+ LVDS1_2- LVDS1_3+ LVDS1_3- S111 S112 S114 S115 S117 S118 S120 S121 Secondary LVDS Channel Differential Pair Data Lines O LVDS Runtime 100 ohm differential termination across the differential pairs at the endpoint of the signal path, usually on the display assembly. LVDS1_CK+ LVDS1_CK- S108 S109 Secondary LVDS Channel Differential Pair Clock Lines O LVDS Runtime 100 ohm differential termination across the differential pair at the endpoint of the signal path, usually on the display assembly. LCD1_VDD_EN S116 Secondary LVDS Channel Power Enable O CMOS 1.8V Runtime Active high Only in use, when two separate LVDS ports are supported, please check Module user manual LCD1_BKLT_EN S107 Secondary LVDS Channel Backlight Enable O CMOS 1.8V Runtime Active high Only in use, when two separate LVDS ports are supported, please check Module user manual LCD1_BKLT_PWM S122 Secondary LVDS Channel Brightness Control O CMOS 1.8V Runtime Through pulse width modulation (PWM) only in use, when two separate LVDS ports are supported, please check Module user manual I2C_LCD_DAT S140 DDC Data Line Used for Flat Panel Detection and Control I/O OD CMOS 1.8V Runtime PU 2k2 Possible conflict if two LVDS panels are used I2C_LCD_CK S139 DDC Clock Line Used for Flat Panel Detection and Control I/O OD CMOS 1.8V Runtime PU 2k2 Possible conflict if two LVDS panels are used **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 20 of 109](.smarc-hardware-specification-v2-1-1/slide-020.jpg) ## Slide 21 ![**3.4.2 eDP** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- eDP0_TX0+(br)eDP0_TX0-(br)eDP0_TX1+(br)eDP0_TX1-(br)eDP0_TX2+(br)eDP0_TX2-(br)eDP0_TX3+(br)eDP0_TX3- S125(br)S126(br)S128(br)S129(br)S131(br)S132(br)S137(br)S138 Primary 4-Lane eDP Differential Pair Data Lines O DP Runtime AC coupled off Module(br)100 nF DC blocking capacitors(br)**shall** be placed on the Carrier. eDP0_AUX+(br)eDP0_AUX- S134(br)S135 Primary Bidirectional Channel used for Link Management and Device Control I/O DP Runtime AC coupled off Module LCD0_VDD_EN S133 Primary Panel Power Enable O CMOS 1.8V Runtime Active high LCD0_BKLT_EN S127 Primary Panel Backlight Enable O CMOS 1.8V Runtime Active high LCD0_BKLT_PWM S141 Primary Panel Brightness Control O CMOS 1.8V Runtime Through pulse width modulation (PWM) eDP0_HPD S144 Detection of Hot Plug / Unplug of Primary eDP Display and Notification of the Link Layer I CMOS 1.8V Runtime PD 1M Module must tolerate high level in stand-by mode eDP1_TX0+(br)eDP1_TX0-(br)eDP1_TX1+(br)eDP1_TX1-(br)eDP1_TX2+(br)eDP1_TX2-(br)eDP1_TX3+(br)eDP1_TX3- S111(br)S112(br)S114(br)S115(br)S117(br)S118(br)S120(br)S121 Secondary 4-Lane eDP Differential Pair Data Lines O DP Runtime AC coupled off Module(br)100 nF DC blocking capacitors(br)**shall** be placed on the Carrier.(br)Only in use, when two separate eDP ports are supported, please check Module user manual. eDP1_AUX+(br)eDP1_AUX- S108(br)S109 Secondary Bidirectional Channel used for Link Management and Device Control I/O DP Runtime AC coupled off Module -only in use, when two separate eDP ports are supported, please check Module user manual. LCD1_VDD_EN S116 Secondary Panel Power Enable O CMOS 1.8V Runtime Active high(br)Only in use, when two separated eDP ports are supported. Please check Module user manual. LCD1_BKLT_EN S107 Secondary Panel Backlight Enable O CMOS 1.8V Runtime Active high(br)Only in use, when two separated eDP ports are supported. Please check Module user manual. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 21 of 109](.smarc-hardware-specification-v2-1-1/slide-021.jpg) ## Slide 22 ![Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments --- --- --- --- --- --- --- --- LCD1_BKLT_PWM S122 Secondary Panel Brightness Control O CMOS 1.8V Runtime Through Pulse Width Modulation (PWM) Only in use, when two separated eDP ports are supported. Please check Module user manual. eDP1_HPD S113 Detection of Hot Plug / Unplug of Secondary eDP Display and Notification of the Link Layer I CMOS 1.8V Runtime PD 1M Only in use, when two separated eDP ports are supported. Please check Module user guide! Module must tolerate high level in stand-by mode I2C_LCD_DAT S140 I2C Data to Read LCD Display EDID EEPROMs I/O OD CMOS 1.8V Runtime PU 2k2 Possible EDID EEPROM Address conflicts may occur if multiple displays are implemented. Optional - eDP panel information is usually exchanged via the eDP auxiliary pair I2C_LCD_CK S139 I2C clock to read LCD display EDID EEPROMs I/O OD CMOS 1.8V Runtime PU 2k2 Optional - eDP panel information is usually exchanged via the eDP auxiliary pair Table 5: eDP Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 22 of 109](.smarc-hardware-specification-v2-1-1/slide-022.jpg) ## Slide 23 ![**3.4.3 MIPI DSI Display** **Table 6: MIPI-DSI Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- **DSI0 Data Lines** (DSI0_D0+, DSI0_D0-, DSI0_D1+, DSI0_D1-, DSI0_D2+, DSI0_D2-, DSI0_D3+, DSI0_D3-) S125, S126, S128, S129, S131, S132, S137, S138 Primary DSI Panel Differential Pair Data Lines O D-PHY Runtime No blocking capacitors or termination required. Layout for 90 ohm differential impedance. **DSI0 Clock Lines** (DSI0_CLK+, DSI0_CLK-) S134, S135 Primary DSI Panel Differential Pair Clock Lines O D-PHY Runtime LCD0_VDD_EN S133 Primary Panel Power Enable O CMOS 1.8V Runtime Active high LCD0_BKLT_EN S127 Primary Panel Backlight Enable O CMOS 1.8V Runtime Active high LCD0_BKLT_PWM S141 Primary Panel Brightness Control O CMOS 1.8V Runtime Through pulse width modulation (PWM) DSI0_TE S144 Primary DSI Panel Tearing Effect Signal I CMOS 1.8V Runtime 1M PD **DSI1 Data Lines** (DSI1_D0+, DSI1_D0-, DSI1_D1+, DSI1_D1-, DSI1_D2+, DSI1_D2-, DSI1_D3+, DSI1_D3-) S111, S112, S114, S115, S117, S118, S120, S121 Secondary DSI Panel Differential Pair Data Lines O D-PHY Runtime No blocking capacitors or termination required. Layout for 90 ohm differential impedance. **DSI1 Clock Lines** (DSI1_CLK+, DSI1_CLK-) S108, S109 Secondary DSI Panel Differential Pair Clock Lines O D-PHY Runtime LCD1_VDD_EN S116 Secondary Panel Power Enable O CMOS 1.8V Runtime Active high LCD1_BKLT_EN S107 Secondary Panel Backlight Enable O CMOS 1.8V Runtime Active high LCD1_BKLT_PWM S122 Secondary Panel Brightness Control O CMOS 1.8V Runtime Through pulse width modulation (PWM) DSI1_TE S113 Secondary DSI Panel Tearing Effect Signal I CMOS 1.8V Runtime 1M PD I2C_LCD_DAT S140 DDC Data Line Used for Flat Panel Detection and Control I/O OD CMOS 1.8V Runtime PU 2k2 Possible conflict if two LVDS panels are used I2C_LCD_CK S139 DDC Clock Line Used for Flat Panel Detection and Control I/O OD CMOS 1.8V Runtime PU 2k2 Possible conflict if two LVDS panels are used SMARC 2.1.1 Specification © 2020 SGET e.V. Page 23 of 109](.smarc-hardware-specification-v2-1-1/slide-023.jpg) ## Slide 24 ![**3.4.4 LVDS / eDP / MIPI DSI Pin Sharing** Pin # LVDS Signal Name MIPI DSI Signal Name eDP Signal Name :--- :--- :--- :--- S125 LVDS0_0+ DSIO_D0+ eDP0_TX0+ S126 LVDS0_0- DSIO_D0- eDP0_TX0- S128 LVDS0_1+ DSIO_D1+ eDP0_TX1+ S129 LVDS0_1- DSIO_D1- eDP0_TX1- S131 LVDS0_2+ DSIO_D2+ eDP0_TX2+ S132 LVDS0_2- DSIO_D2- eDP0_TX2- S137 LVDS0_3+ DSIO_D3+ eDP0_TX3+ S138 LVDS0_3- DSIO_D3- eDP0_TX3- S134 LVDS0_CK+ DSIO_CLK+ eDP0_AUX+ S135 LVDS0_CK- DSIO_CLK- eDP0_AUX- S133 LCD0_VDD_EN LCD0_VDD_EN LCD0_VDD_EN S127 LCD0_BKLT_EN LCD0_BKLT_EN LCD0_BKLT_EN S141 LCD0_BKLT_PWM LCD0_BKLT_PWM LCD0_BKLT_PWM S144 - DSIO_TE eDP0_HPD S111 LVDS1_0+ DS1_D0+ eDP1_TX0+ S112 LVDS1_0- DS1_D0- eDP1_TX0- S114 LVDS1_1+ DS1_D1+ eDP1_TX1+ S115 LVDS1_1- DS1_D1- eDP1_TX1- S117 LVDS1_2+ DS1_D2+ eDP1_TX2+ S118 LVDS1_2- DS1_D2- eDP1_TX2- S120 LVDS1_3+ DS1_D3+ eDP1_TX3+ S121 LVDS1_3- DS1_D3- eDP1_TX3- S108 LVDS1_CK+ DS1_CLK+ eDP1_AUX+ S109 LVDS1_CK- DS1_CLK- eDP1_AUX- S116 LCD1_VDD_EN LCD1_VDD_EN LCD1_VDD_EN S107 LCD1_BKLT_EN LCD1_BKLT_EN LCD1_BKLT_EN S122 LCD1_BKLT_PWM LCD1_BKLT_PWM LCD1_BKLT_PWM S113 - DS1_TE eDP1_HPD S140 I2C_LCD_DAT I2C_LCD_DAT I2C_LCD_DAT S139 I2C_LCD_CK I2C_LCD_CK I2C_LCD_CK Table 7: LVDS / eDP / MIPI DSI Pin Sharing SMARC 2.1.1 Specification © 2020 SGET e.V. Page 24 of 109](.smarc-hardware-specification-v2-1-1/slide-024.jpg) ## Slide 25 ![**3.5 Secondary Display Interface** The SMARC HDMI pins *may* alternatively be used for DisplayPort++ (DP++) operation. This is Module vendor dependent. **3.5.1 HDMI** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- HDMI\_D2+(br)HDMI\_D2-(br)HDMI\_D1+(br)HDMI\_D1-(br)HDMI\_D0+(br)HDMI\_D0- P92(br)P93(br)P95(br)P96(br)P98(br)P99 HDMI Port, Differential Pair Data Lines O TMDS HDMI Runtime HDMI\_CLK+(br)HDMI\_CLK- P101(br)P102 HDMI Port, Differential Pair Clock Lines O TMDS HDMI Runtime HDMI\_CTRL\_CK P105 I2C\_CLK Line Dedicated to HDMI I/O OD CMOS 1.8V Runtime PU 100K Level shifter FET and 5V PU resistor *shall* be placed between the Module and the HDMI connector. Stronger pull-up is demanded to the carrier board. The pull-ups may be part of an integrated HDMI ESD protection and control-line level shift device, such as the Texas Instruments TPD12S016. If discrete Carrier pull-ups are used, the value depends on the individual carrier board implementation. HDMI\_CTRL\_DAT P106 I2C\_DAT Line Dedicated to HDMI I/O OD CMOS 1.8V Runtime PU 100K Level shifter FET and 5V PU resistor *shall* be placed between the Module and the HDMI connector. Stronger pull-up is demanded to the carrier board. The pull-ups may be part of an integrated HDMI ESD protection and control-line level shift device, such as the Texas Instruments TPD12S016. If discrete Carrier pull-ups are used, the value depends on the individual carrier board implementation. HDMI\_HPD P104 HDMI Hot Plug Active High Detection Signal that Serves as an Interrupt Request I CMOS 1.8V Runtime PD 1M Important: Module *shall* tolerate high level in stand-by mode Table 8: Secondary HDMI Signals HDMI displays uses 5V I2C signaling. The Module HDMI\_CTRL\_DAT and HDMI\_CTRL\_CK signals need to be level translated on the Carrier from the Module 1.8V level. A similar consideration applies to the HDMI\_HPD signal. There are a number of single chip devices on the market that perform ESD protection and control signal level shifting for HDMI interfaces. The Texas Instruments TPD12S016 is one such device. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 25 of 109](.smarc-hardware-specification-v2-1-1/slide-025.jpg) ## Slide 26 ![**3.5.2 DP++** **Table 9: DP++ Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- DP1_LANE0+ P92 Secondary DP Port Differential Pair Data Lines O DP Runtime AC coupled off Module 100 nF DC blocking capacitors shall be placed on the Carrier DP1_LANE0- P93 DP1_LANE1+ P95 DP1_LANE1- P96 DP1_LANE2+ P98 DP1_LANE2- P99 DP1_LANE3+ P101 DP1_LANE3- P102 DP1_AUX+ P105 Secondary DP Port Bidirectional Channel used for Link Management and Device Control I/O DP 3.3V Runtime PD 100k AC coupled on Module If DP1_AUX_SEL=0 (DP mode): AC coupled on module, 100k PD. If DP1_AUX_SEL=1 (HDMI mode): DC coupled, CMOS, 100k PU. In case of HDMI over DP++ implementation, stronger pull-up is demanded to the Carrier Board. DP1_AUX- P106 Secondary DP Port Bidirectional Channel used for Link Management and Device Control I/O DP 3.3V Runtime PU 100k AC coupled on Module If DP1_AUX_SEL=0 (DP mode): AC coupled on module, 100k PU. If DP1_AUX_SEL=1 (HDMI mode): DC coupled, CMOS, 100k PU. In case of HDMI over DP++ implementation, stronger pull-up is demanded to the Carrier Board. DP1_HPD P104 DP Hot Plug Detect Input I CMOS 1.8V Runtime PD 1M Module must tolerate high level in stand-by mode. The Carrier shall include a blocking FET on DP1_HPD to prevent back-drive current from damaging the Module. DP1_AUX_SEL P107 Strapping Signal to Enable Either HDMI or DP Output I CMOS 1.8V Runtime PD 1M Pulled to GND on Carrier for DP operation in Dual Mode (DP++) implementations. Driven to 1.8V on Carrier for HDMI mode. Module must tolerate high level in stand-by mode. Should be connected to pin 13 of the DisplayPort connector to enable a dual-mode DisplayPort interface. Dual Mode (HDMI and DisplayPort on the same pins) implementations may be realized. This is desirable for SoCs that natively implement this capability. With such SoCs, the primary Dual Mode implementation challenge is that the HDMI_CTRL_DAT and HDMI_CTRL_CK lines are DC coupled, but the DP_AUX+ /- pair must be AC coupled. A set of FET switches is usually used to sort this out. The FET gates can be controlled by the AUX_SEL pin function. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 26 of 109](.smarc-hardware-specification-v2-1-1/slide-026.jpg) ## Slide 27 ![**3.5.3 Secondary HDMI / DP++ Pin Sharing** **Table:** Pin # HDMI Signal Name DP++ Name --- --- --- P92 HDMI_D2+ DP1_LANE0+ P93 HDMI_D2- DP1_LANE0- P95 HDMI_D1+ DP1_LANE1+ P96 HDMI_D1- DP1_LANE1- P98 HDMI_D0+ DP1_LANE2+ P99 HDMI_D0- DP1_LANE2- P101 HDMI_CK+ DP1_LANE3+ P102 HDMI_CK- DP1_LANE3- P105 HDMI_CTRL_CK DP1_AUX+ P106 HDMI_CTRL_DAT DP1_AUX- P104 HDMI_HPD DP1_HPD Table 10: Secondary HDMI / DP++ Pin Sharing SMARC 2.1.1 Specification © 2020 SGET e.V. Page 27 of 109](.smarc-hardware-specification-v2-1-1/slide-027.jpg) ## Slide 28 ![**3.6 Third Display Interface** **3.6.1 DP++** A DP++ interface can output signals that are formatted per either DP or HDMI / DVI protocols. The signal levels are DP compliant. For DP use, off-Module coupling caps are needed on the 4 DP display data lanes. A Carrier Board level translator is usually needed for HDMI / DVI operation. DP++ or DisplayPort++ (also named as Dual-mode DisplayPort) can directly output HDMI and DVI signals. The level adaptation can be implemented on the Carrier or via plug in cable adapter. In case of Carrier Board implementation, a level shifter adjusts the I/O voltage to HDMI/DVI compliant signal levels. A dual-mode chipset switches to DVI/HDMI mode (4-lane main DisplayPort link and AUX channel) if a DVI or HDMI passive adapter is detected (by DP0_AUX_SEL). **Table Data:** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- DP0_LANE0+ S93 Primary DP Port Differential Pair Data Lines O DP Runtime AC coupled off Module 100 nF DC blocking capacitors shall be placed on the Carrier DP0_LANE0- S94 DP0_LANE1+ S96 DP0_LANE1- S97 DP0_LANE2+ S99 DP0_LANE2- S100 DP0_LANE3+ S102 DP0_LANE3- S103 DP0_AUX+ S105 Primary DP Port Bidirectional Channel used for Link Management and Device Control I/O DP 3.3V Runtime PD 100k AC coupled on Module If DP0_AUX_SEL=0 (DP mode): AC coupled on module, 100k PD. If DP0_AUX_SEL=1 (HDMI mode): DC coupled, CMOS, 100k PU. In case of HDMI over DP++ implementation, stronger pull-up is demanded to the Carrier Board. DP0_AUX- S106 Primary DP Port Bidirectional Channel used for Link Management and Device Control I/O DP 3.3V Runtime PU 100k AC coupled on Module If DP0_AUX_SEL=0 (DP mode): AC coupled on module, 100k PU. If DP0_AUX_SEL=1 (HDMI mode): DC coupled, CMOS, 100k PU. In case of HDMI over DP++ implementation, stronger pull-up is demanded to the Carrier Board. DP0_AUX_SEL S95 Auxiliary Selection I CMOS 1.8V Runtime PD 1M Pulled to GND on Carrier for DP operation in Dual Mode (DP++) implementations Module must tolerate high level in stand-by mode. Should be connected to pin 13 of the DisplayPort connector to enable a dual-mode DisplayPort interface. DP0_HPD S98 DP Hot Plug Detect Input I CMOS 1.8V Runtime PD 1M Module must tolerate high level in stand-by mode. The Carrier shall include a blocking FET on DP(0:1)_HPD to prevent back-drive current from damaging the Module. Table 11: Third Display Interface DP++ Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 28 of 109](.smarc-hardware-specification-v2-1-1/slide-028.jpg) ## Slide 29 ![**3.7 Camera Interfaces** SMARC 2.0 defines two MIPI CSI serial camera interfaces. The defined CSI0 interface supports up to two differential data lanes (CSI0_D(0:1)+/- signals). CSI1 *may* be implemented with up to four differential data lanes (CSI1_D(0:3)+/- signals) to support higher resolution cameras. Both MIPI CSI interfaces support MIPI-CSI 2.0 but are also prepared to support the implementation of MIPI-CSI 3.0. Both standards continue to evolve (see http://mipi.org/specifications/camera-interface). While MIPI-CSI 2.0 utilizes an I2C bus (I2C_CAM(0:1)) to communicate with the camera the MIPI-CSI 3.0 uses a differential data lane (CSI(0:1)_TX+/-). **3.7.1 MIPI CSI** **Table Columns:** Signal Name, Pin #, Description, I/O Type, I/O Level, Power Domain, PU / PD, Comments **Row 1:** * **Signal Name:** CSI0_RX0+, CSI0_RX0-, CSI0_RX1+, CSI0_RX1- * **Pin #:** S11, S12, S14, S15 * **Description:** CSI0 differential input * **I/O Type:** I D-PHY / I M-PHY * **Power Domain:** Runtime **Row 2:** * **Signal Name:** CSI0_CK+, CSI0_CK- * **Pin #:** S8, S9 * **Description:** CSI0 differential clock input (point to point) * **I/O Type:** I D-PHY * **Power Domain:** Runtime **Row 3:** * **Signal Name:** I2C_CAM0_DAT / CSI0_TX- * **Pin #:** S7 * **Description:** I2C data for serial camera data support link or differential data lane * **I/O Type:** I/O OD CMOS / O M-PHY * **I/O Level:** 1.8V * **Power Domain:** Runtime * **PU / PD:** PU 2.2K * **Comments:** MIPI-CSI 2.0 uses I2C_CAM0_DAT which requires PU MIPI-CSI 3.0 uses CSI0_TX-, no PU required **Row 4:** * **Signal Name:** I2C_CAM0_CK / CSI0_TX+ * **Pin #:** S5 * **Description:** I2C clock for serial camera data support link or differential data lane * **I/O Type:** I/O OD CMOS / O M-PHY * **I/O Level:** 1.8V * **Power Domain:** Runtime * **PU / PD:** PU 2.2K * **Comments:** MIPI-CSI 2.0 uses I2C_CAM0_CK which requires PU MIPI-CSI 3.0 uses CSI0_TX+, no PU required **Row 5:** * **Signal Name:** CAM0_PWR# * **Pin #:** P108 * **Description:** Camera 0 Power Enable, active low output. * **I/O Type:** O CMOS * **I/O Level:** 1.8V * **Power Domain:** Runtime * **Comments:** Shared with GPIO0 **Row 6:** * **Signal Name:** CAM0_RST# * **Pin #:** P110 * **Description:** Camera 0 reset, active low output * **I/O Type:** O CMOS * **I/O Level:** 1.8V * **Power Domain:** Runtime * **Comments:** Shared with GPIO2 **Row 7:** * **Signal Name:** CSI1_RX0+, CSI1_RX0-, CSI1_RX1+, CSI1_RX1-, CSI1_RX2+, CSI1_RX2-, CSI1_RX3+, CSI1_RX3- * **Pin #:** P7, P8, P10, P11, P13, P14, P16, P17 * **Description:** CSI1 differential input (point to point) * **I/O Type:** I D-PHY / I M-PHY * **Power Domain:** Runtime **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 29 of 109](.smarc-hardware-specification-v2-1-1/slide-029.jpg) ## Slide 30 ![**Table 12: MIPI-CSI Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- CSI1_CK+(br)CSI1_CK- P3(br)P4 CSI1 differential clock input (point to point) I D-PHY Runtime I2C_CAM1_DAT /(br)CSI1_TX- S2 I2C data for serial camera data support link or differential data lane I/O OD CMOS / O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C_CAM1_DAT which requires PU(br)MIPI-CSI 3.0 mode uses CSI1_TX-, no PU required I2C_CAM1_CK /(br)CSI1_TX+ S1 I2C clock for serial camera data support link or differential data lane I/O OD CMOS / O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C_CAM1_CK which requires PU(br)MIPI-CSI 3.0 mode uses CSI1_TX+, no PU required CAM1_PWR# P109 Camera 1 Power Enable, active low output. O CMOS 1.8V Runtime Shared with GPIO1 CAM1_RST# P111 Camera 1 reset, active low output O CMOS 1.8V Runtime Shared with GPIO3 CAM_MCK S6 Master clock output O CMOS 1.8V Runtime **MIPI CSI Configuration CSI-2 and CSI-3** The newer version of the MIPI Camera Serial Interface CSI-3 no longer uses an I2C bus to transmit commands and configurations to the camera. A newly defined high-speed differential signal pair is used instead. **Serial Cameras In** Two MIPI CSI camera interfaces are supported. The CSI0 interface supports two lanes, the CSI1 interface supports 4 lanes. MIPI CSI 2.0 and MIPI CSI 3.0 are supported. With SMARC 2.1 the fill order changed to CSI1 first. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 30 of 109](.smarc-hardware-specification-v2-1-1/slide-030.jpg) ## Slide 31 ![**3.7.2 3rd and 4th MIPI CSI on optional feature connector** Two identical feature connectors *may* be used to connect extra MIPI cameras by flat foil cables **Table 13: MIPI-CSI Feature Connector Signals for 3rd Camera** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- CSI2_RX0+(br)CSI2_RX0-(br)CSI2_RX1+(br)CSI2_RX1-(br)CSI2_RX2+(br)CSI2_RX2-(br)CSI2_RX3+(br)CSI2_RX3- 4(br)5(br)7(br)8(br)10(br)11(br)13(br)14 CSI2 differential input (point to point) I D-PHY(br)/ I M-PHY Runtime CSI2_CK+(br)CSI2_CK- 16(br)17 CSI2 differential clock input (point to point) I D-PHY Runtime I2C_CAM2_DAT /(br)CSI2_TX- 20 I2C data for serial camera data(br)support link or differential data lane I/O OD CMOS(br)/ O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C which(br)requires PU(br)MIPI-CSI 3.0 mode uses a(br)differential pair, no PU required I2C_CAM2_CK /(br)CSI2_TX+ 19 I2C clock for serial camera data(br)support link or differential data lane I/O OD CMOS(br)/ O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C which(br)requires PU(br)MIPI-CSI 3.0 mode uses a(br)differential pair, no PU required CAM2_PWR# 21 Camera 2 Power Enable, active low(br)output. O CMOS 1.8V Runtime CAM2_RST# 12 Camera 2 reset, active low output O CMOS 1.8V Runtime CAM2_MCK 22 Master clock output O CMOS 1.8V Runtime CAM2_VCC 1, 2 Power 3.3V Runtime VCC Power for MIPI Camera GND 3, 6, 9,(br)15, 18 Ground GND for MIPI Camera power and(br)signals Table 13: MIPI-CSI Feature Connector Signals for 3rd Camera SMARC 2.1.1 Specification © 2020 SGET e.V. Page 31 of 109](.smarc-hardware-specification-v2-1-1/slide-031.jpg) ## Slide 32 ![**Table 14: MIPI-CSI Feature Connector Signals for 4th Camera** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- CSI3_RX0+(br)CSI3_RX0-(br)CSI3_RX1+(br)CSI3_RX1-(br)CSI3_RX2+(br)CSI3_RX2-(br)CSI3_RX3+(br)CSI3_RX3- 4(br)5(br)7(br)8(br)10(br)11(br)13(br)14 CSI3 differential input (point to point) I D-PHY(br)/ I M-PHY Runtime CSI3_CK+(br)CSI3_CK- 16(br)17 CSI3 differential clock input (point to point) I D-PHY Runtime I2C_CAM3_DAT /(br)CSI3_TX- 20 I2C data for serial camera data support link or differential data lane I/O OD CMOS(br)/ O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C which requires PU(br)MIPI-CSI 3.0 mode uses a differential pair, no PU required I2C_CAM3_CK /(br)CSI3_TX+ 19 I2C clock for serial camera data support link or differential data lane I/O OD CMOS(br)/ O M-PHY 1.8V Runtime PU 2.2K MIPI-CSI 2.0 mode uses I2C which requires PU(br)MIPI-CSI 3.0 mode uses a differential pair, no PU required CAM3_PWR# 21 Camera 3 Power Enable, active low output. O CMOS 1.8V Runtime CAM3_RST# 12 Camera 3 reset, active low output O CMOS 1.8V Runtime CAM3_MCK 22 Master clock output O CMOS 1.8V Runtime CAM3_VCC 1, 2 Power 3.3V Runtime VCC Power for MIPI Camera GND 3, 6, 9, 15, 18 Ground GND for MIPI Camera power and signals **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 32 of 109](.smarc-hardware-specification-v2-1-1/slide-032.jpg) ## Slide 33 ![The slide titled '**3.7.2.1 MIPI CSI feature connector**' describes a connector specification. **Text Content:** 'A 22 pin FPC connector with 22 pins *may* be used as feature connector for extra MIPI CSI signals. TE part number: 2-1734592-2 or compatible (i.e. FDS0520 from company Sunfun or MW AFC07-S22FXA-HF from company 勝達電子).' **Visuals:** Two diagrams show green rectangular modules with hatched areas indicating placement zones. Both diagrams contain the text: 'Preferred Areas for MIPI-CSI Feature Connectors (Top Side)'. * **Figure 1:** Labeled 'Figure 1: MIPI CSI feature connector placement (82x50mm Module)'. * **Figure 2:** Labeled 'Figure 2: MIPI CSI feature connector placement (82x80mm Module)'. **Footer:** 'SMARC 2.1.1 Specification' '© 2020 SGET e.V.' 'Page 33 of 109'](.smarc-hardware-specification-v2-1-1/slide-033.jpg) ## Slide 34 ![**3.8 SDIO Card (4 bit) Interface** The SD Card / SDIO interface can support SD Cards or additionally SDIO functionality. A SDIO (Secure Digital Input Output) card is an extension of the SD specification to cover I/O functions. SDIO cards are only fully functional in host devices designed to support their input-output functions. These devices can use the SD slot to support GPS receivers, modems, barcode readers, radio tuners, RFID readers, digital cameras, and interfaces to Wi-Fi, Bluetooth, Ethernet, and IrDA. The SDIO and SD interfaces are mechanically and electrically identical. Host devices built for SDIO cards generally accept SD memory cards without I/O functions. However, the reverse is not true, because host devices need suitable drivers and applications to support the card's I/O functions. The Carrier SDIO Card *may* be selected as the Boot Device – see Table 44 ‘Control of Boot Sources’ on page 63. **Table 15: SDIO Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- SDIO_D0(br)SDIO_D1(br)SDIO_D2(br)SDIO_D3 P39(br)P40(br)P41(br)P42 SDIO Data lines. These signals operate in push-pull mode. I/O CMOS 1.8V or 3.3V Runtime SDIO controller *may* detect SD Cards voltage level (1.8V for UHS-I and 3.3V for standard) and adjust its I/O voltage level accordingly SDIO_WP P33 SDIO Write Protect. This signal denotes the state of the write-protect tab on SD cards. I OD CMOS 1.8V or 3.3V Runtime PU 10k SDIO_CMD P34 SDIO Command/Response. This signal is used for card initialization and for command transfers. During initialization mode this signal is open drain. During command transfer this signal is in push-pull mode. I/O CMOS 1.8V or 3.3V Runtime SDIO controller *may* detect SD Cards voltage level (1.8V for UHS-I and 3.3V for standard) and adjust its I/O voltage level accordingly SDIO_CD# P35 SDIO Card Detect. This signal indicates when a SDIO/MMC card is present. I OD CMOS 1.8V or 3.3V Runtime PU 10k SDIO_CK P36 SDIO Clock. With each cycle of this signal a one-bit transfer on the command and each data line occurs. O CMOS 1.8V or 3.3V Runtime SDIO controller will detect SD Cards voltage level (1.8V for UHS-I and 3.3V for standard) and adjust its I/O voltage level accordingly SDIO_PWR_EN P37 SDIO Power Enable. This signal is used to enable the power being supplied to a SD/MMC card device. O CMOS 3.3V Runtime **Should** be driven low in Standby Mode by the Module **Note:** There are SD Cards with a 1.8V I/O voltage (UHS-I). SDIO controllers supporting these cards will adjust the I/O voltage levels. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 34 of 109](.smarc-hardware-specification-v2-1-1/slide-034.jpg) ## Slide 35 ![**3.9 SPI Interfaces** **3.9.1 SPI0** The Carrier SPI0 device *may* be selected as the Boot Device – see Table 44 ‘Control of Boot Sources’ on page 63 Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- SPI0_CS0# P43 SPI0 Master Chip Select 0 O CMOS 1.8V Standby This signal can be used to select Carrier SPI as boot device SPI0_CS1# P31 SPI0 Master Chip Select 1 O CMOS 1.8V Standby SPI0_CK P44 SPI0 Clock O CMOS 1.8V Standby SPI0_DIN P45 SPI0 Master input / Slave output I CMOS 1.8V Standby also referred to as MISO SPI0_DO P46 SPI0 Master output / Slave input O CMOS 1.8V Standby also referred to as MOSI Table 16: SPI0 Signals **3.9.2 SPI1** SPI1 is the general-purpose SPI bus. Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- SPI1_CS0# P54 SPI1 Master Chip Select 0 O CMOS 1.8V Standby SPI1_CS1# P55 SPI1 Master Chip Select 1 O CMOS 1.8V Standby SPI1_CK P56 SPI1 Clock O CMOS 1.8V Standby SPI1_DIN P57 SPI1 Master input / Slave output I CMOS 1.8V Standby also referred to as MISO SPI1_DO P58 SPI1 Master output / Slave input O CMOS 1.8V Standby also referred to as MOSI Table 17: SPI1 Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 35 of 109](.smarc-hardware-specification-v2-1-1/slide-035.jpg) ## Slide 36 ![**3.9.3 QSPI** The QSPI is a controller extension for the SPI Bus. The difference is that it uses a data queue with programmable queue pointers that allow the data transfers without the CPU intervention. It also has a wrap-around mode that allows continuous transfers and from the queue with no CPU intervention. The peripherals appear to the CPU as memory-mapped parallel devices. This is useful in application such as controlling an analog to digital converter. QSPI has some more programmable features like chip select and transfer length delay. **Table 18: QSPI Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- QSPI_CS0# P54 QSPI Master Chip Select 0 O CMOS 1.8V Standby QSPI_CS1# P55 QSPI Master Chip Select 1 O CMOS 1.8V Standby QSPI_CK P56 QSPI Clock O CMOS 1.8V Standby QSPI_IO_3 S57 QSPI Data input / output I/O CMOS 1.8V Standby QSPI_IO_2 S56 QSPI Data input / output I/O CMOS 1.8V Standby QSPI_IO_1 P57 QSPI Data input / output I/O CMOS 1.8V Standby QSPI_IO_0 P58 QSPI Data input / output I/O CMOS 1.8V Standby SMARC 2.1.1 Specification © 2020 SGET e.V. Page 36 of 109](.smarc-hardware-specification-v2-1-1/slide-036.jpg) ## Slide 37 ![**3.9.4 eSPI** eSPI stands for Enhanced Serial Peripheral Interface. It was introduced to replace the legacy LPC Bus. It is defined to meet the following requirements: * **Low Power:** The interface may be active in all S0-S5 system states. The power consumed when the bus is operating in S3-S5 system states must be very low to meet the power requirements of these low power system states. When the interface is not transmitting or receiving, it should consume a negligible amount of power (at system level). * **Pin Count Reduction:** Moving LPC devices over to the eSPI interface facilitates the removal of LPC pins in the longer term. On top of that messaging through sideband pins needed for communication between the chipset and slave devices (such as EC, BMC and SIO) is converted to in-band messages, resulting in further pin count reduction. * **Medium Bandwidth:** The bus bandwidth needs to be higher than that of the Low Pin Count (LPC) bus. * **LPC Replacement:** Supports all the capabilities needed to replace the parallel LPC interface. However, 8237 DMA and Firmware Hub (FWH) are not supported over this interface. * **Sideband Pins as In-Band Messaging:** Facilitates the removal of sideband pins for communication between chipset and slave devices by converting this communication into in-band messages sent over the eSPI bus. * **Real-Time Flash Sharing:** Supports flash sharing based on partition-able memory mapping. Allows real-time operational access by chipset and slave devices. * **Chipset and Slave Devices SMBus Replacement:** Supports tunneling of all SMBus communication between chipset and slave devices over the new interface as in-band messages. * **Scalable bandwidth:** Allows the bandwidth to be scaled based on application needs to optimize power versus performance. This could be done through frequency scaling or varying the number of active data pins. * **Low Voltage I/O Buffer:** eSPI uses the same I/O buffer as Serial Peripheral Interface (SPI). The I/O buffer will support only 1.8V mode of operation for the eSPI bus. **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 37 of 109](.smarc-hardware-specification-v2-1-1/slide-037.jpg) ## Slide 38 ![**Table 19: eSPI Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- ESPI_CS0# P54 ESPI1 Master Chip Select 0 O CMOS 1.8V Standby ESPI_CS1# P55 ESPI1 Master Chip Select 1 O CMOS 1.8V Standby ESPI_CK P56 ESPI Master Clock Output O CMOS 1.8V Standby Pin provides reference timing for all serial input / output operations. ESPI_RESET# S58 ESPI Reset O CMOS 1.8V Standby Reset the eSPI interface for both master and slaves. eSPI Reset# is typically driven from eSPI master to eSPI slaves ESPI_ALERT0#(br)ESPI_ALERT1# S43(br)S44 ESPI ALERT I OD CMOS 1.8V Standby 4.7k PU These pins are used by eSPI slaves to request service from eSPI master. Open-drain output from the slave. This pin is optional for Single Master-Single Slave configuration where I/O(1) can be used to signal the Alert event. ESPI_IO_0(br)ESPI_IO_1(br)ESPI_IO_2(br)ESPI_IO_3 P58(br)P57(br)S56(br)S57 ESPI Master Data Input / Output I/O CMOS 1.8V Standby In Single I/O mode, ESPI_IO_0 is the eSPI master output / eSPI slave input (MOSI) whereas ESPI_IO_1 is the SPI master input / eSPI slave output (MISO). Table 19: eSPI Signals **3.9.5 eSPI/SPI1/QSPI Pin Sharing** Pin # eSPI Signal Name SPI1 Name QSPI Name :--- :--- :--- :--- P58 ESPI_IO_0 SPI1_DO QSPI_IO_0 P57 ESPI_IO_1 SPI1_DIN QSPI_IO_1 S56 ESPI_IO_2 - QSPI_IO_2 S57 ESPI_IO_3 - QSPI_IO_3 S43 ESPI_ALERT0# - - S44 ESPI_ALERT1# - - S58 ESPI_RESET - - P56 ESPI_CK SPI1_CK QSPI_CK P55 ESPI_CS1# SPI1_CS1# QSPI_CS1# P54 ESPI_CS0# SPI1_CS0# QSPI_CS0# Table 20: eSPI/SPI1 Pin Sharing SMARC 2.1.1 Specification © 2020 SGET e.V. Page 38 of 109](.smarc-hardware-specification-v2-1-1/slide-038.jpg) ## Slide 39 ![**3.10 Audio** Two audio interfaces are defined. One I2S interface is pin shared with HDA. I2S1 from SMARC V1.1 has been deprecated. The I2S interface is typically used for ARM processor implementation. HDA is typically used for x86 processor implementations. The HDA interface *may* also be used for a second I2S interface. **3.10.1 I2S0** Two I2S interfaces are defined. These are typically used for digital audio I/O and other modest bandwidth functions. A common audio master clock signal is also defined. Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- I2S0_LRCK S39 I2S0 Left & Right Synchronization Clock I/O CMOS 1.8V Runtime Module Output if CPU acts in Master Mode. Module Input if CPU acts in Slave Mode I2S0_SDOUT S40 I2S0 Digital Audio Output O CMOS 1.8V Runtime I2S0_SDIN S41 I2S0 Digital Audio Input I CMOS 1.8V Runtime I2S0_CK S42 I2S0 Digital Audio Clock I/O CMOS 1.8V Runtime Module Output if CPU acts in Master Mode Module Input if CPU acts in Slave Mode AUDIO_MCK S38 Master Clock Output to I2S Codec(s) O CMOS 1.8V Runtime Table 21: I2S0 Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 39 of 109](.smarc-hardware-specification-v2-1-1/slide-039.jpg) ## Slide 40 ![**3.10.2 I2S2** The second I2S interface can also be implemented as HDA interface. The master clock output (AUDIO_MCK) is shared between both I2S interfaces. **Table 22: I2S2 Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- I2S2_LRCK S50 I2S2 Left & Right Synchronization Clock I/O CMOS 1.8V Runtime Module Output if CPU acts in Master Mode. Module Input if CPU acts in Slave Mode I2S2_SDOUT S51 I2S2 Digital Audio Output O CMOS 1.8V Runtime I2S2_SDIN S52 I2S2 Digital Audio Input I CMOS 1.8V Runtime I2S2_CK S53 I2S2 Digital Audio Clock I/O CMOS 1.8V Runtime Module Output if CPU acts in Master Mode. Module Input if CPU acts in Slave Mode AUDIO_MCK S38 Master Clock Output to I2S Codec(s) O CMOS 1.8V Runtime **3.10.3 HDA** **Table 23: HDA Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- HDA_SYNC S50 High Definition Audio Sample synchronization clock to codec I/O CMOS 1.8V / 1.5V Runtime SMARC requires 1.5V or 1.8V HD Audio signaling. Please check with your Module vendor if 1.5V or 1.8V are supported and use an audio codec that is capable to support the regarding I/O voltage. The SMARC HD Audio pins are shared with the I2S2 pins, which are defined to be 1.8V. This specification ignores the discrepancy between the 1.5V and 1.8V signaling, as the chance of damage in mismatched systems is negligible. HDA_SDO S51 High Definition Audio data out to codec O CMOS 1.8V / 1.5V Runtime HDA_SDI S52 High Definition Audio data in from codec' I/O CMOS 1.8V / 1.5V Runtime HDA_CK S53 High Definition Audio clock to codec O CMOS 1.8V / 1.5V Runtime HDA_RST# P112 High Definition Audio Reset Output to Codec, low active. O CMOS 1.8V / 1.5V Runtime SMARC 2.1.1 Specification © 2020 SGET e.V. Page 40 of 109](.smarc-hardware-specification-v2-1-1/slide-040.jpg) ## Slide 41 ![**3.10.4 I2S/HDA Pin Sharing** **Table 24: I2S/HDA Pin Sharing** Pin # I2S2 Signal Name HDA Signal Name :--- :--- :--- S50 I2S2_LRCK HDA_SYNC S51 I2S2_SDOUT HDA_SDO S52 I2S2_SDIN HDA_SDI S53 I2S2_CK HDA_CK P112 - HDA_RST# **Note:** The numbering of the secondary, alternative I2S interface is #2 because the I2S interface #1 from SMARC 1.1 was removed for SMARC 2.0. Per the HD Audio specification, HD Audio **may** be run at either 1.5V or 3.3V. SMARC requires 1.5V or 1.8V HD Audio signaling. Please check with your Module vendor if 1.5V or 1.8V are supported and use an audio codec that is capable to support the regarding I/O voltage. The SMARC HD Audio pins are shared with the I2S2 pins, which are defined to be 1.8V. This specification ignores the discrepancy between the 1.5V and 1.8V signaling, as the chance of damage in mismatched systems is negligible. ARM SOC generally run I2S audio and will likely use 1.8V signaling. X86 SOC generally run 1.5V signal levels on the HD Audio interface. *** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 41 of 109](.smarc-hardware-specification-v2-1-1/slide-041.jpg) ## Slide 42 ![**3.11 I2C Interfaces** The Module supports six I2C interfaces, per the following table. Except for the LCD and HDMI Module I2C interfaces, the I2C ports **should** be multi-master capable. Data rates of 100 kHz and 400 kHz **should** be supported. **Table 25: I2C Signals** I2C Port Primary Purpose Alternate Use Note :--- :--- :--- :--- I2C_PM Power Management Support System configuration management see section 3.21 'Management Pins' on page 60 I2C_CAM0 Camera Support General Purpose see section 3.7.1 'MIPI CSI' on page 29 I2C_CAM1 I2C_CAM2 I2C_CAM3 I2C_GP General Purpose Use I2C_LCD LCD Display Support General Purpose see section 3.4.1 'LVDS' on page 19 HDMI_CTRL HDMI Control see section 3.5.1 'HDMI' on page 25 All I2C interfaces but the I2C_GP interface are described in the section served by that I2C link (LCD, HDMI, Camera Interface, etc.). The I2C_GP Module interface consists of the following two pins: **Table 26: General Purpose I2C Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- I2C_GP_DAT S49 General Purpose I2C Data Signal I/O OD CMOS 1.8V Runtime PU 2k2 I2C_GP_CK S48 General Purpose I2C Clock Signal I/O OD CMOS 1.8V Runtime PU 2k2 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 42 of 109](.smarc-hardware-specification-v2-1-1/slide-042.jpg) ## Slide 43 ![**3.12 Asynchronous Serial Ports** Module pins for up to four asynchronous serial ports are defined. The ports are designated SER0 – SER3. Ports SER0 and SER2 are 4 wire ports (2 data lines and 2 handshake lines). Ports SER1 and SER3 are 2 wire ports (data only). **Table Headers:** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments **Table Rows:** * SER0_TX P129 Asynchronous Serial Data Output Port 0 O CMOS 1.8V Runtime * SER0_RX P130 Asynchronous Serial Data Input Port 0 I CMOS 1.8V Runtime PU 100k * SER0_RTS# P131 Request to Send Handshake Line for Port 0 O CMOS 1.8V Runtime * SER0_CTS# P132 Clear to Send Handshake Line for Port 0 I CMOS 1.8V Runtime PU 100k * SER1_TX P134 Asynchronous Serial Data Output Port 1 O CMOS 1.8V Runtime * SER1_RX P135 Asynchronous Serial Data Input Port 1 I CMOS 1.8V Runtime PU 100k * SER2_TX P136 Asynchronous Serial Data Output Port 2 O CMOS 1.8V Runtime * SER2_RX P137 Asynchronous Serial Data Input Port 2 I CMOS 1.8V Runtime PU 100k * SER2_RTS# P138 Request to Send Handshake Line for Port 2 O CMOS 1.8V Runtime * SER2_CTS# P139 Clear to Send Handshake Line for Port 2 I CMOS 1.8V Runtime PU 100k * SER3_TX P140 Asynchronous Serial Data Output Port 3 O CMOS 1.8V Runtime * SER3_RX P141 Asynchronous Serial Data Input Port 3 I CMOS 1.8V Runtime PU 100k Table 27: Serial Port Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 43 of 109](.smarc-hardware-specification-v2-1-1/slide-043.jpg) ## Slide 44 ![**3.13 CAN Bus** **Table 28: CAN Bus Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- CAN0_TX P143 CAN Port 0 Transmit Output O CMOS 1.8V Runtime CAN0_RX P144 CAN Port 0 Receive Input I CMOS 1.8V Runtime CAN1_TX P145 CAN Port 1 Transmit Output O CMOS 1.8V Runtime CAN1_RX P146 CAN Port1 Receive Input I CMOS 1.8V Runtime SMARC 2.1.1 Specification © 2020 SGET e.V. Page 44 of 109](.smarc-hardware-specification-v2-1-1/slide-044.jpg) ## Slide 45 ![**3.14 USB Interfaces** SMARC 2.0 provides six sets of USB 2.0 signals and two sets of USB 3.2 Super Speed signals. USB OTG and USB Client functionalities are also supported. USB 3.2 is supported for the USB ports 2 and 3. For implementation of USB 3.2 OTG or USB 3.2 host USB3 **may** be used. For filling order see also 3.2 'Feature Fill Order'. The order follows the port prefixes USB0 to USB5. For USB 3.2 SuperSpeed signals the filling order is USB2 to USB3. At least one USB client port **should** be supported. It **may** also be available as an OTG port. There can be one or two USB client ports. If one USB client port is supported it can be port 0 or port 3. USB 3.2 Gen. 1 with 5 Gbit/s is supported. Support for USB 3.2 Gen 2 with 10 Gbit/s might be supported in the future. Limitation for trace length will apply. USB 3.2 Gen. 2 x 2 is not supported. **3.14.1 USB Signal Assignments** USB 2.0 USB 3.2 OTG/VBUS Client Capability :--- :--- :--- :--- :--- **USB0** may¹ may should **USB1** shall **USB2** may may **USB3** may may may may **USB4** may **USB5** may Table 29: USB Signal Assignments ¹ USB0 **shall** be implemented as Host or OTG/Client SMARC 2.1.1 Specification © 2020 SGET e.V. Page 45 of 109](.smarc-hardware-specification-v2-1-1/slide-045.jpg) ## Slide 46 ![**3.14.2 USB Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- USB0+(br)USB0- P60(br)P61 USB Differential Data Pairs for Port 0 I/O USB USB Standby USB0_EN_OC# P62 USB Over-Current Sense for Port 0 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB0 power. Pulled low by Carrier OD driver to indicate over-current situation. USB0_VBUS_DET P63 USB Port 0 Host Power Detection I USB VBUS 5V USB VBUS 5V Standby When this Port is used as a device it can be connected to a USB client port VBUS pin. USB0_OTG_ID P64 Input Pin to Announce OTG Device Insertion on USB 2.0 Port Standby Resistor value to ground according to USB specification USB1+(br)USB1- P65(br)P66 USB Differential Data Pairs for Port 1 I/O USB USB Standby USB1_EN_OC# P67 USB Over-Current Sense for Port 1 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB1 power. Pulled low by Carrier OD driver to indicate over-current situation. USB2+(br)USB2- P69(br)P70 USB Differential Data Pairs for Port 2 I/O USB USB Standby USB2_SSRX+(br)USB2_SSRX- S74(br)S75 Receive Signal Differential Pairs for SuperSpeed on Port 2 I USB SS USB SS Standby DC blocking capacitors 100nF shall be placed on the Carrier USB2_SSTX+(br)USB2_SSTX- S71(br)S72 Transmit Signal Differential Pairs for SuperSpeed on Port 2 O USB SS USB SS Standby DC blocking capacitors 100nF shall be placed on the Module USB2_EN_OC# P71 USB Over-Current Sense for Port 2 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB2 power. Pulled low by Carrier OD driver to indicate over-current situation. USB3+(br)USB3- S68(br)S69 USB Differential Data Pairs for Port 3 I/O USB USB Standby USB3_SSRX+(br)USB3_SSRX- S65(br)S66 Receive Signal Differential Pairs for SuperSpeed on Port 3 I USB SS USB SS Standby DC blocking capacitors 100nF shall be placed on the Carrier USB3_SSTX+(br)USB3_SSTX- S62(br)S63 Transmit Signal Differential Pairs for SuperSpeed on Port 3 O USB SS USB SS Standby DC blocking capacitors 100nF shall be placed on the Module ² 3.3V or switched 3.3V: if a USB channel is not used, then the USB(0:5)_EN_OC# pull-up rail may be held at GND to prevent leakage currents. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 46 of 109](.smarc-hardware-specification-v2-1-1/slide-046.jpg) ## Slide 47 ![**Table 30: USB Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- USB3_EN_OC# P74 USB Over-Current Sense for Port 3 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB3 power. Pulled low by Carrier OD driver to indicate over-current situation. USB3_VBUS_DET S37 USB Port 3 Host Power Detection I USB VBUS 5V USB VBUS 5V Standby when this Port is used as a Device USB3_OTG_ID S104 Input Pin to Announce OTG Device Insertion on USB 3.2 Port I CMOS 3.3V Standby USB4+ (br) USB4- S35 (br) S36 USB Differential Data Pairs for Port 4 I/O USB USB Standby USB4_EN_OC# P76 USB Over-Current Sense for Port 4 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB4 power. Pulled low by Carrier OD driver to indicate over-current situation. USB5+ (br) USB5- S59 (br) S60 USB Differential Data Pairs for Port 5 I/O USB USB Standby USB5_EN_OC# S55 USB Over-Current Sense for Port 5 I/O OD CMOS 3.3V² Standby PU 10k Pulled low by Module OD driver to disable USB5 power. Pulled low by Carrier OD driver to indicate over-current situation. **Table 30: USB Signals** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 47 of 109](.smarc-hardware-specification-v2-1-1/slide-047.jpg) ## Slide 48 ![**3.14.3 USB(0:5)_EN_OC# Discussion** The Module USB(0:5)_EN_OC# pins are multi-function Module pins, with a pull-up to a 3.3V rail on the Module, an OD driver on the Module, and, if the OC# (over-current) monitoring function is implemented on the Carrier, an OD driver on the Carrier. The use is as follows: 1) On the Carrier Board, for external plug-in USB peripherals (USB memory sticks, cameras, keyboards, mice, etc.) USB power distribution is typically handled by USB power switches such as the Texas Instruments TPS052B or the Micrel MIC2026-1 or similar devices. The Carrier implementation is more straightforward if the Carrier USB power switches have active-high power enables and active low open drain OC# outputs (as the TI and Micrel devices referenced do). The USB power switch Enable and OC# pins for a given USB channel are tied together on the Carrier. The USB power switch enable pin must function with a low input current. The TI and Micrel devices referenced above require 1 microampere or less, at a 3.3V enable voltage level. 2) The Module drives USB(0:5)_EN_OC# low to disable the power delivery to the USB(0:5) device. 3) The Module floats USB(0:5)_EN_OC# to enable power delivery. The line is pulled to 3.3V by the Module pull-up, enabling the Carrier Board USB power switch. If there is a USB over-current condition, the Carrier Board USB power switch drives the USB(0:5)_EN_OC# line low. This removes the over-current condition (by disabling the USB switch enable input), and allows Module software to detect the over-current condition. The Module software *should* look for a falling edge interrupt on USB(0:5)_EN_OC#, while the port is enabled, to detect the OC# condition. The OC# condition will not last long, as the USB power switch is disabled when the switch IC detects the OC# condition. If the USB power to the port is disabled (USB(0:5)_EN_OC# is driven low by the Module) then the Module software must be aware that the port is disabled, and the low input value on the port does not indicate an over-current condition (because the port power is disabled).If the USB power to the port is disabled, then the Module *may* remove the 3.3V pull-up voltage to the USB(0:5)_EN_OC# node, to save the current drain through the pull-up resistor. This is optional and Module design dependent. Carrier Board USB peripherals that are not removable often do *not* make use of USB power switches with current limiting and over-current detection. It is usually deemed un-necessary for non-removable devices. In these cases, the USB(0:5)_EN_OC# pins *may* be left unused, or they *may* be used as USB(0:5) power enables, without making use of the over-current detect Module input feature. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 48 of 109](.smarc-hardware-specification-v2-1-1/slide-048.jpg) ## Slide 49 ![3.15 PCI Express The Module *may* implement up to four PCIe lanes. The links *may* be PCIe Gen 1, 2 or 3, as the Module chip or chipset allows. The Module PCIe links are primarily PCIe Root Complexes. If the chipset allows it, the PCIe link(s) *may* alternatively be configured as a PCIe target(s). This is Module vendor specific. Modules *should* implement the PCIe Link A port. Modules *may* implement the PCIe Links B, C and D ports. Fill order is A, B, C then D. PCIe lanes C and D *may* implement SERDES alternatively. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 49 of 109](.smarc-hardware-specification-v2-1-1/slide-049.jpg) ## Slide 50 ![**Table 31: PCI Express Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- PCIE_A_TX+(br)PCIE_A_TX- P89(br)P90 Differential PCIe link A transmit data pair O PCIE Runtime Series AC coupled on Module 75-265(br)nF depending on PCIe generation PCIE_A_RX+(br)PCIE_A_RX- P86(br)P87 Differential PCIe link A receive data pair I PCIE Runtime Series AC coupled off Module 75-265(br)nF depending on PCIe generation PCIE_A_REFCK+(br)PCIE_A_REFCK- P83(br)P84 Differential PCIe Link A reference clock output O PCIE Runtime PCIE_A_RST# P75 PCIe Port A reset output O CMOS 3.3V Runtime PCIE_A_CKREQ# P78 PCIe Port A clock request IO OD(br)CMOS 3.3V Runtime )10k PU Can be used for power saving mode on(br)PCIe - Pulled up or terminated on(br)Module PCIE_B_TX+(br)PCIE_B_TX- S90(br)S91 Differential PCIe link B transmit data pair O PCIE Runtime Series AC coupled on Module 75-265(br)nF depending on PCIe generation PCIE_B_RX+(br)PCIE_B_RX- S87(br)S88 Differential PCIe link B receive data pair I PCIE Runtime Series AC coupled off Module 75-265(br)nF depending on PCIe generation PCIE_B_REFCK+(br)PCIE_B_REFCK- S84(br)S85 Differential PCIe Link B reference clock output O PCIE Runtime PCIE_B_RST# S76 PCIe Port B reset output O CMOS 3.3V Runtime PCIE_B_CKREQ# P77 PCIe Port B clock request IO OD(br)CMOS 3.3V Runtime )10k PU Can be used for power saving mode on(br)PCIe - Pulled up or terminated on(br)Module PCIE_C_TX+(br)PCIE_C_TX- S81(br)S82 Differential PCIe link C transmit data pair O PCIE Runtime Series AC coupled on Module 75-265(br)nF depending on PCIe generation PCIE_C_RX+(br)PCIE_C_RX- S78(br)S79 Differential PCIe link C receive data pair I PCIE Runtime Series AC coupled off Module 75-265(br)nF depending on PCIe generation PCIE_C_REFCK+(br)PCIE_C_REFCK- P80(br)P81 Differential PCIe Link C reference clock output O PCIE Runtime PCIE_C_RST# S77 PCIe Port C reset output O CMOS 3.3V Runtime PCIE_D_TX+(br)PCIE_D_TX- S29(br)S30 Differential PCIe link D transmit data pair O PCIE Runtime Series AC coupled on Module 75-265(br)nF depending on PCIe generation PCIE_D_RX+(br)PCIE_D_RX- S32(br)S33 Differential PCIe link D receive data pair I PCIE Runtime Series AC coupled off Module 75-265(br)nF depending on PCIe generation PCIE_WAKE# S146 PCIe wake up interrupt to host – common to PCIe links A, B, C, D I OD(br)CMOS 3.3V Standby PU 10k **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 50 of 109](.smarc-hardware-specification-v2-1-1/slide-050.jpg) ## Slide 51 ![**3.15.1 PCI Express Link Width** A connection between any two PCIe devices is known as a link, and is built up from a collection of one or more lanes. All devices **shall** support at least one single lane (x1) link. Devices may optionally support wider links composed of 2 or 4 lanes. Therefore, the root complex **may** support different link width additionally to the x1 configuration. The SMARC specification allows for multiple PCI Express link configurations. Check with the module vendor which configurations are supported. SMARC 2.1 adds CKREQ# signals for PCIe A and B to allow for enhanced power saving. The clock for PCIe D should be generated from the fixed clock of PCIe C. **Table 32: PCIe Link Configurations** * **Headers:** SMARC PCIe Lane Possible Link Configuration * **Row 1 (PCle A):** x1 x1 * **Row 2 (PCle B):** x1 x1 x2 x2 * **Row 3 (PCle C):** x1 x2 x1 x2 * **Row 4 (PCle D):** x1 x1 * **Rightmost Column (spanning rows 2 & 3):** x4 **Table 33: PCIe Clock and Reset Assignments** * **Headers:** SMARC PCIe Lane REFCK and RST Assignments * **Row 1 (PCle A):** * PCIE_A_REFCK / PCIE_A_CKREQ# / PCIE_A_RST# (repeated across 5 columns) * **Row 2 (PCle B):** * PCIE_B_REFCK / PCIE_B_CKREQ# / PCIE_B_RST# (repeated across 4 columns) * **Row 3 (PCle C):** * PCIE_C_REFCK / PCIE_C_RST# (first column) * PCIE_C_REFCK / PCIE_C_RST# (second column) * PCIE_B_REFCK / PCIE_B_CKREQ# / PCIE_B_RST# (third column) * PCIE_B_REFCK / PCIE_B_CKREQ# / PCIE_B_RST# (fourth column) * **Row 4 (PCle D):** * to be Generated via Buffer from PCle C Signals * (Empty) * PCIE_C_REFCK / PCIE_C_RST# * (Empty) **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 51 of 109](.smarc-hardware-specification-v2-1-1/slide-051.jpg) ## Slide 52 ![**3.16 SERDES** SERDES is the general term for SERialized and DESerialized signals on a high-speed differential line. Many chip manufacturers use different functions on the same lines as PCIe and therefore we want to bring this surrogate use to be utilized on the module. The most common use case is here for sure (S)XGMI and therefore the implementation of one or more additional LAN ports. Other functions might also be possible. Of course, these different implementations lead to possible incompatibilities between different modules and a system designer needs to ensure, that this different functionality needs to be available on the regarding module as these are optional features. **Table 34: SERDES Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- SERDES_1_TX+(br)SERDES_1_TX- S81(br)S82 Differential SERDES 1 Transmit Data Pair O PCIE Runtime Series AC coupled on Module3 SERDES_1_RX+(br)SERDES_1_RX- S78(br)S79 Differential SERDES 1 Receive Data Pair I PCIE Runtime Series AC coupled on Carrier SERDES_0_TX+(br)SERDES_0_TX- S29(br)S30 Differential SERDES 0 Transmit Data Pair O PCIE Runtime Series AC coupled on Module SERDES_0_RX+(br)SERDES_0_RX- S32(br)S33 Differential SERDES 0 Receive Data Pair I PCIE Runtime Series AC coupled on Carrier MDIO_CLK S45 MDIO Signals to Configure Possible PHYs O CMOS 1.8V Runtime Signal for communication to a PHY MDIO_DAT S46 MDIO Signals to Configure Possible PHYs I/O OD CMOS 1.8V Runtime PU 1k5 Signal for communication to a PHY 3 Capacitor values are depending on the module implementation **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 52 of 109](.smarc-hardware-specification-v2-1-1/slide-052.jpg) ## Slide 53 ![**3.16.1 PCI Express SERDES Pin Sharing** Pin # PCIE Signal Name SERDES Signal Name :--- :--- :--- S81 PCIE_C_TX+ SERDES_1_TX+ S82 PCIE_C_TX- SERDES_1_TX- S78 PCIE_C_RX+ SERDES_1_RX+ S79 PCIE_C_RX- SERDES_1_RX- P80 PCIE_C_REFCK+ - P81 PCIE_C_REFCK- - S77 PCIE_C_RST# - S29 PCIE_D_TX+ SERDES_0_TX+ S30 PCIE_D_TX- SERDES_0_TX- S32 PCIE_D_RX+ SERDES_0_RX+ S33 PCIE_D_RX- SERDES_0_RX- S45 - MDIO_CLK S46 - MDIO_DAT Table 35: PCIe Lane C&D / SERDES Pin Sharing SMARC 2.1.1 Specification © 2020 SGET e.V. Page 53 of 109](.smarc-hardware-specification-v2-1-1/slide-053.jpg) ## Slide 54 ![**3.17 SATA** The Module definition allows for one SATA port. The port *may* be SATA Gen 1, 2 or 3 as the Modules SOC allows. The Carrier SATA device *may* be selected as the Boot Device – see section Table 44 ‘Control of Boot Sources’ on page 63 Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- SATA0_TX+(br)SATA0_TX- P48(br)P49 Serial ATA Channel 0(br)Transmit Output Differential Pair O SATA Runtime Series AC coupled on Module(br)10 nF SATA0_RX+(br)SATA0_RX- P51(br)P52 Serial ATA Channel 0(br)Receive Input Differential Pair I SATA Runtime Series AC coupled on Module(br)10 nF SATA_ACT# S54 SATA Activity Indicator O OD(br)CMOS 3.3V Runtime Shall be able to sink 24mA or(br)more Carrier LED current Table 36: SATA Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 54 of 109](.smarc-hardware-specification-v2-1-1/slide-054.jpg) ## Slide 55 ![**3.18 Ethernet** The SMARC 2.0 pin-out supports two gigabit Ethernet capable ports. If only one is implemented, it **should** be GBE0. Additional Ethernet capabilities **may** be added by utilizing the optional SERDES (See section 3.16 ‘SERDES’ on page 52 and section 3.16.1 ‘PCI Express SERDES Pin Sharing’ on page 53). Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- GBE0_MDIO+ P30 Differential Pair Signals for External Transformer I/O GBE MDI Standby Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0, 1, 2, 3. The MDI can operate in 1000, 100, and 10Mbit/sec modes. Some pairs are unused in some modes according to the following: 1000 100 10 GBE0_MDIO- P29 Carrier Series Termination: Magnetics Module appropriate for 10/100/1000 GBE transceivers MDI0+/- B1_DA+/- TX+/- TX+/- GBE0_MD11+ P27 Carrier Parallel Termination: Secondary side center tap terminations appropriate for Gigabit Ethernet implementations MDI1+/- B1_DB+/- RX+/- RX+/- GBE0_MD11- P26 MDI2+/- B1_DC+/- GBE0_MD2+ P24 MDI3+/- B1_DD+/- GBE0_MD2- P23 GBE0_MD3+ P20 GBE0_MD3- P19 GBE0_LINK100# P21 Link Speed Indication LED for GBE0 100Mbps O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current.⁴ GBE0_LINK1000# P22 Link Speed Indication LED for GBE0 1000Mbps O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current.⁴ GBE0_LINK_ACT# P25 Link / Activity Indication LED Driven Low on Link (10, 100 or 1000 Mbps) Blinks on Activity O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current. ⁴ GBE0_CTREF P28 Center-Tap Reference Voltage for Carrier Board Ethernet Magnetic (if required by the Module GBE PHY) Analog 0 to 3.3V max Standby GBE0_SDP P6 IEEE 1588 Trigger Signal for Hardware Implementation of PTP (Precision Time Protocol) I/O CMOS 3.3V Standby ⁴ Needs Carrier based current limiting resistors and LEDs if used. The LED **may** be integrated into a Carrier RJ45 jack. A resistor of 68 ohms and a LED with the anode tied to Carrier 3.3V is typical SMARC 2.1.1 Specification © 2020 SGET e.V. Page 55 of 109](.smarc-hardware-specification-v2-1-1/slide-055.jpg) ## Slide 56 ![GBE1_MDI0+ S17 Differential Pair Signals for External Transformer Carrier Series Termination: Magnetics Module appropriate for 10/100/1000 GBE transceivers Carrier Parallel Termination: Secondary side center tap terminations appropriate for Gigabit Ethernet implementations I/O GBE MDI Standby Gigabit Ethernet Controller 1: Media Dependent Interface Differential Pairs 0, 1, 2, 3. The MDI can operate in 1000, 100, and 10Mbit/sec modes. Some pairs are unused in some modes according to the following: 1000 100 10 MDI0+/- B1_DA+/- TX+/- TX+/- MDI1+/- B1_DB+/- RX+/- RX+/- MDI2+/- B1_DC+/- MDI3+/- B1_DD+/- GBE1_MDI0- S18 GBE1_MDI1+ S20 GBE1_MDI1- S21 GBE1_MDI2+ S23 GBE1_MDI2- S24 GBE1_MDI3+ S26 GBE1_MDI3- S27 GBE1_LINK100# S19 Link Speed Indication LED for GBE1 100Mbps O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current. 