ADLINK GPU Solutions # Simplify the Design and Deployment of Edge Computing and Edge AI Applications ADLINK Extends System Performance, Lifecycle, and ROI with Hardware Optimization • Embedded Graphics/Deep Learning Accelerator • GPU Computing Platform • Edge AI Platform • Customization Services # Table of Contents Table of Contents.. . III About ADLINK . . . . . 01 Simplify the Design and Deployment of Edge Computing and Edge AI Applications . . . 02 Design with ADLINK GPU-Powered Solutions . . . 05 Reduce Your Design Efforts . . . 10 Product Selection . . . 13 MXM Modules.. . . . 13 MXM GPU Modules with NVIDIA Turing™ Architecture....13 MXM GPU Modules with NVIDIA Pascal™ Architecture.....13 PEG Cards... . . . 14 Embedded Graphics/Deep Learning Accelerators...........15 EGX-MXM-T1000.. . . . 15 EGX-MXM-RTX3000. . . . 16 EGX-MXM-RTX5000. . . . 17 EGX-MXM-P1000.. . . . 18 EGX-MXM-P2000.. . . . 20 EGX-MXM-P3000.. EGX-MXM-P5000 Quadro PEG RTX4000. . . . 24 Quadro PEG RTX6000. Quadro-E PEG P620.. . . . 28 Quadro-E PEG P1000.. . . . 29 Quadro-E PEG P2200.. . . . 30 GPU Computing Platform Supporting MXM Modules......31 MVP-5100-MXM Series . . . 31 MVP-6100-MXM Series . . . 33 DLAP-3000-CF Series. . . . 35 DLAP-3100-CF Series. . . . . 37 DLAP-3200-CF Series. . . . . 39 DLAP-4000 Series.. . . . . 41 DLAP-8000 Series . . . . 43 ADi-SC1X . . . . 45 AMSTX-CF Series.. . . . . 47 GPU Computing Platform Supporting PEG. . . . . 49 MVP-6100 Series .. . . . . 49 MVP-6010/6020 Series. . . . . 51 MXC-6400 Series.. . . . . 54 MXC-6600 Series.. . . . . 56 ADi-SA1X-KB/SL . . . . 58 ADi-SA2X-KB/SL . . . . 61 IMB-M43.. . . . . 64 IMB-M43H.. . . . . 67 IMB-M43H.. . . . . 69 IMB-M45... . . . . 71 IMB-M45H... . . . . 74 AmITX-SL-G... AmITX-AL-I . . . . 80 AmITX-RZ-G.. . . . . 84 Jetson-based Edge AI Platform. . . . . 87 DLAP-201-JT2.. . . . . 87 DLAP-211-Nano.. . . . . 88 DLAP-211-JNX.. . . . 89 DLAP-301-Nano . . . . 90 DLAP-301-JNX.. . . . . 91 DLAP-401-Xavier.. . . . . 92 ![ADLINK 01](.2021-gpu-solutions-brochure/095c65ebcb78e200ca39233cd9420fc093a2f6f796fe0b6f6f8c10dce7f5ea3b.jpg) # About ADLINK ADLINK Technology, a global provider of leading edge computing solutions, is an NVIDIA® Quadro® Embedded Partner, Jetson™ Elite Partner, and OEM Preferred Partner. With deep industry experience in embedded systems and edge applications, ADLINK has formulated a hardware optimization strategy to enable edge computing and edge artificial intelligence (AI) deployment with GPU-accelerated, heterogeneous computing platforms. ![The image displays the NVIDIA logo, a stylized green eye shape, centered on a background that is split vertically. The right side features a white square background, while the left side features a solid green rectangular background. The green logo is visible on both sides, contrasting clearly with the white background on the right and appearing on the green background on the left. The logo consists of concentric curved lines forming an abstract eye.](.2021-gpu-solutions-brochure/fdd58945839da75b57d336ed3888ea797a6f2e6027d82a013bab6ed418ba5f18.jpg) NVIDIA QUADRO CER Quadro Embedded Partner ![The image displays the NVIDIA logo set against a solid black background. On the left is a lime green, stylized eye-like shape formed by concentric curves. To its right is a lime green square containing a black, curved shape resembling the letter 'N'.](.2021-gpu-solutions-brochure/77e29640c9badc337aaa3497d6522abe89a2d194843831e8cd15d0436ee4c23a.jpg) NVIDIA. Jetson Elite Partner ELITE PARTNER ![The image displays the NVIDIA logo, which consists of a stylized lowercase 'e'. The background is split vertically into two equal halves: the left side is black, and the right side is green. The letter 'e' follows this division, with the left half of the character appearing green against the black background and the right half appearing black against the green background.](.2021-gpu-solutions-brochure/643bc615c2b121b854be344a4fb876cd5866444aeeb15cc9df233b6e6cc51a07.jpg) NVIDIA. PREFERRED PARTNER OEM Preferred Partner ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan, and China (Figure 1); an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485, and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166). Our products are currently available in over 40 countries across five continents and are supported by worldwide distribution networks and offices and more than 1,600 employees. ![ Region Value :--- :--- Europe 100 China 80 Korea 75 Japan 70 Taiwan 65 South East Asia 60 America 55 ](.2021-gpu-solutions-brochure/70fa808d5bdbb275f2d761034fe665c5b0148dade08cb2cb73174078190585dc.jpg) Figure 1. ADLINK R&D and integration sites # Simplify the Design and Deployment of Edge Computing and Edge AI Applications # Executive Summary Embedded graphics enable system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and AI. Graphics solutions typically use graphics processing units (GPUs) to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management (Figure 2), along with other embedded segments. ![The flowchart is organized into three horizontal sections connected by downward-pointing green arrows. **Top Section** * **Header:** 'Graphics is used for' * **Blocks:** * 'Image processing' (under an icon labeled 'IMG') * 'Image analysis' (under a bar graph icon) * 'Compute acceleration' (under a microchip icon) * 'Artificial intelligence' (under a brain icon) **Middle Section** * **Header:** 'Graphics is used in' * **Blocks:** * 'Manufacturing' * 'Healthcare' * 'Aerospace & Defense' * 'Maritime' * 'Transport' * 'Gaming' **Bottom Section** * **Header:** 'Yet, challenges ahead include' * **Blocks:** * 'System responsiveness' * 'Long product availability' * 'Power efficiency' * 'Durability' * 'Form factor'](.2021-gpu-solutions-brochure/3ef848cac9fae375fe5ba69a26741d1ecdcc5166a2264e00ca3f9af791543d52.jpg) Figure 2. Graphics is widely used in embedded applications Still, adding a GPU to an embedded system can be a complex task. One approach is to use graphics cards developed for the gaming application segment, which accounts for about a third of all GPUs1 ; however, these cards often do not satisfy key embedded system requirements, such as low system latency, long product availability, and power efficiency. Addressing these issues, ADLINK products greatly simplify the process of adding GPUs to embedded designs. These products can satisfy a wide range of embedded requirements around performance, long lifecycle, power consumption, and form factor. The following section describes how ADLINK GPU solutions are being used in edge computing and edge AI applications, and the way ADLINK products can simplify the design process for system developers, OEMs, and systems integrators. ![Composite image showing medical imaging equipment, a person using a laptop, and an airfield view (no visible text or symbols)](.2021-gpu-solutions-brochure/592e001667c7f1af341734dc1788b21f39608d87bbacd0e25aa0543e45a08236.jpg) # Key Design Objectives The deployment of edge computing and edge AI applications satisfies many business objectives, including: ![The image features three concentric, rounded rectangular outlines in green hues on a white background. Inside the innermost rectangle is the text 'IMG' in a sans-serif font. To the right of the rectangles are several small, white, starburst-like shapes.](.2021-gpu-solutions-brochure/13508b2c92446a4c271f74feeb459efccc5b8c85e984ac2a1bb25c5339548064.jpg) # Improve Signal and Image Processing Performance Embedded graphics solutions enable system developers, OEMs, and systems integrators to significantly improve signal and image processing performance in various application areas, including aerospace, maritime, medical, and industrial automation. ![The image features a white background with a grey horizontal bar at the top edge. Below the bar, there are two black-outlined gears. The gear on the left is smaller than the gear on the right. A green arrow originates near the top of the smaller gear and points diagonally upward to the right, passing between the gears and ending above the larger gear.](.2021-gpu-solutions-brochure/72464360e6fca5902b47aced3c463750212df09423d1f42888895b60fe3f84d2.jpg) # Optimize Investment, Maximize Productivity Companies seeking to maximize the innovation and productivity gains from deep learning and AI should consider using a computing platform optimized for the associated algorithms. # Key Business Challenges Solution providers implementing GPU-based solutions face various business considerations, such as: ![Three identical circular arrows are arranged horizontally from left to right. The arrows depict a clockwise rotation. Their colors progress from grey on the left to light green in the center and dark green on the right.](.2021-gpu-solutions-brochure/d6e2201fbae848df9c57e254c09895d9b802767b9020a749fe17fc649715ef41.jpg) # Extending Product Lifecycle Many commercial graphics solutions, such as those developed for gaming applications, have a relatively short lifecycle due to users’ desires for the latest and greatest graphics technology. When embedded solution providers implement these commercial graphics solutions, they may be forced to conduct frequent product certifications, which can be time consuming and expensive. This situation is made more difficult by the relatively few vendors that offer embedded GPU-based computing solutions compared to general-purpose, CPU-based solutions. ![The image features a light green line-art icon of a stopwatch on a white background. Inside the circular face of the stopwatch is a dollar sign (\$) with a curved arrow circling around it.](.2021-gpu-solutions-brochure/73ec95b6501a9021fe3a636c15834457752bbbccbc08f5172dfaad3b8e446ccf.jpg) # Balancing Cost and Efficiency Many AI workloads require large amounts of memory, parallel computing, and low-precision computation.2 The challenge for system architects is to define an optimized AI platform that cost-effectively delivers these computing resources in ways that satisfy their speed and accuracy requirements. For platforms deployed at the edge, system architects must address additional requirements, such as environmental hardening and stringent SWaP constraints. # Solving Design Challenges ADLINK products and services enable developers to improve their system designs, such as: ![The image displays a line graph overlaid on a bar chart against a white background. The bar chart consists of vertical grey bars of varying heights arranged in a row. The line graph, colored light green, connects circular nodes positioned above the bars and generally trends upward from left to right.](.2021-gpu-solutions-brochure/dfcc7d280d211cf6e3848844f72cd40b887273c20af99fd879e106948e07ccf4.jpg) # Increasing Embedded Graphics Performance A common theme in the embedded application examples is the need to quickly move external data from sensors and other sources to the GPU for processing. ADLINK achieves this by implementing remote direct memory access (RDMA), a feature of NVIDIA GPUDirect™ technology in NVIDIA® Quadro® GPUs that can boost data throughput by approximately 80 percent (3.6 to 6.5 gigabytes per second). RDMA gives external data sources direct access to the GPU’s external memory, as shown on the left side of Figure 3. Without this feature, data would be copied into a CPU’s memory (red line on right side of Figure 3) before reaching the GPU, which needlessly increases data transmission delay and latency. As an NVIDIA Quadro Embedded Partner with extensive experience in embedded applications, ADLINK is uniquely qualified to provide system developers with solutions using GPUDirect, enabling them to tap into the power of embedded graphics and AI. 2 Sundeep Bajikar, “Why AI Workloads Require New Computing Architectures,” ![Figure 4. Developers need to evaluate many areas to attain an optimized computing platform for AI solutions](.2021-gpu-solutions-brochure/b7d92754017f8bcf00f76de5c74374cf22121860d11f524a67e635830fdb5d0d.jpg) ![The image displays a block diagram titled '**Dataflow with NVIDIA GPUDirect™ RDMA**'. **Labeled Blocks:** * **System Memory** (top left) * **CPU** (top right) * **GPU** (middle left) * **GPU Memory** (bottom left) * **Chipset** (center) * **3rd Party Devices** (right) **Connections:** * **System Memory** and **CPU** are connected by a horizontal double-headed arrow. * **CPU** and **Chipset** are connected by a vertical double-headed arrow. * **GPU** and **Chipset** are connected by a horizontal double-headed arrow. * **Chipset** and **3rd Party Devices** are connected by a horizontal double-headed arrow. * **GPU** and **GPU Memory** are connected by three vertical double-headed arrows. * A thick red arrow points downward from the **GPU** block to the **GPU Memory** block. * A horizontal pink line (arrow) originates from the **GPU** block, passes underneath the **Chipset**, and points to the **3rd Party Devices** block.](.2021-gpu-solutions-brochure/888cded45aa4a9b4c977b361814f2c4c87cd0cc08a67a18a5399906bd230f992.jpg) Figure 3. NVIDIA GPUDirect™ example3 ![Based on the provided image, here is the accurate and concise description of the flowchart: **Labeled Blocks:** * **System Memory** (top left, dark grey square) * **CPU** (top right, grey square with blue center) * **GPU** (middle left, green square with dark grey center) * **Chipset** (center, small blue square) * **GPU Memory** (bottom left, green square) * **3rd Party Devices** (far right, green rectangular device) * **Dataflow without NVIDIA GPUDirect RDMA** (text caption at bottom right) **Connections:** * **System Memory and CPU**: Connected by a black double-headed arrow. A red arrow points left from the CPU to System Memory, and a faint pink arrow points right from System Memory to the CPU. * **CPU and Chipset**: Connected by a black double-headed arrow. A red line extends downwards from the CPU to the Chipset. * **Chipset and 3rd Party Devices**: Connected by a black double-headed arrow. A faint pink arrow points right from the Chipset to the 3rd Party Devices. * **Chipset and GPU**: Connected by a black double-headed arrow. A red line extends leftwards from the Chipset to the GPU. * **GPU and GPU Memory**: Connected by three vertical black double-headed arrows. A red line extends downwards from the GPU to the GPU Memory.](.2021-gpu-solutions-brochure/976e20a50b919e0ddab872d593bd2528ffa844780e392752da5cad3f472bc505.jpg) ![The image displays a partial view of a gauge or dial against a white background. It features a black curved line forming an arc, representing the upper portion of a circular scale. Inside the arc, a thin green needle or pointer is visible, angled towards the right side, approximately at the 2 o'clock position. There is no text present in the image.](.2021-gpu-solutions-brochure/689f98b504c13f12992502d19580fd94b2eb926250a6d88c3c614d6918de1dd7.jpg) # Optimizing the Execution of AI Workloads In order to attain an optimized computing platform for deep learning and AI solutions, developers may need to evaluate many areas (Figure 4), including: z Selecting Hardware: Determine which computing cores and performance level are best suited to run the required AI algorithms and how much computing power and I/O bandwidth are needed. Hardware selection should also consider SWaP and cost constraints, particularly when deploying AI at the edge of the network. . Tuning AI Performance: Identify bottlenecks in the software or hardware due to insufficient platform resources (e.g., memory, I/O, computing cores, and cache), inefficient scheduling of software threads, or contention between various running processes. This analysis typically requires software profilers and other types of performance tuning tools. z Deploying Dynamic Workloads across the Network: Develop the ability to deploy and provision dynamic workloads across the network in order to improve inference results with refined AI models and tackle new challenges. Dynamic workloads require a flexible and adaptable computing architecture that enables a scalable, real-time, and reliable deployment environment. 3 NVIDIA GPUDirect™ Technology, http://developer.download.nvidia.com/devzone/ devcenter/cuda/docs/GPUDirect\_Technology\_Overview.pdf. # Edge AI Dynamic Workload Deployment Performance Profiling Hardware Selection # Design with ADLINK GPU-Powered Solutions Addressing the requirements of high-mix, low-volume applications, ADLINK offers a lineup of embedded graphics products that are powered by NVIDIA Quadro-embedded GPUs. This extensive product portfolio includes NVIDIA Jetson-based platforms and GPU computing platforms to address specific performance and SWaP requirements for edge computing and edge AI applications. Specification customization is also available to accommodate the application-specific needs of our embedded customers. System developers, OEMs, and systems integrators can more easily add embedded graphics and AI to their applications by using ADLINK’s GPU Solutions portfolio, shown in Figure 5. The portfolio includes embedded graphics products, GPU computing platforms, edge AI platforms, deep-learning consultancy and optimization services, and customization services. ![ GPU Type Hardware Processor CPU Type ---------- ----------- ----------- ---------- PEG ARM® Processor DLAP-211-Nano NEON-2000-JT2 PEG ARM® Processor DLAP-301-Nano NEON-2000-JNX PEG ARM® Processor DLAP-201 NEON-2000-JNX PEG ARM® Processor DLAP-301-JNX ROScube-X PEG ARM® Processor DLAP-211-Nano ROScube-X MXM ARM® Processor AmSTX-CF cPCI-R6500 MXM ARM® Processor AmSTX-CF cPCI-R6500 MXM ARM® Processor AmSTX-CF cPCI-R6500 MXM ARM® Processor AmSTX-CF cPCI-R6500 MXM ARM® Processor AmSTX-CF cPCI-R6500 MXM ARM®, IMB Series AmITX-AL-I IMB Series MXM ARM®, IMB Series AMD-SA1X ADi-SA1X MXM ARM®, IMB Series AMD-SA2X ADi-SA2X MXM ARM®, IMB Series AMD-SA1X AMD-SA2X MXM ARM®, IMB Series AMD-SA1X AMD-SA2X MXM ARM®, IMB Series AMD-SA1X AMD-SA2X MXM ARM®, IMB Series AMD-SA1X AMD-SA2X MXM ARM®, IMB Series AMD-SA1X AMD-SA2X MXM ARM®, IMB Series AlPTX-AL-I AMD-SA1X MXM ARM®, IMB Series AlPTX-AL-I AMD-SA1X MXM ARM®, IMB Series AlPTX-AL-I AMD-SA1X MXM ARM®, IMB Series AlPTX-AL-I AMD-SA1X MXM ARM®, IMB Series AlPTX-AL-I AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM ALPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X MDI-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX-AL-I AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1X MXM AlPTX - ALI AMD-SA1X AMD-SA1 X MXM AlPTX - ALI AMD-SA1X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA1 X MXM AlPTX - ALI AMD-SA1 X AMD-SA2 X MXM AlPTX - ALI AMD-SA2 X AMD-SA2 X MXM AlPTX - ALI AMD-SA2 X AMD-SA2 X MXM AlPTX - ALI AMD-SA2 X AMD-SA2 X MXM AlPTX - ALI AMD-SA2 X AMD-SA2 X MXM AlPTX - ALI 480000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000 MLT / MXP-6*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 .(fcel)MLT / MXP-6*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*5*7 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *7 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *6 *7 *3 *3.499999999999999999999999999999999999999999999999999999999999999999999999999999999999999999999999999988.(nl)](.2021-gpu-solutions-brochure/ffad60268133e479452a49847909b2aa6edffb3a41afb05c4e0c91e9612a0877.jpg) Figure 5. ADLINK solutions portfolio Dual-Width, FHFL F H F L P2200 (FHHL) HHHL P1000 P 6 2 0 Type B RTX5000 RTX3000 P5000 P3000 Type A T1000 P2000 P1000 Jetson AGX Xavier Xavier NX TX2 Nano ype ![Digital illustration of a human head silhouette with glowing brain, circuit board, and tech icons (no text or symbols)](.2021-gpu-solutions-brochure/4da2506777738547e6ed96c13dab099f8f93cfad9a3406fd114a9d0473284b1d.jpg) # Embedded Graphics/Deep-Learning Accelerators ADLINK offers two families of embedded graphics products that are an ideal fit for image processing and analysis, compute acceleration, and AI. ![The image displays the NVIDIA logo. It features a stylized eye symbol centered in a square. The background is split vertically, with the left half being light green and the right half being white. The logo itself is composed of black concentric curved lines, with a vertical black line dividing the center. The left side of the eye reveals the green background, while the right side reveals the white background.](.2021-gpu-solutions-brochure/96ee9ab7977bd5c024b61550301b10ba4e7282364cb91cbf517d2ca1493e1b95.jpg) NVIDIA' QUADRO? CERTIFIED EMBEDDED # Turing Architecture # EGX-MXM-T1000 Mobile PCI Express Module with NVIDIA Quadro Embedded T1000 GPU ![The image displays a green printed circuit board (PCB) featuring a large, central square microprocessor chip surrounded by several smaller black integrated circuits. Four gold contact pads are visible near the corners of the board. White text is printed on the board in specific locations: '105035' vertically along the top left edge, '210' vertically along the bottom left edge, '271024' horizontally along the bottom edge, and '20081105' vertically along the bottom right edge.](.2021-gpu-solutions-brochure/a68b30b664b02d2fe9e7fbdc14589cff635d4abdf44b7e4aaad5e0c84d1ae6fd.jpg) # EGX-MXM-RTX3000 Mobile PCI Express Module with NVIDIA Quadro Embedded RTX™ 3000 GPU ![The image displays a rectangular green printed circuit board (PCB). In the center is a large, square, silver-colored integrated circuit. Surrounding this central chip are four black rectangular chips arranged in a square. To the right of the central chip is a vertical column of five black chips. Gold-plated contact pins run along the left and right edges of the board. Small surface-mount components like resistors and capacitors are scattered across the board. White text printed on the board near the bottom right reads: CQ-700 201206 CE CQC ROHS Made in China Numbers '1' and '15' are visible near the pins on the right edge.](.2021-gpu-solutions-brochure/c55c6f50e5b87ec60ae1cf6fc04efad88bba429e823ec652667275eb7f09c9a6.jpg) # EGX-MXM-RTX5000 Mobile PCI Express Module with NVIDIA Quadro Embedded RTX5000 ![The image displays the back side of a green printed circuit board, likely a graphics card. In the center is a large, square processor chip. Surrounding this central chip are eight rectangular memory chips arranged in two columns of four on either side. Along the bottom edge is a row of gold contact pins. Near the bottom edge, the text 'EVGA' and 'P455' is printed in white. On the right side, near the top edge of the memory chips, a 'CE' marking is visible. Various smaller electronic components, such as capacitors and resistors, are scattered along the periphery of the board.](.2021-gpu-solutions-brochure/708da7b1b82bf3d2f2d01fde310bfaf763645a324d5e045ca5b6fa2f400118b6.jpg) # Pascal Architecture # EGX-MXM-P1000 Mobile PCI Express Module with NVIDIA® Quadro® Embedded P1000 GPU ![The image displays a green printed circuit board (PCB) populated with electronic components. Along the top edge, four black square chips are arranged in a horizontal row. In the center sits a larger square chip with a silver square in its middle. To the right of the central chip is a smaller black rectangular chip. Various small surface-mount components, such as resistors and capacitors, are scattered around the board. The bottom edge features a row of gold contact pins. Text printed on the board includes '962166' near the bottom left, '1402' near the bottom center, and '2011' near the bottom right.](.2021-gpu-solutions-brochure/c5c5063381ad550e8a4011d030e9e00f207521734c679a9d6f5752ddbd757ec8.jpg) # EGX-MXM-P2000 Mobile PCI Express Module with NVIDIA® Quadro® Embedded P2000 GPU ![Green circuit board featuring a central square chip covered by a silver heat spreader, four black rectangular chips near the top corners, two smaller black chips on the left and right sides, and four circular mounting holes with white rings at the corners. Text at the bottom left reads 'FANTECH' above 'PCI EXPRESS TO PCI ADAPTER CARD'. A small sticker with the letter 'N' is located at the bottom right edge.](.2021-gpu-solutions-brochure/7f1901b6d0dc5aa15de1a97a932c78fd431c659ff3fc65b236b8bffcd8b50e25.jpg) # EGX-MXM-P3000 Mobile PCI Express Module with NVIDIA® Quadro® Embedded P3000 GPU ![This image displays a close-up view of a computer motherboard. Dominating the lower center is a large, square green integrated circuit chip with a white square in its middle. Surrounding this chip are several small, cylindrical capacitors with gold tops. In the upper right corner, a group of smaller black chips is visible. A portion of a silver heatsink is seen at the very top edge. The green circuit board features intricate etched traces and white mounting holes. No legible text is visible on any of the components.](.2021-gpu-solutions-brochure/432960175d95c9b734dfe2d7c0dbb7223d6d46b22cee05c0e38f83e434633072.jpg) # EGX-MXM-P5000 Mobile PCI Express Module with NVIDIA® Quadro® Embedded P5000 GPU ![The image displays a close-up section of a dark printed circuit board (PCB). The central focus is a large square integrated circuit chip featuring a metallic heat spreader in the middle. Surrounding this main component are various electronic parts, including a rectangular connector with pins to the upper left and several large, grey rectangular capacitors to the upper right. The board surface shows visible circuit traces and numerous circular solder pads arranged in a grid pattern.](.2021-gpu-solutions-brochure/a95e288070db0b34342aef4d62b0ed849ac5f7323cd71fc7c74cf7a38a572fa8.jpg) # Quadro-E PEG P620 PCI Express Graphic Card