4 GBE1_LINK1000# S22 Link Speed Indication LED for GBE1 1000Mbps O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current. 4 GBE1_LINK_ACT# S31 Link / Activity Indication LED Driven Low on Link (10, 100 or 1000 Mbps) Blinks on Activity O OD CMOS 3.3V Standby Shall be able to sink 24mA or more Carrier LED current. 4 GBE1_CTREF S28 Center-Tap Reference Voltage for Carrier Board Ethernet Magnetic (if required by the Module GBE PHY) Analog 0 to 3.3V max Standby GBE1_SDP P5 IEEE 1588 Trigger Signal for Hardware Implementation of PTP (Precision Time Protocol) I/O CMOS 3.3V Standby Table 37: Ethernet Signals GBE0 and GBE1 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 56 of 109](.smarc-hardware-specification-v2-1-1/slide-056.jpg) ## Slide 57 ![The slide displays section **3.19 Watchdog** followed by a table labeled **Table 38: Watchdog Signals**. **Table Headers:** Signal Name, Pin #, Description, I/O Type, I/O Level, Power Domain, PU / PD, Comments **Table Data:** * **Signal Name:** WDT_TIME_OUT# * **Pin #:** S145 * **Description:** Watch-Dog-Timer Output, low active * **I/O Type:** O CMOS * **I/O Level:** 1.8V * **Power Domain:** Runtime * **PU / PD:** (Blank) * **Comments:** (Blank) **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 57 of 109](.smarc-hardware-specification-v2-1-1/slide-057.jpg) ## Slide 58 ![**3.20 GPIO** 14 Module pins are allocated for GPIO (general purpose input / output) use. All pins *should* be capable of bi-directional operation. At Module power-up, the state of the GPIO pins *may not* be defined, and *may* briefly be configured in the “wrong” state, before boot loader code corrects them. Carrier designers *should* be aware of this and plan accordingly. Module designers *should* generally choose pins that are tri-stated or are inputs during power up and reset, but this *may not* always be the case. All GPIO pins *should* be weakly pulled up to 1.8V. If the pull-ups are implemented as discrete resistors, or resistor packs, a value of 470k *should* be used. SOC internal pull-up / current source features *may* be used instead of external resistors. All GPIO pins *shall* be capable of generating interrupts. The interrupt characteristics (edge or level sensitivity, polarity) are generally configurable in the SOC register set. **Table 39: GPIO Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- GPIO0 P108 GPIO Pin 0 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: CAM0_PWR# GPIO1 P109 GPIO Pin 1 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: CAM1_PWR# GPIO2 P110 GPIO Pin 2 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: CAM0_RST# GPIO3 P111 GPIO Pin 3 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: CAM1_RST# GPIO4 P112 GPIO Pin 4 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: HDA_RST# GPIO5 P113 GPIO Pin 5 Preferred Output I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: PWM_OUT GPIO6 P114 GPIO Pin 6 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ Alternative use: TACHIN GPIO7 P115 GPIO Pin 7 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO8 P116 GPIO Pin 8 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO9 P117 GPIO Pin 9 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO10 P118 GPIO Pin 10 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO11 P119 GPIO Pin 11 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO12 S142 GPIO Pin 12 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ GPIO13 S123 GPIO Pin 13 Preferred Input I/O CMOS 1.8V Runtime PU 470k⁵ ⁵ SMARC Spec also allows for SoC integrated Pull-Ups, these can be ≥ 20k. Max 2.2k PD should be implemented on Carrier if a low level needs to be ensured. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 58 of 109](.smarc-hardware-specification-v2-1-1/slide-058.jpg) ## Slide 59 ![**3.20.1 Alternative GPIO Pin Usage** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- CAM0_PWR# P108 Camera 0 Power Enable, Active Low Output O CMOS 1.8V Runtime PU 470k CAM1_PWR# P109 Camera 1 Power Enable, Active Low Output O CMOS 1.8V Runtime PU 470k CAM0_RST# P110 Camera 0 Reset, Active Low Output O CMOS 1.8V Runtime PU 470k CAM1_RST# P111 Camera 1 Reset, Active Low Output O CMOS 1.8V Runtime PU 470k HDA_RST# P112 HD Audio Reset, Active Low Output O CMOS 1.8V Runtime PU 470k PWM_OUT P113 Fan Speed Control O CMOS 1.8V Runtime PU 470k Uses the Pulse Width Modulation (PWM) technique to control the fan's RPM. TACHIN P114 Fan Tachometer Input I CMOS 1.8V Runtime PU 470k Table 40: Alternative Use of GPIO Signals **3.20.2 GPIO Pin Sharing** Pin # GPIO Signal Name Alternative Use :--- :--- :--- P108 GPIO0 CAM0_PWR# P109 GPIO1 CAM1_PWR# P110 GPIO2 CAM0_RST# P111 GPIO3 CAM1_RST# P112 GPIO4 HDA_RST# P113 GPIO5 PWM_OUT P114 GPIO6 TACHIN Table 41: GPIO Pin Sharing SMARC 2.1.1 Specification © 2020 SGET e.V. Page 59 of 109](.smarc-hardware-specification-v2-1-1/slide-059.jpg) ## Slide 60 ![**3.21 Management Pins** The input pins listed in this table are all active low and are meant to be driven by OD (open drain) devices on the Carrier. The Carrier either floats the line or drives it to GND. No Carrier pull-ups are needed. The pull-up functions are performed on the Module. The voltage rail that these lines are pulled to on the Module varies, depending on the design, and *may* be anywhere from 1.8V to 5V. Switches to GND *may* be used instead of OD drivers for lines such as PWR_BTN# and RESET_IN#. Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- BATLOW# S156 Battery low indication to Module. Carrier to float the line in inactive state. I OD CMOS 1.8 to 5 V Standby/Sleep PU 10k Driven by OD on Carrier. CARRIER_PWR_ON S154 Carrier Board circuits (apart from power management and power path circuits) **should not** be powered up until the Module asserts the CARRIER_PWR_ON signal. O CMOS 1.8V Standby On x86 designs this pin should utilize a standby related power signal i.e. RSM_RST# or SLP_A# signal. CARRIER_STBY# S153 The Module **shall** drive this signal low when the system is in a standby power state. O CMOS 1.8V Standby On x86 designs this pin should utilize the SUS_S3# signal. CHARGER_PRSNT# S152 Held low by Carrier if DC input for battery charger is present. I OD CMOS 1.8 to 5 V Standby/Sleep PU 10k Driven by OD on Carrier. CHARGING# S151 Held low by Carrier during battery charging. Carrier to float the line when charge is complete. I OD CMOS 1.8 to 5 V Standby/Sleep PU 10k Driven by OD on Carrier. VIN_PWR_BAD# S150 Power bad indication from Carrier Board. Module and Carrier power supplies (other than Module and Carrier power supervisory circuits) **shall not** be enabled while this signal is held low by the Carrier. I OD CMOS VDD_IN PU 10k Module must implement PU but actual value is depended on particular Module design. Driven by OD on Carrier SLEEP# S149 Sleep indicator from Carrier Board. **May** be sourced from user Sleep button or Carrier logic. Carrier to float the line in in-active state. Active low, level sensitive. **Should** be de-bounced on the Module. I OD CMOS 1.8 to 5V Standby PU 10k Driven by OD on Carrier. **SMARC 2.1.1 Specification** **© 2020 SGET e.V.** **Page 60 of 109**](.smarc-hardware-specification-v2-1-1/slide-060.jpg) ## Slide 61 ![Table 42: Management Signals Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- LID# S148 Lid open/close indication to Module. Low indicates lid closure (which system may use to initiate a sleep state). Carrier to float the line in in-active state. Active low, level sensitive. **Should** be de-bounced on the Module. I OD CMOS 1.8 to 5 V Standby PU 10k Driven by OD on Carrier. POWER_BTN# P128 Power-button input from Carrier Board. Carrier to float the line in in-active state. Active low, level sensitive. **Should** be debounced on the Module. I OD CMOS 1.8 to 5 V Sleep PU 10k Driven by OD on Carrier. RESET_OUT# P126 General purpose reset output to Carrier Board. O CMOS 1.8V Standby RESET_IN# P127 Reset input from Carrier Board. Carrier drives low to force a Module reset, floats the line otherwise. This signal **Shall** be level triggered during bootup to allow to stop booting of the module. After bootup it **May** act as an edge triggered signal. I OD CMOS 1.8 to 5 V Standby PU 10k Driven by OD on Carrier. I2C_PM_DAT P122 Power management I2C bus DATA I/O OD CMOS 1.8V Standby/Sleep PU 2k2 On x86 systems these serve as SMB DATA. I2C_PM_CK P121 Power management I2C bus CLK I/O OD CMOS 1.8V Standby/Sleep PU 2k2 On x86 systems these serve as SMB CLK. SMB_ALERT# P1 SMBus Alert# (Interrupt) Signal I OD CMOS 1.8 to 5 V Standby/Sleep PU 2k2 TEST# S157 Held Low by Carrier to Invoke Module Vendor Specific Test Functions I OD CMOS 1.8 to 5 V Standby/Sleep PU vendor specific value Module must implement PU but actual value is depended on particular Module design. Carrier Board should leave this pin floating for normal operation. Driven by OD on Carrier Table 42: Management Signals SMARC 2.1.1 Specification © 2020 SGET e.V. Page 61 of 109](.smarc-hardware-specification-v2-1-1/slide-061.jpg) ## Slide 62 ![**3.22 Boot Select** Three Module pins allow the Carrier Board user to select from eight possible boot devices. Three are Module devices, and four are Carrier devices, and one is a remote device. The pins *shall* be weakly pulled up on the Module and the pin states decoded by Module logic. The Carrier *shall* either leave the Module pin Not Connected (“Float” in the table below) or *shall* pull the pin to GND, per the second table below. A “Force Recovery” provision exists, per the pin description below. **Table 43: Boot Select Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- BOOT_SELO# P123 Input straps determine the Module boot device. I OD CMOS 1.8V Standby PU 10k Driven by OD on Carrier. BOOT_SEL1# P124 BOOT_SEL2# P125 FORCE_RECOV# S155 Low on this pin allows non-protected segments of Module boot device to be rewritten / restored from an external USB Host on Module USB0. The Module USB0 operates in Client Mode when in the Force Recovery function is invoked. Pulled high on the Module. For SOCs that do not implement a USB based Force Recovery functions, then a low on the Module FORCE_RECOV# pin may invoke the SOC native Force Recovery mode – such as over a Serial Port. For x86 systems this signal may be used to load BIOS defaults. Pulled up on Module. Driven by OD part on Carrier. I OD CMOS 1.8V Standby PU 10k Driven by OD on Carrier. **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 62 of 109](.smarc-hardware-specification-v2-1-1/slide-062.jpg) ## Slide 63 ![**Carrier Connection** BOOT_SEL2# BOOT_SEL1# BOOT_SEL0# Boot Source 0 GND GND GND Carrier SATA 1 GND GND Float Carrier SD Card 2 GND Float GND Carrier eSPI (CS0#) 3 GND Float Float Carrier SPI (CS0#) 4 Float GND GND Module device (NAND, NOR) – vendor specific 5 Float GND Float Remote boot (GBE, serial) – vendor specific 6 Float Float GND Module eMMC Flash 7 Float Float Float Module SPI Table 44: Control of Boot Sources Note: The boot sources shown above are Module options, and may not be available on all Module designs. The definition of “boot” is left to the Module designer. Some designs may literally implement some or all of the table above, such that the first off-SOC code fetches come from the devices listed above. Alternatively, some designs may always fetch the first few off-SOC instructions from a fixed device, likely a SPI Flash EEPROM, and then re-direct the execution to another device per the table above. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 63 of 109](.smarc-hardware-specification-v2-1-1/slide-063.jpg) ## Slide 64 ![**3.23 Power and GND** See section 6 'Module Power' on page 85 for details on input voltages and power sequencing. **Table 45: Power Signals** Signal Name Pin # Description I/O Type I/O Level Power Domain PU / PD Comments :--- :--- :--- :--- :--- :--- :--- :--- VDD\_IN P147, P148, P149, P150, P151, P152, P153, P154, P155, P156 Module power input voltage - 3.0V min to 5.25V max Analog 3.0V to 5.25V GND P2, P9, P12, P15, P18, P32, P38, P47, P50, P53, P59, P68, P79, P82, P85, P88, P91, P94, P97, P100, P103, P120, P133, P142, S3, S10, S16, S25, S34, S47, S61, S64, S67, S70, S73, S80, S83, S86, S89, S92, S101, S110, S119, S124, S130, S136, S143, S158 Module signal and power return, and GND reference Analog Ground VDD\_RTC S147 Low current RTC circuit backup power – 3.0V nominal. May be sourced from a Carrier based lithium cell or super cap. Analog 2.0V to 3.25V **Table 45: Power Signals** **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 64 of 109](.smarc-hardware-specification-v2-1-1/slide-064.jpg) ## Slide 65 ![**3.24 JTAG** A CPU JTAG interface *may* be implemented on the Module, using a small form factor R/A SMT connector. The JTAG pins are used to allow test equipment and circuit emulators to have access to the Module CPU. The pin-out shown below *may* be used: Signal Name Pin # Description I/O Type I/O Level Comments :--- :--- :--- :--- :--- :--- VDD_JTAG 1 JTAG I/O Voltage (sourced by Module) 1.8 to 3.3V Voltage level depends on the used SOC. Check implementation details with module vendor. A JTAG adapter might use this voltage to adapt the required JTAG signal levels. JTAG_TRST# 2 JTAG reset, active low I CMOS VDD_JTAG JTAG_TMS 3 JTAG mode select I CMOS VDD_JTAG JTAG_TDO 4 JTAG data out O CMOS VDD_JTAG JTAG_TDI 5 JTAG data in I CMOS VDD_JTAG JTAG_TCK 6 JTAG clock I CMOS VDD_JTAG JTAG_RTCK 7 JTAG return clock I CMOS VDD_JTAG JTAG_RESET_IN# 8 Pulled high at module I OD CMOS VDD_JTAG MFG_MODE# 9 Pulled low to allow in-circuit SPI ROM update I CMOS VDD_JTAG Pulled low to allow in-circuit SPI ROM update GND 10 Table 46: JTAG Signals The Module JTAG connector *may* be implemented with a JST SH series 1mm pitch R/A wire mount header (JST SM10B-SRSS-TB). FCI 10051922-1010EHLF, SUNFUN Technology LTDFDS0520-10-11Z, Most Well Technology Corp. MWAFC07-S10-FBA-HFSMARC 2.1JTAG (Diagram showing dimensions) 5.72 0.18 3.40 3.75 7.50 4.5 Pitch 0.5 1.3 Figure 3: JTAG Connector SMARC 2.1.1 Specification © 2020 SGET e.V. Page 65 of 109](.smarc-hardware-specification-v2-1-1/slide-065.jpg) ## Slide 66 ![**3.25 Module Terminations** **3.25.1 General** The required Carrier and Module terminations and the component values are described in the signal tables above, although the final decision on specific component values and types is left to the Module designer. SMARC Module pins of unused features *may* be left un-connected. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 66 of 109](.smarc-hardware-specification-v2-1-1/slide-066.jpg) ## Slide 67 ![**4 MODULE PIN-OUT MAP** **4.1 Module Pin-Out** **P-PIN Primary (Top) Side** P1 SMB_ALERT# P2 GND P3 CSI1_CK+ P4 CSI1_CK- P5 GBE1_SDP P6 GBE0_SDP P7 CSI1_RX0+ P8 CSI1_RX0- P9 GND P10 CSI1_RX1+ P11 CSI1_RX1- P12 GND P13 CSI1_RX2+ P14 CSI1_RX2- P15 GND P16 CSI1_RX3+ P17 CSI1_RX3- P18 GND P19 GBE0_MDI3- P20 GBE0_MDI3+ P21 GBE0_LINK100# P22 GBE0_LINK1000# P23 GBE0_MDI2- P24 GBE0_MDI2+ P25 GBE0_LINK_ACT# P26 GBE0_MDI1- **S-Pin Secondary (Bottom) Side** 6 S1 CSI1_TX+ / I2C_CAM1_CK S2 CSI1_TX- / I2C_CAM1_DAT S3 GND S4 RSVD S5 CSI0_TX+ / I2C_CAM0_CK S6 CAM_MCK S7 CSI0_TX- / I2C_CAM0_DAT S8 CSI0_CK+ S9 CSI0_CK- S10 GND S11 CSI0_RX0+ S12 CSI0_RX0- S13 GND S14 CSI0_RX1+ S15 CSI0_RX1- S16 GND S17 GBE1_MDI0+ S18 GBE1_MDI0- S19 GBE1_LINK100# S20 GBE1_MDI1+ S21 GBE1_MDI1- S22 GBE1_LINK1000# S23 GBE1_MDI2+ S24 GBE1_MDI2- S25 GND S26 GBE1_MDI3+ S27 GBE1_MDI3- 6 Shielding should be provided on the Carrier Board close to the Pins S1 and S75 as differential pairs need ground or static signals right and left. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 67 of 109](.smarc-hardware-specification-v2-1-1/slide-067.jpg) ## Slide 68 ![**P-PIN Primary (Top) Side** P27 GBE0_MDI1+ P28 GBE0_CTREF P29 GBE0_MDI0- P30 GBE0_MDI0+ P31 SPI0_CS1# P32 GND P33 SDIO_WP P34 SDIO_CMD P35 SDIO_CD# P36 SDIO_CK P37 SDIO_PWR_EN P38 GND P39 SDIO_D0 P40 SDIO_D1 P41 SDIO_D2 P42 SDIO_D3 P43 SPI0_CS0# P44 SPI0_CK P45 SPI0_DIN P46 SPI0_DO P47 GND P48 SATA_TX+ P49 SATA_TX- P50 GND P51 SATA_RX+ P52 SATA_RX- P53 GND P54 ESPI_CS0# / SPI1_CS0# / QSPI_CS0# P55 ESPI_CS1# / SPI1_CS1# / QSPI_CS1# P56 ESPI_CK / SPI1_CK / QSPI_CK P57 ESPI_IO_1 / SPI1_DIN / QSPI_IO_1 P58 ESPI_IO_0 / SPI1_DO / QSPI_IO_0 P59 GND P60 USB0+ **S-Pin Secondary (Bottom) Side** S28 GBE1_CTREF S29 PCIE_D_TX+ / SERDES_0_TX+ S30 PCIE_D_TX- / SERDES_0_TX- S31 GBE1_LINK_ACT# S32 PCIE_D_RX+ / SERDES_0_RX+ S33 PCIE_D_RX- / SERDES_0_RX- S34 GND S35 USB4+ S36 USB4- S37 USB3_VBUS_DET S38 AUDIO_MCK S39 I2S0_LRCK S40 I2S0_SDOUT S41 I2S0_SDIN S42 I2S0_CK S43 ESPI_ALERT0# S44 ESPI_ALERT1# S45 MDIO_CLK S46 MDIO_DAT S47 GND S48 I2C_GP_CK S49 I2C_GP_DAT S50 HDA_SYNC / I2S2_LRCK S51 HDA_SDO / I2S2_SDOUT S52 HDA_SDI / I2S2_SDIN S53 HDA_CK / I2S2_CK S54 SATA_ACT# S55 USB5_EN_OC# S56 ESPI_IO_2 / QSPI_IO_2 S57 ESPI_IO_3 / QSPI_IO_3 S58 ESPI_RESET# S59 USB5+ S60 USB5- S61 GND **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 68 of 109](.smarc-hardware-specification-v2-1-1/slide-068.jpg) ## Slide 69 ![**Left Column:** P-PIN Primary (Top) Side P61 USB0- P62 USB0_EN_OC# P63 USB0_VBUS_DET P64 USB0_OTG_ID P65 USB1+ P66 USB1- P67 USB1_EN_OC# P68 GND P69 USB2+ P70 USB2- P71 USB2_EN_OC# P72 RSVD P73 RSVD P74 USB3_EN_OC# Key P75 PCIE_A_RST# P76 USB4_EN_OC# P77 PCIE_B_CKREQ# P78 PCIE_A_CKREQ# P79 GND P80 PCIE_C_REFCK+ P81 PCIE_C_REFCK- P82 GND P83 PCIE_A_REFCK+ P84 PCIE_A_REFCK- P85 GND P86 PCIE_A_RX+ P87 PCIE_A_RX- P88 GND P89 PCIE_A_TX+ **Right Column:** S-Pin Secondary (Bottom) Side S62 USB3_SSTX+ S63 USB3_SSTX- S64 GND S65 USB3_SSRX+ S66 USB3_SSRX- S67 GND S68 USB3+ S69 USB3- S70 GND S71 USB2_SSTX+ S72 USB2_SSTX- S73 GND S74 USB2_SSRX+ S75 USB2_SSRX- Key⁷ S76 PCIE_B_RST# S77 PCIE_C_RST# S78 PCIE_C_RX+ / SERDES_1_RX+ S79 PCIE_C_RX- / SERDES_1_RX- S80 GND S81 PCIE_C_TX+ / SERDES_1_TX+ S82 PCIE_C_TX- / SERDES_1_TX- S83 GND S84 PCIE_B_REFCK+ S85 PCIE_B_REFCK- S86 GND S87 PCIE_B_RX+ S88 PCIE_B_RX- S89 GND S90 PCIE_B_TX+ **Footer Notes:** 7 Shielding should be provided on the Carrier Board close to the Pins S1 and S75 as differential pairs need ground or static signals right and left. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 69 of 109](.smarc-hardware-specification-v2-1-1/slide-069.jpg) ## Slide 70 ![**Left Table** P-PIN Primary (Top) Side P90 PCIE_A_TX- P91 GND P92 HDMI_D2+ / DP1_LANE0+ P93 HDMI_D2- / DP1_LANE0- P94 GND P95 HDMI_D1+ / DP1_LANE1+ P96 HDMI_D1- / DP1_LANE1- P97 GND P98 HDMI_D0+ / DP1_LANE2+ P99 HDMI_D0- / DP1_LANE2- P100 GND P101 HDMI_CK+ / DP1_LANE3+ P102 HDMI_CK- / DP1_LANE3- P103 GND P104 HDMI_HPD / DP1_HPD P105 HDMI_CTRL_CK / DP1_AUX+ P106 HDMI_CTRL_DAT / DP1_AUX- P107 DP1_AUX_SEL P108 GPIO0 / CAM0_PWR# P109 GPIO1 / CAM1_PWR# P110 GPIO2 / CAM0_RST# P111 GPIO3 / CAM1_RST# P112 GPIO4 / HDA_RST# P113 GPIO5 / PWM_OUT P114 GPIO6 / TACHIN P115 GPIO7 P116 GPIO8 P117 GPIO9 P118 GPIO10 P119 GPIO11 P120 GND P121 I2C_PM_CK P122 I2C_PM_DAT P123 BOOT_SEL0# **Right Table** S-Pin Secondary (Bottom) Side S91 PCIE_B_TX- S92 GND S93 DP0_LANE0+ S94 DP0_LANE0- S95 DP0_AUX_SEL S96 DP0_LANE1+ S97 DP0_LANE1- S98 DP0_HPD S99 DP0_LANE2+ S100 DP0_LANE2- S101 GND S102 DP0_LANE3+ S103 DP0_LANE3- S104 USB3_OTG_ID S105 DP0_AUX+ S106 DP0_AUX- S107 LCD1_BKL_T_EN S108 LVDS1_CK+ / eDP1_AUX+ / DSI1_CLK+ S109 LVDS1_CK- / eDP1_AUX- / DSI1_CLK- S110 GND S111 LVDS1_0+ / eDP1_TX0+ / DSI1_D0+ S112 LVDS1_0- / eDP1_TX0- / DSI1_D0- S113 eDP1_HPD / DSI1_TE S114 LVDS1_1+ / eDP1_TX1+ / DSI1_D1+ S115 LVDS1_1- / eDP1_TX1- / DSI1_D1- S116 LCD1_VDD_EN S117 LVDS1_2+ / eDP1_TX2+ / DSI1_D2+ S118 LVDS1_2- / eDP1_TX2- / DSI1_D2- S119 GND S120 LVDS1_3+ / eDP1_TX3+ / DSI1_D3+ S121 LVDS1_3- / eDP1_TX3- / DSI1_D3- S122 LCD1_BKL_PWM S123 GPIO13 S124 GND **Footer** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 70 of 109](.smarc-hardware-specification-v2-1-1/slide-070.jpg) ## Slide 71 ![**Table 1: P-PIN / Primary (Top) Side** * **P124**: BOOT_SEL1# * **P125**: BOOT_SEL2# * **P126**: RESET_OUT# * **P127**: RESET_IN# * **P128**: POWER_BTN# * **P129**: SER0_TX * **P130**: SER0_RX * **P131**: SER0_RTS# * **P132**: SER0_CTS# * **P133**: GND * **P134**: SER1_TX * **P135**: SER1_RX * **P136**: SER2_TX * **P137**: SER2_RX * **P138**: SER2_RTS# * **P139**: SER2_CTS# * **P140**: SER3_TX * **P141**: SER3_RX * **P142**: GND * **P143**: CAN0_TX * **P144**: CAN0_RX * **P145**: CAN1_TX * **P146**: CAN1_RX * **P147**: VDD_IN * **P148**: VDD_IN * **P149**: VDD_IN * **P150**: VDD_IN * **P151**: VDD_IN * **P152**: VDD_IN * **P153**: VDD_IN * **P154**: VDD_IN * **P155**: VDD_IN * **P156**: VDD_IN **Table 2: S-Pin / Secondary (Bottom) Side** * **S125**: LVDS0_0+ / eDP0_TX0+ / DSI0_D0+ * **S126**: LVDS0_0- / eDP0_TX0- / DSI0_D0- * **S127**: LCD0_BKLT_EN * **S128**: LVDS0_1+ / eDP0_TX1+ / DSI0_D1+ * **S129**: LVDS0_1- / eDP0_TX1- / DSI0_D1- * **S130**: GND * **S131**: LVDS0_2+ / eDP0_TX2+ / DSI0_D2+ * **S132**: LVDS0_2- / eDP0_TX2- / DSI0_D2- * **S133**: LCD0_VDD_EN * **S134**: LVDS0_CK+ / eDP0_AUX+ / DSI0_CLK+ * **S135**: LVDS0_CK- / eDP0_AUX- / DSI0_CLK- * **S136**: GND * **S137**: LVDS0_3+ / eDP0_TX3+ / DSI0_D3+ * **S138**: LVDS0_3- / eDP0_TX3- / DSI0_D3- * **S139**: I2C_LCD_CK * **S140**: I2C_LCD_DAT * **S141**: LCD0_BKLT_PWM * **S142**: GPIO12 * **S143**: GND * **S144**: eDP0_HPD / DSI0_TE * **S145**: WDT_TIME_OUT# * **S146**: PCIE_WAKE# * **S147**: VDD_RTC * **S148**: LID# * **S149**: SLEEP# * **S150**: VIN_PWR_BAD# * **S151**: CHARGING# * **S152**: CHARGER_PRSNT# * **S153**: CARRIER_STBY# * **S154**: CARRIER_PWR_ON * **S155**: FORCE_RECOV# * **S156**: BATLOW# * **S157**: TEST# * **S158**: GND **Footer** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 71 of 109](.smarc-hardware-specification-v2-1-1/slide-071.jpg) ## Slide 72 ![The slide features the header 'Table 47: Module Pin-Out' above a large blank space. The footer includes 'SMARC 2.1.1 Specification' on the left, '© 2020 SGET e.V.' in the center, and 'Page 72 of 109' on the right.](.smarc-hardware-specification-v2-1-1/slide-072.jpg) ## Slide 73 ![**5 MECHANICAL DEFINITIONS** **5.1 Carrier Connector** The Carrier Board connector is a 314 pin 0.5mm pitch right angle part designed for use with 1.2mm thick mating PCBs with the appropriate edge finger pattern. The connector is commonly used for MXM3 graphics cards. The SMARC Module uses the connector in a way quite different from the MXM3 usage. **Table 48: Carrier Connectors** Vendor Vendor P/N Stack Height Body Height Contact Plating Pin Style Body Color Notes :--- :--- :--- :--- :--- :--- :--- :--- Foxconn AS0B821-S43B - *H 1.5mm 4.3mm Flash Std Black Foxconn AS0B821-S43N - *H 1.5mm 4.3mm Flash Std Ivory Foxconn AS0B826-S43B - *H 1.5mm 4.3mm 10 u-in Std Black Foxconn AS0B826-S43N - *H 1.5mm 4.3mm 10 u-in Std Ivory JAE MM70-314B2-1-R500 1.5mm 4.3mm 0.1 u-meter Std Black Aces 91781-314 2 8-001 2.7mm 5.2mm 3 u-in Std Black Foxconn AS0B821-S55B 2.7mm 5.5mm Flash Std Black Foxconn AS0B821-S55N - *H 2.7mm 5.5mm Flash Std Ivory Foxconn AS0B826-S55B - *H 2.7mm 5.5mm 10 u-in Std Black Foxconn AS0B826-S55N - *H 2.7mm 5.5mm 10 u-in Std Ivory Foxconn AS0B821-S78B - *H 5.0mm 7.8mm Flash Std Black Foxconn AS0B821-S78N - *H 5.0mm 7.8mm Flash Std Ivory Foxconn AS0B826-S78B - *H 5.0mm 7.8mm 10 u-in Std Black Foxconn AS0B826-S78N - *H 5.0mm 7.8mm 10 u-in Std Ivory Yamaichi CN113-314-2001 5.0mm 7.8mm 0.3 u-meter Std Black Automotive Grade Other, taller stack heights *may* be available from these and other vendors. Stack heights as tall as 11mm are shown on the Aces web site. **Note:** Many of the vendor drawings for the connectors listed above show a PCB footprint pattern for use with an MXM3 graphics card. This footprint, and the associated pin numbering, is not suitable for SMARC use. The MXM3 standard gangs large groups of pins together to provide ~80W capable power paths needed for X86 graphics cards. The SMARC Module 'ungangs' these pins to allow more signal pins. Footprint and pin numbering information for application of this 314 pin connector to SMARC is given in the sections below. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 73 of 109](.smarc-hardware-specification-v2-1-1/slide-073.jpg) ## Slide 74 ![**5.2 Connector Pin Numbering Convention** The Module pins are designated as P1 – P156 on the Module Primary (Top) side, and S1 – S158 on the Module Secondary (Bottom) side. There is a total of 314 pins on the Module. The connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key (4 on the primary side and 3 on secondary side). The Secondary (Bottom) side faces the Carrier Board when a normal or standard Carrier connector is used. Some connector vendors offer “reverse” pin-out connectors, which effectively flip the Module over such that the Module Primary side would face the Carrier Board. The SMARC Module pins are deliberately numbered as P1 – P156 and S1 – S158 for clarity and to differentiate the SMARC Module from MXM3 graphics Modules, which use the same connector but use the pins for very different functions. MXM3 cards and MXM3 baseboard connectors use a different pin numbering scheme. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 74 of 109](.smarc-hardware-specification-v2-1-1/slide-074.jpg) ## Slide 75 ![**Header:** 5.3 Module Outline – 82x50mm Module Figure 4 details the 82mm x 50mm Module mechanical attributes, including the pin numbering and edge finger pattern. **Main Diagrams:** * **Module Primary (Top) Side:** Shows a rectangular outline with dimensions 50 and 46. Mounting holes are labeled '4X Ø6' and '4X Ø2.70 THROUGH'. Edge connector pins are labeled '74 PINS P1 - P74' and '82 PINS P75 - P156'. Specific dimensions include 12, 7.70, 6.20, 3.30, 3.10, 0, a distance of 39, and '1.25 PIN P1'. * **Module Primary (Bottom) Side:** Shows the bottom view with edge connectors. Pins are labeled '1.00 PIN S1', '75 PINS S1 - S75', and '83 PINS S76 - S158'. Individual pin labels 'S1', 'S75', 'S76', and 'S158' are visible near the connector edge. **Detail Views:** * **DETAILA TOP SIDE:** Shows pins P74 and P75. Dimensions include '73X0.50', '( 3.30)', '3.10 TYP', '1.00', '1.25', '1.25', 'FULL RAD', '81X0.50', and '156X0.35'. * **DETAILD NOTCH, 2 PLACES:** Shows a corner notch with label 'S1'. Dimensions include '1.70', '(6.20)', '(1.50)', and '2X R0.50'. * **PIN ALIGNMENT DETAL:** A circular view labeled 'TOP SIDE' and 'BOTTOM SIDE'. Shows pins 'P74', 'P75', 'S76', 'S75' with a gap dimension of '0.25'. * **DETAILB BOTTOM SIDE:** Shows pins S75 and S76. Dimensions include '1', '1', '74X0.50', '158X0.35', '82X0.50', and '3.10 TYP'. * **CHAMFERED EDGE DETAL:** Shows a chamfer dimension '0.18', width '1.20±0.1', and angle '45°'. * **Component Height:** Shows '3.00 MAX COMPONENT HEIGHT (TOP SIDE)' and '1.30 MAX COMPONENT HEIGHT (BOTTOM SIDE)'. **Footer:** Figure 4: 82x50mm Module Outline SMARC 2.1.1 Specification © 2020 SGET e.V. Page 75 of 109](.smarc-hardware-specification-v2-1-1/slide-075.jpg) ## Slide 76 ![It is recommended that Module components be kept away from the edge fingers, on the top and bottom sides, per the following figure: Keep Out Area (Top and Bottom Side) 5.10 mm Figure 5: Module Edge Finger Keep Out Area (82x50mm Module) **5.4 Module Outline – 82x80mm Module** The PCB edge finger pattern and spacing details relative to the board edges and lower mounting holes are the same as for the 82mm x 50mm case (see section 5.3 'Module Outline – 82x50mm Module' above), and are not repeated here. 0...4 78 82 80 76 46 12 Module Primary (Top) Side 7x Ø 2.70mm through 7x Ø 6.00mm both side Figure 6: 82x80mm Module Outline Keep Out Area (Top and Bottom Side) 5.10 mm Figure 7: Module Edge Finger Keep Out Area (82x80mm Module) SMARC 2.1.1 Specification © 2020 SGET e.V. Page 76 of 109](.smarc-hardware-specification-v2-1-1/slide-076.jpg) ## Slide 77 ![**5.4.1 RF Connector Placement** If onboard wireless technologies are provided the required high frequency antenna connectors shall be placed at the described positions on the top side of the Modules. If no wireless technologies are provided this position may be used for other components. u.FL male connectors should be used on the Modules. These are miniature RF connectors with an impedance of 50 ohm for antenna applications. U.FL connectors are commonly used for Wi-Fi or GPS in space critical applications. The mated connection is only 2.5 mm high and only requires 3 mm² of board space. u.FL connectors are patented by Hirose but there are many other suppliers offering this connectors. **Figure 8: u.FL connector** **Figure 9: RF connector placement (82x80mm Module)** Diagram text: 'Preferred Area for RF Connectors (Top Side)', 'Keep Out Area (Top and Bottom Side)', '5.10 mm' **Figure 10: RF connector placement (82x50mm Module)** Diagram text: 'Preferred Area for RF Connectors (Top Side)', 'Keep Out Area (Top and Bottom Side)', '5.10 mm' SMARC 2.1.1 Specification © 2020 SGET e.V. Page 77 of 109](.smarc-hardware-specification-v2-1-1/slide-077.jpg) ## Slide 78 ![**5.5 Module 'Z' Height Considerations** Note from above that the component height on the Module is restricted to a maximum component height of 3mm on the Module Primary (Top) side and to 1.3mm on the Module Secondary (Bottom) side. The 1.3mm Secondary side component height restriction allows the Module to be used with 1.5mm stack-height Carrier connectors. When used with 1.5mm stack height connectors, the 'Z' height profile from Carrier Board Top side to tallest Module component is 5.7mm. When a 1.5mm stack height Carrier Board connector is used, there shall not be components on the Carrier Board Top side in the Module region. Additionally, when 1.5mm stack height connectors are used, there should not be PCB traces on the Carrier top side in the Module shadow. This is to prevent possible problems with metallic Module heat sink attachment hardware that may protrude through the Module. If Carrier Board components are required in this region, then the Carrier components must be on the Carrier Bottom side, or a taller Module – to – Carrier connector may be used. Stack heights of 2.7mm, 3mm, 5mm and up are available. Not shown in the Figure 11 below are any thermal dissipation components (heat sinks, heat spreaders, etc) nor is fastening hardware (standoffs, spacers, screws, washers, etc) shown. The dimensions of those components must of course be considered in a system design. (Diagram labels) * 5.7mm Min. * 1.5mm Min. * TOP Side Component 3.0mm Max. * Module PCB 1.2mm Typ. * BOT Side Component 1.3mm Max. * Carrier PCB 1.6mm Typ. * Carrier Connector Figure 11: Module Minimum 'Z' Height Note: There is no clearance defined between heatspreader height and component height. The heatspreader designer, which is usually the module designer has to handle that, e.g. by pockets in the heatspreader. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 78 of 109](.smarc-hardware-specification-v2-1-1/slide-078.jpg) ## Slide 79 ![The slide presents a technical schematic titled '**5.6 Carrier Board Connector PCB Footprint**'. **Diagram Content:** The central image is a detailed engineering drawing of a PCB layout showing mounting holes, pad arrangements, and various dimensions (e.g., 74.0, 64.0, 34.0). Text annotations surrounding the diagram include: * 'STANDOFF HEIGHT DEPENDS ON CONNECTOR SELECTION 1.5MM MINIMUM, 5MM IS ALSO COMMON' * '3X USED ONLY ON 82 X 80 MODULE' * 'HOLE DIAMETER IN PCB IS DEPENDENT ON MOUNTING HARDWARE SELECTED, MUST BE M2.5 THREADED THROUGH HOLE' * '4X 6.0MM GROUND PAD BOTH SIDES (82MM X 50MM MODULE)' * '7X 6.0MM GROUND PAD BOTH SIDES (82 X 80 MODULES)' * '75 PADS (S1 - S75)' * '83 PADS (S76 - S158)' * '74 PADS (P1-P74)' * '82 PADS (P75 - P156)' * Labels for 'S' PINS and 'P' PINS are also visible near the connector rows. **Text Below Diagram:** * **Caption:** 'Figure 12: Carrier Board Connector PCB Footprint' * **Note 1:** 'Note: The pin numbering shown here is different from the pin numbering used in an MXM3 application. In an SMARC application, all 314 pins of the connector are used individually. The MXM3 power ganging is not used.' * **Note 2:** 'Note: The hole diameter for the 4 holes (82mm x 50mm Module) or 7 holes (82mm x 80mm Module) depends on the spacer hardware selection. See the section 5.7 'GND Connection' below for more information.' **Footer:** 'SMARC 2.1.1 Specification' '© 2020 SGET e.V.' 'Page 79 of 109'](.smarc-hardware-specification-v2-1-1/slide-079.jpg) ## Slide 80 ![**5.7 GND Connection Mounting Holes** It *shall* be possible to tie all Module and Carrier Board mounting holes to GND. The holes *should* be tied directly to the GND planes, although Module and Carrier designers *may* optionally make the mounting hole GND connections through passive parts, allowing the mounting holes to be isolated from GND if they feel it necessary. **5.8 Carrier Board Standoffs** Standoffs secured to the Carrier Board are expected. The standoffs are to be used with M2.5 hardware. Most implementations will use Carrier Board standoffs that have M2.5 threads (as opposed to clearance holes). A short M2.5 screw and washer, inserted from the Module top side, secures the Module to the Carrier Board threaded standoff. **5.9 Thermal Attachment Points** Attachment points for thermal heat sinks and thermal dissipaters, if needed, are Module design dependent. Thermal hardware *should* be attached to the Module using attachment points other than the Module mounting holes (4 mounting holes for the 82mm x 50mm and 7 mounting holes for the 82mm x 80mm Module). The Module mounting holes *should* be clear for securing the Module to the Carrier. Having thermal attachment points separate from the Module mounting holes allows the thermal solution to be shipped with the Module, attached to the Module with thermal interface materials applied, and avoids the disassembly of the thermal interface materials when the end-users places the Module their system. The Module mounting holes *may* be used as supplemental thermal attachment points. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 80 of 109](.smarc-hardware-specification-v2-1-1/slide-080.jpg) ## Slide 81 ![**5.10 Heat Spreader – 82mm x 50mm Module** A standard heat-spreader plate for use with the SMARC 82mm x 50mm form factor is described below. A standard heat spreader plate definition allows the customer to use a Module from multiple vendors, and the details of the thermal interface to the Module ICs – which can be tricky – becomes the Module designer’s problem. The heat spreader plate is sized at 82mm x 42mm x 3mm, and sits 3mm above the SMARC Module. The heat spreader plate ‘Y’ dimension is deliberately set at 42mm and not 50mm, to allow the plate to clear the SMARC MXM3 connector. The plate is shown in the Figure 13 below. Figure 13: Heat Spreader Isometric View The internal square in the Figure 13 above is a thermally conductive and mechanically compliant Thermal Interface Material (or “TIM”). The exact X-Y position and Z thickness details of the TIM vary from design to design. The two holes immediately adjacent to the TIM serve to secure the PCB in the SOC area and compress the TIM. The four interior holes that are further from the center allow a heat sink to be attached to the heat spreader plate, or they can be used to secure the heat spreader plate to a chassis wall that serves as a heat sink. Dimensions and further details **may** be found in the Figure 14 ‘Heat Spreader Plan View’ on the following page. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 81 of 109](.smarc-hardware-specification-v2-1-1/slide-081.jpg) ## Slide 82 ![**Figure 14: Heat Spreader Plan View** Dimensions in the figure above are in millimeters. “TIM” stands for “Thermal Interface Material”. The TIM takes up the small gap between the SOC top and the Module - facing side of the heat spreader. **Table 49: Heat Spreader Hole Reference** * **Hole Reference A** * **Description:** SMARC Module corner mounting holes Spacing determined by SMARC specification for 82mm x 50mm Modules. Typically, these holes have 3mm length press fit or swaged clearance standoffs on the Module side. These holes are typically countersunk on the far side of the plate, to allow the heat spreader plate to be flush with a secondary heat sink. * **Size:** Hole size depends on standoffs used. Standoff diameter must be compatible with SMARC Module mounting hole pad and hole size (6.0mm pads, 2.7mm holes on the Module). The holes and standoffs are for use with M2.5 screw hardware. The far side of these holes are counter-sunk to allow the attachment screw to be flush with the far side heat spreader surface. * **Hole Reference B** * **Description:** Design – specific attachment points. The X-Y position, size and finish details of these holes *may* vary between designs. * **Size:** Varies, design dependent The far side of these holes are counter-sunk to allow the attachment screw to be flush with the far side heat spreader surface. * **Hole Reference C** * **Description:** Fixed location holes to allow the attachment of a heat sink to the heat spreader, or to allow the heat spreader to be secured to a chassis wall that can serve as a heat sink. * **Size:** M3 threaded holes **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 82 of 109](.smarc-hardware-specification-v2-1-1/slide-082.jpg) ## Slide 83 ![The slide presents technical diagrams of a heat sink alongside a detailed description of its specifications and attachment methods. **Visuals:** Four views of a heat sink are shown: * Top left: Side view with a dimension of **63.2**. * Bottom left: Front view (grid of holes with four corner mounting holes) with a dimension of **42.0**. * Center: Side profile view showing fin thickness with a dimension of **8.0**. * Top right: Isometric 3D view. **Caption:** Figure 15: Heat Sink Attachment Option **Body Text:** This figure shows an optional heat sink that can be added on to the heat spreader plate. Some situations may require a taller heat sink and / or one with an embedded fan. The four holes in the heat sink above are used with M3 flat head screws. The screws engage the 'C' holes in the heat spreader plate in Figure 14 'Heat Spreader Plan View' on the previous page. A relatively large, thin TIM is required between the heat spreader plate 'Far Side' and the flat surface of the heat sink. The heat sink Y dimension matches the 42mm Y dimension of the heat spreader plate. The X dimension of the heat sink is less, at 63.2 mm, than the 82 mm length of the heat spreader plate. This is to allow the heat sink to clear the four Module corner holes (the 'A' holes in Figure 14 'Heat Spreader Plan View'). The heat sink Z dimension can vary according to the thermal situation at hand. Alternatively, the system enclosure wall may be used as the heat sink. In this case, the heat spreader plate is secured to the enclosure wall via the four 'C' holes shown in Figure 14 'Heat Spreader Plan View' on the previous page. A large, thin TIM is then required between the heat spreader plate 'Far Side' and the enclosure wall. **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 83 of 109](.smarc-hardware-specification-v2-1-1/slide-083.jpg) ## Slide 84 ![**5.11 Heat Spreader – 82mm x 80mm Module** The heat spreader for an 82mm x 80mm Module is similar to the heat spreader for the 82mm x 50mm Module, but is extended upward by 30mm and appropriate additional holes are provided. The ‘A’ and ‘C’ hole drill details are the same as the ‘A’ and ‘C’ holes on the heat spreader for the 82mm x 50mm Module. The TIM and the B holes are not fixed, and may be in locations other than what is shown in Figure 16. **Diagram (Figure 16):** A technical drawing showing the front view and side profile of the heat spreader with the following labels and dimensions: * **Dimensions:** 82.0, 3X 74.0, 37.0, 3X 4.0, 72.0, 3X 64.0, 2X 34.0, 2X 4.0, 3X 14.0, 3X 54.0, 2X 48.0, 2X 24.0, 2X 9.0. * **Hole Labels:** A, B, and C. * **Center Label:** TIM (inside a square). * **Side View Labels:** 3.0, MODULE SIDE, FAR SIDE. **Figure 16: Heat Spreader - 82mm x 80mm Module** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 84 of 109](.smarc-hardware-specification-v2-1-1/slide-084.jpg) ## Slide 85 ![6 MODULE POWER 6.1 Input Voltage / Main Power Rail The Module input power voltage is brought in on the ten VDD_IN pins and returned through the numerous GND pins on the connector. A Module *shall* withstand an indefinite exposure to an applied VDD_IN that *may* vary over the 3.0V to 5.25V range, without damage. A Module *should* operate over the entire VDD_IN range of 3.0V to 5.25V. Modules that use higher wattage SOCs *may* be designed to operate with a fixed 5V supply (4.75V to 5.25V). Modules that are designed for rock-bottom cost and that use low power SOCs *may* be designed to operate with a fixed 3.3V supply (3.1V to 3.4V). They *shall not* be damaged in any way by exposure to the allowable VDD_IN range of 3.0 to 5.25V. Ten pins are allocated to VDD_IN. The connector pin current rating is 0.5A per pin. This works out to 5A total for the 10 pins. At the lowest allowed Module input voltage of 3.0V, this would allow up to 15W of electrical power to be brought in (with no de-rating on the connector current capability). With a 40% connector current de-rating, up to 9W *may* be brought in at 3.0V. If the fixed 5V input option is used, then 25W *may* be brought in over the 10 power pins (no de-rating). With a 40% connector de-rating, 15W are allowed to be brought in at 5V. As a practical matter, ARM most Module designs are expected to be 6W or less. X86 designs are expected to be in the 5W to 12W range, depending on the CPU SKU. 6.2 No Separate Standby Voltage There is no separate voltage rail for standby power, other than the very low current (optional) RTC voltage rail. All Module operating and standby power comes from the single set of VDD_IN pins. This suits battery power sources well, and is also easy to use with non-battery sources. 6.3 RTC Voltage Rail RTC backup power *may* brought in on the VDD_RTC rail. The RTC consumption is typically 15 µA or less. The allowable VDD_RTC voltage range *shall* be 2.0V to 3.25V. The VDD_RTC rail *may* be sourced from a Carrier based Lithium cell or Super Cap, or it *may* be left open if the RTC backup functions are not required. The Module *shall* be able to boot without an external VDD_RTC voltage source. **Important:** Lithium cells must be protected against charging by reverse currents, with a series Schottky diode and resistor. It is impractical to have the series diode on the Module, as this complicates the use of Super Caps (they need to be charged, over the Module VDD_RTC pin). Lithium cells, if used, *shall* be protected against charging by a Carrier Schottky diode. The diode is placed in series with the positive battery terminal. The diode anode is on the battery side, and the cathode on the Module VDD_RTC side. Note that if a Super cap is used, current *may* flow out of the Module VDD_RTC rail to charge the Super Cap. The supply voltage rail used for the Module is VDD_IN. There are no timing relations between this Module supply rail and the optional VDD_RTC. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 85 of 109](.smarc-hardware-specification-v2-1-1/slide-085.jpg) ## Slide 86 ![**6.4 Power Rail Definition** The intention of mapping the SMARC Module connector signals to separate power domains is to enable a compatible implementation of power saving sleep state called **standby state** between different Module vendors and CPU technologies. At **runtime state**, all supported IO signals are powered and driven. At **standby state**, dedicated wake sources **shall** be enabled with active interfaces and signals. Standby state and runtime state are corresponding to the in the x86 world well known ACPI system states Standby and Full On. If a power saving **standby state** is implemented at the Carrier Board and supported by the Module, the IO voltage rails of the Carrier Board are controlled by the Module using the two signals CARRIER_PWR_ON and CARRIER_STBY#. The signal CARRIER_PWR_ON enables the IO supply rails that are powered in **standby mode**. The signal CARRIER_STBY# enables the additional IO supply rails that are powered in **runtime mode**. Comparing to previous releases of SMARC standard, a new low power consumption domain is defined as 'Sleep'. This is an optional domain which can be used to support DeepSleep states of modern CPU architectures. Typical wake event is the power button only. Optionally the battery management can be used. If the state is not used, Sleep power domain can be tied to Standby domain. **Table 50: Power Rail Definitions** SMARC domain name ACPI domain name ACPI System-State VIN_PWR_BAD# CARRIER_PWR_ON CARRIER_STB# Corresponding Signal for x86 Designs (only for Module designer) :--- :--- :--- :--- :--- :--- :--- Off 0 0 0 Sleep Deep sleep Pseudo G3 (after Mechanical OFF G3; before Standby) 1 0 0 SLP_SUS# asserted(br)Note: VIN_PWR_BAD# is not tied to SLP_SUS# Standby Standby S5-S3 1 1 0 Standby related power signal i.e. RSMRST# or SLP_SUS# deasserted Runtime Full-On S0 1 1 1 i.e. SLP_S3# deasserted In order to avoid back driving between module and carrier by high active signals in standby state the signal power domains in the pin description in chapter 3 shall be observed. In general, it is recommended to adapt the Carrier Board power rails to the Module power rails. In some cases, you **may** drive signals low or to use weak pull up resistors to minimize back driving. The Carrier Board **shall** avoid back driving from Module into unpowered circuit at **standby mode**. The Carrier Board **shall not** drive any runtime signals high during **standby mode**. Special attention has to be spent at runtime powered output signals in **standby mode**. SMARC 2.0 modules may have used different signal to power domain assertion. The module datasheet has to be checked for standby mode implementation details to prevent backdriving and to define wakeup sources. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 86 of 109](.smarc-hardware-specification-v2-1-1/slide-086.jpg) ## Slide 87 ![The slide presents technical documentation titled **'6.5 Power Sequencing'**. The first paragraph states: 'Basically, VDD_IN is the first power domain to be turned on by the carrier circuit during power-up. Other circuit components on the carrier, which are galvanically coupled to the module, shall not be supplied to avoid feedback. From the moment VDD_IN is stable - recognizable by VIN_PWR_BAD# deasserted - the module takes over control of the power sequencing. As soon as the module reaches the next system state standby, CARRIER_PWR_ON signals the carrier to switch on all its standby voltages. No feedback is provided to allow the carrier to signal Power OK to the modules power state machine. When the state Runtime is reached, the module deasserts CARRIER_STBY#. The carrier then switches on the remaining rails.' The second paragraph reads: 'The following sections 6.5.1 to 6.5.4 show power sequence scenarios with/without sleep power domain and with/without power button.' Below this is a section header **'6.5.1 Power up sequence scenario 1'** followed by the subtitle **'Power up with sleep power domain and PWR_BTN#.'** The main visual is a timing diagram labeled **'Figure 17: Power sequence diagram sleep and power button'** at the bottom. The diagram details signal states across two rows at the top: * **Module State:** off start Sleep voltage rails start Standby voltage rails S5 ) S3 start Runtime voltage rails ) S0 wait for Reset_IN before booting continue boot * **Carrier State:** off start Sleep voltage rails start Standby voltage rails start Runtime voltage rails opt: configure or boot further boot devices* The diagram lists various signals and circuits from top to bottom: * to module **VDD_IN** * to module **VIN_PWR_BAD#** * to module **POWER_BTN#** * **Module Standby Circuits** (Red text) * to carrier **CARRIER_PWR_ON** (Black text) * RESUME_RST (Blue text) * **Carrier Standby Circuits** (Purple text) * to carrier **CARRIER_STBY#** (Black text) * SLEEP_S3 (Blue text) * **Module Runtime Circuits** (Red text) * **Carrier Standby Circuits** (Purple text) * to module **RESET_IN** (Black text) * Carrier ready for module boot (Blue text) * to carrier **RESET_OUT#** An arrow indicates a time delay of **) 100 ms** near the bottom signals. A legend at the bottom left explains the color coding: * **Supply Rails:** at Module (Red) at Carrier (Purple) * **Control Signals:** from Module (Black) from Carrier (Blue) The footer contains: * **SMARC 2.1.1 Specification** * **© 2020 SGET e.V.** * **Page 87 of 109**](.smarc-hardware-specification-v2-1-1/slide-087.jpg) ## Slide 88 ![**6.5.2 Power up sequence scenario 2** Power up sequence with sleep power domain without PWR_BTN# **Table Headers:** Module State, Carrier State **Module State:** off, start Sleep volt. rails, start Standby voltage rails, S5 ► S3, start Runtime voltage rails, ► S0, wait for Reset_IN before booting, continue boot **Carrier State:** off, start Sleep voltage rails, start Standby voltage rails, start Runtime voltage rails, opt: configure or boot further boot devices* **Signal Labels:** to module VDD_IN to module VIN_PWR_BAD# Module Standby Circuits to carrier CARRIER_PWR_ON RESUME_RST Carrier Standby Circuits to carrier CARRIER_STBY# SLEEP_S3 Module Runtime Circuits Carrier Standby Circuits to module RESET_IN Carrier ready for module boot to carrier RESET_OUT# **Legend:** Supply Rails at Module at Carrier Control Signals from Module from Carrier Figure 18: Power sequence diagram sleep, no power button SMARC 2.1.1 Specification © 2020 SGET e.V. Page 88 of 109](.smarc-hardware-specification-v2-1-1/slide-088.jpg) ## Slide 89 ![This slide, titled **6.5.3 Power up sequence scenario 3**, illustrates the 'Power up sequence without sleep power domain and with PWR_BTN#'. It features a timing diagram (**Figure 19: Power sequence diagram power button**) detailing signal transitions for 'Module State' and 'Carrier State' as they progress from 'off' through states 'S5', 'S3', and 'S0'. The diagram tracks signals including: * **VD_D_IN** and **VIN_PWR_BAD#** (to module) * **POWER_BTN#** (to module) * **Module Standby Circuits** and **Module Runtime Circuits** * **CARRIER_PWR_ON** / **RESUME_RST** and **CARRIER_STBY#** / **SLEEP_S3** (to carrier) * **Carrier Standby Circuits** * **RESET_IN** (to module) noting 'Carrier ready for module boot' * **RESET_OUT#** (to carrier) indicating a delay of ') 100 ms' Green arrows indicate timing dependencies between signals. A legend at the bottom distinguishes 'Supply Rails' and 'Control Signals'. The footer identifies the document as the '**SMARC 2.1.1 Specification**', page 89 of 109, © 2020 SGET e.V.](.smarc-hardware-specification-v2-1-1/slide-089.jpg) ## Slide 90 ![This slide is a technical diagram titled **6.5.4 Power up sequence scenario 4**. The subtitle reads: **Power up sequence without sleep power domain and without PWR_BTN#** The main body of the slide is a timing diagram (Figure 20) illustrating signal states over time. The top section defines states: * **Module State:** off start Sleep/Standby voltage rails S5 ► S3 start Runtime voltage rails ► S0 wait for Reset_IN before booting continue boot * **Carrier State:** off start Sleep/Standby voltage rails start Runtime voltage rails opt: configure or boot further boot devices* The diagram lists specific signals and their waveforms: * **to module VDD_IN** (Purple line) * **to module VIN_PWR_BAD#** (Black line) * **Module Standby Circuits** (Red text) * **to carrier CARRIER_PWR_ON** (Black line) * **RESUME_RST** * **Carrier Standby Circuits** (Purple text) * **to carrier CARRIER_STBY#** (Black line) * **SLEEP_S3** * **Module Runtime Circuits** (Red text) * **Carrier Standby Circuits** (Purple text) * **to module RESET_IN** (Black line) * **Carrier ready for module boot** * **to carrier RESET_OUT#** (Black line) There are green curved arrows connecting signals and a timing arrow labeled **) 100 ms**. A legend at the bottom reads: * **Supply Rails at Module at Carrier** * **Control Signals from Module from Carrier** The caption below the diagram is: **Figure 20: Power sequence diagram, no power button** The footer contains: * **SMARC 2.1.1 Specification** * **© 2020 SGET e.V.** * **Page 90 of 109**](.smarc-hardware-specification-v2-1-1/slide-090.jpg) ## Slide 91 ![**7 MODULE AND CARRIER SERIAL EEPROMS** SMARC Modules **should** include an I2C serial EEPROM on the Module I2C_GP bus. The device used **should** be an Atmel 24C32 or equivalent. The device **shall** operate at 1.8V. The Module serial EEPROM **should** be placed at I2C slave addresses A2 A1 A0 set to 0 (I2C slave address 50 hex, 7 bit address format or A0 / A1 hex, 8 bit format) (recall that for I2C EEPROMs, address bits A6 A5 A4 A3 are set to binary 1010 convention). The Module serial EEPROM is intended to retain Module parameter information, including a Module serial number. The Module serial EEPROM data structure **should** conform to the PICMG® EEEP Embedded EEPROM Specification. SMARC Carriers **may** include an I2C serial EEPROM on the I2C_PM bus, in the Module power domain. The device used **should** be an Atmel 24C32 or equivalent. The device **shall** operate at 1.8V. The Carrier serial EEPROM **should** be placed with I2C slave addresses A2 A1 A0 set to binary 111 (I2C slave address 57 hex, 7 bit address format or AE / AF hex, 8 bit format). The Carrier serial EEPROM is intended to retain Carrier parameter information. The Carrier serial EEPROM data structure **should** conform to the PICMG® EEEP Embedded EEPROM Specification. SMARC 2.1.1 Specification © 2020 SGET e.V. Page 91 of 109](.smarc-hardware-specification-v2-1-1/slide-091.jpg) ## Slide 92 ![This slide is titled '**8 APPENDIX A: LVDS LCD COLOR MAPPINGS**' with a subsection '**8.1 LVDS LCD Color Mappings**'. The text explains the serialization of parallel LCD data (Red, Green, Blue, Display Enable, Vertical Sync, Horizontal Sync) onto LVDS differential pairs into 7-bit frames. * **18-bit color depths:** Use three LVDS channels (18 data bits + 3 control bits = 21 bits; hence 3 channels with 7 bit frames) plus a clock pair. * **24-bit color depths:** Use four LVDS channels (24 data bits + 3 control bits + 1 unused bit = 28 bits, or 4 x 7) plus a clock pair. The LVDS clock is a separate pair with a period 7 times longer than the pixel clock. Its edges are offset from the 7-bit frame boundaries by 2 pixel periods. The slide notes two 24-bit color mappings: 1. **'24 bit standard color mapping' (more common):** Not compatible with 18-bit panels; places the most significant RGB color data on the 4th LVDS data pair. 2. **'24 bit / 18 bit compatible' mapping (less common):** Puts the least significant color bits of the 24-bit set onto the 4th LVDS pair. Some panels feature pin straps to select the mapping. **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 92 of 109](.smarc-hardware-specification-v2-1-1/slide-092.jpg) ## Slide 93 ![**Header:** 8.1.1 Single Channel Color Mapping 8.1.1.1 General Information **Table:** LVDS Channel Transmit Bit Order 18 Bit Standard 24 Bit / 18 Bit Compatible 24 Bit Standard :--- :--- :--- :--- :--- **0** 1 G0 G0 G2 2 R5 R5 R7 3 R4 R4 R6 4 R3 R3 R5 5 R2 R2 R4 6 R1 R1 R3 7 R0 R0 R2 **1** 1 B1 B1 B3 2 B0 B0 B2 3 G5 G5 G7 4 G4 G4 G6 5 G3 G3 G5 6 G2 G2 G4 7 G1 G1 G3 **2** 1 DE DE DE 2 VS VS VS 3 HS HS HS 4 B5 B5 B7 5 B4 B4 B6 6 B3 B3 B5 7 B2 B2 B4 **3** 1 (not used) (not used) (not used) 2 (not used) B7 B1 3 (not used) B6 B0 4 (not used) G7 G1 5 (not used) G6 G0 6 (not used) R7 R1 7 (not used) R6 R0 **Footer:** Table 51: LVDS Color Mapping SMARC 2.1.1 Specification © 2020 SGET e.V. Page 93 of 109](.smarc-hardware-specification-v2-1-1/slide-093.jpg) ## Slide 94 ![9 APPENDIX B: DOCUMENT CHANGES 9.1 Changes V1.1 to V2.0 Removed Interfaces - Parallel camera interface - Parallel Display interface - PCI Express presence and clock request signals - Alternate function block - SPDIF - eMMC - 1 of 3 I2S Added Interfaces - 2nd channel LVDS - 2nd Ethernet - IEEE1588 trigger signals (software definable pins) - 4th PCI Express lane - Extra USB ports (6x USB 2.0 + 2x USB SS signals now) - x86 power management signals - eSPI - DP++ Total Video Interfaces now - 2x 24 Bit LVDS / eDP 4 channel / MIPI DSI 4 channel - HDMI / DP++ - DP++ Other Changes - Added RF connector option - Changed Module EEPROM from I2C_PM to I2C_GP - Added power sequencing details - See detailed pinout changes is section 9.3 'Pinout Comparison' below - Some mandatory and optional features changed, see section 3.1 'Required and Optional Feature Table' on page 14 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 94 of 109](.smarc-hardware-specification-v2-1-1/slide-094.jpg) ## Slide 95 ![The slide is titled '9.2 Changes V2.0 to V2.1' and lists the following updates: * Incorporated Errata 1.1 Rev. 2 (2/9/2017) * Updated signal tables * Added pin number * Added power domain * Updated content * Added termination information * Added details for eDP(0:1)_HPD * Added SERDES as alternative function for PCIeC and PCIeD * Added MDIO Interface * Updated power domains and power sequencing * Added two extra GPIOs * PCIe Clock Request signals for PCIeA and PCIeB at previous locations * Changed fill order for MIPI CSI (CSI1 first, then CSI0) * Added CSI 2 and 3 on extra optional connector * USB client mode defined more clearly * Added sleep power domain * Redefinied JTAG connector The footer reads 'SMARC 2.1.1 Specification', '© 2020 SGET e.V.', and 'Page 95 of 109'.](.smarc-hardware-specification-v2-1-1/slide-095.jpg) ## Slide 96 ![**9.3 Pinout Comparison** **Table:** * **Headers:** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 * **P1:** PCAM_PXL_CK1 SMB_ALERT_1V8# SMB_ALERT# * **P2:** GND GND GND * **P3:** CSI1_CK+ /PCAM_D0 CSI1_CK+ CSI1_CK+ * **P4:** CSI1_CK- /PCAM_D1 CSI1_CK- CSI1_CK- * **P5:** PCAM_DE GBE1_SDP GBE1_SDP * **P6:** PCAM_MCK GBE0_SDP GBE0_SDP * **P7:** CSI1_D0+ /PCAM_D2 CSI1_RX0+ CSI1_RX0+ * **P8:** CSI1_D0- /PCAM_D3 CSI1_RX0- CSI1_RX0- * **P9:** GND GND GND * **P10:** CSI1_D1+ /PCAM_D4 CSI1_RX1+ CSI1_RX1+ * **P11:** CSI1_D1- /PCAM_D5 CSI1_RX1- CSI1_RX1- * **P12:** GND GND GND * **P13:** CSI1_D2+ /PCAM_D6 CSI1_RX2+ CSI1_RX2+ * **P14:** CSI1_D2- /PCAM_D7 CSI1_RX2- CSI1_RX2- * **P15:** GND GND GND * **P16:** CSI1_D3+ /PCAM_D8 CSI1_RX3+ CSI1_RX3+ * **P17:** CSI1_D3- /PCAM_D9 CSI1_RX3- CSI1_RX3- * **P18:** GND GND GND * **P19:** GBE_MDI3- GBE0_MDI3- GBE0_MDI3- * **P20:** GBE_MDI3+ GBE0_MDI3+ GBE0_MDI3+ * **P21:** GBE_LINK100# GBE0_LINK100# GBE0_LINK100# * **P22:** GBE_LINK1000# GBE0_LINK1000# GBE0_LINK1000# * **P23:** GBE_MDI2- GBE0_MDI2- GBE0_MDI2- * **P24:** GBE_MDI2+ GBE0_MDI2+ GBE0_MDI2+ * **P25:** GBE_LINK_ACT# GBE0_LINK_ACT# GBE0_LINK_ACT# * **P26:** GBE_MDI1- GBE0_MDI1- GBE0_MDI1- * **P27:** GBE_MDI1+ GBE0_MDI1+ GBE0_MDI1+ * **P28:** GBE_CTREF GBE0_CTREF GBE0_CTREF * **P29:** GBE_MDI0- GBE0_MDI0- GBE0_MDI0- * **P30:** GBE_MDI0+ GBE0_MDI0+ GBE0_MDI0+ * **P31:** SPI0_CS1# SPI0_CS1# SPI0_CS1# * **P32:** GND GND GND * **P33:** SDIO_WP SDIO_WP SDIO_WP * **P34:** SDIO_CMD SDIO_CMD SDIO_CMD * **P35:** SDIO_CD# SDIO_CD# SDIO_CD# * **P36:** SDIO_CK SDIO_CK SDIO_CK * **P37:** SDIO_PWR_EN SDIO_PWR_EN SDIO_PWR_EN * **P38:** GND GND GND **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 96 of 109](.smarc-hardware-specification-v2-1-1/slide-096.jpg) ## Slide 97 ![**Table: Pin Assignments** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 :--- :--- :--- :--- P39 SDIO_D0 SDIO_D0 SDIO_D0 P40 SDIO_D1 SDIO_D1 SDIO_D1 P41 SDIO_D2 SDIO_D2 SDIO_D2 P42 SDIO_D3 SDIO_D3 SDIO_D3 P43 SPI0_CS0# SPI0_CS0# SPI0_CS0# P44 SPI0_CK SPI0_CK SPI0_CK P45 SPI0_DIN SPI0_DIN SPI0_DIN P46 SPI0_DO SPI0_DO SPI0_DO P47 GND GND GND P48 SATA_TX+ SATA_TX+ SATA_TX+ P49 SATA_TX- SATA_TX- SATA_TX- P50 GND GND GND P51 SATA_RX+ SATA_RX+ SATA_RX+ P52 SATA_RX- SATA_RX- SATA_RX- P53 GND GND GND P54 SPI1_CS0# SPI1_CS0# / ESPI_CS0# SPI1_CS0# / ESPI_CS0# / QSPI_CS0# P55 SPI1_CS1# SPI1_CS1# / ESPI_CS1# SPI1_CS1# / ESPI_CS1# / QSPI_CS1# P56 SPI1_CK SPI1_CK / ESPI_CK SPI1_CK / ESPI_CK / QSPI_CK P57 SPI1_DIN SPI1_DIN / ESPI_IO_1 SPI1_DIN / ESPI_IO_1 / QSPI_IO_1 P58 SPI1_DO SPI1_DO / ESPI_IO_0 SPI1_DO / ESPI_IO_0 / QSPI_IO_0 P59 GND GND GND P60 USB0+ USB0+ USB0+ P61 USB0- USB0- USB0- P62 USB0_EN_OC# USB0_EN_OC# USB0_EN_OC# P63 USB0_VBUS_DET USB0_VBUS_DET USB0_VBUS_DET P64 USB0_OTG_ID USB0_OTG_ID USB0_OTG_ID P65 USB1+ USB1+ USB1+ P66 USB1- USB1- USB1- P67 USB1_EN_OC# USB1_EN_OC# USB1_EN_OC# P68 GND GND GND P69 USB2+ USB2+ USB2+ P70 USB2- USB2- USB2- P71 USB2_EN_OC# USB2_EN_OC# USB2_EN_OC# P72 PCIE_C_PRSNT# RSVD RSVD P73 PCIE_B_PRSNT# RSVD RSVD P74 PCIE_A_PRSNT# USB3_EN_OC# USB3_EN_OC# P75 PCIE_A_RST# PCIE_A_RST# PCIE_A_RST# P76 PCIE_C_CKREQ# USB4_EN_OC# USB4_EN_OC# P77 PCIE_B_CKREQ# RSVD PCIE_B_CKREQ# P78 PCIE_A_CKREQ# RSVD PCIE_A_CKREQ# **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 97 of 109](.smarc-hardware-specification-v2-1-1/slide-097.jpg) ## Slide 98 ![This slide displays a pinout comparison table for SMARC standards 1.1, 2.0, and 2.1. **Table Content:** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 :--- :--- :--- :--- P79 GND GND GND P80 PCIE_C_REFCK+ PCIE_C_REFCK+ PCIE_C_REFCK+ P81 PCIE_C_REFCK- PCIE_C_REFCK- PCIE_C_REFCK- P82 GND GND GND P83 PCIE_A_REFCK+ PCIE_A_REFCK+ PCIE_A_REFCK+ P84 PCIE_A_REFCK- PCIE_A_REFCK- PCIE_A_REFCK- P85 GND GND GND P86 PCIE_A_RX+ PCIE_A_RX+ PCIE_A_RX+ P87 PCIE_A_RX- PCIE_A_RX- PCIE_A_RX- P88 GND GND GND P89 PCIE_A_TX+ PCIE_A_TX+ PCIE_A_TX+ P90 PCIE_A_TX- PCIE_A_TX- PCIE_A_TX- P91 GND GND GND P92 HDMI_D2+ HDMI_D2+ / DP1_LANE0+ HDMI_D2+ / DP1_LANE0+ P93 HDMI_D2- HDMI_D2- / DP1_LANE0- HDMI_D2- / DP1_LANE0- P94 GND GND GND P95 HDMI_D1+ HDMI_D1+ / DP1_LANE1+ HDMI_D1+ / DP1_LANE1+ P96 HDMI_D1- HDMI_D1- / DP1_LANE1- HDMI_D1- / DP1_LANE1- P97 GND GND GND P98 HDMI_D0+ HDMI_D0+ / DP1_LANE2+ HDMI_D0+ / DP1_LANE2+ P99 HDMI_D0- HDMI_D0- / DP1_LANE2- HDMI_D0- / DP1_LANE2- P100 GND GND GND P101 HDMI_CK+ HDMI_CK+ / DP1_LANE3+ HDMI_CK+ / DP1_LANE3+ P102 HDMI_CK- HDMI_CK- / DP1_LANE3- HDMI_CK- / DP1_LANE3- P103 GND GND GND P104 HDMI_HPD HDMI_HPD / DP1_HPD HDMI_HPD / DP1_HPD P105 HDMI_CTRL_CK HDMI_CTRL_CK / DP1_AUX+ HDMI_CTRL_CK / DP1_AUX+ P106 HDMI_CTRL_DAT HDMI_CTRL_DAT / DP1_AUX- HDMI_CTRL_DAT / DP1_AUX- P107 HDMI_CEC DP1_AUX_SEL DP1_AUX_SEL P108 GPIO0 / CAM0_PWR# GPIO0 / CAM0_PWR# GPIO0 / CAM0_PWR# P109 GPIO1 / CAM1_PWR# GPIO1 / CAM1_PWR# GPIO1 / CAM1_PWR# P110 GPIO2 / CAM0_RST# GPIO2 / CAM0_RST# GPIO2 / CAM0_RST# P111 GPIO3 / CAM1_RST# GPIO3 / CAM1_RST# GPIO3 / CAM1_RST# P112 GPIO4 / HDA_RST# GPIO4 / HDA_RST# GPIO4 / HDA_RST# P113 GPIO5 / PWM_OUT GPIO5 / PWM_OUT GPIO5 / PWM_OUT P114 GPIO6 / TACHIN GPIO6 / TACHIN GPIO6 / TACHIN P115 GPIO7 / PCAM_FLD GPIO7 GPIO7 P116 GPIO8 / CAN0_ERR# GPIO8 GPIO8 P117 GPIO9 / CAN1_ERR# GPIO9 GPIO9 P118 GPIO10 GPIO10 GPIO10 **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 98 of 109](.smarc-hardware-specification-v2-1-1/slide-098.jpg) ## Slide 99 ![**Header:** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 **Table Content:** * **P119:** GPIO11 GPIO11 GPIO11 * **P120:** GND GND GND * **P121:** I2C_PM_CK I2C_PM_CK I2C_PM_CK * **P122:** I2C_PM_DAT I2C_PM_DAT I2C_PM_DAT * **P123:** BOOT_SEL0# BOOT_SEL0# BOOT_SEL0# * **P124:** BOOT_SEL1# BOOT_SEL1# BOOT_SEL1# * **P125:** BOOT_SEL2# BOOT_SEL2# BOOT_SEL2# * **P126:** RESET_OUT# RESET_OUT# RESET_OUT# * **P127:** RESET_IN# RESET_IN# RESET_IN# * **P128:** POWER_BTN# POWER_BTN# POWER_BTN# * **P129:** SER0_TX SER0_TX SER0_TX * **P130:** SER0_RX SER0_RX SER0_RX * **P131:** SER0_RTS# SER0_RTS# SER0_RTS# * **P132:** SER0_CTS# SER0_CTS# SER0_CTS# * **P133:** GND GND GND * **P134:** SER1_TX SER1_TX SER1_TX * **P135:** SER1_RX SER1_RX SER1_RX * **P136:** SER2_TX SER2_TX SER2_TX * **P137:** SER2_RX SER2_RX SER2_RX * **P138:** SER2_RTS# SER2_RTS# SER2_RTS# * **P139:** SER2_CTS# SER2_CTS# SER2_CTS# * **P140:** SER3_TX SER3_TX SER3_TX * **P141:** SER3_RX SER3_RX SER3_RX * **P142:** GND GND GND * **P143:** CAN0_TX CAN0_TX CAN0_TX * **P144:** CAN0_RX CAN0_RX CAN0_RX * **P145:** CAN1_TX CAN1_TX CAN1_TX * **P146:** CAN1_RX CAN1_RX CAN1_RX * **P147:** VDD_IN VDD_IN VDD_IN * **P148:** VDD_IN VDD_IN VDD_IN * **P149:** VDD_IN VDD_IN VDD_IN * **P150:** VDD_IN VDD_IN VDD_IN * **P151:** VDD_IN VDD_IN VDD_IN * **P152:** VDD_IN VDD_IN VDD_IN * **P153:** VDD_IN VDD_IN VDD_IN * **P154:** VDD_IN VDD_IN VDD_IN * **P155:** VDD_IN VDD_IN VDD_IN * **P156:** VDD_IN VDD_IN VDD_IN **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 99 of 109](.smarc-hardware-specification-v2-1-1/slide-099.jpg) ## Slide 100 ![**Pin** **SMARC 1.1** **SMARC 2.0** **SMARC 2.1** --- --- --- --- **S1** PCAM_VSYNC CSI1_TX+ / I2C_CAM1_CK CSI1_TX+ / I2C_CAM1_CK **S2** PCAM_HSYNC CSI1_TX- / I2C_CAM1_DAT CSI1_TX- / I2C_CAM1_DAT **S3** GND GND GND **S4** PCAM_PXL_CK0 RSVD RSVD **S5** I2C_CAM_CK I2C_CAM0_CK / CSI0_TX+ I2C_CAM0_CK / CSI0_TX+ **S6** CAM_MCK CAM_MCK CAM_MCK **S7** I2C_CAM_DAT I2C_CAM0_DAT / CSI0_TX- I2C_CAM0_DAT / CSI0_TX- **S8** CSI0_CK+ / PCAM_D10 CSI0_CK+ CSI0_CK+ **S9** CSI0_CK- / PCAM_D11 CSI0_CK- CSI0_CK- **S10** GND GND GND **S11** CSI0_D0+ / PCAM_D12 CSI0_RX0+ CSI0_RX0+ **S12** CSI0_D0- / PCAM_D13 CSI0_RX0- CSI0_RX0- **S13** GND GND GND **S14** CSI0_D1+ / PCAM_D14 CSI0_RX1+ CSI0_RX1+ **S15** CSI0_D1- / PCAM_D15 CSI0_RX1- CSI0_RX1- **S16** GND GND GND **S17** AFB0_OUT GBE1_MDI0+ GBE1_MDI0+ **S18** AFB4_OUT GBE1_MDI0- GBE1_MDI0- **S19** AFB2_OUT GBE1_LINK100# GBE1_LINK100# **S20** AFB3_IN GBE1_MDI1+ GBE1_MDI1+ **S21** AFB4_IN GBE1_MDI1- GBE1_MDI1- **S22** AFB5_IN GBE1_LINK1000# GBE1_LINK1000# **S23** AFB6_PTIO GBE1_MDI2+ GBE1_MDI2+ **S24** AFB7_PTIO GBE1_MDI2- GBE1_MDI2- **S25** GND GND GND **S26** SDMMC_D0 GBE1_MDI3+ GBE1_MDI3+ **S27** SDMMC_D1 GBE1_MDI3- GBE1_MDI3- **S28** SDMMC_D2 GBE1_CTRREF GBE1_CTRREF **S29** SDMMC_D3 PCIE_D_TX+ PCIE_D_TX+ / SERDES_0_TX+ **S30** SDMMC_D4 PCIE_D_TX- PCIE_D_TX- / SERDES_0_TX- **S31** SDMMC_D5 GBE1_LINK_ACT# GBE1_LINK_ACT# **S32** SDMMC_D6 PCIE_D_RX+ PCIE_D_RX+ / SERDES_0_RX+ **S33** SDMMC_D7 PCIE_D_RX- PCIE_D_RX- / SERDES_0_RX- **S34** GND GND GND **S35** SDMMC_CK USB4+ USB4+ **S36** SDMMC_CMD USB4- USB4- **S37** SDMMC_RST# USB3_VBUS_DET USB3_VBUS_DET **S38** AUDIO_MCK AUDIO_MCK AUDIO_MCK **S39** I2S0_LRCK I2S0_LRCK I2S0_LRCK **S40** I2S0_SDOUT I2S0_SDOUT I2S0_SDOUT **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 100 of 109](.smarc-hardware-specification-v2-1-1/slide-100.jpg) ## Slide 101 ![The slide presents a table comparing pin assignments for SMARC 1.1, SMARC 2.0, and SMARC 2.1 standards. **Table Content:** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 :--- :--- :--- :--- S41 I2S0_SDIN I2S0_SDIN I2S0_SDIN S42 I2S0_CK I2S0_CK I2S0_CK S43 I2S1_LRCK ESPI_ALERT0# ESPI_ALERT0# S44 I2S1_SDOUT ESPI_ALERT1# ESPI_ALERT1# S45 I2S1_SDIN RSVD MDIO_CLK S46 I2S1_CK RSVD MDIO_DAT S47 GND GND GND S48 I2C_GP_CK I2C_GP_CK I2C_GP_CK S49 I2C_GP_DAT I2C_GP_DAT I2C_GP_DAT S50 I2S2_LRCK I2S2_LRCK / HDA_SYNC I2S2_LRCK / HDA_SYNC S51 I2S2_SDOUT I2S2_SDOUT / HDA_SDO I2S2_SDOUT / HDA_SDO S52 I2S2_SDIN I2S2_SDIN / HDA_SDI I2S2_SDIN / HDA_SDI S53 I2S2_CK I2S2_CK / HDA_CK I2S2_CK / HDA_CK S54 SATA_ACT# SATA_ACT# SATA_ACT# S55 AFB8_PTIO USB5_EN_OC# USB5_EN_OC# S56 AFB9_PTIO ESPI_IO_2 ESPI_IO_2 / QSPI_IO_2 S57 PCAM_ON_CSI0# ESPI_IO_3 ESPI_IO_3 / QSPI_IO_3 S58 PCAM_ON_CSI1# ESPI_RESET# ESPI_RESET# S59 SPDIF_OUT USB5+ USB5+ S60 SPDIF_IN USB5- USB5- S61 GND GND GND S62 AFB_DIFF0+ USB3_SSTX+ USB3_SSTX+ S63 AFB_DIFF0- USB3_SSTX- USB3_SSTX- S64 GND GND GND S65 AFB_DIFF1+ USB3_SSRX+ USB3_SSRX+ S66 AFB_DIFF1- USB3_SSRX- USB3_SSRX- S67 GND GND GND S68 AFB_DIFF2+ USB3+ USB3+ S69 AFB_DIFF2- USB3- USB3- S70 GND GND GND S71 AFB_DIFF3+ USB2_SSTX+ USB2_SSTX+ S72 AFB_DIFF3- USB2_SSTX- USB2_SSTX- S73 GND GND GND S74 AFB_DIFF4+ USB2_SSRX+ USB2_SSRX+ S75 AFB_DIFF4- USB2_SSRX- USB2_SSRX- S76 PCIE_B_RST# PCIE_B_RST# PCIE_B_RST# S77 PCIE_C_RST# PCIE_C_RST# PCIE_C_RST# S78 PCIE_C_RX+ PCIE_C_RX+ PCIE_C_RX+ / SERDES_1_RX+ S79 PCIE_C_RX- PCIE_C_RX- PCIE_C_RX- / SERDES_1_RX- S80 GND GND GND **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 101 of 109](.smarc-hardware-specification-v2-1-1/slide-101.jpg) ## Slide 102 ![**Table Data:** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 :--- :--- :--- :--- S81 PCIE_C_TX+ PCIE_C_TX+ PCIE_C_TX+ / SERDES 1 TX+ S82 PCIE_C_TX- PCIE_C_TX- PCIE_C_TX- / SERDES 1 TX- S83 GND GND GND S84 PCIE_B_REFCK+ PCIE_B_REFCK+ PCIE_B_REFCK+ S85 PCIE_B_REFCK- PCIE_B_REFCK- PCIE_B_REFCK- S86 GND GND GND S87 PCIE_B_RX+ PCIE_B_RX+ PCIE_B_RX+ S88 PCIE_B_RX- PCIE_B_RX- PCIE_B_RX- S89 GND GND GND S90 PCIE_B_TX+ PCIE_B_TX+ PCIE_B_TX+ S91 PCIE_B_TX- PCIE_B_TX- PCIE_B_TX- S92 GND GND GND S93 LCD_D0 DP0_LANE0+ DP0_LANE0+ S94 LCD_D1 DP0_LANE0- DP0_LANE0- S95 LCD_D2 DP0_AUX_SEL DP0_AUX_SEL S96 LCD_D3 DP0_LANE1+ DP0_LANE1+ S97 LCD_D4 DP0_LANE1- DP0_LANE1- S98 LCD_D6 DP0_HPD DP0_HPD S99 LCD_D6 DP0_LANE2+ DP0_LANE2+ S100 LCD_D7 DP0_LANE2- DP0_LANE2- S101 GND GND GND S102 LCD_D8 DP0_LANE3+ DP0_LANE3+ S103 LCD_D9 DP0_LANE3- DP0_LANE3- S104 LCD_D10 USB3_OTG_ID USB3_OTG_ID S105 LCD_D11 DP0_AUX+ DP0_AUX+ S106 LCD_D12 DP0_AUX- DP0_AUX- S107 LCD_D13 LCD1_BKLT_EN LCD1_BKLT_EN S108 LCD_D14 LVDS1_CK+ / eDP1_AUX+ / DSI1_CLK+ LVDS1_CK+ / eDP1_AUX+ / DSI1_CLK+ S109 LCD_D15 LVDS1_CK- / eDP1_AUX- / DSI1_CLK- LVDS1_CK- / eDP1_AUX- / DSI1_CLK- S110 GND GND GND S111 LCD_D16 LVDS1_0+ / eDP1_TX0+ / DSI1_D0+ LVDS1_0+ / eDP1_TX0+ / DSI1_D0+ S112 LCD_D17 LVDS1_0- / eDP1_TX0- / DSI1_D0- LVDS1_0- / eDP1_TX0- / DSI1_D0- S113 LCD_D18 eDP1_HPD eDP1_HPD / DSI1_TE S114 LCD_D19 LVDS1_1+ / eDP1_TX1+ / DSI1_D1+ LVDS1_1+ / eDP1_TX1+ / DSI1_D1+ S115 LCD_D20 LVDS1_1- / eDP1_TX1- / DSI1_D1- LVDS1_1- / eDP1_TX1- / DSI1_D1- S116 LCD_D21 LCD1_VDD_EN LCD1_VDD_EN S117 LCD_D22 LVDS1_2+ / eDP1_TX2+ / DSI1_D2+ LVDS1_2+ / eDP1_TX2+ / DSI1_D2+ S118 LCD_D23 LVDS1_2- / eDP1_TX2- / DSI1_D2- LVDS1_2- / eDP1_TX2- / DSI1_D2- S119 GND GND GND S120 LCD_DE LVDS1_3+ / eDP1_TX3+ / DSI1_D3+ LVDS1_3+ / eDP1_TX3+ / DSI1_D3+ **Footer Text:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 102 of 109](.smarc-hardware-specification-v2-1-1/slide-102.jpg) ## Slide 103 ![**SMARC Pinout Comparison Table** Pin SMARC 1.1 SMARC 2.0 SMARC 2.1 :--- :--- :--- :--- S121 LCD_VS LVDS1 3- / eDP1 TX3- / DSI1 D3- LVDS1 3- / eDP1_TX3- / DSI1_D3- S122 LCD_HS LCD1_BKLT_PWM LCD1_BKLT_PWM S123 LCD_PCK RSVD GPIO13 S124 GND GND GND S125 LVDS0+ LVDS0_0+ / eDP0_TX0+ / DSI0_D0+ LVDS0_0+ / eDP0_TX0+ / DSI0_D0+ S126 LVDS0- LVDS0_0- / eDP0_TX0- / DSI0_D0- LVDS0_0- / eDP0_TX0- / DSI0_D0- S127 LCD_BKLT_EN LCD0_BKLT_EN LCD0_BKLT_EN S128 LVDS1+ LVDS0_1+ / eDP0_TX1+ / DSI0_D1+ LVDS0_1+ / eDP0_TX1+ / DSI0_D1+ S129 LVDS1- LVDS0_1- / eDP0_TX1- / DSI0_D1- LVDS0_1- / eDP0_TX1- / DSI0_D1- S130 GND GND GND S131 LVDS2+ LVDS0_2+ / eDP0_TX2+ / DSI0_D2+ LVDS0_2+ / eDP0_TX2+ / DSI0_D2+ S132 LVDS2- LVDS0_2- / eDP0_TX2- / DSI0_D2- LVDS0_2- / eDP0_TX2- / DSI0_D2- S133 LCD_VDD_EN LCD0_VDD_EN LCD0_VDD_EN S134 LVDS_CK+ LVDS0_CK+ / eDP0_AUX+ / DSI0_CLK+ LVDS0_CK+ / eDP0_AUX+ / DSI0_CLK+ S135 LVDS_CK- LVDS0_CK- / eDP0_AUX- / DSI0_CLK- LVDS0_CK- / eDP0_AUX- / DSI0_CLK- S136 GND GND GND S137 LVDS3+ LVDS0_3+ / eDP0_TX3+ / DSI0_D3+ LVDS0_3+ / eDP0_TX3+ / DSI0_D3+ S138 LVDS3- LVDS0_3- / eDP0_TX3- / DSI0_D3- LVDS0_3- / eDP0_TX3- / DSI0_D3- S139 I2C_LCD_CK I2C_LCD_CK I2C_LCD_CK S140 I2C_LCD_DAT I2C_LCD_DAT I2C_LCD_DAT S141 LCD_BKLT_PWM LCD0_BKLT_PWM LCD0_BKLT_PWM S142 RSVD RSVD GPIO12 S143 GND GND GND S144 RSVD- / EDP_HPD eDP0_HPD eDP0_HPD / DSI0_TE S145 WDT_TIME_OUT# WDT_TIME_OUT# WDT_TIME_OUT# S146 PCIE_WAKE# PCIE_WAKE# PCIE_WAKE# S147 VDD_RTC VDD_RTC VDD_RTC S148 LID# LID# LID# S149 SLEEP# SLEEP# SLEEP# S150 VIN_PWR_BAD# VIN_PWR_BAD# VIN_PWR_BAD# S151 CHARGING# CHARGING# CHARGING# S152 CHARGER_PRSNT# CHARGER_PRSNT# CHARGER_PRSNT# S153 CARRIER_STBY# CARRIER_STBY# CARRIER_STBY# S154 CARRIER_PWR_ON CARRIER_PWR_ON CARRIER_PWR_ON S155 FORCE_RECOV# FORCE_RECOV# FORCE_RECOV# S156 BATLOW# BATLOW# BATLOW# S157 TEST# TEST# TEST# S158 GND GND GND **Footer Text:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 103 of 109](.smarc-hardware-specification-v2-1-1/slide-103.jpg) ## Slide 104 ![**9.4 Signal Name Index** **Audio** AUDIO_MCK...................................................... 39, 40, 68, 99 HDA_CK............................................................. 40, 41, 68, 100 HDA_RST#......................................................... 40, 41, 58, 59, 70, 97 HDA_SDI............................................................ 40, 41, 68, 100 HDA_SDO........................................................... 40, 41, 68, 100 HDA_SYNC........................................................ 40, 41, 68, 100 I2S0_CK............................................................. 39, 68, 100 I2S0_LRCK....................................................... 39, 68, 99 I2S0_SDIN......................................................... 39, 68, 100 I2S0_SDOUT..................................................... 39, 68, 99 I2S2_CK............................................................. 40, 41, 68, 100 I2S2_LRCK....................................................... 40, 41, 68, 100 I2S2_SDIN......................................................... 40, 41, 68, 100 I2S2_SDOUT..................................................... 40, 41, 68, 100 **Camera** CAM_MCK........................................................ 30, 32, 67, 99 CAM0_PWR#..................................................... 29, 58, 59, 70, 97 CAM0_RST#....................................................... 29, 58, 59, 70, 97 CAM1_PWR#....................................................... 30, 58, 59, 70, 97 CAM1_RST#....................................................... 30, 58, 59, 70, 97 CAM2_MCK........................................................ 31 CAM2_PWR#....................................................... 31 CAM2_RST#....................................................... 31 CAM2_VCC........................................................ 31 CAM3_MCK........................................................ 32 CAM3_PWR#....................................................... 32 CAM3_RST#....................................................... 32 CAM3_VCC........................................................ 32 CSI0_CK............................................................. 29, 67, 99 CSI0_CK+.......................................................... 29, 67, 99 CSI0_RX0.......................................................... 29, 67, 99 CSI0_RX0+....................................................... 29, 67, 99 CSI0_RX1-......................................................... 29, 67, 99 CSI0_RX1+....................................................... 29, 67, 99 CSI0_TX............................................................. 29, 67, 99 CSI0_TX+.......................................................... 29, 67, 99 CSI1_CK............................................................. 30, 67, 95 CSI1_CK+.......................................................... 30, 67, 95 CSI1_RX0.......................................................... 29, 67, 95 CSI1_RX0+....................................................... 29, 67, 95 CSI1_RX1-......................................................... 29, 67, 95 CSI1_RX1+....................................................... 29, 67, 95 CSI1_RX2-......................................................... 29, 67, 95 CSI1_RX2+....................................................... 29, 67, 95 CSI1_RX3-......................................................... 29, 31, 67, 95 CSI1_RX3+....................................................... 29, 67, 95 CSI1_TX-........................................................... 30, 31, 32, 67, 99 CSI1_TX+.......................................................... 30, 31, 32, 67, 99 CSI2_CK............................................................. 31 CSI2_CK+.......................................................... 31 CSI2_RX0.......................................................... 31 CSI2_RX0+....................................................... 31 CSI2_RX1-......................................................... 31 CSI2_RX1+....................................................... 31 CSI2_RX2-......................................................... 31 CSI2_RX2+....................................................... 31 CSI2_RX3.......................................................... 31 CSI2_RX3+....................................................... 31 CSI2_TX-........................................................... 31 CSI2_TX+.......................................................... 31 CSI3_CK............................................................. 32 CSI3_CK+.......................................................... 32 CSI3_RX0.......................................................... 32 CSI3_RX0+....................................................... 32 CSI3_RX1-......................................................... 32 CSI3_RX1+....................................................... 32 CSI3_RX2-......................................................... 32 CSI3_RX2+....................................................... 32 CSI3_RX3.......................................................... 32 CSI3_RX3+....................................................... 32 CSI3_TX............................................................. 32 CSI3_TX+.......................................................... 