with NVIDIA® Quadro® Embedded P620 ![The image displays a black computer graphics card, specifically an NVIDIA Quadro model, oriented horizontally. On the right side, there is a black cooling fan. The left side reveals various electronic components, including capacitors and chips on the circuit board. The word 'QUADRO' is printed vertically in white text near the center. Below that, the word 'NVIDIA' is printed vertically in smaller white text. A gold connector edge is visible at the bottom of the card.](.2021-gpu-solutions-brochure/e28335b9220d2928102affb5881f69fa2c56988aadaac7da8bac6ba1f7b83837.jpg) # Quadro-E PEG P1000 PCI Express Graphic Card with NVIDIA® Quadro® Embedded P1000 ![The image shows a black NVIDIA Quadro graphics card angled slightly against a white background. The card features a large cooling fan with a circular grille on the right side and the word 'QUADRO' printed vertically in white capital letters near the center of the circuit board. On the left edge, a metal bracket holds multiple video output ports, including two DVI connectors, an HDMI port, and a DisplayPort. The gold contact pins of the PCIe connector are visible along the bottom edge.](.2021-gpu-solutions-brochure/d396372d75fefe5edbef04427cbd27306f096cd24725d77ea6c2460944c9d6d2.jpg) # Quadro-E PEG P2200 PCI Express Graphic Card with NVIDIA® Quadro® P2200 ![The image displays a black computer graphics card, specifically an NVIDIA Quadro model, set against a plain white background. The card is oriented vertically. Key details include: * **Text:** The word '**QUADRO**' is printed vertically in large, white, capital letters along the center-left portion of the card's black shroud. The word '**NVIDIA**' is visible in smaller white letters at the bottom right corner of the shroud. * **Cooling:** A circular cooling fan with black blades is situated on the right side of the shroud. * **Ports:** On the far left edge, a metal I/O bracket features three video output ports. From top to bottom, they appear to be a DVI connector, a DisplayPort connector, and another DVI connector. * **Connectors:** At the bottom edge, gold contact pins (PCIe slot connector) are visible. * **Internal Components:** A portion of the blue printed circuit board (PCB) is visible on the left side, showing various capacitors and electronic components.](.2021-gpu-solutions-brochure/829ef5be177b11d04faddd5aaef173a26b55ff97a48d7061a6fa52ca3c95df69.jpg) # Quadro PEG RTX4000 PCI Express Graphic Card with NVIDIA® Quadro® RTX4000 ![Front view of a quadro GPU card showing front panel, ventilation grille, and model number RTX 4000 (no readable text beyond branding)](.2021-gpu-solutions-brochure/9d29a1823af4def8a1c39c3350034d4763ba93b3a7d7dcfc9d7cc85939330edb.jpg) # Quadro PEG RTX5000 PCI Express Graphic Card with NVIDIA® Quadro® RTX5000 ![Illustration of a quadro VR headset with green and gray casing, no visible text or symbols on the device itself.](.2021-gpu-solutions-brochure/4c1e41c40d7bcce265bd3262e1726d67bf00c84eea01f78e7b23f59385674b19.jpg) # Quadro PEG RTX6000 PCI Express Graphic Card with NVIDIA® Quadro® RTX6000 ![Exterior view of a quadro GPU monitor with visible branding and model number (no text or symbols on the device itself)](.2021-gpu-solutions-brochure/c800cf1bb966a1688f4c75f198f9f170c61687cb49056ec7d355c9e221403fb3.jpg) # Quadro PEG RTX8000 PCI Express Graphic Card with NVIDIA® Quadro® RTX8000 ![Illustration of a quadro GPU with visible branding and front livery (no text or symbols on the device itself)](.2021-gpu-solutions-brochure/cb54588a15e9d0c246ab562c6e4d0b00ba5511d1affb129e5a8997706343b4fb.jpg) Figure 6. ADLINK embedded graphics products feature longevity support, NVIDIA GPUDirect™ RDMA, and NVIDIA Video Codec SDK. # GPU Computing Platforms For SWaP-constrained applications, ADLINK’s Matrix compact fanless embedded computers offer the best performance-per-watt and high availability with expandability options, including the previously discussed MXM cards. Actively-cooled deep learning acceleration platforms (DLAPs) support applications in less thermally-challenged settings. For mission-critical applications, ADLINK’s configurable embedded computers provide an expandable building block to host multiple accelerators, enabling the consolidation of workloads, including highly-parallel graphics computing, motion control, and data acquisition, onto one system. For applications demanding even greater scalability, ADLINK offers highly configurable motherboards and rackmount industrial chassis that provide an enclosure for ADLINK’s large family of industrial ATX motherboards. The boards feature multiple PCIe/PCI/LAN/USB 3.0, enable immediate multi-tasking deployment, and balance performance and expandability. ![Three black industrial electronic devices with visible ports and connectors, no text or symbols present.](.2021-gpu-solutions-brochure/61a8e31d86399aa1a70ab93dc721870dd9dd774092af5693d6afa92d8a309c77.jpg) DLAP x86 Series ![Three black hardware units with various ports and connectors, no visible text or symbols on the devices themselves.](.2021-gpu-solutions-brochure/4898f88fc2c56db3443dd0d65b25cef0d15d4643375d7843264ad854c411704a.jpg) Matrix Series ![Close-up of a computer motherboard with CPU socket and RAM slots (no visible text or labels)](.2021-gpu-solutions-brochure/85e3dec2c9d1157b7c63e68d79a9227c1f08616492c2b7951feaf8f8cc1e402c.jpg) Micro-STX Platform # Edge AI Platforms ADLINK has already developed many edge AI platforms based on the full spectrum of NVIDIA Jetson modules, including NVIDIA® Jetson Nano™, NVIDIA® Jetson™ TX2, and NVIDIA® Jetson AGX Xavier™, and NVIDIA® Jetson Xavier™ NX. The following lists our latest edge AI offerings: ![This image displays a black, box-like electronic device, likely an industrial computer, featuring a large, finned heat sink on its top surface. On the front face, a series of I/O ports are visible from left to right: a small square hole, a 3.5mm audio jack, two RJ45 Ethernet ports, two blue USB Type-A ports, and a circular DC power jack. The text 'ADLINK' is printed in red and white on the bottom right corner.](.2021-gpu-solutions-brochure/44b1bcc201b72c37b632a36d4a6afd50374542789702a5c44f383aed00775952.jpg) DLAP-201-JT2 Inference Platform for Edge AI Applications based on NVIDIA® Jetson™ TX2 ![The image displays a black, rectangular electronic device, likely a fanless mini PC, featuring a large, ribbed heat sink on its top surface. The front panel includes a small black button and LED indicator on the far left. Moving right, there are two blue USB 3.0 ports, followed by a gold-plated RJ45 Ethernet port, and then a third blue USB 3.0 port. On the far right is a circular DC power input jack. In the bottom right corner of the front face, the text 'AXLINK' appears in white next to a red triangular logo.](.2021-gpu-solutions-brochure/60d80b209831ad3ce191437b95ee1a6077bd1e34d87cdfc33d733293a9b16a38.jpg) DLAP-211-Nano Edge AI Platform based on NVIDIA® Jetson Nano™ ![The image shows a black, rectangular electronic device, likely a compact computer or industrial PC, featuring a large, black finned heat sink covering the top surface. The side panel displays an array of connectivity options, including a small white square component, two blue USB ports, two Ethernet ports, and a circular power jack on the far right. The logo 'ADLINK' is printed in red and white on the lower right corner.](.2021-gpu-solutions-brochure/972c4b60eccac60c771be0c1d4fe8692d6a4de7af926ca60c2f30e40dea0d911.jpg) DLAP-211-JNX Inference Platform for Edge AI Applications based on NVIDIA® Jetson Xavier™ NX ![This image displays a black, box-shaped electronic device, likely a computer chassis or embedded system, angled to show its front and top. The top surface features a large ventilation grill. The front panel includes the brand name 'ADLINK' in red and white on the left. Moving right, there are ports labeled 'USB 3.0' and 'USB 2.0'. Further right are buttons and lights labeled 'POWER', 'RESET', and 'LED'.](.2021-gpu-solutions-brochure/74ebf7ed4242df8ff494d127d967bf966d35317f82b86d9856bdd89087020b00.jpg) DLAP-301-Nano Industrial-Grade AI NVR based on NVIDIA® Jetson Nano™ ![The image displays a black, rectangular ADLINK computer chassis, likely a fanless mini PC. On the top left corner, the text 'ADLINK' appears in white capital letters next to a red triangular logo. The top surface of the device features a large, ribbed heatsink structure. The rear I/O panel on the right side shows various connectivity ports and labels, including 'USB 3.0' next to a blue USB port, 'USB 2.0' next to a black USB port, an HDMI port, a VGA port, a LAN port, and audio jacks. On the far right edge, there are a 'POWER' switch and a 'RESET' button.](.2021-gpu-solutions-brochure/56a415ef6616bde9a7fdc344cbfeaed9dde609124ac83aa903b93b9f2938ac7c.jpg) DLAP-301-JNX Edge AI Platforms based on NVIDIA® Jetson Xavier™ NX for AI NVR # Coming Soon # DLAP-401-Xavier Edge AI Platform based on NVIDIA® Jetson AGX Xavier™ # Deep-Learning Consultancy and Optimization Services # Deep-Learning Consultancy Service ADLINK offers consultancy services via deep learning profiling to help users determine the right hardware platform to costeffectively fulfill their application needs, as shown in Figure 7. ADLINK developed a profiling tool that models computing platform performance based on the elements of AI algorithms, such as: z Types of neural networks, like AlexNet, MobileNet, ResNet. z Number of neural network layers. The profiling tool runs these and other inputs against a large database of AI and deep learning accelerators and generates statistics, such as inferences per second; performance per watt; and performance per dollar, for popular neural networks. Additionally, the tool helps developers by determining which accelerator may offer the best performance for the neural networks used by their application. # Performance Profiling Service For in-depth performance tuning, developers can have ADLINK run x86 and GPU performance analyzers on their software. These analyzers help identify hardware and software bottlenecks that, when remedied, can greatly increase throughput and inference per second, performance per dollar, and SWaP. ADLINK is also working with research bodies and academic institutions to find bottlenecks on AI platforms to profile system issues that can be addressed for performance improvement. For example, it is possible to determine if the system is making too many memory copies or if increasing resources (e.g., memory size) will boost performance. # Dynamic Workload Deployment ADLINK’s Data River™ is an underlying technology for deploying dynamic workloads and enabling data to move freely. It solves a key challenge when developing AI solutions, which is allowing data exchange and workload provisioning across the entire network. The solution helps communicate data among computing nodes and devices. ADLINK’s solution can scale acceleration engines over a distributed data service (DDS), which is a type of messageoriented middleware supporting a data-centric publish and subscribe style of communication. This distributed architecture allows a massive number of computing nodes to be attached to the network. In other words, users can add additional hardware accelerators that best fit their application needs based on profiling results, even after AI is deployed. # Customization Services Specification customization is often needed to deliver optimized solutions for different embedded market segments. With our long-term success in designing embedded modules, carrier boards, and systems, ADLINK, as an NVIDIA® Quadro® Embedded Partner, can quickly develop edge AI platforms based on NVIDIA Quadro Embedded GPUs and Jetson modules, catered to individual project needs. This is what enables our customers to rapidly harness the power of AI at the edge. Hardware Selection ![Computing Core x AI Neural Network Benchmark Platform CPU #1 CPU #2 CPU #3 CPU #4 GPU #1 GPU #2 GPU #3 GPU #4 ASIC #1 ASIC #2 ASIC #3 ASIC #4 FPGA #1 FPGA #2 FPGA #3 FPGA #4 --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- AlexNet 350 680 700 950 300 300 350 700 450 1100 900 750 400 800 850 950 MobileNet 400 720 750 920 350 350 380 720 480 1120 950 800 380 820 880 1200 ResNet 1050 820 680 920 1150 850 650 920 450 1180 880 750 350 850 980 1220 CifarNet 820 820 680 920 1120 1020 650 820 450 1180 880 750 350 850 980 1220 Inception 1180 460 950 780 620 730 320 590 330 980 1030 730 320 830 830 520 ](.2021-gpu-solutions-brochure/597cb70b82151d51e28837a6123f1caaddc86d2996590dfa3452f5d58ae82f32.jpg) Performance Profiling ![CPU Time CPU (%) --- --- 08:55 35 09:00 40 09:05 75 09:10 45 09:15 50 09:20 25 09:25 78 09:30 68 09:35 0 09:40 10 09:45 65 09:50 72 09:55 58 10:00 78 10:05 38 10:10 65 ](.2021-gpu-solutions-brochure/abf2f51a35f4394f0bcd56de3cfdd58aa6889ecca7d4d34ca906051094c892ba.jpg) 。 Neural Network Computing Core 。 Batchsize ![Illustration of a human head profile with a brain, circuit board, and smart glasses (no text or symbols)](.2021-gpu-solutions-brochure/e20ec9a54eb671a159ee962e1da420f62efa59518cbbdf3bd7896917c360ccdf.jpg) Figure 7. ADLINK offers consultancy services to help users determine the right hardware platforms System developers, OEMs, and systems integrators can more easily deploy embedded graphics and AI with help from ADLINK’s large portfolio of computing products and services that can be designed into a wide range of form factors. Combining its strong expertise serving embedded developers and its close partner relationship with NVIDIA, ADLINK is delivering high-performance, long lifecycle, embedded graphics solutions to many market segments. By working with ADLINK, it is possible to more easily: z Lower solution cost: Select the right hardware platform for the target workload. z Increase system performance: Eliminate platform bottlenecks that slow down embedded graphics and AI algorithms. z Simplify deployment: Leverage ADLINK’s deep-learning consultancy, optimization services, and Data River™ to more easily integrate systems, and share data and distribute computing processing across the network. # FAQs # Q1 Where are the business opportunities for embedded graphics? # A GPUs are used in embedded applications demanding highresolution, multi-display capability, parallel computing, and AI enablement. ADLINK sees applications such as clinical diagnostic imaging devices, rugged military laptops and imaging radar for aerospace and defense, and gaming slot machinesas presenting considerable potential to benefit from embedded graphics. Top-down applications that can benefit from embedded graphics further include High-resolution, multi-display setup: Applications include air traffic control, electronic chart displays and information systems (ECDIS), video walls, digital signage, gaming, and healthcare environments Parallel computing: High-performance application processing including radar/ sonar systems in aerospace and defense, ultrasound imaging in healthcare, and accelerated multi-access edge computing (AMEC) in telecoms AI engines: System training and inferencing in smart manufacturing, smart city, telecom, aerospace and defense, and transportation # Q2 Why should customers choose ADLINK embedded graphics products powered by NVIDIA Quadro Embedded GPUs? # A Longevity support: Product availability is 18 months for consumer-grade NVIDIA® GeForce® GPUs and 3 years for NVIDIA Quadro GPUs while NVIDIA Quadro Embedded GPUs support 5+ year availability in line with embedded application requirements. ADLINK MXMs support 5-year availability. PEG cards support 3-year availability which can be extended to additional 5 years under an extended life program.
ModelLongevity Support
MXMs5 years
PEG Cards3 (+5)* years
\* Special conditions apply . Lower development costs: Long lifecycle support translates into reduced development time, effort, and costs associated with graphics entering end-of-life (EOL). Development costs can reach six figures4 for safety-critical applications that undergo time-consuming verification and testing processes. As consumer-grade graphics could reach EOL three times through the lifecycle of an embedded graphics solution, it is obvious that developing with embedded graphics would yield a superior return on investment (ROI). z Increased system responsiveness: NVIDIA GPUDirect RDMA in NVIDIA Quadro Embedded GPUs can boost data throughput by approximately 80% and lower latency by 60%5 . A direct path for data exchange is established between the GPU and third-party devices3, eliminating the need to copy data to CPU memory before reaching the GPU, such that data throughput and system responsiveness are significantly increased for GPUaccelerated applications. # Q3 # How are NVIDIA Quadro Embedded GPUs benchmarked? # A For graphics-intensive applications involved with high-resolution, multi-display setup, please refer to performance benchmark testing results in Figure 8. For compute-intensive applications involved with highly-parallel workloads or AI training and inferencing, please refer to performance benchmark testing results in Figure 8 and Figure 10. If you can't find professional software, or AI networks used in your industrial applications, please contact ADLINK for more detailed GPU performance benchmark results. ![ Category Quadro PEG P620 EGX-MXM-P1000 Quadro PEG P1000 EGX-MXM-P3000 EGX-MXM-P5000 EGX-MXM-RTX3000 Quadro PEG RTX4000 Quadro PEG P2200 EGX-MXM-T1000 EGX-MXM-T1000 Quadro PEG RTX5000 Quadro PEG RTX6000 :--- :--- :--- :--- :--- :--- :--- :--- :--- :--- :--- :--- :--- 3ds Max 50 60 70 90 100 150 160 110 95 85 200 250 SOLIDWORKS 80 85 90 110 120 130 135 115 105 115 140 145 Siemens NX 90 95 100 180 290 270 350 190 140 185 430 530 Energy 15 20 25 30 35 40 45 25 20 25 45 80 Medical 30 35 40 60 85 90 100 65 55 65 110 140 ](.2021-gpu-solutions-brochure/d50b758f20c06d29852e96fd8f39aee98d32893820aeb2925aa550578d9d6cab.jpg) Figure 8. GPU Performance Benchmark Results based on Professional Software ![ Model Model 1X Performance (%) :--- :--- :--- ResNet_v1_50 EGX-MXM-P1000 120 ResNet_v1_50 Quadro PEG P1000 130 ResNet_v1_50 EGX-MXM-P2000 160 ResNet_v1_50 EGX-MXM-P3000 180 ResNet_v1_50 EGX-MXM-P5000 300 ResNet_v1_50 EGX-MXM-T1000 290 ResNet_v1_50 Quadro PEG P2200 210 ResNet_v1_50 EGX-MXM-RTX3000 540 ResNet_v1_50 Quadro PEG RTX4000 670 ResNet_v1_50 EGX-MXM-RTX5000 720 ResNet_v1_50 Quadro PEG RTX6000 1090 Inception_v2_50 EGX-MXM-P1000 120 Inception_v2_50 Quadro PEG P1000 140 Inception_v2_50 EGX-MXM-P2000 160 Inception_v2_50 EGX-MXM-P3000 180 Inception_v2_50 EGX-MXM-P5000 310 Inception_v2_50 EGX-MXM-T1000 310 Inception_v2_50 Quadro PEG P2200 220 Inception_v2_50 EGX-MXM-RTX3000 510 Inception_v2_50 Quadro PEG RTX4000 610 Inception_v2_50 EGX-MXM-RTX5000 710 Inception_v2_50 Quadro PEG RTX6000 880 AlexNet_v2 EGX-MXM-P1000 120 AlexNet_v2 Quadro PEG P1000 135 AlexNet_v2 EGX-MXM-P2000 145 AlexNet_v2 EGX-MXM-P3000 265 AlexNet_v2 EGX-MXM-P5000 315 AlexNet_v2 EGX-MXM-T1000 275 AlexNet_v2 Quadro PEG P2200 245 AlexNet_v2 EGX-MXM-RTX3000 485 AlexNet_v2 Quadro PEG RTX4000 635 AlexNet_v2 EGX-MXM-RTX5000 695 AlexNet_v2 Quadro PEG RTX6000 925 MobileNet_v2_140 EGX-MXM-P1000 125 MobileNet_v2_140 Quadro PEG P1000 145 MobileNet_v2_140 EGX-MXM-P2200 275 MobileNet_v2_140 EGX-MXM-RTX3000 845 MobileNet_v2_140 Quadro PEG RTX4000 1015 MobileNet_v2_140 EGX-MXM-RTX5000 1125 MobileNet_v2_140 Quadro PEG RTX6000 1465 ](.2021-gpu-solutions-brochure/a93208020238ba8e519cd21a90979ffa7362c711391d4dd812bb399a8481abdc.jpg) Figure 9. GPU Performance Benchmark Results based on AI Network ![ Model Performance (FP32) Performance (FP16) :--- :--- :--- EGX-MXM-P1000 1X Quadro PEG P1000 1X EGX-MXM-P2000 1X Quadro PEG P2200 250 1X EGX-MXM-RTX3000 350 250 Quadro PEG RTX4000 425 1025 EGX-MXM-RTX5000 500 1125 Quadro PEG RTX6000 650 1350 The chart displays a multi-scale performance comparison across different models. The Y-axis represents Performance (%) and the X-axis represents the model names. The values for the bars are annotated with “1X” or “2X” to indicate relative performance levels. The legend is implicit in the color coding of the bars.](.2021-gpu-solutions-brochure/efe9df9d274a95bc83ed3414e446d13fc0f0b829af43bd97c34b3039ae6632fe.jpg) Figure 10. GPU Performance Benchmark Results based on Precisions # Q4 Why should customers choose ADLINK embedded graphics products over other graphics products? # A ADLINK embedded graphics products offer long lifecycle support and very high performance, key requirements for many embedded applications. For high-resolution, multidisplay applications, ADLINK embedded graphics products are a good choice when four or less displays are needed. As for highly-parallel computing and AI applications, ADLINK embedded graphics products can reduce CPU overhead, boost data throughput by approximately 80%, lower latency by 60%, and increase system responsiveness. # Q5 Why buy embedded graphics products powered by NVIDIA Quadro Embedded GPUs from ADLINK or ADLINK’s distributors? # A ADLINK is the top choice for embedded customers. Among a few NVIDIA Quadro Embedded Partners in the world, ADLINK is one of the few with market-proven experience offering diverse product portfolios that address embedded application needs. ADLINK’s offerings, including embedded graphics in MXM and PEG form factors, and MXM- and PEGcompatible platforms and modules, accelerate and facilitate GPU adoption in embedded applications. # Q7 Other NVIDIA GPU-powered Mobile Express modules are available online. Why should I buy from ADLINK or ADLINK’s distributors? # A ADLINK and our distributors offer MXM modules powered by NVIDIA Quadro Embedded GPUs with five-year availability and technical support that cannot be offered by online vendors. Online NVIDIA GPU-powered MXMs are highly likely to be gray market goods without warranty or long lifecycle support. Additionally, ADLINK provides technical support to allow users to configure Quadro-powered MXMs for consistent or maximum performance, lower I/O latency, and higher responsiveness, better fulfilling application requirements. # Q8 What are lifecycles of NVIDIA Jetson Platforms? # A Some Jetson platforms are available through 2026. The long lifecycle support is in line with embedded application requirements.
ModelsAvailable through
Jetson NanoJan 2025
Jetson TX2Apr 2022
Jetson AGX XavierJan 2025
Jetson Xavier NXJan 2026
# Q6 # How do I choose ADLINK embedded graphics products for embedded applications? # A ADLINK’s Mobile Express modules (MXMs), with high performance per watt and extended operating temperature options, are an ideal fit for mobile, SWaP-constrained, passive-cooling applications such as portable ultrasound, airborne radar, and aerial infrared imaging. PCI Express Graphics (PEG) cards connect via a common interface, making them easy to integrate and use in many embedded applications, such as MRI and CT scanning in healthcare, quality inspection in industrial automation, and telecom multi-access edge computing. GPU onboard solutions can fulfill ODM project requirements in different verticals (e.g., gaming and medical) and for various form factors, like PC/104 and VPX. # MXM Modules MXM GPU Modules with NVIDIA Turing™ Architecture
Model NameEGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-RTX5000
[4676]<img src="images/375696d053c291b8709ef5bd022c4840f5a551648f08a325e1678c9c03f35734.jpg"/><img src="images/fdb74bef134a7fb827f8d6cc501cec1d9da410cfc69dde496227b23e5af44181.jpg"/>
Graphic Core
GPUQuadro® T1000Quadro® RTX3000Quadro® RTX5000
Memory4GB GDDR6 memory, 128-bit,Bandwidth: 192 GB/s6GB GDDR6 memory, 192-bit,Bandwidth: 336 GB/s16GB GDDR6 memory, 256-bit,Bandwidth: 448 GB/s
GPGPU Computing
CUDA Cores896 CUDA® cores,2.6 TFLOPS Peak FP32 performance1920 CUDA® cores,5.3 TFLOPS Peak FP32 performance3072 CUDA® cores,9.4 TFLOPS Peak FP32 performance
Tensor Cores-240 Tensor Cores384 Tensor Cores
Compute APICUDA Toolkit 8.0 and above, CUDA Compute version 6.1 and above, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX® 12, Vulkan 1.0
Display
Display Outputs4x DisplayPort 1.4a digital video outputs4K at 120Hz or 8K at 60Hz4x DisplayPort 1.4b digital video outputs4K at 120Hz or 8K at 60Hz
InterfaceMXM 3.1, PCI Express 3.0 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm82 (W) x 105 (D) x 4.8 (H) mm82 (W) x 110 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type AStandard MXM 3.1 Type BStandard MXM 3.1 Type B+
Environmental
Operating Temp.Standard: 0°C to 55°CStandard: 0°C to 55°CStandard: 0°C to 45°C
Storage Temp.-40°C to 85°C
Module Power Consumption50W TGP80W TGP110W TGP
SW Support
OS SupportWindows 10 & Linux Drivers, 64-bit
MXM GPU Modules with NVIDIA Pascal™ Architecture
Model NameEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-P3000EGX-MXM-P5000
<img src="images/c41c3ea829ba9b29736e4fd7b597376e8386e2cf6596c5e91bf97dcfd11ee082.jpg"/><img src="images/8968c5fbe1a89e373689f1f1c91e85bfbc00d85671eca142275e49623cca8727.jpg"/><img src="images/5a28b2e0f0ba32171dfa2d5c6d9664617cf4b1fb94fad6f5dcc25735c1238936.jpg"/><img src="images/93014dff50240136c9149f53f03d2322170bdf8347733dd8724cdf3baf5aba0e.jpg"/>
Graphic Core
GPUQuadro® P1000Quadro® P2000Quadro® P3000Quadro® P5000
Memory4GB GDDR5 memory, 128-bit,Bandwidth: 96 GB/s6GB GDDR5 memory, 192-bit,Bandwidth: 168.2 GB/s16GB GDDR5 memory, 256-bit,Bandwidth: 192.2 GB/s
GPGPU Computing
CUDA Cores512 CUDA® cores,1.8 TFLOPS SP Peak768 CUDA® cores,2.3 TFLOPS SP Peak1280 CUDA® cores,3.9 TFLOPS peak FP32Performance2048 CUDA® cores,6.4 TFLOPS peak FP32performance
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2CUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2, Direct Compute
Graphics APIOpenGL 4.5, DirectX® 12, Vulcan 1.0Shader Model 5.1, OpenGL 4.5, DirectX® 12, Vulkan 1.0
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)4K at 120Hz or 5K at 60Hz4x DisplayPort 1.4 digital video outputs (DP++),1x HDMI, 2x DVI, 1x eDP
InterfaceMXM 3.1, PCI Express 3.0 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm82 (W) x 105 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type AStandard MXM 3.1 Type B
Environmental
Operating Temp.Standard: 0°C to 55°C, ETT: -20°C to 70°C0°C to 55°C
Storage Temp.-40°C to 85°C-40°C to 125°C
Module Power Consumption48W58W75W100W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
PEG Cards
ModelQuadro PEG RTX4000Quadro PEG RTX5000Quadro PEG RTX6000Quadro PEG RTX8000Quadro-E PEG P620Quadro-E PEG P1000Quadro-E PEG P2200
<img src="images/b5bbe8053f40cca9044f39fa9833c64d91f989e79faaf19214b21b9464b3d00f.jpg"/><img src="images/775b0713cc0c6cd5ba7e6a7f360dc70582637e9a1e7c18da6b46d29d7fa013c8.jpg"/><img src="images/b3b9998f513492c22632fd088fc6e7d2059b461ced7a394014ccdc7ab4d2e43a.jpg"/><img src="images/fb82f125e59c9accf81e0c5ae505c7a8b5cab7aa909f47fbe9e50feb50ea7e63.jpg"/><img src="images/4a7e570e36fbbc25bf0dcc7fb42f4b9536f759e7df39ca0f510b320e76be7c46.jpg"/><img src="images/1491416d5651e51d587d983a10a05af80920854d8e385e31ac7061185a952873.jpg"/><img src="images/271375f6ee2ce034a0b68229baab6e0f23cc2063bf01660a33598fc372e51d9a.jpg"/>
Graphic Core
Graphic CoreNVIDIA TuringTM TU106NVIDIA TuringTM TU104NVIDIA TuringTM TU102NVIDIA PascalTM GP107NVIDIA PascalTM GP106
GPUQuadro® RTX4000Quadro® RTX5000Quadro® RTX6000Quadro® RTX8000Quadro® P620Quadro® P1000Quadro® P2200
Memory8 GB GDDR6 memory, 256-bit,Bandwidth: Up to 416 GB/s16 GB GDDR6 memory, 256-bit,Bandwidth: Up to 448 GB/s24 GB GDDR6 memory, 384-bit,Bandwidth: Up to 672 GB/s48 GB GDDR6 memory, 384-bit,Bandwidth: Up to 672 GB/s2GB GDDR5 memory,memory, 128-bit,Bandwidth: 80 GB/s4GB GDDR5 memory, 128-bit,Bandwidth: 80 GB/s5GB GDDR5 memory, 160-bit,Bandwidth: 200 GB/s
ECCN/AYesN/A
GPGPU Computing
CUDA Cores2304 CUDA® cores,7.1 TFLOPS SP Peak3072 CUDA® cores,11.2 TFLOPS SP Peak4608 CUDA® cores,16.3 TFLOPS SP Peak512 CUDA® cores,1.38 TFLOPS peak FP32 performance640 CUDA® cores,1.89 TFLOPS peak FP32 performance1280 CUDA® cores,3.8 TFLOPS peak FP32 performance
Tensor Cores28857 TFLOPS38489.2 TFLOPS576130.5 TFLOPS-
RT Cores364872-
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2CUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2,Direct Compute
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX® 12.0, Vulkan 1.1Shader Model 5.1, OpenGL 4.5, DirectX® 12.0, Vulkan 1.0
Display
Display Outputs3x DisplayPort1.4 digital video outputs (DP++)1x USB-C4x 3840x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz4x DisplayPort 1.4 digital video outputs (DP++)1x USB-C4x 4096x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz4x mDP 1.4,4096x2160 @ 60Hz5120x2880 @ 60HzHDCP 2.2 support* VGA/DVI/HDMI support via adapter/connector/ bracket4x DP 1.4,4096x2160@ 60Hz5120x2880@ 60HzHDCP 2.2 support* VGA/DVI/HDMI support via adapter/connector/ bracket
InterfacePCI Express 3.0 x16PCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 9.5" L,single slot4.4" H x 10.5" L,dual slot2.713" H x 5.7" L,single slot4.4" H x 7.9" L,single slot
Form FactorFull height,full lengthFull height,full lengthLow profile-
Environmental
Operating Temp.0°C~55°C0°C~45°C0°C to 55°C
Storage Temp.-40°C~75°C-40°C to 75°C
Module Power Consumption160W265W295W40W47W75W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bitWindows 7/10 & Linux drivers, 64-bit
# EGX-MXM-T1000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded T1000 # Features ● NVIDIA® Quadro® T1000 embedded graphics Standard MXM 3.1 Type A (82 x 70 mm) ● 896 CUDA cores, 2.6 TFLOPS peak FP32 performance ● 4GB GDDR6 memory, 128-bit 192GB/s maximal memory bandwidth ● Support up to 4 DP 1.4a displays, 50W TGP 5-year availability # Introduction The EGX-MXM-T1000 module features advanced NVIDIA® Turing™ GPU technology in MXM 3.1 Type A form factor. It’s compact, slim and reliable design makes it suitable for mission critical environment. EGX-MXM-T1000 provides improved performance per watt. This MXM GPU module offers a flexible and easy solution for deep learning solutions for applications including medical, image processing, and gaming applications. ![The image displays a certification badge. The top section has a green background featuring the NVIDIA logo (a stylized eye) on the left and the text 'NVIDIA QUADRO® CERTIFIED' in black on the right. Below this, on a white background, is a green bullet point followed by the text 'EMBEDDED'.](.2021-gpu-solutions-brochure/2499aebcda9e7bc9b8612bb9884fe816a07eaa7cb2441158987f212065cd4217.jpg) ![Close-up of a green printed circuit board with integrated circuits and connectors (no readable text or symbols)](.2021-gpu-solutions-brochure/d79a0a665af8e5533c27299cfe47bdef0709f2e7941ed19b75823e76a52b03e9.jpg) # Ordering Information # ● EGX-MXM-T1000 NVIDIA® Quadro® T1000 Embedded Graphics, MXM 3.1 type A, 82 x 70mm, PCIe x16 Gen3 Specifications
Model NameEGX-MXM-T1000
Graphic Core
GPUQuadro® T1000
Memory4GB GDDR6 memory, 128-bit,Bandwidth: 192 GB/s
GPGPU Computing
CUDA Cores896 CUDA cores,2.6 TFLOPS Peak FP32 performance
Compute APICUDA Toolkit 8.0 and above,CUDA Compute version 6.1 and above, OpenCLTM 1.2
Graphics APIDirectX® 12, OpenGL 4.6,Vulkan 1.0 API
Display
Display Outputs4x DisplayPort 1.4a digital video outputs4K at 120Hz or 8K at 60Hz
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type A
Environmental
Operating Temp.Standard: 0°C to 55°C
Storage Temp.-40°C to 85°C
Module Power Consumption50W TGP
SW Support
OS SupportWindows 10 & Linux Drivers, 64-bit
# EGX-MXM-RTX3000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded RTX3000 # Features ● NVIDIA® Quadro® RTX3000 embedded graphics Standard MXM 3.1 Type B form factor (82 x 105 mm) ● 1920 CUDA cores, 30 RT cores, and 240 Tensor cores ● 5.3 TFLOPS peak FP32 performance ● 6GB GDDR6 memory, 192-bit 336GB/s maximal memory bandwidth ● Support up to 4 DP 1.4b displays, 80W TGP ● 5-year availability # Introduction The EGX-MXM-RTX3000 module features advanced NVIDIA® Turing™ GPU technology in MXM 3.1 Type B form factor. It’s compact, slim and reliable design makes it suitable for mission critical environment. EGX-MXM-RTX3000 supports 4 DP1.4b displays offering a flexible and easy solution for medical and gaming applications. Specifications
Model NameEGX-MXM-RTX3000
Graphic Core
GPUQuadro® RTX3000
Memory6GB GDDR6 memory, 192-bit,Bandwidth: 336 GB/s
GPGPU Computing
CUDA Cores1920 CUDA® cores,5.3 TFLOPS Peak FP32 performance
Tensor Cores240 Tensor Cores
Compute APICUDA Toolkit 8.0 and above,CUDA Compute version 6.1 and above, OpenCLTM 1.2
Graphics APIDirectX® 12, OpenGL 4.6,Vulkan 1.0 API
Display
Display Outputs4x DisplayPort 1.4b digital video outputs4K at 120Hz or 8K at 60Hz
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 105 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type B
Environmental
Operating Temp.Standard: 0°C to 55°C
Storage Temp.-40°C to 85°C
Module Power Consumption80W TGP
SW Support
OS SupportWindows 10 & Linux Drivers, 64-bit
![The image displays a certification badge with two distinct sections. The top section is a green banner featuring the NVIDIA eye logo on the left and the text 'NVIDIA QUADRO® CERTIFIED' in white capital letters. Below this is a white banner containing a small green square bullet point followed by the word 'EMBEDDED' in green capital letters.](.2021-gpu-solutions-brochure/04df382a39adea93d08ed678d4d490925caa87dd7ba6cda5ab843292f5f11a4b.jpg) ![Close-up of a green printed circuit board with multiple integrated circuits and connectors (no readable text or symbols)](.2021-gpu-solutions-brochure/ebf4171ca894330c5597e34fec64cc5c8527cd7d7bbec1fda271a2e127f9bf38.jpg) # Ordering Information # ● EGX-MXM-RTX3000 NVIDIA® Quadro® RTX3000 Embedded Graphics, MXM 3.1 type B, 82 x 105mm, PCIe x16 Gen3 # EGX-MXM-RTX5000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded RTX5000 # Features ● NVIDIA® Quadro® RTX5000 embedded graphics ● Standard MXM 3.1 Type B+ form factor (82 x 110mm) ● 3072 CUDA cores, 48 RT cores, and 384 Tensor cores 9.4 TFLOPS peak FP32 performance ● 16GB GDDR6 memory, 256-bit 448GB/s maximal memory bandwidth ● Support up to 4 DP 1.4b displays, 110W TGP 5-year availability # Introduction The EGX-MXM-RTX5000 module features advanced NVIDIA® Turing™ GPU technology in MXM 3.1 Type B+ form factor. It’s compact, slim and reliable design makes it suitable for mission critical environment. EGX-MXM-RTX5000 supports 4 DP 1.4b displays offering a flexible and easy solution for medical and gaming applications. Specifications
Model NameEGX-MXM-RTX5000
Graphic Core
GPUQuadro® RTX5000
Memory16GB GDDR6 memory, 256-bit,Bandwidth: 448 GB/s
GPGPU Computing
CUDA Cores3072 CUDA® cores,9.4 TFLOPS Peak FP32 performance
Tensor Cores384 Tensor Cores
Compute APICUDA Toolkit 8.0 and above,CUDA Compute version 6.1 and above, OpenCLTM 1.2
Graphics APIDirectX® 12, OpenGL 4.6,Vulkan 1.0 API
Display
Display Outputs4x DisplayPort 1.4b digital video outputs4K at 120Hz or 8K at 60Hz
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 110 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type B+
Environmental
Operating Temp.Standard: 0°C to 45°C
Storage Temp.-40°C to 85°C
Module Power Consumption110W TGP
SW Support
OS SupportWindows 10 & Linux Drivers, 64-bit
![Close-up of a green printed circuit board with integrated circuits and connectors (no readable text or symbols)](.2021-gpu-solutions-brochure/2435b929c53ff34bf957b50f18ff3ac9523ad0dc111f32058989c29afaa4d39b.jpg) # Ordering Information ● EGX-MXM-RTX5000 NVIDIA® Quadro® RTX5000 Embedded Graphics, MXM 3.1 type B+, 82 x 110mm, PCIe x16 Gen3 # EGX-MXM-P1000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded P1000 # Features ● Standard MXM 3.1 Type A form factor (82 x 70 mm) ● 512 NVIDIA® CUDA® cores ● 1.8 TFLOPS SP peak performance ● 4GB GDDR5 memory, 128-bit ● 96GB/s maximum memory bandwidth ● Support up to 4 UHD displays, 48W TDP ● 5-year availability ![The image displays the NVIDIA logo, featuring a white stylized eye symbol set against a background that is split vertically into a green section on the left and a white section on the right.](.2021-gpu-solutions-brochure/be258366c153d4509f452ac2baa1a4562d709fdd0cdf9ca16f0ef20946df76de.jpg) NVIDIAQUADRO CERTIFIED ![Green printed circuit board with multiple integrated circuits and connectors (no readable text or symbols)](.2021-gpu-solutions-brochure/50301fd0e8bc53bcd1bfd6527658cc23bc41696aa234ac07bad3218084d85576.jpg) # Introduction The EGX-MXM-P1000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P1000 has 512 NVIDIA CUDA cores and a peak single-precision floating-point performance of 1.8 TFLOPS. The EGX-MXM-P1000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%\*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harsh-environment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints. # Ordering Information # ● EGX-MXM-P1000 NVIDIA Quadro Embedded P1000, MXM 3.1 type A, 82 x 70mm, PCIe x16 Gen3 Specifications
EGX-MXM-P1000
Graphic Core
GPUQuadro® P1000
Memory4GB GDDR5 memory, 128-bit,Bandwidth: 96 GB/s
GPGPU Computing
CUDA Cores512 CUDA® cores,1.8 TFLOPS SP Peak
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIDirectX® 12, OpenGL 4.5,Vulcan 1.0
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)4K at 120Hz or 5K at 60Hz
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type A
Environmental
Operating Temp.Standard: 0°C to 55°C,-40°C to 85°C
Storage Temp.-40°C to 85°C
Module Power Consumption48W
SW
OS SupportWindows 10 & Linux drivers, 64-bit
\* The software and workloads used in performance tests were optimized for performance on ADLINK platforms. Performance tests are measured using specific computer systems, components, software, operations and functions. Any changes to these factors may cause the results to vary. Contact ADLINK for more complete information about performance and benchmark results. Block Diagram ![This block diagram illustrates the connectivity of a central component labeled **N18P-Q1 40W** (center green bar) with a **3.1 Connector** (left green bar) and various external components (right side). **Left Side Connections (3.1 Connector to/from N18P-Q1 40W):** * **PCIE:** An arrow labeled **PCIE x16 Gen3** points from the 3.1 Connector to the **PCIE** block within N18P-Q1. * **Display:** Four arrows labeled **DP1.4** point from internal blocks (**IFPA**, **IFPB**, **IFPE**, **IFPF**) towards the 3.1 Connector. * **Power Management:** An arrow labeled **Power Management (PWR_EN、PWR_GOOD、WAKE#)** points from the **PM** block towards the 3.1 Connector. * **I2CS:** An arrow points from the 3.1 Connector to the **I2CS** block. * **JTAG:** An arrow points from the **JTAG** block towards the 3.1 Connector. * **Power Inputs:** Three arrows labeled **P_+SRC**, **P_+5V**, and **P_+3V3** point from the 3.1 Connector towards the N18P-Q1 block. **Right Side Connections (N18P-Q1 40W to External Components):** * **Memory:** * From the **PCIE** block, connections go to **GDDR5 Channel A** and **GDDR5 Channel B**. Both channels have text **3Gbps** below them. * **GDDR5 Channel A** splits into two arrows pointing to two blocks labeled **GDDR5 x32 memory down**. * **GDDR5 Channel B** splits into two arrows pointing to two blocks labeled **GDDR5 x32 memory down**. * **Power Supplies:** Four arrows point from right-side power blocks towards the N18P-Q1 block: * **Power Supply NVVDD-PH1, NVVDD-PH2, NVVDD-PH3, NVVDD-PH4** * **Power Supply FBVDDQ** * **Power Supply PEX_VDD** * **Power Supply VDD_AON/MAIN** **Other Connections:** * **SPI:** A block labeled **SPI** inside N18P-Q1 connects via a double-headed arrow labeled **SPI** to a separate block labeled **SPI - VBIOS**.](.2021-gpu-solutions-brochure/7118c496c035f5a15b2654ad68c5e14716fcdd5bdaf1411562b8877f9c1c87c9.jpg) Mechanical Drawing ![(mm) Ø 3.20 x6 Ø 6 x6 70 ±0.13 82 ±0.13 (1.20)](.2021-gpu-solutions-brochure/79b252f474eb38aa21d7d34a1644457f79c1ab5a1e199cf6ef67a1aa1bcc0e6a.jpg) # EGX-MXM-P2000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded P2000 # Features Standard MXM 3.1 Type A form factor (82 x 70 mm) ● 768 NVIDIA® CUDA® cores ● 2.3 TFLOPS SP peak performance ● 4GB GDDR5 memory, 128-bit 96GB/s maximum memory bandwidth ● Support up to 4 UHD displays, 58W TDP ● 5-year availability ![NVIDIA® QUADRO® CERTIFIED ■ EMBEDDED](.2021-gpu-solutions-brochure/1d6a0a545deac13d5d70887231303dc5596ae4f90796e3b17ec7993c8ac6117a.jpg) ![Close-up of a green printed circuit board with integrated circuits and connectors (no readable text or symbols)](.2021-gpu-solutions-brochure/fcd9aa0de7eea5e37457770495572ff8700ca4b5c5ed5359512d4081feb71071.jpg) # Introduction The EGX-MXM-P2000 features advanced NVIDIA Quadro GPU with NVIDIA Pascal™ Architecture technology in MXM 3.1 Type A form factor. The EGX-MXM-P2000 has 768 NVIDIA CUDA cores and a peak single-precision floating-point performance of 2.3 TFLOPS. The EGX-MXM-P2000 has 4GB of GDDR5 memory and supports NVIDIA GPUDirect™ RDMA which helps increase data throughput by up to 80% and consequently system responsiveness by up to 60%\*. Additionally, 4 UHD display outputs and an extended operating temperature range of -40°C to 85°C are supported. The embedded graphics product is suitable for mission-critical harshenvironment edge computing applications with size, weight, and power (SWaP) and network connectivity constraints. # Ordering Information # ● EGX-MXM-P2000 NVIDIA Quadro Embedded P2000, MXM 3.1 type A, 82 x 70mm, PCIe x16 Gen3 Specifications
EGX-MXM-P2000
Graphic Core
GPUQuadro® P2000
Memory4GB GDDR5 memory, 128-bit,Bandwidth: 96 GB/s
GPGPU Computing
CUDA Cores768 CUDA® cores,2.3 TFLOPS SP Peak
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIDirectX® 12, OpenGL 4.5,Vulcan 1.0
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)4K at 120Hz or 5K at 60Hz
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type A
Environmental
Operating Temp.Standard: 0°C to 55°C,-40°C to 85°C
Storage Temp.-40°C to 85°C
Module Power Consumption58W
SW supports
OS SupportWindows 10 & Linux drivers, 64-bit
\* The software and workloads used in performance tests were optimized for performance on ADLINK platforms. Performance tests are measured using specific computer systems, components, software, operations and functions. Any changes to these factors may cause the results to vary. Contact ADLINK for more complete information about performance and benchmark results. Block Diagram ![This block diagram illustrates the connections between a central module, a connector on the left, and various peripherals on the right. **Labeled Blocks:** * **MxM 3.1 Connector** (Vertical bar on the left) * **N18P-Q3 50W** (Central vertical bar) * **GDDR5 x32 memory down** (Four separate blocks on the top right) * **Power Supply NVVDD-PH1, NVVDD-PH2, NVVDD-PH3, NVVDD-PH4** (Block on the middle right) * **Power Supply FBVDD Q** (Block on the lower right) * **Power Supply PEX_VDD** (Block on the lower right) * **Power Supply VDD_AON/MAIN** (Block on the bottom right) * **SPI - VBIOS** (Block on the bottom center) **Connections:** **Between MxM 3.1 Connector and N18P-Q3 50W:** * Bidirectional arrow labeled **PCIE x16 Gen3** * Bidirectional arrow labeled **DP1.4** (connected to label **IFPA**) * Bidirectional arrow labeled **DP1.4** (connected to label **IFPB**) * Bidirectional arrow labeled **DP1.4** (connected to label **IFPE**) * Bidirectional arrow labeled **DP1.4** (connected to label **IFPF**) * Bidirectional arrow labeled **I2CS** * Bidirectional arrow labeled **(PWR_EN、PWR_GOOD、WAKE#)** (connected to label **PM**) * Bidirectional arrow labeled **JTAG** * Unidirectional arrows (pointing right): **P +SRC**, **P +5V**, **P +3V3** **Between N18P-Q3 50W and GDDR5 Memory:** * Bidirectional arrow labeled **GDDR5 Channel A** connects to the first **GDDR5 x32 memory down** block and branches to the second **GDDR5 x32 memory down** block. * Bidirectional arrow labeled **GDDR5 Channel B** connects to the third **GDDR5 x32 memory down** block and branches to the fourth **GDDR5 x32 memory down** block. **Between N18P-Q3 50W and SPI:** * Bidirectional arrow labeled **SPI** connects to **SPI - VBIOS**. **From Power Supplies to N18P-Q3 50W:** * Unidirectional arrows (pointing left) originate from: * **Power Supply NVVDD-PH1, NVVDD-PH2, NVVDD-PH3, NVVDD-PH4** * **Power Supply FBVDD Q** * **Power Supply PEX_VDD** * **Power Supply VDD_AON/MAIN**](.2021-gpu-solutions-brochure/036eae6b91a323be5d290f721240647a89304ff7d8bfa22ec3e0572ee2ef80bb.jpg) Mechanical Drawing ![Ø3.20 x6 Ø6 x6 70 ±0.13 82 ±0.13 (1.20) Ø7 x4](.2021-gpu-solutions-brochure/8e95ca9c47064e2cf6381852ec8ee0bcd075f9a92d7d36cfab638eff9200d58b.jpg) # EGX-MXM-P3000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded P3000 # Features ● Standard MXM 3.1 Type B form factor (82mm x 105 mm) ● 1280 CUDA cores ● 3.9 TFLOPS peak FP32 performance ● 6GB GDDR5 memory, 192-bit 168GB/s peak memory bandwidth ● Maximum power 75W ● 5-year availability ![The image displays the NVIDIA logo, featuring a white, stylized eye shape resembling an 'E' on the left side against a green background. To the right of the eye symbol is a vertical white rectangular bar, followed by a thin vertical strip of green along the far right edge.](.2021-gpu-solutions-brochure/4bbfeb9690b542473bddacde94019dfaf4e3b43fc3f5cd08e510f5673f0e388c.jpg) # NVIDIA QUADRO # CERTIFIED ![Close-up of a microprocessor board with visible components and no readable text or symbols](.2021-gpu-solutions-brochure/c51c1f21962df0bdcbcb5d8bb6bbf60c350fe722463bb435d93e6b7096187354.jpg) # Introduction Meeting the needs of embedded, ruggedized, and mobile system builders, the EGX-MXM-P3000 is specifically purposed to accommodate form factors incompatible with conventional PCI Express cards, and is built to maintain operations under a wide range of thermal and other environmental conditions. It’s the ideal choice for blade-based and other deployments where high GPU density is critical, with a choice of GPU memory capacity, extremely reasonable power requirements, and flexible display options. # Ordering Information # ● EGX-MXM-P3000 NVIDIA® Quadro® Embedded P3000 , MXM 3.1 type B, 82 x 105mm, PCIe x16 Gen3 \* The product is recommended to use with PIS-5500. Specifications
EGX-MXM-P3000
Graphic Core
GPUQuadro® P3000
Memory6GB GDDR5 memory, 192-bit,Bandwidth: 168.2 GB/s
GPGPU Computing
CUDA Cores1280 CUDA® cores,3.9 TFLOPS peak FP32 Performance
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2, Direct Compute
Graphics APIDirectX® 12, OpenGL 4.5,Vulkan 1.0 Shader Model 5.1
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++),1x HDMI, 2x DVI, 1x eDP
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 105 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type B
Environmental
Operating Temp.0°C to 55°C
Storage Temp.-40°C to 125°C
Module Power Consumption75W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# EGX-MXM-P5000 # Mobile PCI Express Module with NVIDIA® Quadro® Embedded P5000 # Features ● Standard MXM 3.1 Type B form factor (82mm x 105 mm) ● 2048 CUDA cores ● 6.4 TFLOPS peak FP32 performance 16GB GDDR5 memory, 256-bit ● 192GB/s peak memory bandwidth ● Maximum power 100W ● 5-year availability ![NVIDIA® QUADRO® CERTIFIED ■ EMBEDDED](.2021-gpu-solutions-brochure/48f7aa4696ea3882758618dda790109957e45f23ae8bc9175e952c232460428b.jpg) ![Close-up of a microprocessor board with visible circuitry and components (no readable text or symbols)](.2021-gpu-solutions-brochure/773c8184ec693c3e44d4235240461edc8c5c206105c000fd0a193acc59296339.jpg) # Introduction Meeting the needs of embedded, ruggedized, and mobile system builders, the EGX-MXM-P5000 utilizes Quadro Pascal architecture to deliver superior graphics and computing performance. The EGX-MXM-P5000 is specifically purposed to accommodate form factors incompatible with conventional PCI Express cards, and is built to maintain operations under a wide range of thermal and other environmental conditions. It’s the ideal choice for blade-based and other deployments where high GPU density is critical, with a choice of GPU memory capacity, extremely reasonable power requirements, and flexible display options. # Ordering Information # ● EGX-MXM-P5000 NVIDIA® Quadro® Embedded P5000, MXM 3.1 type B, 82 x 105mm, PCIe x16 Gen3 Specifications
EGX-MXM-P5000
Graphic Core
GPUQuadro® P5000
Memory16GB GDDR5 memory, 256-bit,Bandwidth: 192.2 GB/s
GPGPU Computing
CUDA Cores2048 CUDA® cores,6.4 TFLOPS peak FP32 performance
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2, Direct Compute
Graphics APIDirectX® 12, OpenGL 4.5,Vulkan 1.0 Shader Model 5.1
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++),1x HDMI, 2x DVI, 1x eDP
InterfaceMXM 3.1, PCI Express Gen3 x16 support
Mechanicals
Dimensions82 (W) x 105 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type B
Environmental
Operating Temp.0 to 55°C
Storage Temp.-40°C to 125°C
Module Power Consumption100W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# Quadro PEG RTX4000 # PCI Express Graphic Card with NVIDIA® Quadro® RTX4000 # Features ● DisplayPort 1.4 x3 ● VirtualLink x1 ● DisplayPort with Audio ● 3D Stereo Support ● Quadro Sync II Compatibility ● NVIDIA nView® Desktop Management Software ● HDCP 2.2 Support ● NVIDIA Mosaic ![Front view of a quadro VR headset with NVIDIA branding and RTX 4000 chip (no text or symbols on main body)](.2021-gpu-solutions-brochure/30bea73426f4e00bfcd3c2e10b0ecb9b6c12da4c0af9cb4bdd8e5ab43adbcaa1.jpg) # Ordering Information # ● Quadro PEG RTX4000 (Bundle sale) NVIDIA® Quadro® RTX4000, PCIe x16 Gen3, 3x DP 1.4, 1x Type C, 4.4” H x 9.5” L, single slot \* The product is sold with ADLINK platforms. Recommended models are DLAP-4000, AmITX-SL, IMB-M43H, IMB-M43-C236, IMB-M43, and NuPRO-E43 paired with EBP-13E2. Specifications
Quadro PEG RTX4000
Graphic Core
Graphic ArchitectureNVIDIA® TuringTM TU106
GPUQuadro® RTX4000
Memory8 GB GDDR6 memory, 256-bit,Bandwidth: Up to 416 GB/s
ECCN/A
GPGPU Computing
CUDA Cores2304 CUDA® cores,7.1 TFLOPS SP Peak
Tensor Cores28857 TFLOPS
RT Cores36
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX 12.0, Vulkan 1.1
Display
Display Outputs3x DisplayPort 1.4 digital video outputs (DP++)1x USB-C4x 3840x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz
InterfacePCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 9.5" L, single slot
Form FactorFull height, full length
Environmental
Operating Temp.0°C ~ 55°C
Storage Temp.-40°C ~ 75°C
Module Power Consumption160W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# Quadro PEG RTX5000 # PCI Express Graphic Card with NVIDIA® Quadro® RTX5000 # Features ● DisplayPort 1.4 x4 ● VirtualLink x1 DisplayPort with Audio ● 3D Stereo Support ● Quadro Sync II Compatibility ● NVIDIA nView® Desktop Management Software ● HDCP 2.2 Support ● NVIDIA Mosaic ![Illustration of a quadro VR headset with NVIDIA branding and RTX 5000 chip (no text or symbols on the device itself)](.2021-gpu-solutions-brochure/010e6d821df7012cde162f42f0279fc894e39bf081c66bb0c9d416b3440ebabc.jpg) # Ordering Information # ● Quadro PEG RTX5000 (Bundle sale) NVIDIA® Quadro® RTX5000, PCIe x16 Gen3, 4x DP 1.4, 1x Type C, 4.4” H x 10.5” L, dual slot, full height \* The product is sold with ADLINK platforms. Recommended models are DLAP-4000, AmITX-SL, IMB-M43H, IMB-M43-C236, IMB-M43, and NuPRO-E43 paired with EBP-13E2. Specifications