32 I2C_CAM0_CK................................................... 29, 67, 99 I2C_CAM0_DAT............................................... 29, 67, 99 I2C_CAM1_CK................................................... 30, 31, 32, 67, 99 I2C_CAM1_DAT............................................... 30, 31, 32, 67, 99 I2C_CAM2_CK................................................... 31 I2C_CAM2_DAT............................................... 31 I2C_CAM3_CK................................................... 32 I2C_CAM3_DAT............................................... 32 **CAN** CAN0_RX........................................................... 44, 71, 98 SMARC 2.1.1 Specification © 2020 SGET e.V. Page 104 of 109](.smarc-hardware-specification-v2-1-1/slide-104.jpg) ## Slide 105 ![**Left Column:** CAN0_TX 44, 71, 98 CAN1_RX 44, 71, 98 CAN1_TX 44, 71, 98 **Display** DP0_AUX- 21, 24, 28, 70, 71, 101, 102 DP0_AUX_SEL 28, 70, 101 DP0_AUX+ 28, 70, 71, 101, 102 DP0_HPD 28, 70, 101 DP0_LANE0- 28, 70, 101 DP0_LANE0+ 28, 70, 101 DP0_LANE1- 28, 70, 101 DP0_LANE1+ 28, 70, 101 DP0_LANE2- 28, 70, 101 DP0_LANE2+ 28, 70, 101 DP0_LANE3- 28, 70, 101 DP0_LANE3+ 28, 70, 101 DP1_AUX- 21, 24, 26, 27, 70, 97, 101 DP1_AUX_SEL 26, 70, 97 DP1_AUX+ 26, 27, 70, 97, 101 DP1_HPD 26, 27, 70, 97 DP1_LANE0- 26, 27, 70, 97 DP1_LANE0+ 26, 27, 70, 97 DP1_LANE1- 26, 27, 70, 97 DP1_LANE1+ 26, 27, 70, 97 DP1_LANE2- 26, 27, 70, 97 DP1_LANE2+ 26, 27, 70, 97 DP1_LANE3- 26, 27, 70, 97 DP1_LANE3+ 26, 27, 70, 97 DSI0_CLK- 23, 24, 71, 102 DSI0_CLK+ 23, 24, 71, 102 DSI0_D0- 23, 24, 70, 102 DSI0_D0+ 23, 24, 70, 102 DSI0_D1- 23, 24, 71, 102 DSI0_D1+ 23, 24, 71, 102 DSI0_D2- 23, 24, 71, 102 DSI0_D2+ 23, 24, 71, 102 DSI0_D3- 23, 24, 71, 102 DSI0_D3+ 23, 24, 71, 102 DSI0_TE 23, 24, 71, 102 DSI1_CLK- 23, 24, 70, 101 DSI1_CLK+ 23, 24, 70, 101 DSI1_D0- 23, 24, 70, 101 DSI1_D0+ 23, 24, 70, 101 DSI1_D1- 23, 24, 70, 101 DSI1_D1+ 23, 24, 70, 101 DSI1_D2- 23, 24, 70, 101 **Right Column:** DSI1_D2+ 23, 24, 70, 101 DSI1_D3- 23, 24, 70, 102 DSI1_D3+ 23, 24, 70, 101 DSI1_TE 23, 24, 70, 101 eDP0_AUX- 21, 24, 71, 102 eDP0_AUX+ 21, 24, 71, 102 eDP0_HPD 21, 24, 70, 102 eDP0_TX0- 21, 24, 70, 102 eDP0_TX0+ 21, 24, 70, 102 eDP0_TX1- 21, 24, 71, 102 eDP0_TX1+ 21, 24, 71, 102 eDP0_TX2- 21, 24, 71, 102 eDP0_TX2+ 21, 24, 71, 102 eDP0_TX3- 21, 24, 71, 102 eDP0_TX3+ 21, 24, 71, 102 eDP1_AUX- 21, 24, 70, 101 eDP1_AUX+ 21, 24, 70, 101 eDP1_HPD 22, 24, 70, 101 eDP1_TX0- 21, 24, 70, 101 eDP1_TX0+ 21, 24, 70, 101 eDP1_TX1- 21, 24, 70, 101 eDP1_TX1+ 21, 24, 70, 101 eDP1_TX2- 21, 24, 70, 101 eDP1_TX2+ 21, 24, 70, 101 eDP1_TX3- 21, 24, 70, 101 eDP1_TX3+ 21, 24, 70, 101 HDMI_CK- 25, 27, 70, 97 HDMI_CK+ 25, 27, 70, 97 HDMI_CTRL_CK 25, 26, 27, 70, 97 HDMI_CTRL_DAT 25, 26, 27, 70, 97 HDMI_D0- 25, 27, 70, 97 HDMI_D0+ 25, 27, 70, 97 HDMI_D1- 25, 27, 70, 97 HDMI_D1+ 25, 27, 70, 97 HDMI_D2- 25, 27, 70, 97 HDMI_D2+ 25, 27, 70, 97 HDMI_HPD 25, 27, 70, 97 LCD0_BKLT_EN 20, 21, 23, 24, 71, 102 LCD0_BKLT_PWM 20, 21, 23, 24, 71, 102 LCD0_VDD_EN 19, 21, 23, 24, 71, 102 LCD1_BKLT_EN 20, 21, 23, 24, 70, 101 LCD1_BKLT_PWM 20, 22, 23, 24, 70, 102 LCD1_VDD_EN 20, 21, 23, 24, 70, 101 LVDS0_0- 19, 24, 70, 102 LVDS0_0+ 19, 24, 70, 102 LVDS0_1- 19, 71, 102 LVDS0_1+ 19, 24, 71, 102 **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 105 of 109](.smarc-hardware-specification-v2-1-1/slide-105.jpg) ## Slide 106 ![This slide presents a reference table of signal names and associated page numbers, organized into two columns. **Left Column:** **LVDS** LVDS0_2- ................................................................... 19, 24, 71, 102 LVDS0_2+ ................................................................... 19, 24, 71, 102 LVDS0_3- ................................................................... 19, 24, 71, 102 LVDS0_3+ ................................................................... 19, 24, 71, 102 LVDS0_CK- .................................................................. 19, 24, 71, 102 LVDS0_CK+ .................................................................. 19, 24, 71, 102 LVDS1_0- ................................................................... 20, 24, 70, 101 LVDS1_0+ ................................................................... 20, 24, 70, 101 LVDS1_1- ................................................................... 20, 70, 101 LVDS1_1+ ................................................................... 20, 24, 70, 101 LVDS1_2- ................................................................... 20, 24, 70, 101 LVDS1_2+ ................................................................... 20, 24, 70, 101 LVDS1_3- ................................................................... 20, 24, 70, 102 LVDS1_3+ ................................................................... 20, 24, 70, 101 LVDS1_CK- .................................................................. 20, 24, 70, 101 LVDS1_CK+ .................................................................. 20, 24, 70, 101 **ESPI** ESPI_ALERT0# ................................................................ 38, 68, 100 ESPI_ALERT1# ................................................................ 38, 68, 100 ESPI_CK .................................................................... 38, 68, 96 ESPI_CS0# .................................................................. 38, 68, 96 ESPI_CS1# .................................................................. 38, 68, 96 ESPI_IO_0 .................................................................. 38, 68, 96 ESPI_IO_1 .................................................................. 38, 68, 96 ESPI_IO_2 .................................................................. 38, 68, 100 ESPI_IO_3 .................................................................. 38, 68, 100 ESPI_RESET# ................................................................ 38, 68, 100 **Ethernet** GBE0_CTREF ................................................................ 55, 68, 95 GBE0_LINK_ACT# ............................................................ 55, 67, 95 GBE0_LINK100# ............................................................. 55, 67, 95 GBE0_LINK1000# ............................................................ 55, 67, 95 GBE0_MDI0- ................................................................ 55, 68, 95 GBE0_MDI0+ ................................................................ 55, 68, 95 GBE0_MDI1- ................................................................ 55, 67, 95 GBE0_MDI1+ ................................................................ 55, 68, 95 GBE0_MDI2- ................................................................ 55, 67, 95 GBE0_MDI2+ ................................................................ 55, 67, 95 GBE0_MDI3- ................................................................ 55, 67, 95 GBE0_MDI3+ ................................................................ 55, 67, 95 GBE0_SDP ................................................................... 55, 67, 95 GBE1_CTREF ................................................................ 56, 68, 99 GBE1_LINK_ACT# ............................................................ 56, 68, 99 GBE1_LINK100# ............................................................. 56, 67, 99 GBE1_LINK1000# ............................................................ 56, 67, 99 GBE1_MDI0- ................................................................ 56, 67, 99 **Right Column:** GBE1_MDI0+ ................................................................ 56, 67, 99 GBE1_MDI1- ................................................................ 56, 67, 99 GBE1_MDI1+ ................................................................ 56, 67, 99 GBE1_MDI2- ................................................................ 56, 67, 99 GBE1_MDI2+ ................................................................ 56, 67, 99 GBE1_MDI3- ................................................................ 56, 67, 99 GBE1_MDI3+ ................................................................ 56, 67, 99 GBE1_SDP ................................................................... 56, 67, 95 **GPIO** GPIO0 ...................................................................... 29, 58, 59, 70, 97 GPIO1 ...................................................................... 30, 58, 59, 70, 97 GPIO10 ..................................................................... 58, 70, 97 GPIO11 ..................................................................... 58, 70, 98 GPIO12 ..................................................................... 58, 71, 102 GPIO13 ..................................................................... 58, 70, 102 GPIO2 ...................................................................... 29, 58, 59, 70, 97 GPIO3 ...................................................................... 30, 58, 59, 70, 97 GPIO4 ...................................................................... 58, 59, 70, 97 GPIO5 ...................................................................... 15, 58, 59, 70, 97 GPIO6 ...................................................................... 16, 58, 59, 70, 97 GPIO7 ...................................................................... 58, 70, 97 GPIO8 ...................................................................... 58, 70, 97 GPIO9 ...................................................................... 58, 70, 97 **I2C** I2C_GP_CK .................................................................. 42, 68, 100 I2C_GP_DAT ................................................................... 42, 68, 100 I2C_LCD_CK ................................................................... 20, 22, 23, 24, 71, 102 I2C_LCD_DAT .................................................................. 20, 22, 23, 24, 71, 102 I2C_PM_CK .................................................................... 61, 70, 98 I2C_PM_DAT ................................................................... 61, 70, 98 **Misc** BOOT_SEL0# ................................................................ 62, 63, 70, 98 BOOT_SEL1# ................................................................ 62, 63, 70, 98 BOOT_SEL2# ................................................................ 62, 63, 70, 98 FORCE_RECOV# .............................................................. 62, 71, 102 LID# ....................................................................... 61, 71, 102 PWM_OUT ................................................................... 58, 59, 70, 97 RESET_IN# .................................................................. 60, 61, 65, 71, 98 RESET_OUT# ................................................................ 61, 71, 98 RSVD ..................................................................... 67, 69, 96, 99, 100, 102 SLEEP# ..................................................................... 60, 71, 102 SMB_ALERT# ................................................................ 61, 67, 95 TACHIN ..................................................................... 58, 59, 70, 97 TEST# ...................................................................... 61, 71, 102 WDT_TIME_OUT# .............................................................. 57, 71, 102 **Footer:** SMARC 2.1.1 Specification © 2020 SGET e.V. Page 106 of 109](.smarc-hardware-specification-v2-1-1/slide-106.jpg) ## Slide 107 ![PCIe PCIE_A_CKREQ#.....................50, 51, 69, 96 PCIE_A_REFCK-.....................50, 69, 97 PCIE_A_REFCK+.....................50, 69, 97 PCIE_A_RST#.....................50, 51, 69, 96 PCIE_A_RX-.....................50, 69, 97 PCIE_A_RX+.....................50, 69, 97 PCIE_A_TX-.....................50, 69, 97 PCIE_A_TX+.....................50, 69, 97 PCIE_B_CKREQ#.....................50, 51, 69, 96 PCIE_B_REFCK-.....................50, 69, 101 PCIE_B_REFCK+.....................50, 69, 101 PCIE_B_RST#.....................50, 51, 69, 100 PCIE_B_RX-.....................50, 69, 101 PCIE_B_RX+.....................50, 69, 101 PCIE_B_TX-.....................50, 69, 101 PCIE_B_TX+.....................50, 69, 101 PCIE_C_REFCK-.....................50, 53, 69, 97 PCIE_C_REFCK+.....................50, 53, 69, 97 PCIE_C_RST#.....................50, 51, 53, 69, 100 PCIE_C_RX-.....................50, 53, 69, 100 PCIE_C_RX+.....................50, 53, 69, 100 PCIE_C_TX-.....................50, 53, 69, 101 PCIE_C_TX+.....................50, 53, 69, 101 PCIE_D_RX-.....................50, 53, 68, 99 PCIE_D_RX+.....................50, 53, 68, 99 PCIE_D_TX-.....................50, 53, 68, 99 PCIE_D_TX+.....................50, 53, 68, 99 PCIE_WAKE#.....................12, 50, 71, 102 Power BATLOW#.....................60, 71, 102 CARRIER_PWR_ON.....................16, 60, 71, 85, 86, 102 CARRIER_STBY#.....................60, 71, 85, 86, 102 CHARGER_PRSNT#.....................60, 71, 102 CHARGING#.....................60, 71, 102 GND..26, 28, 31, 32, 46, 60, 62, 63, 64, 65, 67, 68, 69, 70, 71, 78, 79, 84, 95, 96, 97, 98, 99, 100, 101, 102 POWER_BTN#.....................61, 71, 98 VDD_IN.....................17, 60, 64, 71, 84, 86, 98 VDD_RTC.....................64, 71, 84, 102 VIN_PWR_BAD#.....................16, 60, 71, 85, 86, 102 QSPI QSPI_CK.....................36, 38, 68, 96 QSPI_CS0#.....................36, 38, 68, 96 QSPI_CS1#.....................36, 38, 68, 96 QSPI_IO_0.....................36, 38, 68, 96 QSPI_IO_1.....................36, 38, 68, 96 QSPI_IO_2.....................36, 38, 68, 100 QSPI_IO_3.....................36, 38, 68, 100 SATA SATA_ACT#.....................54, 68, 100 SATA_RX-.....................68, 96 SATA_RX+.....................68, 96 SATA_TX-.....................68, 96 SATA_TX+.....................68, 96 SDIO SDIO_CD#.....................34, 68, 95 SDIO_CK.....................34, 68, 95 SDIO_CMD.....................34, 68, 95 SDIO_D0.....................34, 68, 96 SDIO_D1.....................34, 68, 96 SDIO_D2.....................34, 68, 96 SDIO_D3.....................34, 68, 96 SDIO_PWR_EN.....................34, 68, 95 SDIO_WP.....................34, 68, 95 SERDES MDIO_CLK.....................52, 53, 68, 100 MDIO_DAT.....................52, 53, 68, 100 SERDES_0_RX-.....................52, 53, 68, 99 SERDES_0_RX+.....................52, 53, 68, 99 SERDES_0_TX-.....................52, 53, 68, 99 SERDES_0_TX+.....................52, 53, 68, 99 SERDES_1_RX-.....................52, 53, 69, 100 SERDES_1_RX+.....................52, 53, 69, 100 SERDES_1_TX-.....................52, 53, 69, 101 SERDES_1_TX+.....................52, 53, 69, 101 Serial SER0_CTS#.....................43, 71, 98 SER0_RTS#.....................43, 71, 98 SER0_RX.....................43, 71, 98 SER0_TX.....................43, 71, 98 SER1_RX.....................43, 71, 98 SER1_TX.....................43, 71, 98 SER2_CTS#.....................43, 71, 98 SER2_RTS#.....................43, 71, 98 SER2_RX.....................43, 71, 98 SER2_TX.....................43, 71, 98 SER3_RX.....................43, 71, 98 SER3_TX.....................43, 71, 98 SPI SMARC 2.1.1 Specification © 2020 SGET e.V. Page 107 of 109](.smarc-hardware-specification-v2-1-1/slide-107.jpg) ## Slide 108 ![This slide lists pin assignments for SPI and USB interfaces. **Left Column:** SPI0_CK ...................................................... 35, 68, 96 SPI0_CS0# ...................................................... 35, 68, 96 SPI0_CS1# ...................................................... 35, 68, 95 SPI0_DIN ...................................................... 35, 68, 96 SPI0_DO ...................................................... 35, 68, 96 SPI1_CK ...................................................... 35, 38, 68, 96 SPI1_CS0# ...................................................... 35, 38, 68, 96 SPI1_CS1# ...................................................... 35, 38, 68, 96 SPI1_DIN ...................................................... 35, 38, 68, 96 SPI1_DO ...................................................... 35, 38, 68, 96 **USB** USB0- ...................................................... 46, 68, 96 USB0_EN_OC# ...................................................... 46, 69, 96 USB0_OTG_ID ...................................................... 46, 69, 96 USB0_VBUS_DET ...................................................... 46, 69, 96 USB0+ ...................................................... 46, 68, 96 USB1- ...................................................... 46, 69, 96 USB1_EN_OC# ...................................................... 46, 69, 96 USB1+ ...................................................... 46, 69, 96 USB2- ...................................................... 46, 69, 96 **Right Column:** USB2_EN_OC# ...................................................... 46, 69, 96 USB2_SSRX- ...................................................... 46, 69, 100 USB2_SSRX+ ...................................................... 46, 69, 100 USB2_SSTX- ...................................................... 46, 69, 100 USB2_SSTX+ ...................................................... 46, 69, 100 USB2+ ...................................................... 46, 69, 96 USB3- ...................................................... 46, 69, 100 USB3_EN_OC# ...................................................... 47, 69, 96 USB3_OTG_ID ...................................................... 47, 70, 101 USB3_SSRX- ...................................................... 46, 69, 100 USB3_SSRX+ ...................................................... 46, 69, 100 USB3_SSTX- ...................................................... 46, 69, 100 USB3_SSTX+ ...................................................... 46, 68, 100 USB3_VBUS_DET ...................................................... 47, 68, 99 USB3+ ...................................................... 46, 69, 100 USB4- ...................................................... 47, 68, 99 USB4_EN_OC# ...................................................... 47, 69, 96 USB4+ ...................................................... 47, 68, 99 USB5- ...................................................... 47, 68, 100 USB5_EN_OC# ...................................................... 47, 68, 100 USB5+ ...................................................... 47, 68, 100 **Footer:** SMARC 2.1.1 Specification ............................ © 2020 SGET e.V. ............................ Page 108 of 109](.smarc-hardware-specification-v2-1-1/slide-108.jpg) ## Slide 109 ![The slide features a large, lime-green logo on the left side, resembling a cross with rounded ends and a white square cutout in the center. To the right of the logo is the text 'SMARC' in large, bold, dark blue capital letters. Directly below 'SMARC' is the word 'module' in a smaller, dark blue font. Centered below the title is the text: '© Copyright 2020, SGET Standardization Group for Embedded Technology e.V.' The footer contains three distinct lines of text: - Bottom Left: 'SMARC 2.1.1 Specification' - Bottom Center: '© 2020 SGET e.V.' - Bottom Right: 'Page 109 of 109'](.smarc-hardware-specification-v2-1-1/slide-109.jpg) [🔗 Link to the original document](.smarc-hardware-specification-v2-1-1/smarc-hardware-specification-v2-1-1.pdf)