Quadro PEG RTX5000
Graphic Core
Graphic ArchitectureNVIDIA® TuringTM TU104
GPUQuadro® RTX5000
Memory16 GB GDDR6 memory, 256-bit,Bandwidth: Up to 448 GB/s
ECCYes
GPGPU Computing
CUDA Cores3072 CUDA® cores,11.2 TFLOPS SP Peak
Tensor Cores38489.2 TFLOPS
RT Cores48
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX 12.0, Vulkan 1.1
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)1x USB-C4x 4096x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz
InterfacePCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 10.5" L, dual slot
Form FactorFull height, full length
Environmental
Operating Temp.0°C ~ 45°C
Storage Temp.-40°C ~ 75°C
Module Power Consumption265W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# Quadro PEG RTX6000 # PCI Express Graphic Card with NVIDIA® Quadro® RTX6000 # Features ● DisplayPort 1.4 x4 ● VirtualLink x1 ● DisplayPort with Audio ● 3D Stereo Support ● Quadro Sync II Compatibility ● NVIDIA nView® Desktop Management Software ● HDCP 2.2 Support ● NVIDIA Mosaic # Ordering Information # ● Quadro PEG RTX6000 (Bundle sale) NVIDIA® Quadro® RTX6000, PCIe x16 Gen3, 4x DP 1.4, 1x Type C, 4.4” H x 10.5” L, dual slot, full height \* The product is sold with ADLINK platforms. Recommended models are DLAP-4000, AmITX-SL, IMB-M43H, IMB-M43-C236, IMB-M43, and NuPRO-E43 paired with EBP-13E2. ![Front view of a quadro VR headset with green and gray branding, showing front panel and external circuitry (no readable text or symbols beyond branding)](.2021-gpu-solutions-brochure/550d8e130c2b9999a269c7124059494f0812975d1251f8c439cf6f6334a19abd.jpg) Specifications
Quadro PEG RTX6000
Graphic Core
Graphic ArchitectureNVIDIA® TuringTM TU102
GPUQuadro® RTX6000
Memory24 GB GDDR6 memory, 384-bit,Bandwidth: Up to 672 GB/s
ECCYes
GPGPU Computing
CUDA Cores4608 CUDA® cores,16.3 TFLOPS SP Peak
Tensor Cores576130.5 TFLOPS
RT Cores72
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX 12.0, Vulkan 1.1
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)1x USB-C4x 4096x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz
InterfacePCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 10.5" L, dual slot
Form FactorFull height, full length
Environmental
Operating Temp.0°C ~ 45°C
Storage Temp.-40°C ~ 75°C
Module Power Consumption295W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# Quadro PEG RTX8000 # PCI Express Graphic Card with NVIDIA® Quadro® RTX8000 # Features ● DisplayPort 1.4 x4 ● VirtualLink x1 DisplayPort with Audio ● 3D Stereo Support ● Quadro Sync II Compatibility ● NVIDIA nView® Desktop Management Software ● HDCP 2.2 Support ● NVIDIA Mosaic ![Illustration of a quadro VR headset with NVIDIA branding and RTX 800G chip (no text or symbols on the device itself)](.2021-gpu-solutions-brochure/b06130f2597596625d679c52a71658c75abd76e6efb15cd930903ef89a1c878c.jpg) # Ordering Information # ● Quadro PEG RTX8000 (Bundle sale) NVIDIA® Quadro® RTX8000, PCIe x16 Gen3, 4x DP 1.4, 1x Type C, 4.4” H x 10.5” L, dual slot, full height \* The product is sold with ADLINK platforms. Recommended models are DLAP-4000, AmITX-SL, IMB-M43H, IMB-M43-C236, IMB-M43, and NuPRO-E43 paired with EBP-13E2. Specifications
Quadro PEG RTX6000
Graphic Core
Graphic ArchitectureNVIDIA® TuringTM TU102
GPUQuadro® RTX8000
Memory48 GB GDDR6 memory, 384-bit,Bandwidth: Up to 672 GB/s
ECCYes
GPGPU Computing
CUDA Cores4608 CUDA® cores,16.3 TFLOPS SP Peak
Tensor Cores576130.5 TFLOPS
RT Cores72
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX 12.0, Vulkan 1.1
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)1x USB-C4x 3840x2160 @ 120 Hz4x 5120x2880 @ 60 Hz2x 7680x4320 @ 60 Hz
InterfacePCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 10.5" L, dual slot
Form FactorFull height, full length
Environmental
Operating Temp.0°C ~ 45°C
Storage Temp.-40°C ~ 75°C
Module Power Consumption295W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
# Quadro-E PEG P620 # PCI Express Graphic Card with NVIDIA® Quadro® Embedded P620 # Features ● Mini DisplayPort 1.4 x4 DisplayPort with audio ● NVIDIA nView® Desktop Management Software HDCP 2.2 support ● NVIDIA Mosaic Dedicated hardware video encode and decode engines ● 3 (+5)†years ![The image displays the Nvidia logo, characterized by a stylized spiral shape resembling a lowercase 'e'. The background is split vertically down the middle; the left half is a solid lime green square, while the right half is a solid white square. The logo itself is formed by a continuous spiral design: on the left side, a white curved band is set against the green background, and on the right side, a green curved band is set against the white background. These bands spiral inward around a small central white square.](.2021-gpu-solutions-brochure/dc09c1f6b49aa3bf819fde1398ec6fa2acaf407d071182561dac7a725e77e832.jpg) NVIDIA QUADRO CERTIFIED ![Close-up of a black OPD/VO VR headset with visible circuitry and fan (no text or symbols)](.2021-gpu-solutions-brochure/728f34aea21c7ac8ad6e94ab18f824e2a024368cbce3bfb1273a94a7ed8473ba.jpg) # Introduction Quadro-E PEG P620 combines a 512 CUDA core Pascal GPU, ample onboard memory, and advanced display technologies to deliver superior performance in a range of applications. 2GB ultrafast GPU memory enables complex 2D and 3D models, and a flexible single-slot, low-profile form factor allow compatibility with space and power-constrained chassis mounting, and display quality is maximized with support for up to four 4K displays (4096x2160 @ 60 Hz) with HDR color. # Ordering Information ● Quadro-E PEG P620 NVIDIA® Quadro® Embedded P620, PCIe x16 Gen3, 4x mDP 1.4, 2.713” H x 5.7” L, single slot, low profile \* The product is recommended to use with MXC-6400, MVP-6010, MVP-6020 and MVP-6000. † Special conditions apply. Specifications
Quadro-E PEG P620
Graphic Core
Graphic ArchitectureNVIDIA® PascalTM GP107
GPUQuadro® P620
Display Outputs4x mDP 1.4, 4096x2160 @ 60Hz / 5120x2880 @ 60HzHDCP 2.2 support* VGA/DVI/HDMI support via adapter/connector/ bracket
Signal InterfacePCI Express Gen3 x16 support
GPGPU Computing
CUDA Supports512 CUDA cores, 1.38 TFLOPS peak FP32 performance
MemoryGDDR5 2GB memory, memory width: 128-bit, bandwidth: 80 GB/s
SW
OS SupportWindows 7/10 & Linux Drivers, 64bit
Graphic APIDirectX® 12, OpenGL 4.5, Vulkan 1.0 Shader Model 5.1
Compute APICUDA Toolkit 8.0, CUDA Compute version 6.1OpenCLTM 1.2, Direct Compute
NVIDIA technologyNVIDIA® Mosaic Technology/ NVIDIA® nView® Display Management Technology
Environmental
Operating Temp.0 to 55°C
Storage Temp.-40°C to 75°C
Operating RH5% to 90%
Storage RH5% to 95%
Module Power Consumption40W
Mechanicals
Dimensions2.713" × 5.7", single slot
Weight129g
# Quadro-E PEG P1000 PCI Express Graphic Card with NVIDIA® Quadro® Embedded P1000 # Features ● Mini DisplayPort 1.4 x4 ● DisplayPort with audio ● NVIDIA nView® Desktop Management Software ● HDCP 2.2 support ● NVIDIA Mosaic ● Dedicated hardware video encode and decode engines ● 3 (+5)†years ![NVIDIA® QUADRO® CERTIFIED ■ EMBEDDED](.2021-gpu-solutions-brochure/5659b4bcde59807aad25663a13b1ff7ad18f0df0ac72da0b98b8aada3948c283.jpg) # Introduction Quadro-E PEG P1000 combines a 640 CUDA core Pascal GPU, 4GB GDDR5 onboard memory, and advanced display technologies in a low-profile form factor to deliver the graphics performance demanded in professional application. Support for four 4K displays (4096x2160 @ 60Hz) with HDR color provides an expansive visual workspace with maximum detail. # Ordering Information # ● Quadro-E PEG P1000 NVIDIA® Quadro® Embedded P1000, PCIe x16 Gen3, 4x mDP 1.4, 2.713” H x 5.7” L, single slot, low profile \* The product is recommended to use with MXC-6400, MVP-6010, MVP-6020 and MVP-6000. † Special conditions apply. Specifications
Quadro-E PEG P1000
Graphic Core
Graphic ArchitectureNVIDIA® PascalTM GP107
GPUQuadro® P1000
Display Outputs4x mDP 1.4, 4096x2160 @ 60Hz / 5120x2880 @ 60HzHDCP 2.2 support* VGA/DVI/HDMI support via adapter/connector/bracket
Signal InterfacePCI Express Gen3 x16 support
GPGPU Computing
CUDA Supports640 CUDA cores, 1.89 TFLOPS peak FP32 performance
MemoryGDDR5 4GB memory, memory width: 128-bit, bandwidth: 80 GB/s
SW
OS SupportWindows 7/10 & Linux Drivers, 64-bit
Graphic APIDirectX® 12, OpenGL 4.5, Vulkan 1.0 Shader Model 5.1
Compute APICUDA Toolkit 8.0, CUDA Compute version 6.1OpenCLTM 1.2, Direct Compute
NVIDIA technologyNVIDIA® Mosaic Technology/NVIDIA® nView® Display Management Technology
Environmental
Operating Temp.0 to 55°C
Storage Temp.-40°C to 75°C
Operating RH5% to 90%
Storage RH5% to 95%
Module Power Consumption47W
Mechanicals
Dimensions2.713" × 5.7", single slot
Weight129g
# Quadro-E PEG P2200 # PCI Express Graphic Card with NVIDIA® Quadro® P2200 # Features ● DisplayPort 1.4 x4 DisplayPort with audio ● NVIDIA nView® Desktop Management Software HDCP 2.2 support ● NVIDIA Mosaic NVIDIA Iray and MentalRay support # Introduction The Quadro-E PEG P2200 perfectly balances performance, features, and compact form factor to deliver exceptional creative experience and productivity across a variety of 3D applications. The Pascal GPU with 1280 CUDA cores, 5GB GDDR5 onboard memory and support for up to four 5K (5120x2880 @ 60Hz) native displays accelerate product development and creation workflow demanding fluid interactivity for large, complex 3D workpieces. ![Front view of a black CPU board with a fan and ventilation grille (no visible text or symbols)](.2021-gpu-solutions-brochure/70ad2d38fdfc0dfbbc7fbfb06a830010939e01b6f45f64e17f86f788ff21b93e.jpg) # Ordering Information # ● Quadro-E PEG P2200 NVIDIA® Quadro® P2200, PCIe x16 Gen3, 4x DP 1.4, 4.4” H x 7.9” L, single slot \* The product is sold with ADLINK platforms. Recommended models are AMITX-SL, IMB-M43H, IMB-M43-C236, IMB-M43, and NuPRO-E43 paired with EBP-13E2. Specifications
Quadro-E PEG P2200
Graphic Core
Graphic ArchitectureNVIDIA® PascalTM GP106
GPUQuadro® P2200
Display Outputs4x DP 1.4, 4096x2160 @ 60Hz / 5120x2880 @ 60Hz HDCP 2.2 Support* VGA/DVI/HDMI support via adapter/connector/bracket
Signal InterfacePCI Express Gen3 x16 support
GPGPU Computing
CUDA Support1280 CUDA cores, 3.8 TFLOPS peak FP32 performance
MemoryGDDR5 5GB memory, memory width: 160-bit, bandwidth up to: 200 GB/s
SW
OS SupportWindows 7/10 & Linux drivers, 64-bit
Graphic APIDirectX® 12, OpenGL 4.5, Vulkan 1.0 Shader Model 5.1
Compute APICUDA Toolkit 8.0, CUDA Compute version 6.1OpenCLTM 1.2, Direct Compute
NVIDIA TechnologyNVIDIA® Mosaic Technology/ NVIDIA® nView® Display Management Technology
Environmental
Operating Temp.0 to 55°C
Storage Temp.-40°C to 75°C
Operating RH5% to 95%
Storage RH5% to 95%
Module Power Consumption75W
Mechanicals
Dimensions4.4" H x 7.9" L, single slot
Weight256g
# MVP-5100-MXM Series Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms # Features 9th Gen Intel® Core™ i7/i5/i3 LGA processor ● Dual SODIMMs sockets for up to 32GB DDR4 ● Abundant I/O: • Up to 4x additional DP 1.4 from MXM • 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0 • 3x USB 3.1 Gen 1, 3x USB 2.0 ● Rich storage options: 2x 2.5" SATA, M.2 2280 ● Front accessible I/O and adaptive Function Module 2.0 options Embedded slots for Mini PCIe, M.2 3042, 2x USIM ● World leading embedded GP/GPU computing options built-in ![Front view of a black Matrix ADLINK industrial device with visible ports, connectors, and wiring (no readable text or symbols beyond branding)](.2021-gpu-solutions-brochure/2b8cd126b5168a2579d427edb65120aff90f8bd616851bb80b2433f987c52435.jpg) ![The image displays a certification badge consisting of two stacked sections. The top section is a bright green rectangle featuring the white NVIDIA 'eye' logo on the left and the text 'NVIDIA QUADRO' and 'CERTIFIED' in white capital letters to the right. The bottom section is a white rectangle containing a small green square bullet point followed by the word 'EMBEDDED' in green capital letters.](.2021-gpu-solutions-brochure/4aab69fc2236c6e27fc399e73327067f683fd8d61e7cc72fc73ca66cb1c350bd.jpg) # Software Support . Windows 10 IoT Enterprise CBB/LTSB 64-bit ● Linux Ubuntu18.04 LTS # Optional Accessories ● Factory Installed 2.5" SSD/HDD/M.2 Storage . Wireless Mini PCIe/M.2 Module Wi-Fi/ BT/ 3G/ 4G LTE/ LoRa wireless kit (w/ antenna) AC/DC Adapter 220W (P/N: 31-62149-0000) 280W (P/N: 91-95263-0010) Ordering Information
ModelCPUMemory
MVP-510A-MXM/M4G/[GPU]Intel® CoreTM i7-9700E4GB non-ECC DDR4
MVP-5101-MXM/M4G/[GPU]Intel® CoreTM i7-9700TE4GB non-ECC DDR4
MVP-5102-MXM/M4G/[GPU]Intel® CoreTM i5-9500TE4GB non-ECC DDR4
MVP-5103-MXM/M4G/[GPU]Intel® CoreTM i3-9100TE4GB non-ECC DDR4
GPU Options
ModelGPUPowerCUDA® CoresGraphics Memory
EGX-MXM-P1000NVIDIA® Quadro® Embedded P100047W512GDDR5 4GB
EGX-MXM-P2000NVIDIA® Quadro® Embedded P200058W768GDDR5 4GB
EGX-MXM-P3000NVIDIA® Quadro® Embedded P300075W1280GDDR5 6GB
EGX-MXM-P5000NVIDIA® Quadro® Embedded P5000100W2048GDDR5 16GB
Specifications
Model NameMVP-510A-MXMMVP-5101-MXMMVP-5102-MXMMVP-5103-MXM
System Core
ProcessorIntel® CoreTM i7-9700EIntel® CoreTM i7-9700TEIntel® CoreTM i5-9500TEIntel® CoreTM i3-9100TE
TDP65 W35 W35 W35 W
# of Cores8864
Base Frequency2.6 GHz1.8 GHz2.2 GHz2.2 GHz
Max Turbo Frequency4.4 GHz3.8 GHz3.6 GHz3.2 GHz
ChipsetIntel® H310 (Optional: C246)
Memory4GB DDR4 non-ECC 2400 MHz, dual SODIMMs, up to 32GB (Optional: 8/16/32GB ECC, only for Intel Core i3 w/ C246)
I/O Interface
GraphicsDual independent displays: 2x DP++ 1.2/ 1x DVI-D/VGA (3 independent ones w/ C246)Extra 4x DP 1.4 powered by MXM P1000/P2000 or 3x DP 1.4 powered by MXM P3000/P5000
Ethernet3x Intel® GbE: i219 + 2x i211AT (support Intel AMT/vPro w/ C246)
Serial PortsCOM1/2: RS-232/422/485, COM3: RS-232
USB3x USB 3.1 Gen 1, 3x USB 2.0, 1x internal USB2.0 dongle (2x USB 3.1 up to Gen 2 w/ C246)
M.21x socket 2, key B+M or B, 2280/3042 (USB3.1 + SATA III + PCIex1. Up to PCIex2 w/ C246)
Mini PCIe1x Full size (USB 2.0, PCIe)
USIM2
$I^2C$ 2 (3.3V/5V)
TPMTPM 2.0
Storage Device
2.5" SATA2x internal (support RAID 0/1 w/ C246)
Mechanical
Dimensions125 (W) x 240 (D) x 210 (H) mm (4.92" x 9.45" x 8.27")
CoolingFanless passive cooling
Weight6.5 kg (14.4 lbs)
MountingWall mount
Power Supply
DC Input12 to 24V
AC InputOptional 220W or 280W AC/DC adapter
Environmental
Operating TemperatureStandard: w/ air flow 0.6 m/s
0°C to 45°C(35°C for P5000)0°C to 50°C (30°C for P5000)
Extended: w/ air flow 0.6 m/s & Ind. storage
-20°C to 45°C(30°C for P5000)-20°C to 60°C (30°C for P5000)
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excl. storage)
Humidity~95% @ 40°C (non-condensing)
VibrationOperating: 3 Grms, random, 5-500 Hz, 3 axes (w/ 2.5" SSD/CFast))
ShockOperating: 50 G, half sine 11ms duration (w/ 2.5" SSD)
ESDContact 4kV, Air 8kV
EMCEN61000-6-4/-2, CE, FCC Class A
SafetyUL/cUL, CB
\*: MXM module's performance depends on ambient temperature, software and devices # MVP-6100-MXM Series Value Family 9th Gen Intel® Xeon® /Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms # Features . 9th Gen Intel® Xeon® /Core™ i7/i5/i3 LGA processor ● Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC ● Abundant I/O: • Up to 4x additional DP 1.4 from MXM • 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0 • 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0 ● Rich storage options: up to 4x 2.5" SATA, M.2 2280 ● Front accessible I/O and adaptive Function Module 2.0 options ● Flexible functionality expansion: • Expansion slots for standard PCIe and PCI card • Embedded slots for Mini PCIe, M.2 3042, 2x USIM ● World leading embedded GP/GPU computing options built-in # Software Support ● Windows 10 IoT Enterprise CBB/LTSB 64-bit ● Linux Ubuntu 18.04 LTS Ordering Information ![Exterior view of two black Matrix industrial devices with visible ports and connectors, no text or symbols on the main components.](.2021-gpu-solutions-brochure/4e34e76a864d07271985806b37d4a54c3b29da65f3a347f139f37fdd35980379.jpg) # Optional Accessories Factory Installed 2.5" SSD/HDD/M.2 Storage ● Optional 2x 2.5” SATA Kit Includes cables and bracket Wireless Mini PCIe/M.2 Module Wi-Fi/ BT/ 3G/ 4G LTE/ LoRa wireless kit (w/ antenna) ● AC/DC Adapter 220W (P/N: 31-62149-0000) 280W (P/N: 91-95263-0010)
ModelCPUExpansion Slots
MVP-612X-MXM-1E/M4G/[GPU]Intel® Xeon® E-2278GE1 PCIe x4
MVP-612A-MXM-1E/M4G/[GPU]Intel® CoreTM i7-9700E1 PCIe x4
MVP-6121-MXM-1E/M4G/[GPU]Intel® CoreTM i7-9700TE1 PCIe x4
MVP-6122-MXM-1E/M4G/[GPU]Intel® CoreTM i5-9500TE1 PCIe x4
MVP-6123-MXM-1E/M4G/[GPU]Intel® CoreTM i3-9100TE1 PCIe x4
MVP-614X-MXM-2E/M4G/[GPU]Intel® Xeon® E-2278GE2 PCIe x4, 1 PCI
MVP-614A-MXM-2E/M4G/[GPU]Intel® CoreTM i7-9700E2 PCIe x4, 1 PCI
MVP-6141-MXM-2E/M4G/[GPU]Intel® CoreTM i7-9700TE2 PCIe x4, 1 PCI
MVP-6142-MXM-2E/M4G/[GPU]Intel® CoreTM i5-9500TE2 PCIe x4, 1 PCI
MVP-6143-MXM-2E/M4G/[GPU]Intel® CoreTM i3-9100TE2 PCIe x4, 1 PCI
GPU Options
ModelGPUPowerCUDA® CoresGraphics Memory
EGX-MXM-P1000NVIDIA® Quadro® Embedded P100047W512GDDR5 4GB
EGX-MXM-P2000NVIDIA® Quadro® Embedded P200058W768GDDR5 4GB
EGX-MXM-P3000NVIDIA® Quadro® Embedded P300075W1280GDDR5 6GB
EGX-MXM-P5000NVIDIA® Quadro® Embedded P5000100W2048GDDR5 16GB
Specifications
Model NameMVP-610X-MXMMVP-610A-MXMMVP-6101-MXMMVP-6102-MXMMVP-6103-MXM
System Core
ProcessorIntel® Xeon®E-2278GEIntel® CoreTMi7-9700EIntel® CoreTMi7-9700TEIntel® CoreTMi5-9500TEIntel® CoreTMi3-9100TE
TDP80 W65 W35 W35 W35 W
# of Cores88864
Base Frequency3.3 GHz2.6 GHz1.8 GHz2.2 GHz2.2 GHz
Max Turbo Frequency4.7 GHz4.4 GHz3.8 GHz3.6 GHz3.2 GHz
ChipsetIntel® C246
Memory4GB DDR4 non-ECC 2400 MHz, dual SODIMMs, up to 32GB(Optional: 8, 16, 32GB ECC, only for Intel® Xeon®/CoreTM i3)
I/O Interface
Graphics3 independent displays: 2x DP++ 1.2/ 1x DVI-D/VGAAxtra 4x DP 1.4 powered by MXM P1000/P2000 or 3x DP 1.4 powered by MXM P3000/P5000
Ethernet3x Intel® GbE(2x i211AT, 1x i219) w/ iAMT/vPro support
Serial PortsCOM1/2: RS-232/422/485, COM3: RS-232
USB2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0, 1x internal USB2.0 dongle
I2C2 (3.3V/5V)
TPMTPM 2.0
M.21x socket 2, key B+M or B, 2280/3042 (USB3.1 + SATA III + PCIe x2)
Mini PCIe1x Full size (USB 2.0, PCIe)
USIM2
Expansion SlotsMVP-6120-MXM: 1 PCIe x4MVP-6140-MXM: 2 PCIe x4, 1 PCI
Storage Device
2.5" SATA2 (extra 2 by optional kit), support RAID 0/1/5/10
Mechanical
DimensionsMVP-6120-MXM: 165 (W) x 240 (D) x 210 (H) mm (6.5" x 9.45" x 8.27")MVP-6140-MXM: 206 (W) x 240 (D) x 210 (H) mm (8.11" x 9.45" x 8.27")
CoolingSystem/MXM: Active fan cooling
WeightMVP-6120-MXM: 6.0 kg (13.2 lbs)MVP-6140-MXM: 6.4 kg (14.0 lbs)
MountingWall mount
Power Supply
DC Input12 to 24V
AC Input220W or 280W AC/DC adapter (optional)
Environmental
Operating TemperatureStandard: (w/ air flow 0.6 m/s)
0°C to 40°C(35°C for P5000)0°C to 50°C
Extended: (w/ air flow 0.6 m/s & ind. storage)
-20°C to 40°C(35°C for P5000)-20°C to 50°C-20°C to 60°C
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excl. storage)
Humidity~95% @ 40°C (non-condensing)
VibrationOperating: 2 Grms, random, 5-500 Hz, 3 axes (w/ 2.5" SSD/CFast)Operating: 0.5 Grms, random, 5-500 Hz, 3 axes (w/ HDD)
ShockOperating: 50 G, half sine 11ms duration (w/ 2.5" SSD)
ESDContact 4kV, Air 8kV
EMCEN61000-6-4/-2, CE, FCC Class A
SafetyUL/cUL, CB
# DLAP-3000-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module ● Reliable Molex type 12V DC-in connector . 1x Intel® i219-LM and 3x Intel® i210-AT ![Front view of a black ADLINK network device with ports and ventilation grilles (no visible text or symbols)](.2021-gpu-solutions-brochure/066ad588b701cd884f1e1363bea4528745ecb4e563a15e2513cc97dcd1401882.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO 91-95266-0010 Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3000-CFP1EGX-MXM-P1000H31012V
DLAP-3000-CFP2EGX-MXM-P2000H31012V
DLAP-3000-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)H31012V
DLAP-3000-CFP3EGX-MXM-P3000H31012V
DLAP-3000-CFP5EGX-MXM-P5000H31012V
DLAP-3000-CFP35EGX-MXM-P3000/5000(not incl.)H31012V
DLAP-3000-CFT1EGX-MXM-T1000H31012V
DLAP-3000-CFT3EGX-MXM-RTX3000H31012V
Specifications
ModelDLAP-3000-CFP1DLAP-3000-CFP2DLAP-3000-CFT1DLAP-3000-CFT3DLAP-3000-CFP3DLAP-3000-CFP5
DLAP-3000-CFP12*DLAP-3000-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® H310 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB4x USB 3.1 Gen1 x1 ports, 4x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module
Digital IODefault: w/o DIOOptional: 1x DI/DO with 4 in, 4 outNote: Optional DIO, Audio and TPM 2.0 must be chosen together.
AudioDefault: w/o AudioOption 1: Mic-in, Line-out, Line-inOption 2: Mic-in, L/R speaker-out (6W + 6W)Option 3: Line-in, L/R speaker-out (6W + 6W)
TPM 2.0Default: w/o TPM
eSIMOptional
Storage
SATA2x 2.5" SATA 6Gb/s external drive bays1x SATA 6Gb/s signal via M.2 B key connector
Mechanical
Dimensions235 x 182 x 75mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
\*Note: These models do not include an MXM graphics module. # DLAP-3100-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module ● Reliable Molex type 12V DC-in connector ● 1x Intel® i219-LM) and 5x Intel® i210-AT ![Back view of a black ADLINK network device with ports and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/3d58d1b867574a9e999e33afc84fdc92455ee400e5049cc5255bc3fef7e20b3a.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3100-CFP1EGX-MXM-P1000Q37012V
DLAP-3100-CFP2EGX-MXM-P2000Q37012V
DLAP-3100-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)Q37012V
DLAP-3100-CFP3EGX-MXM-P3000Q37012V
DLAP-3100-CFP5EGX-MXM-P5000Q37012V
DLAP-3100-CFP35EGX-MXM-P3000/5000 (not incl.)Q37012V
DLAP-3100-CFT1EGX-MXM-T1000Q37012V
DLAP-3100-CFT3EGX-MXM-RTX3000Q37012V
Specifications
ModelDLAP-3100-CFP1DLAP-3100-CFP2DLAP-3100-CFT1DLAP-3100-CFT3DLAP-3100-CFP3DLAP-3100-CFP5
DLAP-3100-CFP12*DLAP-3100-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® Q370 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 5x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB6x USB 3.1 Gen1x1 ports, 2x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
Digital IO1x DI/DO with 4 in, 4 out
AudioMic-in, L/R speaker-out (6W + 6W)
TPM 2.0Yes
eSIMOptional
Storage
SATA2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel® RST RAID Support
Mechanical
Dimensions235 x 182 x 75mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
\*Note: These models do not include an MXM graphics module. # DLAP-3200-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module ● Reliable Molex type 12V DC-in connector ● 1x Intel® i219-LM and 3x Intel® i210-AT ● 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support ![Back view of a black ADLINK network device with ports, connectors, and ventilation grilles (no visible text or symbols)](.2021-gpu-solutions-brochure/d13b38e7ebed30e28063e5ec5149d882f56501954841cc39c3ed023b1d5b9748.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3200-CFP1EGX-MXM-P1000Q37012V
DLAP-3200-CFP2EGX-MXM-P2000Q37012V
DLAP-3200-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)Q37012V
DLAP-3200-CFP3EGX-MXM-P3000Q37012V
DLAP-3200-CFP5EGX-MXM-P5000Q37012V
DLAP-3200-CFP35EGX-MXM-P3000/5000(not incl.)Q37012V
DLAP-3200-CFT1EGX-MXM-T1000Q37012V
DLAP-3200-CFT3EGX-MXM-RTX3000Q37012V
Specifications
ModelDLAP-3200-CFP1DLAP-3200-CFP2DLAP-3200-CFT1DLAP-3200-CFT3DLAP-3200-CFP3DLAP-3200-CFP5
DLAP-3200-CFP12*DLAP-3200-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® Q370 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB6x USB 3.1 Gen1x1 ports, 2x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
Digital IO1x DI/DO with 4 in, 4 out
AudioMic-in, L/R speaker-out (6W + 6W)
TPM 2.0Yes
eSIMOptional
Expansion slot2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
Storage
SATA2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel® RST RAID Support
Mechanical
Dimensions235 x 182 x 130mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
\*Note: These models do not include an MXM graphics module. # DLAP-4000 Series Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features NVIDIA® Quadro® PEG card support ● 8th/9th Gen Intel® Core™ i7/i5/i3 processor ● Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU) ● 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards ● 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module, 1x M.2 M key supporting 2280 SATA SSD module, 1x PCIe x16 slot for PEG card ● 300W/500W Flex ATX PSU ![Interior view of a server rack unit showing internal components and ventilation slots (no visible text or symbols)](.2021-gpu-solutions-brochure/33dfcade290edca1588900ebd93678f7236546282b25c08d01bd4d0fff065f22.jpg) ![Front view of a black ADLINK desktop computer chassis with ports and ventilation slots (no visible text or labels)](.2021-gpu-solutions-brochure/1dc45ad9bda70e40e4a9f78090663f9e8b4bb18850b2fb1298fdf091134a2bd7.jpg) # Software Support ● Windows 10 IoT Enterprise CBB 64-bit ● Ubuntu 16.04 LTS # Optional Accessories ● 3.5" SATA HDD, 2.5" SATA SSD/HDD, M.2 2280 SATA SSD ● Wireless Module Wi-Fi/Bluetooth or 4G LTE wireless kit (w/ antenna) Ordering Information
ModelCPUMemory
DLAP-4001/M8G/[PEG]Intel® CoreTM i7-9700E8GB non-ECC DDR4
DLAP-4002/M8G/[PEG]Intel® CoreTM i5-9500E8GB non-ECC DDR4
DLAP-4003/M8G/[PEG]Intel® CoreTM i3-9100E8GB non-ECC DDR4
DLAP-4004/M8G/[PEG]Intel® CoreTM i7-9700TE8GB non-ECC DDR4
DLAP-4005/M8G/[PEG]Intel® CoreTM i5-9500TE8GB non-ECC DDR4
DLAP-4006/M8G/[PEG]Intel® CoreTM i3-9100TE8GB non-ECC DDR4
DLAP-4007/M8G/[PEG]Intel® CoreTM i7-87008GB non-ECC DDR4
DLAP-4008/M8G/[PEG]Intel® CoreTM i5-85008GB non-ECC DDR4
DLAP-4009/M8G/[PEG]Intel® CoreTM i3-81008GB non-ECC DDR4
DLAP-400A/M8G/[PEG]Intel® CoreTM i7-8700T8GB non-ECC DDR4
DLAP-400B/M8G/[PEG]Intel® CoreTM i5-8500T8GB non-ECC DDR4
DLAP-400C/M8G/[PEG]Intel® CoreTM i3-8100T8GB non-ECC DDR4
PEG Card Options
PEGModelPowerCUDA® CoresGraphics Memory
P2200NVIDIA® Quadro® P220075W1280GDDR5 5GB
RTX4000NVIDIA® Quadro® RTX 4000160W2304GDDR6 8GB
RTX5000NVIDIA® Quadro® RTX 5000265W3072GDDR6 16GB
RTX6000NVIDIA® Quadro® RTX 6000295W4608GDDR6 24GB
RTX8000NVIDIA® Quadro® RTX 8000295W4608GDDR6 48 GB
Specifications
ModelDLAP-4000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (4C/4T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
ChipsetIntel® H310 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 32GB (dependent on CPU) system memory
PEG Card SupportNVIDIA® Quadro® P2200NVIDIA® Quadro® RTX 4000NVIDIA® Quadro® RTX 5000NVIDIA® Quadro® RTX 6000NVIDIA® Quadro® RTX 8000
I/O Interfaces
Display1x DVI-D connector (rear), resolution up to 1920 x 1200 @ 60 Hz1x DP connector (rear), resolution up to 4096 x 2304 @ 60 Hz1x HDMI connector (rear) resolution up to 4096 x 2160 @ 30 HzAdditional display output from PEG cards
Ethernet2x GbE (Realtek RTL8111G)
Serial Ports1x RS-232/422/485, 4x RS-232
USB4x USB 3.1 Gen1 ports, 2x USB 2.0 ports
DIO1x 8-bit GPIO
Mini PCIe1x Mini PCIe slot (USB 2.0 and PCIe x1)
M.21x M.2 M key (SATA 6Gb/s)
Expansion Slot1x PCIe x16 slot
AudioMic-in, Line-out, Line-in
TPM 2.0Optional
Storage
2.5" SATA2x 2.5" SATA 6Gb/s internal drive bays
Mechanical
Dimensions220 x 300 x 150 mm (W x D x H)
Power Supply
AC Input100 to 240 VAC
Output Rating300W500W500W500W500W
Environmental
Operating Temperature0°C to 50°C0°C to 50°C0°C to 40°C0°C to 40°C0°C to 40°C
Storage Temperature-20°C to 60°C
Humidity5% to 90%, non-condensing
VibrationOperating: 1Grms, 5-500Hz, 3 axes (with 2.5" SSD and PEG card)Non-operating: 2Grms, 5-500Hz, 3 axes
ShockOperating: 20G, 11ms duration, half sineNon-operating: 30G, 11ms duration, half sine
EMCEN55032/35, EN61000-6-2/-4, CE, FCC Part 15B Class B
SafetyUL/cUL, CB
# DLAP-8000 Series 9th Gen Intel® Xeon® , Core™ i7/i5/i3-Based Compact Industrial GPU Workstation # Features ● 9th Gen Intel® Xeon® , Core™ i7/i5/i3 LGA processors with workstation C246 chipset ● Dual SODIMMs for up to 64GB DDR4 / ECC options\* ● Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0 ● 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0 ● Rich storage: • Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280 ● Embedded expansion: 1x Mini PCIe, 1x M.2 key B+M 2280/3042, 2x USIM ● Front accessible I/O and adaptive Function Module v.2 option Flexible and powerful PCIe expansions via backplane • 2x FHFL PCI Express cards (e.g. Quadro RTX 8000) accommodation w/ AUX power inlets • PCIe x8, x1, x4, x8, and x4 signals with physical x16, x4, x8, x16, and x8 slots ● Optional AC or DC SKUs in power inputs \*Available on Xeon/i3 SKUs ![Front view of a black hardware server rack with connected ports and ventilation units (no visible text or labels)](.2021-gpu-solutions-brochure/bab77deada56f927f3f01ee73a3006fcefb7f368ab9654d6057238184a409933.jpg) ![Interior view of an industrial electronic device showing internal components like CPU, RAM slots, and a green circuit board (no text or symbols visible)](.2021-gpu-solutions-brochure/4b0bda2587aadf68865a80d381a2e7dc9c3ed912f747e6d211683317bf2cdb6b.jpg) # Software Support ● Windows 10 IoT Enterprise CBB 64-bit ● Linux Ubuntu 18.04 # Optional Accessories 2.5" SSD, HDD, M.2, CFast Storage ● Wireless Module Wi-Fi, BT, 3G, 4G LTE, wireless kit (w/ antenna) Ordering Information
ModelCPUExpansion Slots2.5” SATA
DLAP-800X-DC /M16GIntel® Xeon® E2278GE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-800X-AC/M16GIntel® Xeon® E2278GE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8001-DC/M8GIntel® CoreTM i7-9700TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8001-AC/M8GIntel® CoreTM i7-9700TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8002-DC/M8GIntel® CoreTM i5-9500TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8002-AC/M8GIntel® CoreTM i5-9500TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8003-DC/M8GIntel® CoreTM i3-9100TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8003-AC/M8GIntel® CoreTM i3-9100TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
ModelDLAP-800XDLAP-8001DLAP-8002DLAP-8003
System Core
ProcessorIntel® Xeon®E-2278GE 80WIntel® CoreTMi7-9700TE 35WIntel® CoreTMi5-9500TE 35WIntel® CoreTMi3-9100TE 35W
Core #8864
Base Freq.3.3 GHz2.6 GHz2.2 GHz2.2 GHz
MAX Turbo Freq.4.7 GHz4.4 GHz3.6 GHz3.2 GHz
ChipsetWorkstation Intel® C246
Memory4GB DDR4 2400MHz, dual SODIMMs, up to 64GBOptional: 8, 16, 32GB DDR4 ECC 2400MHz (Xeon® and i3 support ECC)
Display2x DP++ and 1x DVI-I
I/O Interfaces
Ethernet3x Intel® GbE: 2x i211AT + 1x i219iAMT support
Serial PortsCOM1/2: RS-232/422/485, COM3/4: RS-232
USB2x USB 3.1 Gen 2 + 1x USB 3.1 Gen 1 + 3x USB 2.0, 1x internal USB 2.0 dongle
AudioLine-out, Mic-in (Optional: speaker-out)
Mini PCIe1x Full size (USB 2.0 + PCIe)
M.21x socket, key B+M, 2280/3042: USB 3.1 Gen 1, SATA 6 Gb/s and PCIe x2
USIM2 (1 for Mini PCIe and 1 for M.2)
DI/O8-ch DI and 8-ch DO
I2C2 (3.3V & 5V)
TPM 2.0Supported
Expansion SlotsPhysical: 2x PCIe x16, 2x PCIe x8, 1x PCIe x4;Signal: 2x PCIe x8, 2x PCIe x4, 1x PCIe x1
Storage Devices
2.5" SATA4x external swappable trays (supports RAID 0, 1, 5, 10)
CFast1x Type II
Mechanical
Dimensions210 (W) x 210 (D) x 350 (H) mm (8.27" x 8.27" x 13.8")
Weight7kg for PC sku, 10kg for AC sku
MountingWall mount
Power Supply
DC Input24 Vdc
AC InputOptional AC SKU for 90-260 Vac
Environmental
Operating TemperatureStandard: 0°C to 50°C
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excluding storage)
Humidity~95% @ 40°C (104°F) (non-condensing)
VibrationOperating: 3 Grms, 5-500 Hz, 3 axes (w/ SSD/CFast)Operating: 0.1 Grms, 5-500 Hz, 3 axes (w/ HDD)
ShockOperating: 30 Grms, half sine 11ms duration (w/ SSD/CFast)
ESDContact ±4KV, Air ±8KV
EMCEN61000-6-4/-2, CE & FCC Class A
SafetyUL/cUL, CB, CCC
# ADi-SC1X # High-Performance Gaming Platform # Fully Modular Slot-In Platform with Backplane Architecture # Supports up to Eight Independent 4K/UHD Displays # Features ● Flexible platform selection: 6th Gen. and later Intel® Core™ CPU and AMD Ryzen™ APU with COMe support ● Flexible maintenance and upgrade: slot-in/backplane design, CPU COMe module, GPU MXM module ● Full-scale customization options: GDDR5, V-BIOS, video ports, I/O ports, etc. High level of integration: FPGA & logging controller onboard ![Modular and Flexible ADI-SC1X Fully Modular Slot-In Platform CPU Fan May vary depending on thermal requirements intel IoT Solutions Alliance Premier CPU COMe Module Flexible Platform Selection: 6th Gen and later Intel® Core™ CPU as well as AMD Ryzen™ APU platform support Overall - Flexible Maintenance and Upgrade: slot-in machine construction, CPU COMe module, GPU MXM module - High Integration: FPGA & logging controller onboard GPU Fan May vary depending on thermal requirements NVIDIA GPU MXM Module Advanced Customization: GDDR5, V-BIOS](.2021-gpu-solutions-brochure/89cc67cafd3d69e966f677b0a22c59dbd699e35d11f315ac3cefd105315f1249.jpg) # Introduction ADLINK‘s ADi-SC1X gaming platform with backplane architecture features a wide range of powerful processing and graphics options for gaming applications. Equipped with a COM Express Type 6 interface and an MXM Type B slot, ADi-SC1X provides superior scalability for all possible use cases and performance requirements. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, ADi-SC1X fully satisfies the needs of gaming applications. The platform is designed to meet the GLI-11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements. The comprehensive middleware as well as the security and extensive I/O solutions enable developers to easily bridge applications with peripheral devices, sensors, and surrounding solutions up to central monitoring and control systems. # High Scalability and Ideal Range of Performance Class ADi-SC1X is designed with highly scalable and reliable hardware that can be flexibly scaled from entry level up to the highest performance class, with tailored configuration of COMe CPU and MXM GPU selections. ![Black server rack with exposed network equipment and ports, no visible text or symbols](.2021-gpu-solutions-brochure/fcad27a2960c9afff6421be5f1d15d408341f0a8f59e93fa1e7dc0ac48a9d200.jpg) # Multi-Display Graphics Capabilities ADi-SC1X provides support for up to 4K resolutions and is capable of supporting dedicated graphics cards for up to eight independent monitors that conform to the latest DisplayPort 1.2 standard. # Advanced Security and NVRAM PCI Express for Gaming Designed to Meet GLI-11 High-speed PCI Express card with up to 64 MB NVRAM. It offers a crypto and authentication security chip with power-off monitoring and event logging designed to meet the GLI-11 (Gaming Laboratories International) certification requirements. Further features are also available, such as TPM1.2 trusted platform module or custom secure BIOS options. # Ordering Information ADi-SC1Xxxxxx ● ADi-SA2X-KB-BAAS (call for availability) \*Other configurations on request # Options ● ADiAPI Intelligent middleware used for controlling peripheral devices # Optional Accessories ● ADi-BSEC cable . Box PC cable kit . ADi-BSDK board . ADi-BSDK board cable kit Specifications
Model NameADi-SC1X (preliminary data subject to change)
Core System
ProcessorCOM Express Type 6 up to 65W
ChipsetDependent on COM Express module
BIOSSocketed dual AMI uEFI-based BIOS on with Intel® AMT 11.0 support; onboard BIOS socket and SPI header
Expansion Slot1x M.2 / 1x MXM Type B
MemoryDual-channel, non-ECC 1333/1600/2133 MHz DDR4/DDR3L memory up to 32 GB in dual vertical SODIMM sockets
Graphics CardIntegrated graphics dependent on COM Express module
NVIDIA Quadro® P1000 embedded MXM
Various other MXM options
Storage3x SATA 6Gb/s (onboard)
2x HDD/SSD/CFast
Flexible, field-removable 2.5" drive bay on front panel
Up to 3x SATADOM support
1x M.2 (M Key, Socket 3 type)
3x EEPROM storage support (1x with 3.3V/5V support)
I/O Interfaces
Ethernet2x GbE ports (10/100/1000 GbE connection)
Serial Ports2x RS232/422/485/TTL; 4x RS232; 2x RS232/TTL; 2x RS232/CCTALK
Audio Interface7.1 channel audio via 5 jacks and S/PDIF output on rear I/O;7.1 channel audio signals and S/PDIF output via internal header;optional 2.1 Class D amplifier
USB8 x USB on backplane (USB 2.0/3.0 distribution dependent on chipset)
2x USB 3.0 on front panel
2x USB 2.0/3.0 on internal vertical connector
DisplayPortUp to 4x COMe DP outputs dependent on COM Express module
4x MXM card DP outputs (optional)
OtherSPI, 1-Wire, I2C, removable EEPROM modules
Gaming-Specific Features and Security
NVRAM up to 4x 8MB (battery-buffered)
Intrusion detection
Event logging processor (battery-buffered)
3x high-current outputs
24 x open drain /40V LED drivers
32x digital inputs / 32x digital outputs
8x independent current-sensed hardmeter support
Key lock, eyelet for sealing, TPM, GLI covers, dedicated security ICs, secure key storage, SHA and AES support
Fully customizable secure BIOS
Power Supply
12V or 24V input (optional)
Mechanical
Dimensions292mm (W) x 255mm (D) x 230mm (H)
Operating System Support
Windows® 32/64-bit, Linux 32/64-bit (optional)
Environmental & Safety
Operating Temp.0°C to 50°C (32°F to 122°F)
Storage Temp.-20°C to 70°C (-4°F to 158°F) (excl. HDD/SSD/CFast)
Humidity~ 85% @ 50°C (122°F) (non-condensing)
ShockOperating, 20 G, half sine 11 ms duration (w/ CFast or SSD)
EMCCE and FCC Class A
ESDContact +/-4 KV and Air +/-8 KV
SafetyUL/cUL, CB, KCC
# AMSTX-CF Series ![The image displays a blue oval shape containing the word 'Preliminary' in white, italicized, sans-serif text.](.2021-gpu-solutions-brochure/7d24ba0055770b32bb3c4c8b2eddaff1dfc0b6cbccde5010face272cdc809ffa.jpg) Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (CPU dependent) ● 6 x DisplayPort (2 from CPU, 4 from MXM). one internal HDMI (vertical connector from CPU), LVDS optional ● 1x M.2 E key supporting 1630 or 2230 for wireless LAN / Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module, 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module (not supported by H310 Chipset) ● Reliable Molex type 12V DC-in connector . 1x Intel® i219-LM and 3x Intel® i210-AT ![Close-up of a computer motherboard with CPU socket, connectors, and ports (no visible text or labels)](.2021-gpu-solutions-brochure/47359e8d465b4175dbd74ad851739d6b8e38521aab2df8ff07dad1593b6d34fa.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories ● 65W CPU cooler: 32-20495-0000 . 35W CPU cooler: 32-20378-0000-A0 ● CPU cooler bracket 32-50015-0100-A0 (default bundle in AMSTX-CF packing) . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 ● MXM cooler for T1000: 32-20830-0200-A0 ● MXM cooler for RTX3000: 32-20823-1100-A0 . 12V/240W adaptor: 31-62164-0010-A0 . Wifi Kit INTEL AC9260 Non-VPRO 91-95266-0010 Ordering Information
ModelMXM SupportChipsetDC-in
AMSTX-CFP12-Q370EGX-MXM-P1000/P2000/T1000/RTX3000Q37012V
AMSTX-CFP35-Q370EGX-MXM-P3000/P5000Q37012V
AMSTX-CFP12-H310EGX-MXM-P1000/P2000/T1000/RTX3000H31012V
AMSTX-CFP35-H310EGX-MXM-P3000/P5000H31012V
Specifications
ModelAMSTX-CFP12-Q370AMSTX-CFP35-Q370AMSTX-CFP12-H310AMSTX-CFP35-H310
MXM SupportEGX-MXM-P1000/P2000/T1000/RTX3000EGX-MXM-P3000/P5000EGX-MXM-P1000/P2000/T1000/RTX3000EGX-MXM-P3000/P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® Q370 ChipsetIntel® H310 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM). One internal HDMI (vertical connector from CPU), LVDS optional
Ethernet1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485 pin header, 1x RS-232 pin header (Ctalk supported by jumper setting)
USB4x USB 3.1 Gen1 x1 ports, 2x USB 2.0 pin headers, 2x USB 3.1 Gen1 x1 pin headers4x USB 3.1 Gen1x1 ports, 4x USB 2.0 pin headers
AudioDefault: One 10-pin wafer (box header) for Mic-in/Line out/Line in Optional 1: Mic in /(6W speaker_out_L+6W speaker_out_R. (on board 10-pin wafer. Connector via additional audio module) Optional 2: Line in /(6W speaker_out_L+6W speaker_out_R. (on board 10-pin wafer. Connector via additional audio module)
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/ BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module, 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module1x M.2 E key supporting 1630 or 2230 for Wi-Fi / BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module
PCB Edge Connector1x PCIe x8 PCB edge connector (data is from 2x PCIe Gen3 x4 root ports, one set of clocks, up to 50W), one PCIe power connector up to 12V @3.5A/5V@4A1x PCIe x8 PCB edge connector (data is from 1x PCIe Gen2 x1 root ports, one set of clocks, up to 50W), one PCIe power connector up to 12V @3.5A/5V@4A
Digital I/OOne 1x 10-pin/2.0mm wafer: DI/DO: 4 in and 4 out
TPM 2.0Optional
eSIMOptional
Storage
SATA2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel® RST RAID Support2x SATA 6Gb/s, one SATA power connector 1x SATA 6Gb/s signal via M.2 B key connector
Mechanical
Dimensions197.72 x 167.32 mm (W x L)
MountingADLINK proprietary mounting hole locations, ADLINK proprietary CPU cooler bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V @20A) AC/DC adapter
Environmental
Operating Temperature0°C to 60°C (w/o MXM), 0°C to 55°C (w/ MXM)
Storage Temperature-40°C to 85°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
# MVP-6100 Series Value Family 9th Generation Intel® Xeon® /Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Expandable Computer # Features 9th Gen Intel® Xeon® /Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor ● Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0 ● 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0 ● Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280 ● Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM ● Front accessible I/O and adaptive Function Module v.2 option ● Flexible modular expansion with 2 or 4 slots ![Front view of a black Matrix industrial device with visible ports, connectors, and ventilation slots (no readable text or symbols)](.2021-gpu-solutions-brochure/5d3002b5f94c94105951ee390628dc00a365072d0a1920126501a45db7b80da4.jpg) ![Front view of a black Matrix industrial device with multiple ports and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/e97c81984c1796efc036b96dca21ab9471e84957e9b4f43d1658871005346240.jpg) # Software Support ● Win10 IoT Enterprise CBB 64bit ● Linux Ubuntu 18.04 # Optional Accessories ● MVP-6100 Fan Kit (P/N: 91-95267-0010) . Factory Installed 2.5" SATA SSD/HDD/M.2/CFast Wireless Module Wi-Fi/ BT/ 3G/ 4G LTE/ LoRa wireless kit (w/ antenna) ● Optional 2x 2.5" SATA Kit (w/ Bracket and Cable) AC/DC Adapter 220W (P/N: 31-62149-0000) 280W (P/N: 31-62162-1010-A0) ● Internal power cable for add-on card 30-21656-0000-A0: for MVP-6120 30-21655-0000-A0: for MVP-6140 Ordering Information
ModelCPUPCHSlot #
MVP-612X-1E/M4GIntel® Xeon® E-2278GEC2462
MVP-612A-1E/M4GIntel® CoreTM i7-9700EH3102
MVP-6121-1E/M4GIntel® CoreTM i7-9700TEH3102
MVP-6122-1E/M4GIntel® CoreTM i5-9500TEH3102
MVP-6123-1E/M4GIntel® CoreTM i3-9100TEH3102
MVP-6124-1E/M4GIntel® Celeron® G4900TH3102
MVP-614X-3E/M4GIntel® Xeon® E-2278GEC2464
MVP-614A-3E/M4GIntel® CoreTM i7-9700EC2464
MVP-6141-3E/M4GIntel® CoreTM i7-9700TEC2464
MVP-6142-3E/M4GIntel® CoreTM i5-9500TEC2464
MVP-6143-3E/M4GIntel® CoreTM i3-9100TEC2464
MVP-6144-3E/M4GIntel® Celeron® G4900TC2464
Specifications
Model NameMVP-610XMVP-610AMVP-6101MVP-6102MVP-6103MVP-6104
System Core
ProcessorIntel® Xeon®E-2278GEIntel® CoreTMi7-9700EIntel® CoreTMi7-9700TEIntel® CoreTMi5-9500TEIntel® CoreTMi3-9100TEIntel® Celeron®G4900T
TDP80W65W35W35W35W35W
# of Cores888642
Base Freq.3.3 GHz2.6 GHz1.8 GHz2.2 GHz2.2 GHz2.9 GHz
Max Turbo Freq.4.7 GHz4.4 GHz3.8 GHz3.6 GHz3.2 GHz-
ChipsetC246MVP-6120 series: H310MVP-6140 series: C246
Memory4GB DDR4 non-ECC 2400 MHz, dual SODIMMs, up to 32GB(Optional: 4/8/16/32GB ECC, only for Intel® Xeon®/CoreTM i3/Celeron w/ C246)
I/O Interface
Display2x DP++ 1.2, DVI-D, VGA (dual independent displays w/ H310, 3 independent displays w/ C246)
Ethernet3x Intel GbE: 2x i211AT + i219(Support Intel® AMT/vProTM w/ C246)
Serial PortsCOM1/2: RS-232/422/485, COM3/4: RS-232(Optional COM5/6: RS-232, shared w/ DI/O)
USB3x USB 3.1 Gen 1 + 3x USB 2.0, 1x internal USB 2.0 dongle (2x USB 3.1 up to Gen 2 w/ C246)
AudioLine-out, Mic-in (Optional: speaker-out)
Mini PCIe1x Full size (USB 2.0 + PCIe)
M.21x socket 2, key B+M or B, 2280/3042 (USB3.1 + SATA III + PCIe x1. Up to PCIe x2 w/ C246)
USIM2
DI/O8-CH DI and 8-CH DO
I2C2 (3.3V/5V)
TPMTPM2.0
Expansion SlotsMVP-6120 series: PCIe x16 + PCI (total up to 150W)MVP-6140 series: PCIe x16 + 2 PCIe x4 + PCI (total up to 150W with 12V in; total up to 250W with 24V in)
Storage Device
2.5" SATA2x internal (RAID 0/1/5/10 support w/ C246)(Optional: additional 2x internal, w/ C246)
CFast1 Type II
Mechanical
DimensionsMVP-6120 series: 165 (W) x 240 (D) x 210 (H) mm (6.5" x 9.45" x 8.27")MVP-6140 series: 206 (W) x 240 (D) x 210 (H) mm (8.11" x 9.45" x 8.27")
WeightMVP-6120 series: 4.8 kg (10.6 lbs)MVP-6140 series: 5.1 kg (11.2 lbs)
MountingWall mount
FanOptional
Power Supply
DC Input12-24V (± 10% tolerance)
AC InputOptional: 220W/280W AC/DC adapter
Environmental
Operating TemperatureStandard: (w/ air flow 0.6 m/s)
0°C to 40°C0°C to 50°C
Extended: (w/ air flow 0.6 m/s & ind. storage)
-20°C to 40°C-20°C to 50°C-20°C to 60°C
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excl. storage)
Humidity~95% @ 40°C (non-condensing)
VibrationOperating: 5 Grms, random, 5-500 Hz, 3 axes (w/2.5" SSD/CFast, 3 Grms w/ fan)Operating: 0.5 Grms, random, 5-500 Hz, 3 axes (w/ HDD)
ShockOperating: 50 G, half sine 11ms duration (w/ 2.5" SSD/CFast)
ESDContact +/-4KV, Air +/-8KV
EMCEN61000-6-4/-2, CE & FCC Class A
SafetyUL/cUL, CB, CCC
# MVP-6010/6020 Series Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer # Features ● 6th Gen Intel® Core™ i7/i5/i3 processors with H110/Q170 chipset ● Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory ● Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort 4 expansion slots • MVP-6010: 1 PCIe Gen3 x16 and 3 PCI expansion slots • MVP-6020: 2 PCIe Gen3 x8 and 2 PCI expansion slots 3 Intel® GbE ports with teaming function 2 software-programmable RS-232/422/485 + 2 RS-232 ports ● Built-in 8CH DI & 8CH DO ● Front-accessible I/O for simplified installation and maintenance Extremely cost-effective, high performance Fanless system • Support up to 65W CPU with fanless operation # Introduction ADLINK’s newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely costeffective price point. The MVP-6010/6020 Series supports dual-channel DDR4 memory for more powerful computing and the Intel® HD Graphics 530 speeds graphics performance. Along with a versatile I/O array and flexible expansion capacity, the MVP-6010/6020 Series fully satisfies all the needs of industrial automation with the performance demanded by vision inspection, motion control, and surveillance applications. Fanless construction not only overcomes contaminant and noise challenges presented by harsh IA environments, the elimination of problematic structural elements that negatively affect MTBF greatly increases life cycle expectations for the platform. # Optional Accessories . Optional Fan Module Fan module for MVP-6010/6020 series 8/16/32 GB DDR4 Option Upgrade to 8/16/32 GB DDR4 memory ● 500 GB / 1TB HDD Option Factory-installed 500 GB / 1 TB SATA hard disk drive ● 64 GB SSD Option Factory-installed 64 GB MLC SATA solid-state drive ● 160W AC-DC Adapter 160W Industrial grade AC-DC adapter ![Front view of a black industrial hardware unit with multiple ports and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/0097107da99fe2c1a3a80a936dbc0e79f360633fa768a2c50d48cb24985054cf.jpg) # Software Support ● Windows® 10 / 7 / Embedded Standard 7 ● Linux # Ordering Information ● MVP-6011 Intel® Core™ i7-6700TE fanless embedded computer 1 PCIe Gen3 x16 + 3 PCI expansion slots ● MVP-6012 Intel® Core™ i5-6500TE fanless embedded computer 1 PCIe Gen3 x16 + 3 PCI expansion slots ● MVP-6013 Intel® Core™ i3-6100TE fanless embedded computer 1 PCIe Gen3 x16 + 3 PCI expansion slots ● MVP-6015 Intel® Core™ i7-6700 fanless embedded computer 1 PCIe Gen3 x16 + 3 PCI expansion slots ● MVP-6021 Intel® Core™ i7-6700TE fanless embedded computer 2 PCIe Gen3 x8 + 2 PCI expansion slots ● MVP-6022 Intel® Core™ i5-6500TE fanless embedded computer 2 PCIe Gen3 x8 + 2 PCI expansion slots ● MVP-6023 Intel® Core™ i3-6100TE fanless embedded computer 2 PCIe Gen3 x8 + 2 PCI expansion slots ● MVP-6025 Intel® Core™ i7-6700 fanless embedded computer 2 PCIe Gen3 x8 + 2 PCI expansion slots Specifications
Expandable Fanless Embedded ComputersIntegrated Fanless Embedded Computers
Model NameMVP-6010/6020 SeriesMVP-6000 SeriesMVP-5000 Series
<img src="images/bd2f1cd97db7b0f32b49234c3e1779cb2e26a285e8e65362b1f9b35c073e6c81.jpg"/>
<img src="images/4da212f2f46b4c89de88c35227b9b6790abb423348d26e5e2999d82dc73c0646.jpg"/><img src="images/18c7ec13a0205b05ed0a6ee9107273de9859131dce5e8de81e7633457dc687d7.jpg"/><img src="images/f986b40a9586bd135b64217be1c4902dd74f2ff7a48652f8620f22a4ed6fec9f.jpg"/>
System
ProcessorIntel® CoreTMi7-6700TE/i5-6500TE/i3-6100TEIntel® CoreTM i7-6700 (65W)Intel® CoreTMi7-6700TE/i5-6500TE/i3-6100TE
ChipsetMVP-6010 Series: H110MVP-6020 Series: Q170H110
Video1 VGA + 2 DisplayPort + 1 DVI-D
Memory4 GB DDR4 2133 MHz (up to 32 GB)
I/O Interface
Expansion slots1 PCIe Gen3 x16 + 3 PCI expansion slots forMVP-6010 Series2 PCIe Gen3 x8 + 2 PCI expansion slots forMVP-6020 Series1 PCIe Gen3 x16 + 1 PCI-
Ethernet3 Intel® I211 AT GbE portsWOL and teaming functions are supported
Serial Ports4 COM by DB9 connector2 BIOS selectable RS-232/422/485 + 2x RS-232RS-485 with auto flow control
USB6 external USB ports (4 USB 3.0 +2 USB 2.0)1 internal USB 2.0 port
DIO8-CH DI and 8-CH DO
Mini PCIe1 internal mini PCIe socket
USIM1 USIM socket
Audio1 Mic-in and 1 Line out
Power Supply
DC InputBuilt-in 12-24 VDC wide-range DC input3P pluggable connector with latch (V-, GND, V+)
AC InputOptional 160 W external AC-DC adapter for AC input
Storage Device
SATA HDD1 SATA port for 2.5" HDD/SSD installation (up to 6 Gb/s)
CompactFlash Socket1 Type II CFast
Mechanical
Dimensions220 (W) x 210 (D) x 208.7 (H)mm(8.67" x 8.27" x 8.21")220 (W) x 210 (D) x170 (H) mm(8.67" x 8.27" x 6.69")220 (W) x 210 (D) x121(H) mm(8.67" x 8.27" x 4.76")
Weight4.7 kg (10.36 lbs)4.5 kg (9.92 lbs)3.6 kg (7.9 lb)
MountingWall mount kit
Environmental
Operating Temperature0 to 50°C0 to 40°C0 to 50°C
Storage Temperature-40 to 85°C (-40 to 185°F) (excl. HDD/SDD/CFast)
Humidity~95% @ 40°C (non-condensing)
VibrationOperating, 5 Grms, 5-500 Hz, 3 axes (w/ CFast or SSD)Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD)
ESDContact +/-4KV, Air +/-8KV
ShockOperating, 100 Grms, half sine 11ms duration (w/ CFast or SSD)
EMCCE & FCC Class A
SafetyUL/cUL, CB, CCC
# Product Illustration ![DVI-D DisplayPort x2 VGA Power Button Line-Out Mic-In USB 2.0 x2 USB 3.0 x4 Power Connector COM Port x4 8-CH DI Gbe Port x3 8-CH DO MVP-6010/6020 Series](.2021-gpu-solutions-brochure/247b68aea296197629a5b4f43b7663f4971a68f03617cbb396e07de007af230d.jpg) # Versatile Expansion The MVP-6010/6020 Series offer various of expansion slot options for flexible function enhancement and easier system integration. MVP-6010 Series (4 Slots) ![3 PCI PCIe x16](.2021-gpu-solutions-brochure/55b08ba4fdade662ff7c72d940df0ddbab1ab0400e87d3828e5962b50785a41e.jpg) MVP-6020 Series (4 Slots) ![2 PCI 2 PCIe x16](.2021-gpu-solutions-brochure/c0fe81493946dc11cdee57d808a26e7c5c2a284b70072313edd63ac094c85513.jpg) # MXC-6400 Series # 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer # Features ● 6th Gen Intel® Core™ i7/i5/i3 Processors and QM170 chipset ● 2 DDR4 SO-DIMM sockets support up to 32 GB memory ● 1 PCI and 2 PCIe Gen3 x8 (or 1 PCIe Gen3 x16) slots ● Support for 3 independent displays via 2 DisplayPort and 1 DVI-I ports with resolution up to 4K UHD ● 6 USB 3.0 ports and 1 internal USB 2.0 wafer connector ● 2 hot-swappable SATA III trays on the front panel and 2 internal SATA III ports with RAID 0/1/5/10 support ● Remote power on/off switch connector on the front panel ● Rugged construction provides fanless -20°C to 70°C operability (with industrial grade SSD/CFast) ● Built-in SEMA 3.0 # Introduction The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption. Features include 3 PCI/PCIe expansion slots allowing installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications, 2 internal mPCIe, and 1 USIM slot for 4G/3G communication. In addition, the MXC-6400 series offers independent digital display support from DisplayPort and DVI-I with resolution up to 4K UHD, as well as 6 USB 3.0 and 3 GbE LAN ports with Intel® iAMT 11.0 and teaming function. The 2 hot-swappable SATA III trays support 2.5" storage in the front panel with high speed SATA 6.0 Gb/s and 2 internal SATA III ports carry RAID 0, 1, 5, 10 support. 16 channel isolated DI/O with digital filter meets the needs of general purpose industrial automation. Features with the integrated 6th Generation Intel® Core™ i7/i5/i3 processor, 4x 2.5” SATA III (6Gb/s) ports, fanless rugged constrction, operating shock tolerance up to 50G, withstanding vibration up to 5Grms and extended operating temperatures of -20°C to 70°C (with industrial grade SSD/CFast), the MXC-6400 Series fully satisfies all the needs of Intelligent Transportation System as railway rolling stock, maritime, in-vehicle infotainment, and high-speed data processing and mission critical industrial automation. ![Exterior view of a black ADLINK network module with multiple ports and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/736fa9c7786aecd7db4958a684d63ead35563111f295864ea327d2601aaef572.jpg) # Software Support ● Win10/Win7/Embedded Standard 7 ● Linux® Ubuntu 16.04 LTS # Ordering Information ● MXC-6401D Intel® Core™ i7-6820EQ, 4GB DDR4 SODIMM ● MXC-6402D Intel® Core™ i5-6440EQ, 4GB DDR4 SODIMM . MXC-6403D Intel® Core™ i3-6100E, 4GB DDR4 SODIMM # Optional Accessories . MXC-6400 Optional Fan Module P/N: 91-95199-0010 . 8/16/32 GB DDR4 Option Upgrade to 1x 8GB/ 2x 8GB/ 2x 16GB DDR4 SODIMM . 2.5" SATA HDD/SSD & CFast Factory-installed and test . 160W AC-DC Adapter 160W industrial grade AC-DC adapter (-20 to 70°C. -4°F to 158°F) . Extended Temperature Option\* Optional screening service to extended operating temperature ( -20 to 70°C) . Kit for Internal USB Wafer Connector P/N: 91-95199-100E (including 2 sets) A cable for type A USB connector, bracket and screws for fixing the cable Specifications
Model NameMXC-6401DMXC-6402DMXC-6403D
System Core
ProcessorIntel® CoreTM i7-6820EQ4 Core/8 Threads, 2.8GHz, 8M Cache(Max Turbo Frequency 3.5 GHz)Intel® CoreTM i5-6440EQ4 Core/4 Threads, 2.7GHz, 6M Cache(Max Turbo Frequency 3.4 GHz)Intel® CoreTM i3-6100E2 Core/4 Threads, 2.7 GHz, 3M Cache
ChipsetIntel® QM170
Video2 DisplayPort (4K2K resolution)1 DVI-I
Memory2x DDR4 SODIMM up to 32GB
I/O Interface
Expansion slots1 PCI +2 PCIe Gen3 x8 or 1 PCI + 1 PCIe Gen3 x16 (auto switched)
Mini PCIe2x full size Mini PCIe
USIM1 USIM
Ethernet3x GbE (2 Intel I210IT + 1 I219 PHY)
Serial PortsCOM1/2: RS-232/422/485COM3/4: RS-232
USB6 USB 3.0 2 w/ 1600 mA, 4 w/ 900 mA1 internal USB 2.0 wafer connector
DIOIsolated 16x DI + 16x DO
AudioALC262, Line-out/ Mic-in
KB/MS1 PS/2 keyboard and 1 PS/2 mouse
Manageability
SecurityTPM1.2
WDTWatch Dog Timer supported
Storage Device
2.5" SATA2x removable drive bays2x internal(RAID 0/ 1/ 5/ 10)
CompactFlash1 type II CFast
Power Supply
DC InputBuilt-in 9-32 VDC wide-range DC input3 pluggable connectors with latch (GND, V-, V+)3-pin remote power on/off switch on the front
AC InputOptional 160 W external AC-DC adapter
Mechanical
Optional Fan ModuleOptional hot-pluggable fan module, smart fan control
Dimensions170 (W) x 225 (D) x 200 (H) mm
Weight4 kg (8,82 lbs)
MountingWall-mount kit
Environmental
Operating TemperatureStandard: 0°C to 50°C (32°F to 122°F) (w/HDD)Extended option*: -20°C to 70°C (-4°F to 158°F) (w/Ind. SSD or CFast)
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excl. HDD/SSD/CFast)
Humidityapprox. 95% @ 40°C (104°F) (non-condensing)
VibrationOperating, 5 Grms, 5-500 Hz, 3 axes (w/ CFast or SSD)Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD)
ESDContact +/-4 KV and Air +/-8 KV
ShockOperating, 50 G, half sine 11 ms duration (w/ CFast or SSD)
EMCCE and FCC Class A
SafetyUL/cUL,CB
\*Extended operating temperature is optional and requires use of an industrial solid-state drive storage device or CFast card. \*\*Other Linux Distribution support by request # MXC-6600 Series 9th Gen Intel® Xeon® , Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer # Features ● 9th Gen Intel® Xeon® , Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer ● Dual SODIMMs for up to 32GB DDR4 ● Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0 ● 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0 ● Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280 Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM ● Front accessible I/O and adaptive Function Module v.2 option 5x user defined LEDs ● Flexible modular expansion with 2 or 4 slots ![Front view of a black Matrix industrial device with multiple ports and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/40bd75baee47642ed610639b36b432c275f1239a805b8e0371cfecd12f0a04cd.jpg) # Software Support ● Win10 IoT Enterprise CBB 64bit Linux Ubuntu 18.04 Ordering Information
ModelCPUPCHSlot #
MXC-662X-2E/M4GIntel® Xeon® E-2276MECM2462
MXC-6621-2E/M4GIntel® CoreTM i7-9850HECM2462
MXC-6622-2E/M4GIntel® CoreTM i5-8400HCM2462
MXC-6623-2E/M4GIntel® CoreTM i3-9100HLCM2462
MXC-664X-3E/M8GIntel® Xeon® E-2276MECM2464
MXC-6641-3E/M8GIntel® CoreTM i7-9850HECM2464
MXC-6642-3E/M8GIntel® CoreTM i5-8400HCM2464
MXC-6643-3E/M8GIntel® CoreTM i3-9100HLCM2464
# Optional Accessories 2.5" SSD, HDD, M.2, CFast Storage MXC-6600 Fan Kit (P/N: 91-95267-000E) ● Additional 2x 2.5" SATA expansion kit ● Wireless Module Wi-Fi, BT, 3G, 4G LTE, LoRa wireless kit (w/ antenna) ● AC/DC Adapter 280W (P/N: 91-95263-0010) 220W (P/N: 31-62149-0010-A0) Specifications
Model NameMXC-660XMXC-6601MXC-6602MXC-6603
System Core
ProcessorIntel® Xeon®E-2276ME 45WIntel® CoreTMi7-9850HE 45WIntel® CoreTMi5-8400H 45WIntel® CoreTMi3-9100HL 25W
Core6644
Base Freq.2.8 GHz2.7 GHz2.5 GHz1.6 GHz
MAX Turbo Freq.4.5 GHz4.4 GHz4.2 GHz2.9 GHz
ChipsetMobile Intel® CM246
Memory4GB DDR4 2400MHz, dual SODIMMs, up to 32GBOptional: 8, 16, 32GB DDR4 ECC 2400MHz (Xeon® and i3 support ECC)
I/O Interfaces
Display2x DP++ and 1x HDMI
Ethernet2x Intel® GbE: 1x i211AT + 1x i219iAMT support
Serial PortsCOM1/2: RS-232/422/485, COM3/4/5/6: RS-232
USB2x USB 3.1 Gen 2 + 2x USB 3.1 Gen 1 + 4x USB 2.0, 1x internal USB 2.0 dongle
AudioLine-out, Mic-in (Optional: speaker-out)
Mini PCIe1x Full size (USB 2.0 + PCIe)
M.21x socket 2, key B+M or B, 2280/3042: USB 3.1 Gen 1, SATA 6 Gb/s and PCIe x2
USIM2 (1 for Mini PCIe and 1 for M.2)
DI/O8-ch DI and 8-ch DO
I2C2 (3.3V & 5V)
TPM 2.0Supported
Expansion SlotsMXC-6620 series : PCIe x16 + PCIe x4 (Total up to 150W)MXC-6640 series : PCIe x16 + 2 PCIe x4 + PCI (Total up to 150W with 12V in; total up to 250W with 24V in)
Storage Devices
2.5" SATA2x internal (supports RAID 0, 1, 5, 10)Optional: additional 2x internal
CFast1x Type II
Mechanical
DimensionsMXC-6620 series: 165 (W) x 240 (D) x 210 (H) mm (6.5" x 9.45" x 8.27")MXC-6640 series: 206 (W) x 240 (D) x 210 (H) mm (8.11" x 9.45" x 8.27")
WeightMXC-6620 series : 4.6 kg (10.2 lbs)MXC-6640 series : 4.9 kg (10.8 lbs)
MountingWall mount
Power Supply
DC Input9 to 32V (± 10% tolerance)
AC InputOptional: 220W or 280W AC/DC adapter
Environmental
Operating TemperatureStandard: 0°C to 50°C w/ airflowExtended temperature (w/ ind. storage, airflow)-20°C to 70°C (-4°F to 158°F) (only support single SODIMM)-20°C to 60°C (-4°F to 140°F) (w/ dual SODIMMs)
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excluding storage)
Humidity~95% @ 40°C (104°F) (non-condensing)
VibrationOperating: 5 Grms, 5-500 Hz, 3 axes (w/ SSD/CFast)Operating: 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD)
ShockOperating: 100 Grms, half sine 11ms duration (w/ SSD/CFast)
ESDContact ±8KV, Air ±15KV
EMCEN61000-6-4/-2, CE & FCC Class B with validated AC/DC adapter
SafetyUL/cUL, CB
# ADi-SA1X-KB/SL Ultimate Performance Gaming Platform based on 7th Gen Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD # Features ● Ultimate " all-in-one" gaming platform ● The best-in-class graphics capabilities in games with high levels of detail ● Up to 11x independent HD monitors supporting 4K UHD ● Advanced security feature set and software solutions . Intelligent middleware shortens development time # Introduction ADLINK‘s ADi-SA1X-KB/SL all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 7th Generation Intel® Core™ processors, the ADi-SA1X-KB/SL provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® HD Graphics 630 together with multi-display support for up to eleven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA1X-KB/SL fully satisfies the needs of your gaming application. The ADi-SA1X-KB/SLL is a true application-ready gaming platform providing OEMs with a highly flexible and reliable all-in-one system that offers unparalleled portfolio of services that help developers save time and remain in compliance. The platform is designed to meet the GLI-11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements. The comprehensive middleware as well as the security and extensive I/O solutions enable developers to easily bridge applications with peripheral devices, sensors, and surrounding solutions up to central monitoring and control systems. # Ultimate Performance Processing and Graphics The ADi-SA1X-KB/SL supports Intel® Core™ i7/i5 processors clocked at up to 4.2 GHz with boost With integrated Intel® HD Graphics 630 and optionally with PCI Express 3.0 x16 or 2x PCI Express 3.0 x8 discrete graphics providing compelling processing and graphics performance. # Multi-Display Graphics Capabilities The ADi-SA1X-KB/SL provides support for up to 4K resolutions via three standard video outputs based on the Intel® Q170 chipset. It is capable of supporting dedicated graphics cards for up to eleven independent monitors that conform to the latest DisplayPort 1.2 standard. # Advanced Security and NVRAM PCI Express for Gaming Designed to Meet GLI-11 ADLINK’s ADi-BSEC is a high-speed PCI Express card with up to 16 MB NVRAM & SRAM. It offers a crypto and authentication security chip with power-off monitoring and event logging designed to meet the GLI-11 Perfect for multi-player table games! ![The image displays the text 'GAMING STANDARDS' in black, uppercase letters at the top. Below the text is a graphic featuring abstract, golden-yellow shapes on a white background.](.2021-gpu-solutions-brochure/171b927de6b8b58221d75162a41cfd4ef8b936d071f41d2e940d3724d40a2619.jpg) ![The image displays a logo featuring the acronym 'AGEM' in large, white, serif capital letters within a dark red rectangular field. Below this, the text 'Association of Gaming Equipment Manufacturers' appears in black serif font.](.2021-gpu-solutions-brochure/77602157fa739a380e63f44c7ae7bdd312d3d30eb0c1bd87134ae2fc8c81350e.jpg) ![Interior view of a black server rack with multiple ports and connectors, showing internal components and ventilation slots (no visible text or labels)](.2021-gpu-solutions-brochure/566fb0866341da7aad1a81c468e30e5a668cd2992c414b1bd00b928eeadb9858.jpg) (Gaming Laboratories International) certification requirements. Further features are also available, such as TPM1.2 trusted platform module, Bit Lock, Software Chain of Trust (sCOT), BIOS customizations, Intrusion Detection, Security Dongle to provide the comprehensive protection of the assets. # ADLINK Comprehensive Middleware Solutions ADLINK’s ADiAPI (intelligent Application Programming Interface) and SEMA® (Smart System Management Agent) provide advanced integration of hardware/software monitoring and controlling allowing simplified and unified application development without dependencies on the peripheral devices. # Product Illustration ![Back view of a computer interface with ports, connectors, and memory drives (no visible text or labels)](.2021-gpu-solutions-brochure/59afe8917ea5b087cdf628eb3961316201712262dca2e909cecba863526e8873.jpg) ADi-SA1X-KB-CAAS ADi-SA1X-SL-CAAS ![Back view of a computer interface showing ports, connectors, and memory drives (no readable text or symbols)](.2021-gpu-solutions-brochure/48955c56507a1f3d04ad2d41236e3ba1e67e95842e89f038a811e6b944ea4c85.jpg) ADi-SA1X-KB-DAAS ADi-SA1X-SL-DAAS Specifications
Model NameADI-SA1X-KBADI-SA1X-SL
Core System
ProcessorSocket LGA1151 supporting 7th Generation Intel® CoreTM Processors from 35W up to 65WSocket LGA1151 supporting 6th Generation Intel® CoreTM Processors from 35W up to 65W
ChipsetIntel® Q170 or H110
BIOSAMI uEFI on 16 MB SPI BIOS flash with Intel® AMT 11.0 support via onboard BIOS socket and SPI header
Expansion Slot1 PCIe x16 slot
1 PCIe x1 slot
1 full-size Mini PCIe slot supporting PCIe+USB or mSATA (option for ADi-SA1X-SL)
1 half-size Mini PCIe slot supporting PCIe and USB
MemoryDual-channel, non-ECC 2133/2400 MHz DDR4 memory up to 32 GB in dual vertical SODIMM sockets
GraphicsIntel® HD Graphics 630Intel® HD Graphics 530
NVIDIA® QUADRO® P620 embedded with extended availabilityNVIDIA® QUADRO® P1000 embedded with extended availabilityNVIDIA® QUADRO® P2000 embeddedNVIDIA® QUADRO® P4000 embeddedOther options on request
Storage2x HDD/SSD (2.5")
2x CFast (via 2.5" adapter option)
2x SATADOM *on request
SecurityKensington Lock, Intrusion switch for ADi-BSEC power-off, Security Dongle, Eylet for seal, TPM, Bit Lock, Software Chain of Trust, BIOS Customization, ADi-BSEC security card (option), Cable and connector covers (option)
I/O interface
Serial ATA3x Serial ATA 6Gbps ports
Ethernet2x GbE ports (10/100/1000 GbE connection)
Serial Ports1x RS-232/422/485 via onboard header
3x RS-232 via onboard header
Audio InterfaceCodec Realtek ALC886
7.1 channel audio via 5 jacks and S/PDIF output on rear I/O
7.1 channel audio signals and S/PDIF output on internal header
USB4x USB 3.0 and 4x USB 2.0 on rear I/O
2x USB 3.0 on board header (H110:USB2.0)
1x USB 2.0 on vertical connector with keep out area for dongle
DisplayPortQ170: 3x outputs with resolution up to 4096 x 2160 pixels
H110: 2x outputs with resolution up to 4096 x 2160 pixels
Up to two additional PEG cards with up to 8x additional outputs (option, only for Q170)
Wi-Fi802.11 a/b/g/n (option)
Power supply (option)
ADI-SPSU-500AC (500W), 24 pin ATX power adaptor
Mechanical
Dimensions330 mm (W) x 330 mm (D) x 105 mm (H; w/o brackets) (13 in x 13 in x 4.1 in)ADI-SPSU option: +43 mm (w); ADi-BACC option: +20 mm (D)
Environmental & Safety
Operating Temperature0°C to 50°C (32°F to 122°F)
Storage Temperature-20°C to 70°C (-4°F to 158°F) (excl. HDD/SSD/CFast)
Humidity~85% @ 50°C (144°F) (non-condensing)
VibrationOperating, 1 Grms, 5-500 Hz, 3 axes (w/ CFast or SSD)
Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ 2.5" HDD)
Operating, 20 G, half sine 11 ms duration (w/ CFast or SSD)
ShockOperating, 20 G, half sine 11 ms duration (w/ CFast or SSD)
EMCCE and FCC Class A
ESDContact +/-4 KV and Air +/-8 KV
SafetyUL/cUL, CB, KCC
Operating Systems
Windows® 10 IoTWindows® 7 32/64-bit, Linux 32/64-bit (option)
Gaming-Specific Features and Security (Options)
Up to 2x 8MB dual independent (battery-buffered) high-speed NVRAM (fast PCIe x1 interface)
Crypto & Authentication Security Chip (SHA-256, RNG, UID, EEPROM, OTP)
Intrusion detection and event logging (battery-buffered )
EEPROM support (various; SMD down and DIP socket jurisdiction EEPROM)
1-Wire bus support (multiple UID S/Ns silicon numbers and EEPROM)
4x additional serial interfaces (RS-232, RS-232 TTL, ccTalk)
ccTalk, ID003, EBDS, SSP, TCL and MDB
32x digital inputs / 32x digital outputs
24 x open drain /40V LED drivers
3x high-current outputs
EPFail support (early power fail detection input)
User LEDs and function switches
DIP switch option
8x independent current-sensed hardmeter support
SEC soft meter suport (SPI)
1-Wire support (UID & EEPROM)
Key lock, eyelet for sealing, TPM, dedicated security ICs, secure key storage
Fully customizable secure BIOS
# Ordering Information ● ADi-SA1X-KB-CAAS Intel® Core™ i5-7500T, 8GB DDR4, 16GB Cfast Card, ADi-BSEC (4MB), ADi-BACC-G2F, ADi-BAMP ● ADi-SA1X-KB-DAAS Intel® Core™ i7-7700, 32GB DDR4, ADi-SPSU-500AC (500W PSU), ADi-BSEC (8MB), ADi-BACC-G2FA, ADi-BAMP, Windows 10 IoT Enterpris ● ADi-SA1X-SL (Call for availability ) \*Other configurations on request # Options . ADi-BSEC Intelligent Infotainment Security and NVRAM PCI Express Card ADi-BAMP Audio Amplifier, 2x 12-15W ● ADi-BACC Gaming and Retail Extension I/O Board . ADiAPI Intelligent middleware used for controlling peripheral devices ADiDLL Middleware used for controlling optional add-on devices ● SAS 6.02/6.03 engine # Optional Accessories . ADi-BSEC cable ● Box PC cable kit ADi-BACC cable kit # ADi-SA2X-KB/SL High-Performance Gaming Platform based on 7th Gen Intel® Core™ Processors Supports up to Seven Independent Displays Including 4K UHD # Features ● High performance "all-in-one" gaming platform ● Highly scalable platform meets individual performance, graphics and power needs ● Compact dimension yet with intensive expansion for vertical add-ons ● Advanced security feature set and software solutions Intelligent middleware shortens development time # Introduction ADLINK‘s ADi-SA2X-KB/SL all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 7th Generation Intel® Core™ processors, the ADi-SA2X-KB/SL provides compelling graphics performance from a PCI Express 3.0 x16 discrete graphics card and/or an embedded Intel® HD Graphics 630 together with multi-display support for up to seven independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-KB/SL fully satisfies the needs of your gaming application. The ADi-SA2X-KB/SL is a true application-ready gaming platform providing OEMs with a highly flexible and reliable all-in-one system that offers unparalleled portfolio of services that help developers save time and remain in compliance. The platform is designed to meet the GLI-11 (Gaming Laboratories International) certification and all major global gaming market compliance requirements. The comprehensive middleware as well as the security and extensive I/O solutions enable developers to easily bridge applications with peripheral devices, sensors, and surrounding solutions up to central monitoring and control systems. # High Scalability and Ideal Range of Performance Class The ADi-SA2X-KB/SL is designed with highly scalable and reliable hardware that can be flexibly scaled from entry level up to the highest performance class, with tailored configuration of CPU and GPU selections. The platform also provides compact dimensions for developers using a more compact cabinet footprint and offers extensive expansion capabilities for the needs of vertical add-ons. # Multi-Display Graphics Capabilities The ADi-SA2X-KB/SL provides support for up to 4K resolutions via three standard video outputs based on the Intel® Q170 chipset. It is capable of supporting dedicated graphics cards for up to seven independent monitors that conform to the latest DisplayPort 1.2 standard. # Advanced Security and NVRAM PCI Express for Gaming Designed to Meet GLI-11 ADLINK’s ADi-BSEC is a high-speed PCI Express card with up to 16 MB NVRAM & SRAM. It offers a crypto and authentication security chip with power-off monitoring and event logging designed to meet the GLI-11 (Gaming Laboratories International) certification requirements. Further features are also available, such as TPM1.2 trusted platform module, Bit ![The image displays the logo for the 'GAMING STANDARDS ASSOCIATION.' At the top, the text 'GAMING STANDARDS' appears in black, uppercase sans-serif font, followed by a registered trademark symbol (®). Below this text is a yellow square containing abstract white shapes. At the very bottom, the word 'ASSOCIATION' is written in a faint, grey, uppercase font with wide spacing between the letters.](.2021-gpu-solutions-brochure/58641b4af7d7b0a87d78091ece8f6d833015f73249035114b4f969da3ba148ce.jpg) ![The image features a logo consisting of the acronym 'AGEM' in large, white serif capital letters centered within a rectangular box with a reddish-brown background. Directly below the box, the text 'Association of Gaming Equipment Manufacturers' appears in smaller black serif font.](.2021-gpu-solutions-brochure/ec6f756b8fe3e387210d30f87d87ede453c1c698b9b400e9888569b0f72e9224.jpg) ![Front view of a black industrial rack-mounted server with multiple ports and indicator lights (no visible text or labels)](.2021-gpu-solutions-brochure/f48c378dffe87bb402c8ddacc03349751b937c5faeb569172e153faadfba6dfa.jpg) Lock, Software Chain of Trust (sCOT), BIOS customizations, Intrusion Detection, Security Dongle to provide the comprehensive protection of the assets. # ADLINK Comprehensive Middleware Solutions ADLINK’s ADiAPI (intelligent Application Programming Interface) and SEMA® (Smart System Management Agent) provide advanced integration of hardware/software monitoring and controlling allowing simplified and unified application development without dependencies on the peripheral devices. # Ordering Information ● ADi-SA2X-SL-BAAS Intel® Core™ i5-6500TE, Intel® Q170, TPM, SEMA, ADi-BSEC card(4MB SRAM), ADi-BACC-G2F, ADi-BAMP Card, 8G DDR4, 128GB SSD, with +12V/120W ATX power adaptor ● ADi-SA2X-KB-BAAS (Call for availability) \*Other configurations on request # Options ● ADi-BSEC Intelligent Infotainment Security and NVRAM PCI Express Card . ADi-BAMP Audio Amplifier, 2x 12-15W . ADi-BACC Gaming and Retail Extension I/O Board . ADiAPI Intelligent middleware used for controlling peripheral devices . ADiDLL Middleware used for controlling optional add-on devices . SAS 6.02/6.03 engine # Optional Accessories . ADi-BSEC cable Box PC cable kit ● ADi-BACC Cable kit # Product Illustration ![Back view of a black industrial electronic device with ports and connectors (no visible text or labels)](.2021-gpu-solutions-brochure/b7fcdf96c7363cf9eb36c4d0c5bb567b95a2e2ffdd98c5490bc97180ded93c95.jpg) ADi-SA2X-KB-BAAS ADi-SA2X-SL-BAAS ![Back view of a black server rack with ports, switches, and ventilation grilles (no visible text or labels)](.2021-gpu-solutions-brochure/93b9b6502cbe9db6ed6035084a2de9977b6dbc37b17ba4ee47e55bfe81f1be25.jpg) ADi-SA2X-KB-DAAS ADi-SA2X-SL-DAAS ![Back view of a black industrial rack-mounted server unit with ports and ventilation grilles (no visible text or labels)](.2021-gpu-solutions-brochure/5ce0d0e66c3e9c3c758794bcdeb39035e979a79cb328eeb5b48d3116493cf138.jpg) ADi-SA2X-KB-AAAS ADi-SA2X-SL-AAAS Specifications
Model NameADi-SA2X-KBADi-SA2X-SL
Core System
ProcessorSocket LGA1151 supporting 7th Generation Intel® CoreTMProcessors from 35W up to 65WSocket LGA1151 supporting 6th Generation Intel® CoreTMProcessors from 35W up to 65W
ChipsetIntel® Q170 or H110
BIOSAMI uEFI on 16 MB SPI BIOS flash with Intel® AMT 11.0 support via onboard BIOS socket and SPI header
Expansion Slot1 PCIe x16 slot
1 PCIe x1 slot
1 full-size Mini PCIe slot supporting PCIe+USB or mSATA (by option)
1 half-size Mini PCIe slot supporting PCIe and USB
MemoryDual-channel, non-ECC 1333/1600/2133 MHz DDR4/DDR3L memory up to 32 GB in dual vertical SODIMM sockets
GraphicsIntel® HD Graphics 630Intel® HD Graphics 530
NVIDIA® QUADRO® P620 embedded with extended availabilityNVIDIA® QUADRO® P1000 embedded with extended availabilityOther options on request
Storage2x HDD/SSD (2.5")
2x CFast (via 2.5" adapter option)
2x SATADOM *on request
SecurityKensington Lock, Intrusion switch for ADi-BSEC power-off, Security Dongle, Eylet for seal, TPM, Bit Lock, Software Chain of Trust, BIOS Customization, ADi-BSEC security card (option), Cable and connector covers (option)
I/O interface
Serial ATA3x Serial ATA 6Gbps ports
Ethernet2x GbE ports (10/100/1000 GbE connection)
Serial Ports1x RS-232/422/485 via onboard header
3x RS-232 via onboard header
Audio InterfaceCodec Realtek ALC886
7.1 channel audio via 5 jacks and S/PDIF output on rear I/O
7.1 channel audio signals and S/PDIF output on internal header
USB4x USB 3.0 and 4x USB 2.0 on rear I/O
2x USB 3.0 on board header (H110:USB2.0)
1x USB 2.0 on vertical connector with keep out area for dongle
DisplayPortQ170: 3x outputs with resolution up to 4096 x 2160 pixels
H110: 2x outputs with resolution up to 4096 x 2160 pixels
4x PEG card outputs (option)
Wi-Fi802.11 a/b/g/n (option)
Power supply (option)
ADI-SPSU (100-240VAC) or 3pin DC in connector (+9-36VDC) or 14 pin ATX power adaptor (+12V/120W)
Mechanical
Dimensions265 mm (W) x 225 mm (D) x 87 mm (H; w/o brackets) (10.4 in x 8.9 in x 3.4 in)ADI-SPSU option: +43 mm (w); ADi-BACC option: +20 mm (D)
Environmental & Safety
Operating Temperature0°C to 50°C (32°F to 122°F)
Storage Temperature-20°C to 70°C (-4°F to 158°F) (excl. HDD/SSD/CFast)
Humidity~85% @ 50°C (144°F) (non-condensing)
VibrationOperating, 1 Grms, 5-500 Hz, 3 axes (w/ CFast or SSD)
Operating, 0.5 Grms, 5-500 Hz, 3 axes (w/ 2.5" HDD)
ShockOperating, 20 G, half sine 11 ms duration (w/ CFast or SSD)
EMCCE and FCC Class A
ESDContact +/-4 KV and Air +/-8 KV
SafetyUL/cUL, CB, KCC
Operating Systems
Windows® 10 IoTWindows® 7 32/64-bit, Linux 32/64-bit
Gaming-Specific Features and Security (Options)
Up to 2x 8MB dual independent (battery-buffered) high-speed NVRAM (fast PCIe x1 interface)
Crypto & Authentication Security Chip (SHA-256, RNG, UID, EEPROM, OTP)
Intrusion detection and event logging (battery-buffered )
EEPROM support (various; SMD down and DIP socket jurisdiction EEPROM)
1-Wire bus support (multiple UID S/Ns silicon numbers and EEPROM)
4x additional serial interfaces (RS-232, RS-232 TTL, ccTalk)
ccTalk, ID003, EBDS, SSP, TCL and MDB
32x digital inputs / 32x digital outputs
24 x open drain /40V LED drivers
3x high-current outputs
EPFail support (early power fail detection input)
User LEDs and function switches
DIP switch option
8x independent current-sensed hardmeter support
SEC soft meter suport (SPI)
1-Wire support (UID & EEPROM)
Key lock, eyelet for sealing, TPM, dedicated security ICs, secure key storage
Fully customizable secure BIOS
# IMB-M43 # Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor # Features 6th/7th Gen Intel® Core™ i7/i5/i3 processors and Q170 chipset ● Dual-channel DDR4 2133/2400 MHz memory up to 64 GB Intel® PCIe 3.0 slot bifurcation supports up to 5x PCIe 3.0 expansion slots ● Rugged I/O design to enhance I/O port compatibility and reliability Unique power design to ensure stable USB power of 5V ±5% ● IEC 61000-4-2\~6 (Performance Criterion A), CE/FCC class B certified ![Green computer motherboard with various slots, CPU socket, and RAM slots (no visible text or labels)](.2021-gpu-solutions-brochure/027a79d43e884958e447e8df70910042a8fb138ba2eb5949d8cbd6ccce4da419.jpg) # Product Illustration ![Multiple PCIe 3.0 support Intel® Q170 Express Chipset Dual Channel DDR4 DIMMs LGA1151 socket for 6th/7th Gen Intel® Core™ Processor](.2021-gpu-solutions-brochure/0756cce0eba4201d7d6e871acb505d226c8368506a2bf3bfda17b84462f5449f.jpg) ![PS/2 combo VGA COM1 LAN1 LAN2 Line In Line out 2x DP 6x USB3.0 COM2 Mic In](.2021-gpu-solutions-brochure/aaa436c9d7688e65d7b8a41b02417c0d37b7b74ec2e57c29b0791f79710f80ea.jpg) # Ordering Information ● IMB-M43 ATX 6th/7th Intel® Core™ i7/i5/i3 industrial motherboard Note: CPU, Memory module and Cooler kit are not included # Packing Lists ● IMB-M43 . IMB-M43 I/O shield # Optional Accessories . USB 3.0 Cable 2-port USB 3.0 port cable with bracket . USB 2.0 Cable 4-port USB 2.0 port cable with bracket ● LPT Cable 1-port LPT port cable with bracket ● COM Cable 2-port COM port cable with bracket . 2U CPU Cooler LGA1156 2U Thermal Module Specifications
Processor SystemWatchdog Timersoftware programmable and can be generate system reset
CPUIntel® CoreTM i7-6700, 3.4 GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)Hardware MonitorCPU voltage
+3.3 V voltage
Intel® CoreTM i7-6700TE, 2.4 GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)+5 V voltage
+12 V voltage
Intel® CoreTM i5-6500, 3.2 GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)CPU temperature
System temperature
CPU fan speed
Intel® CoreTM i5-6500TE, 2.3 GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)System fan speed
Intel® CoreTM i3-6100, 3.7 GHz, 3M Cache, 14nm, 51W TDP, LGA1151 (2C/4T)Operating SystemsMicrosoft® Windows® 7 32/64-bit(only for 6th Gen Intel® CoreTM processors)
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
Ubuntu 15.10 32/64-bit
Intel® CoreTM i3-6100TE, 2.7 GHz, 4M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)I/O Interfaces
Serial ATA6x SATA 6.0 Gb/s connectors
Intel® Pentium® G4400, 3.3GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/2T)Software RAID support 0/1/5/10
USB6x USB 3.0 connectors (rear)
2x USB 3.0 pin headers
Intel® Pentium® G4400TE, 2.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)4x USB 2.0 pin headers
2x USB 2.0 (vertical type A connector)
Intel® Celeron® G3900, 2.8GHz, 2M Cache, 14nm, 51W TDP, LGA1151 (2C/2T)Serial Ports2x RS-232/422/485 with auto flow control connector (rear)
4x RS-232 pin headers
Intel® Celeron® G3900TE, 2.3GHz, 2M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)Expansion slots
Intel® CoreTM i7-7700, 3.6GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)If PEG3 is occupied, PEG1 is PCIex8 Gen3, PEG2 is PCIex4 Gen3, and PEG3 is PCIex4 Gen3If PEG3 is not occupied and PEG2 is occupied, PEG1 is PCIex8 Gen3, PEG2 is PCIex8 Gen3, and PEG3 is no signalIf PEG3 is not occupied and PEG2 is not occupied, PEG1 is PCIex16 Gen3,PEG2 and PEG3 is no signalPCIe1: PCIe x4 Gen3, PCIe2: PCIe x4 Gen3, PCI1: PCI 2.2, PCI2: PCI 2.2
Intel® CoreTM i7-7700T, 2.9GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
Intel® CoreTM i5-7500, 3.4GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
Intel® CoreTM i5-7500T, 2.7GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
Intel® CoreTM i3-7101E, 3.9GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/4T)PEG1: PCIex16 slot, PCI1: PCI slot, PEG2: PCIex16 slot,PEG3: PCIex4 slot,PCIe1: PCIex4 slot,PCIe2: PCIex4 slot,PCI2: PCI slot
Intel® CoreTM i3-7101TE, 3.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
ChipsetIntel® Q170 Express ChipsetParallel Port1x LPT pin header
PS2 Combo Port1x PS/2 keyboard & Mouse connector (rear)
MemoryFour 288 PIN DDR4 Sockets (vertical type)Dual channel DDR4 2133/2400 MHz, up to 64 GBDIO1x 10-pin/2.54mm GPIO pin header: 4 in and 4 out, one ground pin and one power pin (5V/12V/no power, jumper selected)
BIOSAMI® UEFI BIOS, 128 Mb SPI Flash Memory
\*Extending operating temperature is optional and requires use of an industrial solid-state drive storage device or CFast card.. \*\*Other Linux Distribution support by request Specifications
Audio
Audio CodecRealtek® ALC262-VC2-GR
Interface1x Mic-in, 1x Line-out and 1x Line-in connector (rear)
Graphics
Graphics EngineIntegrated Intel® HD Graphics series (based on CPU)
VGA1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz
DisplayPort 1.22x DP connector (rear), resolution up to 4096 x 2304 @ 60 Hz
Ethernet
ControllerLAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2: Intel® I211-AT via RJ45 connector (rear)
Intel® AMTLAN1 Support
Wake On LANLAN1 and LAN2 support
Mechanical and Environmental
Form FactorATX
Dimension305 mm x 244 mm (W x L)
Operating Temperature0 °C to 60 °C
Storage Temperature-40 °C to 85 °C
Relative Humidity40°C @ 95% RHNon-condensing
CertificationCE & FCC Class B
\*Extending operating temperature is optional and requires use of an industrial solid-state drive storage device or CFast card.. \*\*Other Linux Distribution support by request # IMB-M43H # Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor # Features ● 6th Gen Intel® Core™ i7/i5/i3 processors support, compatible with Windows® 7 7th Gen Intel® Core™ i7/i5/i3 processors support ● Up to 32 GB Dual-channel DDR4 2133/2400 MHz Unique power design to ensure stable USB power of 5V ±5% ● IEC 61000-4-2\~6 (Performance Criterion A), CE/FCC class B certified ![Green computer motherboard with various slots, RAM slots, and CPU socket (no visible text or labels)](.2021-gpu-solutions-brochure/0a34a5661350a3afeae13ab878ada7621fc83efe925acc5fcf8f9f9c018770c0.jpg) Product Illustration ![Dual Channel DDR4 DIMMs 1x PCIe x16 Gen3 Intel® H110 Express Chipset LGA1151 socket for 6th/7th Gen Intel® Core™ Processor 2x Vertical USB 2.0 1xPClex4 Gen2 5x PCI 2.2](.2021-gpu-solutions-brochure/1ed02e266117acb64673f0a0d7c40c4318cee448909066d84d61c167c02a3e5f.jpg) ![KB/MS Combo VGA COM Line Out Line In HDMI COM LAN + USB 3.0 Mic In USB 2.0](.2021-gpu-solutions-brochure/bdbe147ba9b62c83dd905d55f3b5fdbc3b228961475c6ab58ab2e3ae42b50714.jpg) # Ordering Information ● IMB-M43H ATX Intel® Core™ i7/i5/i3 industrial motherboard Note: CPU, Memory module and Cooler kit are not included # Packing Lists ● IMB-M43H . IMB-M43H I/O shield # Optional Accessories . USB 2.0 Cable 2-port USB 2.0 port cable with bracket . LPT Cable 1-port LPT port cable with bracket COM Cable 2-port COM port cable with bracket ● 2U CPU Cooler LGA1156 2U Thermal Module Specifications
Processor System
CPUIntel® CoreTM i7-6700, 3.4 GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
Intel® CoreTM i7-6700TE, 2.4 GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
Intel® CoreTM i5-6500, 3.2 GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
Intel® CoreTM i5-6500TE, 2.3 GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
Intel® CoreTM i3-6100, 3.7 GHz, 3M Cache, 14nm, 51W TDP, LGA1151 (2C/4T)
Intel® CoreTM i3-6100TE, 2.7 GHz, 4M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
Intel® Pentium® G4400, 3.3GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/2T)
Intel® Pentium® G4400TE, 2.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)
Intel® Celeron® G3900, 2.8GHz, 2M Cache, 14nm, 51W TDP, LGA1151 (2C/2T)
Intel® Celeron® G3900TE, 2.3GHz, 2M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)
Intel® CoreTM i7-7700, 3.6GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
Intel® CoreTM i7-7700T, 2.9GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
Intel® CoreTM i5-7500, 3.4GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
Intel® CoreTM i5-7500T, 2.7GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
Intel® CoreTM i3-7101E, 3.9GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/4T)
Intel® CoreTM i3-7101TE, 3.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
ChipsetIntel® H110 Express Chipset
MemoryTwo 288 PIN DDR4 Sockets (vertical type)Dual channel DDR4 2133/2400 MHz, up to 32 GB
BIOSAMI® UEFI BIOS, 128 Mb SPI Flash Memory
Watchdog Timersoftware programmable and can be generate system reset
Hardware MonitorCPU voltage+3.3 V voltage+5 V voltage+12 V voltageCPU temperatureSystem temperatureCPU fan speedSystem fan speed
Operating SystemsMicrosoft® Windows® 7 32/64-bit (only for 6th Gen Intel® CoreTM processors)
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
OpenSUSE Leap 42.1 64-bit
Fedora 25 64-bit
Ubuntu 16.04 LTS 64 bit
I/O Interfaces
Serial ATA4x SATA 6.0 Gb/s connectors
USB4x USB 3.0 connectors (rear)
2x USB 2.0 connectors (rear)
2x USB 2.0 pin headers
2x USB 2.0 (vertical type A connector)
Serial Ports2x RS-232/422/485 with auto flow control connector (rear)
4x RS-232 pin headers
Expansion slots1xPCIe x16 Gen31xPCIe x4 Gen25x PCI 2.2
Parallel Port1x LPT pin header
PS2 Combo Port1x PS/2 keyboard & Mouse connector (rear)
DIO2x 20-pin/2.0mm GPIO pin header: 16 in and 16 out, one ground pin and one power pin (5V/12V/no power, jumper selected)
Audio
Audio CodecRealtek® ALC892-CG
Interface1x Mic-in, 1x Line-out and 1x Line-in connector (rear)
Graphics
Graphics EngineIntegrated Intel® HD Graphics series (based on CPU)
VGA1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz
HDMI 1.41x HDMI connector (rear) resolution up to 4096 x 2160 @ 24 Hz
Ethernet
ControllerLAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2: Intel® I211-AT via RJ45 connector (rear)
Wake On LANLAN1 and LAN2 support
Mechanical and Environmental
Form FactorATX
Dimension305 mm x 244 mm (W x L)
Operating Temperature0 °C to 60 °C
Storage Temperature-40 °C to 85 °C
Relative Humidity40°C @ 95% RH Non-condensing
Certification (EMC)CE & FCC Class B
# IMB-M43H # Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor # Features ● 6th Gen Intel® Core™ i7/i5/i3 processors support, compatible with Windows® 7 7th Gen Intel® Core™ i7/i5/i3 processors support ● Up to 32 GB Dual-channel DDR4 2133/2400 MHz Unique power design to ensure stable USB power of 5V ±5% ● IEC 61000-4-2\~6 (Performance Criterion A), CE/FCC class B certified ![Green computer motherboard with various slots, RAM slots, and CPU socket (no visible text or labels)](.2021-gpu-solutions-brochure/8812fd1045428f769577a94fb3315b6183646f3ffa1a1f722e34abdb5684ae6a.jpg) Product Illustration ![Dual Channel DDR4 DIMMs 1x PCIe x16 Gen3 Intel® H110 Express Chipset LGA1151 socket for 6th/7th Gen Intel® Core™ Processor 2x Vertical USB 2.0 1xPClex4 Gen2 5x PCI 2.2](.2021-gpu-solutions-brochure/899c212e8a1fe6d3abaffaf29eb39bb1c5e373ddaaf8941b82f5df5c2522fbb0.jpg) ![KB/MS Combo VGA COM Line Out Line In HDMI COM LAN + USB 3.0 Mic In USB 2.0](.2021-gpu-solutions-brochure/8e12ab37a07f8f0e9a05adc21990997e2baa740c5f8e0f00a300daa8cc34f0a1.jpg) # Ordering Information ● IMB-M43H ATX Intel® Core™ i7/i5/i3 industrial motherboard Note: CPU, Memory module and Cooler kit are not included # Packing Lists ● IMB-M43H . IMB-M43H I/O shield # Optional Accessories . USB 2.0 Cable 2-port USB 2.0 port cable with bracket . LPT Cable 1-port LPT port cable with bracket COM Cable 2-port COM port cable with bracket ● 2U CPU Cooler LGA1156 2U Thermal Module Specifications
Processor System
CPUIntel® CoreTM i7-6700, 3.4 GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
Intel® CoreTM i7-6700TE, 2.4 GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
Intel® CoreTM i5-6500, 3.2 GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
Intel® CoreTM i5-6500TE, 2.3 GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
Intel® CoreTM i3-6100, 3.7 GHz, 3M Cache, 14nm, 51W TDP, LGA1151 (2C/4T)
Intel® CoreTM i3-6100TE, 2.7 GHz, 4M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
Intel® Pentium® G4400, 3.3GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/2T)
Intel® Pentium® G4400TE, 2.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)
Intel® Celeron® G3900, 2.8GHz, 2M Cache, 14nm, 51W TDP, LGA1151 (2C/2T)
Intel® Celeron® G3900TE, 2.3GHz, 2M Cache, 14nm, 35W TDP, LGA1151 (2C/2T)
Intel® CoreTM i7-7700, 3.6GHz, 8M Cache, 14nm, 65W TDP, LGA1151 (4C/8T)
Intel® CoreTM i7-7700T, 2.9GHz 8M Cache, 14nm, 35W TDP, LGA1151 (4C/8T)
Intel® CoreTM i5-7500, 3.4GHz, 6M Cache, 14nm, 65W TDP, LGA1151 (4C/4T)
Intel® CoreTM i5-7500T, 2.7GHz, 6M Cache, 14nm, 35W TDP, LGA1151 (4C/4T)
Intel® CoreTM i3-7101E, 3.9GHz, 3M Cache, 14nm, 54W TDP, LGA1151 (2C/4T)
Intel® CoreTM i3-7101TE, 3.4GHz, 3M Cache, 14nm, 35W TDP, LGA1151 (2C/4T)
ChipsetIntel® H110 Express Chipset
MemoryTwo 288 PIN DDR4 Sockets (vertical type)Dual channel DDR4 2133/2400 MHz, up to 32 GB
BIOSAMI® UEFI BIOS, 128 Mb SPI Flash Memory
Watchdog Timersoftware programmable and can be generate system reset
Hardware MonitorCPU voltage
+3.3 V voltage
+5 V voltage
+12 V voltage
CPU temperature
System temperature
CPU fan speed
System fan speed
Operating SystemsMicrosoft® Windows® 7 32/64-bit (only for 6th Gen Intel® CoreTM processors)
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
OpenSUSE Leap 42.1 64-bit
Fedora 25 64-bit
Ubuntu 16.04 LTS 64 bit
I/O Interfaces
Serial ATA4x SATA 6.0 Gb/s connectors
USB4x USB 3.0 connectors (rear)
2x USB 2.0 connectors (rear)
2x USB 2.0 pin headers
2x USB 2.0 (vertical type A connector)
Serial Ports2x RS-232/422/485 with auto flow control connector (rear)
4x RS-232 pin headers
Expansion slots1xPCIe x16 Gen31xPCIe x4 Gen25x PCI 2.2
Parallel Port1x LPT pin header
PS2 Combo Port1x PS/2 keyboard & Mouse connector (rear)
DIO2x 20-pin/2.0mm GPIO pin header: 16 in and 16 out, one ground pin and one power pin (5V/12V/no power, jumper selected)
Audio
Audio CodecRealtek® ALC892-CG
Interface1x Mic-in, 1x Line-out and 1x Line-in connector (rear)
Graphics
Graphics EngineIntegrated Intel® HD Graphics series (based on CPU)
VGA1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz
HDMI 1.41x HDMI connector (rear) resolution up to 4096 x 2160 @ 24 Hz
Ethernet
ControllerLAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2: Intel® I211-AT via RJ45 connector (rear)
Wake On LANLAN1 and LAN2 support
Mechanical and Environmental
Form FactorATX
Dimension305 mm x 244 mm (W x L)
Operating Temperature0 °C to 60 °C
Storage Temperature-40 °C to 85 °C
Relative Humidity40°C @ 95% RH Non-condensing
Certification (EMC)CE & FCC Class B
\*Extending operating temperature is optional and requires use of an industrial solid-state drive storage device or CFast card.. \*\*Other Linux Distribution support by request # IMB-M45 # Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i7/i5/i3 or Xeon™ E Processors # Features ● 8th/9th Gen Intel® Core™ i7/i5/i3 or Xeon™ E processors and C246 chipset ● ECC or NON ECC UDIMM support(based on CPU) ● Dual-channel DDR4 2400/2666 MHz memory up to 128 GB (based on CPU) ● Intel® PCIe 3.0 slot bifurcation supports up to 5x PCIe 3.0 expansion slots ● Rugged I/O design to enhance I/O port compatibility and reliability ● Unique power design to ensure stable USB power of 5V ±5% ● IEC 61000-4-2\~6 (Performance Criterion A), CE/FCC class B certified ![Green computer motherboard with various slots, CPU socket, and RAM slots (no visible text or labels)](.2021-gpu-solutions-brochure/5af4c053e81844e0520c040e15e146a041c9cc087e0138b943ad61dd1cbb3ab3.jpg) # Product Illustration ![Multiple PCIe 3.0 support Intel® C246 Express Chipset Dual Channel DDR4 DIMMs LGA1151 socket for 8th/9th Gen Intel® Core™ and Xeon™ E Processor](.2021-gpu-solutions-brochure/0f2bafa155ec848d374e1ee7d16295d49d3bb990403086d1501a6dacf2694c27.jpg) ![VGA COM1 LAN + USB 3.1 Gen 2 Line out HDMI DP COM2 Mic In](.2021-gpu-solutions-brochure/6ab4b16ba9bb22525493e1fba312eef24e4cc7858fb7bde9d9c00044676ad9d1.jpg) # Ordering Information ● IMB-M45 ATX 8th/9th Intel® Core™ i7/i5/i3 or Xeon™E industrial motherboard Note: CPU, Memory module and Cooler kit are not included # Packing Lists ● IMB-M45 ● IMB-M45 I/O shield # Optional Accessories ● 2-port USB 2.0 port cable with bracket (Part Number: 30-25010-3010) 4-port USB 2.0 port cable with bracket (Part Number: 30-25009-3000) ● 2-port USB 3.0 port cable with bracket (Part Number: 30-25046-0100) ● 1-port LPT port cable with bracket (Part Number: 30-25019-2000) ● 2-port COM port cable with bracket (Part Number: 30-25003-3000) . PS/2 KB/MS Cable with Bracket from 6P pin-header (Part Number: 30-01019-2010) 1-port SATA cable (Part Number: 30-10057-7000) ● CPU cooler for <=65W and 35W CPU (CPU cooler Part Number: 32-20113-2000, including CPU cooler backplane) ● CPU cooler for >65W CPU (CPU cooler Part Number: 32-20831-0000-A0, CPU cooler backplane Part Number: 32-50031-0000-A0) Specifications
Processor System
CPUIntel® XeonTM E-2278GE, 3.3GHz, 16M Cache, 80W TDP, LGA1151, DDR4 2666MHz support, (8C/16T)
Intel® XeonTM E-2226GE, 3.4GHz, 12M Cache, 80W TDP, LGA1151, DDR4 2666MHz support, (6C/6T)
Intel® XeonTM E-2176G, 3.7GHz, 12M Cache, 80W TDP, LGA1151, DDR4 2666MHz support, (6C/12T)
Intel® XeonTM E-2124G, 3.4GHz, 8M Cache, 71W TDP, LGA1151, DDR4 2666MHz support, (4C/4T)
Intel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® Pentium® G5400, 3.7GHz, 4M Cache, 58W TDP, LGA1151, DDR4 2400MHz support (2C/4T)
Intel® Pentium® G5400T, 3.1GHz, 4M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/4T)
Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® C246 Express Chipset
MemoryFour 288 PIN DDR4 ECC or NON ECC Sockets Dual channel DDR4 2400/2666 MHz, up to 128 GB (based on CPU)
BIOSAMI® UEFI BIOS, 256 Mb SPI Flash Memory
Watchdog Timersoftware programmable and can be generate system reset
Hardware MonitorCPU voltage
+3.3 V voltage
+5 V voltage
+12 V voltage
CPU temperature
System temperature
CPU fan speed
System fan speed
Operating SystemsMicrosoft® Windows® 10 64-bit
Microsoft® Windows® 2016 64-bit
OpenSUSE Leap 15.1 64-bit
Fedora 30 64-bit
Ubuntu 18.10 64 bit
I/O Interfaces
Serial ATA6x SATA 6.0 Gb/s connectors
Intel® Software RAID support 0/1/5/10
USB4x USB 3.1 Gen2 connectors (rear)
2x USB 3.1 Gen1 pin headers
6x USB 2.0 pin headers
1x USB 3.1 Gen1 (vertical type A connector)
1x USB 2.0 (vertical type A connector)
Serial Ports2x RS-232/422/485 with auto flow control connector (rear)
4x RS-232 pin headers
Expansion slots
If PEG2 is occupied,PEG1 is PCIex8 Gen3, PEG2 is PCIex8 Gen3If PEG2 is not occupied,PEG1 is PCIex16 Gen3,PEG2 is no signalPCIe1: PCIe x4 Gen3, PCIe2: PCIe x4 Gen3,PCIe3:PCIe x4 Gen3,PCI1: PCI 2.2, PCI2: PCI 2.2
PEG1: PCIex16 slot, PCI1: PCI slot, PEG2: PCIex16 slot,PCIe1: PCIex4 slot,PCIe2:PCIex4 slot,PCIe3: PCIex4 slot,PCI2: PCI slot
Parallel Port1x LPT pin header
PS2 Combo Port1x PS/2 keyboard & Mouse pin header
DIO2x 20-pin/2.0mm GPIO pin header: 16 in and 16 out, one ground pin and one power pin (5V/12V/no power, jumper selected)
\*Other Linux Distribution support by request Specifications
Audio
Audio CodecRealtek® ALC892
Interface1x Line-out and 1x Mic-in connector (rear)
Graphics
Graphics EngineIntegrated Intel® HD Graphics series (based on CPU)
VGA1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz
DisplayPort 1.21x DP connector (rear), resolution up to 3840 x 2160 @ 60 Hz
HDMI 1.41x HDMI connector (rear) resolution up to 3840 x 2160 @ 30 Hz
Ethernet
ControllerLAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2: Intel® I210-AT via RJ45 connector (rear)
Intel® AMTLAN1 Support
Wake On LANLAN1 and LAN2 support
Mechanical and Environmental
Form FactorATX
Dimension305 mm x 244 mm (W x L)
Operating Temperature0 °C to 60 °C
Storage Temperature-40 °C to 85 °C
Relative Humidity60°C @ 95% RHNon-condensing
CertificationCE & FCC Class B
\*Other Linux Distribution support by request # IMB-M45H # Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i7/i5/i3 Processor # Features ● 8th/9th Gen Intel® Core™ i7/i5/i3 processors support, compatible with Windows® 10 ● Up to 64 GB Dual-channel DDR4 2666 MHz(based on CPU) ● Rugged I/O design to enhance I/O port compatibility and reliability ● Unique power design to ensure stable USB power of 5V ±5% ● IEC 61000-4-2\~6 (Performance Criterion A), CE/FCC class B certified ![Green computer motherboard with multiple slots, CPU socket, and RAM slots (no visible text or labels)](.2021-gpu-solutions-brochure/583ed10a248667fb41be358409d9f88b498e318b0ebb46aae659d3c5e437380d.jpg) Product Illustration ![Dual Channel DDR4 DIMMs 1x PCIe x16 Gen3 Intel® H310 Express Chipset LGA1151 socket for 8th/9th Gen Intel® Core™ Processor 2x Vertical USB 2.0 1xPCIex4 Gen2 5x PCI 2.2 PS2 Line Out VGA COM HDMI COM Mic In USB 2.0 LAN + USB 3.0](.2021-gpu-solutions-brochure/06c2bd9a66a7f663b35229d45a8f8ee7e418ce768f8a919780fe2011851c01b0.jpg) # Ordering Information ● IMB-M45H ATX Intel® Core™ i7/i5/i3 industrial motherboard Note: CPU, Memory module and Cooler kit are not included # Packing Lists ● IMB-M45H ● IMB-M45H I/O shield # Optional Accessories ● 2-port USB 2.0 port cable with bracket (Part Number: 30-25010-3010) ● 1-port LPT port cable with bracket (Part Number: 30-25019-2000) ● 2-port COM port cable with bracket (Part Number: 30-25003-3000) 1-port PS/2 cable for KB/MS (Part Number: 30-01016-0000) . 1-port SATA cable (Part Number: 30-10057-7000) CPU cooler for <=65W and 35W CPU (CPU cooler Part Number: 32-20113-2000, including CPU cooler backplane) . CPU cooler for >65W CPU (CPU cooler Part Number: 32-20831-0000-A0, CPU cooler backplane Part Number: 32-50031-0000-A0) Specifications
Processor System
CPUIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T)
Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T)
Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T)
Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® CoreTM i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
Intel® Pentium® G5400, 3.7GHz, 4M Cache, 58W TDP, LGA1151, DDR4 2400MHz support (2C/4T)
Intel® Pentium® G5400T, 3.1GHz, 4M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/4T)
Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® H310 Express Chipset
MemoryTwo 288 PIN DDR4 Sockets (vertical type)Dual channel DDR4 2400/2666 MHz, up to 64 GB (based on CPU)
BIOSAMI® UEFI BIOS, 128 Mb SPI Flash Memory
Watchdog Timersoftware programmable and can be generate system reset
Hardware MonitorCPU voltage
+3.3 V voltage
+5 V voltage
+12 V voltage
CPU temperature
System temperature
CPU fan speed
System fan speed
Operating SystemsMicrosoft® Windows® 10 64bit
OpenSUSE Leap 15.1 64bit
Fedora 30 64bit
Ubuntu 18.10 64bit
I/O Interfaces
Serial ATA4x SATA 6.0 Gb/s connectors
USB4x USB 3.0 connectors (rear)
2x USB 2.0 connectors (rear)
2x USB 2.0 pin headers
2x USB 2.0 (vertical type A connector)
Serial Ports2x RS-232/422/485 with auto flow control connector (rear)
4x RS-232 pin headers
Expansion slots1xPCIe x16 Gen31xPCIe x4 Gen25x PCI 2.2
Parallel Port1x LPT pin header
PS2 Combo Port1x PS/2 keyboard & Mouse connector (rear)
DIO2x 20-pin/2.0mm GPIO pin header: 16 in and 16 out, one ground pin and one power pin (5V/12V/no power, jumper selected)
Audio
Audio CodecRealtek® ALC892
Interface1x Mic-in and 1x Line-out connector (rear)
Graphics
Graphics EngineIntegrated Intel® HD Graphics series (based on CPU)
VGA1x VGA connector (rear), resolution up to 1920 x 1200 @ 60 Hz
HDMI 1.41x HDMI connector (rear) resolution up to 3840 x 2160 @ 30 Hz
Ethernet
ControllerLAN1: Intel® I219-LM via RJ45 connector (rear)
LAN2: Intel® I211-AT via RJ45 connector (rear)
Wake On LANLAN1 and LAN2 support
Mechanical and Environmental
Form FactorATX
Dimension305 mm x 244 mm (W x L)
Operating Temperature0 °C to 60 °C
Storage Temperature-40 °C to 85 °C
Relative Humidity60°C @ 95% RH Non-condensing
Certification (EMC)CE & FCC Class B
\*Other Linux Distribution support by request # AmITX-SL-G # Mini-ITX Embedded Board with 6th/7th Gen Intel® Core™ i7/i5/i3 # Desktop Processor # Features ● 6th/7th Gen Intel® Core™ i7/i5/i3, Intel® Pentium® and Celeron® Desktop Processor with Intel® Q170/H110 Chipset ● Up to 32GB dual channel DDR4 at 2133/2400MHz ● PCIe x16, PCIe x1 and Mini PCIe expansion ● 3 DisplayPort outputs on rear IO (Q170) Supports Smart Embedded Management Agent (SEMA® ) functions # Specifications # Processor & System # CPU Desktop 6th Generation Intel® Core™ i7/i5/i3 and Pentium®/Celeron® Processor, LGA1151 socket Intel® Core™ i7-6700 Processor, 4C, 3.4/4.0 GHz, 8M, 65W Intel® Core™ i7-6700TE Processor, 4C, 2.4/3.4 GHz, 8M, 35W Intel® Core™ i5-6500 Processor, 4C , 3.2/3.6 GHz 6M, 65W Intel® Core™ i5-6500TE Processor, 4C, 2.3/3.3 GHz, 6M, 35W Intel® Core™ i3-6100 Processor, 2C, 3.7 GHz, 3M, 51W Intel® Core™ i3-6100TE Processor, 2C, 2.7 GHz, 4M, 35W Intel® Pentium® G4400 Processor, 2C, 3.3 GHz, 3M, 54W Intel® Pentium® G4400TE Processor, 2C, 2.4 GHz, 3M, 35W Intel® Celeron® G3900 Processor, 2C, 2.8 GHz, 2M, 51W Intel® Celeron® G3900TE Processor, 2C, 2.3 GHz, 2M, 35W Desktop 7th Generation Intel® Core™ i7/i5/i3 and Pentium®/Celeron® Processor, LGA1151 socket Intel® Core™ i7-7700 Processor, 4C, 3.6/4.2 GHz, 8M, 65W Intel® Core™ i7-7700T Processor, 4C, 2.9/3.8 GHz, 8M, 35W Intel® Core™ i5-7500 Processor, 4C, 3.4/3.8 GHz, 6M, 65W Intel® Core™ i5-7500T Processor, 4C, 2.7/3.3 GHz, 6M, 35W Intel® Core™ i3-7101E Processor, 2C, 3.9 GHz, 3M, 54W Intel® Core™ i3-7101TE Processor, 2C, 3.4GHz, 3M, 35W Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX-NI # Chipset Intel® Q170/H110 Chipset # BIOS AMI EFI in 16MB SPI BIOS with Intel® AMT 11.0 support (Q170 only) SPI header for external BIOS, optional onboard SPI BIOS socket # Debug Interface 40-pin multipurpose flat cable connector for use in combination with DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints, debug LEDs # Memory Dual channel non-ECC 2133/2400 MHz DDR4 memory up to 32GB in dual vertical SODIM sockets # SEMA® Support Supports: voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and triple Smart Fan control ![Close-up of a green computer motherboard with CPU socket and various ports (no visible text or symbols)](.2021-gpu-solutions-brochure/fc864dd9063cf905fd2b3c70069d79532eb11caa74b560d38d0d17e868414d74.jpg) ![The image displays a black-and-white lineup of various computer motherboards and components arranged horizontally. From left to right, there is a motherboard lying flat, followed by three identical motherboards standing upright featuring blue rectangular heatsinks. Next is a vertical stack of three motherboards behind one another, showcasing tall, finned heatsinks. To the right stands a motherboard with a large vertical heatsink and a white I/O shield displaying four circular audio jacks arranged vertically (red, yellow, green, and blue). On the far right, another small motherboard component or card is visible. No legible text is present on the components.](.2021-gpu-solutions-brochure/0f55bb490e33b9c3cc1f1b48c631a616fee864354fbab77f9dbfc3e44d9c4414.jpg) # ● I/O Interfaces # Expansion Slots 1 PCIe x16 Gen3 1 PCIe x1 Gen2 1x Mini-PCIe card (half size): support ing PCIex1(Gen 2)/USB 2.0 (top side) 1x Mini-PCIe card (full size): support ing PCIex1(Gen 2) or mSATA/USB 2.0 (bottom side) # Serial ATA 3x SATA 6 Gbps ports (Jumper select NA/3.3V/5V for SATA1 and SATA2 to deliver power by SATA pin7; Default is NA) 2x SATA power connector # USB 4x USB 3.0 and 4x USB 2.0 on rear I/O 2x USB 3.0 onboard header (H110: USB 2.0) 1x USB 3.0 on vertical connector with keep out area for dongle (H110: USB 2.0) # KB/MS 1x PS/2 internal header # Serial Ports 3x RS-232 headers, 1x RS-232/422/485 headers (Support NA (Default)/5V/12V by jumper selection) # Digital IO 10 GPIO via onboard feature connector # . ● Audio # Audio Codec Realtek® ALC886 # Interfaces 7.1 channel audio via 5 jacks and S/PDIF output on rear I/O 7.1 channel audio signals and S/PDIF output on internal header # Specifications # ● Display # Graphics Core Intel® 9th generation LP graphics core architecture with up to 18 execution units supporting DirectX 11/12, OGL4.3/4.4, and up to three independent, simultaneous displays # DisplayPort 3x DisplayPort v1.2 with resolution up to 4096 x 2160 @ 24Hz (3x DisplayPort(Q170) , 2x DisplayPort (H110) # LVDS LVDS (optional): Single/dual channel 24-bit LVDS up to 1920x1080 @ 60 Hz (from eDP-to-LVDS converter) # eDP (build option) eDP (optional): Supports 3840x2160 resolution @ 60Hz, 24bpp (not available concurrently with LVDS) # ● Ethernet Intel® i219-LM (PHY) Ethernet controller (H110: i219-V) • Supports Intel® AMT 11.0 (Q170 only) • Supports Intel® vPro™ (Q170 only) Intel® i211AT (MAC/PHY) Ethernet controller 10/100/1000 GbE connection # ● TPM Atmel AT97SC3204 (optional) # . Power Standard Input: ATX: 12V ±5% / 5Vsb ±5% AT: 12V ±5% Peripheral Output: Onboard headers for fan and SATA power ATX Power Connector (14-pin) # ● Mechanical and Environmental Dimension (mm): 170 mm x 170 mm (L x W) # Operating Temperature Standard: 0˚C to +60˚C Storage Temperature: -20˚C to +80˚C Certification: CE, FCC Class B # Relative Humidity 40° C @ 95% RH Non-condensing # Operating Systems # Standard Support 6th Gen CPU: Windows 10/8.1/7, Linux 7th Gen CPU: Windows 10, Linux # Extended Support (BSP) 6th Gen CPU: WES7, Linux, VxWorks (TBD) 7th Gen CPU: Linux, VxWorks (TBD) # ● Intelligent Middleware # SEMA® Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) ![The image displays a logo featuring the text 'SEMA' in bold, white, sans-serif capital letters that are slanted slightly to the right. The text is set against a rectangular background with a horizontal gradient that transitions from a lighter peach-orange on the left to a deeper reddish-orange on the right. The logo is centered on a plain white background.](.2021-gpu-solutions-brochure/8489915e8f41c4db3bfc48defdd55dc5600cf8f1ec9625a5b4f505f6a70ee890.jpg) Functional Diagram ![**Labeled Blocks:** * Intel® Core™ i7/i5/i3 Processor * LGA 1151 Socket * Vertical SODIMM (Channel A) DDR4 (non ECC) * Vertical SODIMM (Channel B) DDR4 (non ECC) * DisplayPort C * eDP (optional) * eDP * 4 lanes * eDP to LVDS * DDC * LVDS Dat/Clk * LVDS Single/Dual Channel 18/24-bit (optional eDP) * LVDS Control * LVDS AUX Connector * Brightness * PCIe x16 * PCIe x16 slot * USB3.0 port 3/4 * DP * USB3.0 * USB3.0 * DisplayPort B * USB 3.0 port 1/2 * DisplayPort A * USB Hub x4 * 1x USB 2.0 port 10 * 4x USB 2.0 * USB2.0 * USB2.0 * USB2.0 * USB2.0 * GbE i219LM/V * PCIe port 6 * RJ-45 10/100/1000 (top) * GbE i211AT * PCIe port 5 * RJ-45 10/100/1000 (bottom) * HDA Codec ALC886 * Center Surround L/R Line In Line Out S/PDIF Out Mic In * Audio Header * Super I/O ITE IT8783 * LPC * 1x RS-232/422/485 * COM1 Header * 3x RS-232 * COM2 Header * COM3 Header * COM4 Header * PS/2 * TPM Atmel (optional) * Intel® Q170/H110 Chipset * DMI * FPU * System Signals * MIC2-In / Lin2-Out * Front Panel * Q170: 2x USB 3.0 port 5/6 * USB Header * H110: 2x USB 2.0 port 7/8 * Q170: 1x USB 3.0 port 7 * USB Vertical * H110: 1x USB 2.0 port 5 * PCIe x1 port 3 * Mini PCIe half size (top side) * USB 2.0 port 6 * USB 2.0 port 9 * mSATA/ Mini PCIe full size (bottom) * PCIe x1 port 4 * Switch * 1x SATA 6Gb/s port 4 * 3x SATA 6Gb/s port 1/2/3 * 3x SATA * SPI0/1 * SPI0/1 Header * SPI0 * SPI1 Socket * Failsafe Switch * SMBus * BMC * CPU FAN * SYS FAN1 * SYS FAN2 * Sensor LM73 * GPIO * Feature Connector **Connections:** * **Processor Connections:** * Connects to Vertical SODIMM (Channel A) DDR4 (non ECC) and Vertical SODIMM (Channel B) DDR4 (non ECC). * Connects to DisplayPort C. * Connects to eDP (optional), which flows through eDP, 4 lanes, and eDP to LVDS, then splits to DDC and LVDS Dat/Clk, connecting to LVDS Single/Dual Channel 18/24-bit (optional eDP). * Connects to LVDS Control and Brightness, both connecting to LVDS AUX Connector. * Connects to PCIe x16, connecting to PCIe x16 slot. * Connects to USB3.0 port 3/4, connecting to a block containing DP, USB3.0, and USB3.0. * Connects to DisplayPort B. * Connects to DMI and FPU, both connecting to the Intel® Q170/H110 Chipset. * **Chipset Connections:** * Receives connections from DMI and FPU. * Connects to DisplayPort A. * Connects to USB 3.0 port 1/2, connecting to a block containing DP, USB3.0, and USB3.0. * Connects to 1x USB 2.0 port 10, connecting to USB Hub x4. * Connects to PCIe port 6, connecting to GbE i219LM/V, which connects to RJ-45 10/100/1000 (top). * Connects to PCIe port 5, connecting to GbE i211AT, which connects to RJ-45 10/100/1000 (bottom). * Connects to LPC, connecting to Super I/O ITE IT8783. * Connects to SMBus, connecting to BMC. * Connects to SPI0/1, connecting to SPI0/1 Header, SPI0, and SPI1 Socket (near Failsafe Switch). * Connects to System Signals, connecting to Feature Connector. * Connects to PCIe x1 port 2, connecting to PCIe x1 slot. * Connects to System Signals and MIC2-In / Lin2-Out, both connecting to Front Panel. * Connects to Q170: 2x USB 3.0 port 5/6 and H110: 2x USB 2.0 port 7/8, both connecting to USB Header. * Connects to Q170: 1x USB 3.0 port 7 and H110: 1x USB 2.0 port 5, both connecting to USB Vertical. * Connects to PCIe x1 port 3 and USB 2.0 port 6, both connecting to Mini PCIe half size (top side). * Connects to USB 2.0 port 9, connecting to mSATA/ Mini PCIe full size (bottom). * Connects to PCIe x1 port 4 and 1x SATA 6Gb/s port 4, both connecting to Switch, which connects to mSATA/ Mini PCIe full size (bottom). * Connects to 3x SATA 6Gb/s port 1/2/3, connecting to 3x SATA. * **Peripheral/Other Connections:** * USB Hub x4 connects to 4x USB 2.0, which connects to a block containing USB2.0, USB2.0, USB2.0, and USB2.0. * Super I/O ITE IT8783 connects to 1x RS-232/422/485, connecting to COM1 Header. * Super I/O ITE IT8783 connects to 3x RS-232, connecting to COM2 Header, COM3 Header, and COM4 Header. * Super I/O ITE IT8783 connects to PS/2. * TPM Atmel (optional) connects to the Chipset. * HDA Codec ALC886 connects to Center Surround L/R Line In Line Out S/PDIF Out Mic In and Audio Header. * BMC connects to CPU FAN, SYS FAN1, and SYS FAN2. * BMC connects to Sensor LM73. * BMC connects to GPIO, which connects to Feature Connector.](.2021-gpu-solutions-brochure/becba7710db94711b11de8798f98bee07b88bb505b2b4278727af9d5507db1c6.jpg) # Ordering Information ● AmITX-SL-G-Q170 Mini-ITX Embedded Board with 6th/7th generation Intel® Core™ i7/i5/i3 Desktop Processor with Q170 Chipset AmITX-SL-G-H110 Mini-ITX Embedded Board with 6th/7th generation Intel® Core™ i7/i5/i3 Desktop Processor with H110 Chipset # Packing List . 30-20872-0000 ATX/AT Power Cable ● 30-20875-0000 SATA Dual Power Cable ● 30-10057-0600 SATA Cable ● 34-25314-1000 Rear I/O Shield # Optional Accessories ● 30-20876-0000 COM Port Cable, 1 Port, 25cm ● 30-20873-0000 PS/2 KB/MS Cable, 40cm ● 30-20963-0000 USB 3.0 Cable, 2 ports, 20cm (for AmITX-SL-G-Q170) ● 30-20874-1000 USB 2.0 Cable, 2 ports, 20cm (for AmITX-SL-G-H110) ● 32-20513-0000 LGA1150 CPU Cooler, H=30.0mm, 45W ● 32-20512-0000 LGA1150 CPU Cooler, H=46.05mm, 45W ● 32-20113-3000 LGA1150 CPU Cooler, H=50.2mm, 95W ● 32-20495-0000 LGA1150 CPU Cooler, H=61.4mm, 95W # AmITX-AL-I Thin Mini-ITX Embedded board with Intel Atom® E3900 Series, Pentium® , and Celeron® SoC # Features Low-profile Thin Mini-ITX Embedded board ● Intel® VT-x/VT-d supported Up to 16GB non-ECC DDR3L memory at 1866/1600MHz in dual stacked SODIMM socket Intel® Gen9 Low Power graphics, up to 4k resolution and H.265 codec ● DisplayPort, HDMI, dual channel 18/24-bit LVDS (eDP by build option), supports three independent displays ● Supports Smart Embedded Management Agent (SEMA® ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs) ![Green printed circuit board with various electronic components and connectors, no readable text or symbols on the board itself.](.2021-gpu-solutions-brochure/9fa4948d3668e242f1f584dde6bb343de76b5854aa2c4952d5532e0e7075b317.jpg) # Specifications # ● Processor & System # CPU Intel Atom®/Pentium®/Celeron® SoC on 14nm process Atom® x7-E3950 1.6/2.0GHz (Burst Frequency), 12W (4C/1866) Atom® x5-E3940 1.6/1.8GHz (Burst Frequency), 9.5W (4C/1866) Atom® x5-E3930 1.3/1.8GHz (Burst Frequency), 6.5W (2C/1866) Pentium® N4200 1.1/2.5GHz (Burst Frequency), 6W (4C/1866) Celeron® N3350 1.1/2.4GHz (Burst Frequency), 6W (2C/1866) Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG # BIOS AMI EFI in 16MB SPI BIOS # Debug Interface 40-pin multipurpose flat cable connector for use in combination with DB-40 debug module to provide BIOS POST code display, BMC access, SPI BIOS flashing, Power Testpoints, Debug LEDs # Memory Dual channel non-ECC 1866/1600 MHz DDR3L memory up to 16GB in dual stacked SODIMM sockets # SEMA® Support Supports: Voltage/Current monitoring, Power sequence debug support, AT/ ATX mode control, Logistics and Forensic information, Flat Panel Control, General Purpose I2 C, Failsafe BIOS (dual BIOS ), Watchdog Timer and Fan Control # ● I/O Interfaces # Expansion Slots 1x PCIe x1 slot 1x Mini PCIe (full size) with USB 1x mSATA (full size) SIM card slot (build option) microSD card slot (build option) # Serial ATA 2x SATA 6 Gbps ports (one shared with mSATA) # USB 4x USB 3.0 on rear I/O 1x USB 2.0 on front panel header 2x USB 2.0 on standard header 1x USB 2.0 on Mini PCIe # KB/MS 1x PS/2 internal header # Serial Ports 2x RS-232/422/485 via onboard headers (5V/12V support) 4x RS-232 via onboard headers # Digital IO 10x GPIO on internal feature connector # TPM TPM header (supports TPM 2.0) # Specifications # ● Audio Audio Codec Realtek® ALC888S # Interfaces Line-out, Mic-in on rear I/O 7.1 channel signals and S/PDIF output on internal header # ● Display # Graphics Core Intel® Generation 9 Low Power Graphics Core Architecture supporting 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support Triple display: DP + HDMI + LVDS (default) # DisplayPort 1x DisplayPort (2x DisplayPort is build option, one is in place of HDMI), resolution up to 4096x2160@24Hz # HDMI 1x HDMI (co-lay with DP), resolution up to 3840×2160@30 Hz # LVDS Single/Dual channel 18/24-bit (build option, in place of eDP), resolution up to 1900x1200@ 60 Hz. # eDP 4 lane support (build option, in place of LVDS) # ● Ethernet Controller: 2x Intel® Ethernet controller i211 (MAC/PHY) Note: Intel® Ethernet i210 (build option) is supported for -40°C to +85°C SKU Interface: 10/100/1000 GbE connection Wake-on-LAN: Yes # ● Power Standard Input: 12V ±5% from internal 4-pin power connector or external DC jack Peripherals Output: Onboard headers for fan and SATA power # ● Mechanical and Environmental Form Factor: Thin Mini-ITX Dimensions: 170 mm x 170 mm (L x W) # Operating Temp. Standard Operating Temperature: 0°C to 60°C Extreme Rugged Operating Temperature: -40°C + 85°C (build option for selected SKUs) # Shock and Vibration MIL-STD-202G Method 214A, Table 214-I Condition D. MIL-STD-202G Method 213B, Table 213-I Condition A. # Relative Humidity 10% to 90%, non-condensing # Certification CE, FCC, Class B # ● Operating Systems # Standard Support Windows 10 64-bit, Linux 64-bit # Extended Support (BSP) Linux 64-bit, VxWorks 64-bit (TBD) # ● Intelligent Middleware # SEMA® Local management, control of embedded computer systems Extended EAPI for monitoring, control and analytics applications Multiple OS support across platforms (x86, ARM) ![The image displays a logo featuring the text 'SEMA' in white, stylized, sans-serif capital letters. The text is centered horizontally and vertically within a rectangular shape with rounded corners. The background of the rectangle is a gradient of orange, transitioning from a darker shade at the top to a lighter shade at the bottom. The letters are slightly slanted to the right and appear to be interconnected.](.2021-gpu-solutions-brochure/105a918267d3aa4c2ff87adb2e622de332017a6be7ce6368e36399a87b1faebd.jpg) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Functional Diagram ![This flowchart describes the connections for an **Intel Atom® Celeron® Pentium® (formerly 'Apollo Lake' 'Apollo Lake-I') SoC**. **Left Side Connections:** * **Memory:** Two blocks, **Horizontal SODIMM Low (Channel A) DDR3L at 1866/1600 MHz (non ECC)** and **Horizontal SODIMM High (Channel B) DDR3L at 1866/1600 MHz (non ECC)**, connect directly to the SoC. * **Display:** **HDMI DP (optional)** connects via **DDI0** and **DP** connects via **DDI1** to the SoC. * **Ethernet:** Two **RJ-45 10/100/1000** blocks connect to **GbE Intel I211AT** blocks. These connect to the SoC via **PCIe x1 Port 3** and **PCIe x1 Port 4** respectively. * **USB 3.0:** Four **USB 3.0** blocks connect via **USB 3.0 port 0, 1** and **USB 3.0 port 2, 3** to the SoC. * **Audio:** **Line-out Mic-in** connects to **HDA Codec ALC888S**, which connects to the SoC. **Audio Header** connects to the HDA Codec. * **Super I/O & Serial:** **Super I/O** connects to the SoC via **LPC**. * **COM1** and **COM2** connect via **2x RS-232/422/485 0/5/12V COM1, 2** to Super I/O. * **COM3**, **COM4**, **COM5**, and **COM6** connect via **4x RS-232** to Super I/O. * **PS/2 MS/KB** connects via **PS/2** to Super I/O. * **TPM (optional)** connects via **LPC** to Super I/O. **Right Side Connections:** * **eDP/LVDS:** **LVDS (eDP) Single/Dual Channel 18/24-bit** connects to **eDP to LVDS NXP PTN3460IBS** via **DDC LVDS Dat/Clk**. **LVDS AUX Connector** connects via **LVDS control Brightness** to the bridge chip. The bridge chip receives **eDP 4 lanes** from the SoC. A **PWM switch** provides **PWM from SEMA BMC** to the bridge chip. * **PCIe Slots:** **PCIe x1 slot** connects via **PCIe x1 port 1**. **Mini PCIe full size** connects via **PCIe x1 port 2**. **SIM card slot** and **USB 2.0** connect to the Mini PCIe slot. * **Storage:** **mSATA full size** connects to a **SATA Switch** via **SATA**. Another **SATA** block connects to the switch. These connect via **SATA 0 6Gb/s**. A separate **SATA** block connects directly via **SATA 1 6Gb/s**. * **USB Headers:** **1x USB 2.0 front panel header** connects via **USB 2.0 port 1**. **USB 2.0 header** connects via **USB 2.0 port 2** and **USB 2.0 port 3**. * **Miscellaneous:** **microSD Card** connects via a dashed line. **SPI header**, **SPI1**, and **SPI0 socket** connect via **SPI 0/1**. * **Management (SEMA):** **SEMA TI TM4C123** connects via **SMBus**. It connects to **CPU Fan** and **SYS Fan**. **Sensor LM73 (optional)** connects to it. **GPIO NXP PCA9535** connects to SEMA via SMBus. **GPIO** connects to **Feature Connector**. **System Signals** connects the SoC to **Feature Connector**.](.2021-gpu-solutions-brochure/5e4fd1f3cb6379eaadd23ee5457028e1597fbe317ebebafc2215b489d66a9e2c.jpg) # Ordering Information ● AmITX-AL-I-E3950 Thin Mini-ITX motherboard with Intel Atom® x7-E3950 1.6/2.0GHz (Burst Frequency), 12W (4C/1866) ● AmITX-AL-I-E3940 Thin Mini-ITX motherboard with Intel Atom® x5-E3940 1.6/1.8GHz (Burst Frequency), 9.5W (4C/1866) ● AmITX-AL-I-E3930 Thin Mini-ITX motherboard with Intel Atom® x5-E3930 1.3/1.8GHz (Burst Frequency), 6.5W (2C/1866) ● AmITX-AL-I-N4200 Thin Mini-ITX motherboard with Intel® Pentium® N4200 1.1/2.5GHz (Burst Frequency), 6W (4C/1866) ● AmITX-AL-I-N3350 Thin Mini-ITX motherboard with Intel® Celeron® N3350 1.1/2.4GHz (Burst Frequency), 6W (2C/1866) # Packing List ● 30-20875-0000 SATA dual power cable ● 30-10057-0600 SATA cable # Optional Accessories ● 30-20876-0000 COM port cable (1 port, 25cm) ● 30-20873-0000 PS/2 KB/MS cable (40cm) ● 30-20874-1000 USB 2.0 cable (2 ports, 20cm) # AmITX-RZ-G # Mini-ITX Embedded Board with AMD® Ryzen™ APU # Features ● AMD® Ryzen™ Embedded V1000 / R1000 processor family Up to 32GB dual SODIMM socket DDR4 ● PCIe x16, PCIe x1, M.2 and Mini-PCIe expansion (V series) 4x DisplayPort (V series) ![Close-up of a green printed circuit board with various electronic components and connectors (no visible text or symbols)](.2021-gpu-solutions-brochure/12610d64c728a08351f1765e8b1aeb1132b45593985fd29caea6ffa9792aa018.jpg) ![The image displays the rear I/O panel of a computer motherboard. From left to right, the components are an HDMI port, four USB 3.0 ports (arranged in two pairs), two PS/2 ports, an Ethernet port, and a six-jack audio interface. Text labels are printed vertically next to the bottom three audio jacks: MIC IN LINE OUT LINE IN](.2021-gpu-solutions-brochure/d583f0d845336a7a0a6bcfff3ec0ecb651d0704372e389e98a5268ba9d8e093a.jpg) AMD® Ryzen™ Embedded V1000 Series ![This image displays a horizontal lineup of various computer motherboard I/O shields and port brackets against a white background. From left to right: 1. A dark grey rectangular shield featuring one large rectangular cutout and a small square cutout below it. 2. Two identical white rectangular shields. Each has three vertical slots at the top with blue accents and four small rectangular openings below. 3. A black rectangular shield with a dense arrangement of vertical rectangular cutouts of varying sizes. 4. A dark grey square shield with a central square cutout and a small rectangular cutout above it. 5. A white square shield identical to the previous one. 6. A tall white rectangular shield with four circular audio jacks arranged vertically. The rings around the jacks are colored light blue, pink, orange, and red from top to bottom. 7. A small black bracket on the far right with two circular cutouts and a small rectangular cutout.](.2021-gpu-solutions-brochure/b2449cb337873b265514b05be3e97ebde8973adfd7b337dc80d795b47c6aa309.jpg) AMD® Ryzen™ Embedded R1000 Series # Specifications # ● Processor & System # APU AMD® Ryzen™ Embedded V1000 Processors AMD® Ryzen™ Embedded V1807B 3.33GHz (3.8GHz Boost), 54W (4C/11CU) AMD® Ryzen™ Embedded V1756B 3.25GHz (3.6GHz Boost), 54W (4C/8CU) AMD® Ryzen™ Embedded V1605B 2.0GHz (3.6GHz Boost), 25W (4C/8CU) AMD® Ryzen™ Embedded V1202B 2.3GHz (3.2GHz Boost), 25W (2C/3CU) AMD® Ryzen™ Embedded R1000 Processors AMD® Ryzen™ Embedded R1606G 2.6GHz (3.5GHz Boost), 25W (2C/3CU) AMD® Ryzen™ Embedded R1505G 2.4GHz (3.3GHz Boost), 25W (2C/3CU) # Memory Dual channel ECC 3200/2400MHz DDR4 memory up to 32 GB in dual vertical SODIMM sockets (R series: 2400MHz) # BIOS AMI EFI in 16MB SPI BIOS SPI BIOS socket onboard and SPI header for external BIOS, dual BIOS support # TPM2.0 ISLB9665TT2.0 # Board Management Controller Supports: voltage monitoring, system and CPU temperature monitoring, smart fan control,logistics and forensic information, general purpose I2 C, watchdog timer # Debug Header 40-pin multipurpose flat cable connector. Use in combination with DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints, debug LEDs # ● I/O Interfaces # Expansion Slots 1x PCIe x16 Gen3 slot (V series: PCIe x8 signal; R series: PCIe x4 signal) 1x PCIe x1 Gen3 slot (PCIe 3.0) 1x full-size Mini-PCIe slot (for MSATA device) 1x M.2 (M key, 2242/2260/2280, support NVMe , PCIe 3.0 x2 signal; R series W/O SATA interface) 1 SPI header for external BIOS # Serial ATA 2x SATA 6 Gbps ports (Jumper select NA/3.3V/5V for SATA1 and SATA2 to deliver power by SATA pin7; Default is NA) 2x SATA power connector # USB 4x USB 3.0 and 4x USB 2.0 on rear I/O 2x USB 2.0 on header 1x USB 2.0 on vertical connector with space for dongle # Serial Ports 1x RS-232/422/485 on internal header 3x RS-232 on internal headers 1x CCTALK x2 on internal header # Digital IO 8 GPIO on internal feature connector # ● Audio # Audio Codec Realtek® ALC892 # Interfaces 7.1 channel audio via 5 jacks and S/PDIF output on rear I/O 7.1 channel audio signals and S/PDIF output on internal header # Specifications # ● Display # Graphics core “Vega” GPU with up to 11 Compute Units # DisplayPort Up to 4x DisplayPort v1.2 with max resolution of 3840x2160@60Hz 4x DisplayPort (V series) , 3x DisplayPort (R series) # ● Ethernet Controller: 2x Intel® i211AT Ethernet controller (R series: 1x controller) Interface: PCI Express x1 Bus Wake On LAN: Yes # ● Power Standard Input: ATX = 12V ±5%/5Vsb ±5% from internal header AT = 12V ±5% from internal header Peripherals output: Onboard headers for fan and SATA power # Ordering Information # ● AmITX-RZ-G/V1202B Mini-ITX gaming MB with AMD Ryzen™ Embedded V1202B processor # ● AmITX-RZ-G/V1605B Mini-ITX gaming MB with AMD Ryzen™ Embedded V1605B processor # ● AmITX-RZ-G/V1756B Mini-ITX gaming MB with AMD Ryzen™ Embedded V1756B processor # ● AmITX-RZ-G/V1807B Mini-ITX gaming MB with AMD Ryzen™ Embedded V1807B processor # ● AmITX-RZ-G/R1505G Mini-ITX gaming MB with AMD Ryzen™ Embedded R1505G processor # ● AmITX-RZ-G/R1606G Mini-ITX gaming MB with AMD Ryzen™ Embedded R1606G processor # ● Mechanical and Environmental Form Factor: Mini-ITX Dimensions: 170 mm x 170 mm (L x W) # Operating Temperature Standard: 0˚C to +60˚C # Certifications CE, FCC Class A # Relative Humidity 40° C @ 95% RH Non-condensing, Non-operating # Optional Accessories # ● 30-20876-0000 COM Port Cable, 1 Port, 25cm # ● 30-20874-1000 USB 2.0 Cable, 2 ports, 20cm # ● 32-20809-0000-A0 AMD APU Cooler, H=64.4mm, 54W # ● 32-20583-1010 AMD APU Cooler, H=35mm, 35W # Packing List # . 30-20872-0000 ATX/AT Power Cable # ● 30-20875-0000 SATA Dual Power Cable # ● 30-10057-0600 SATA Cable # . 34-25316-1010 Rear I/O Shield # Functional Diagram ![**Central Block:** * AMD SOC FP5 Processor (V1000 / R1000) **Left Side Blocks and Connections:** * **DP CONN (1&2)** connects via **DDI 1&2** to **AMD SOC**. * **DP CONN (3&4)** connects via **DDI 3&4** to **AMD SOC**. * **RJ-45 #2 10/100/1000** connects to **GbE i211AT**, which connects via **PCIe #4** to **AMD SOC**. * **RJ-45 #1 10/100/1000** connects to **GbE i211AT**, which connects via **PCIe #5** to **AMD SOC**. * **PCIe16 Slot** connects via **PCIe x8 (V1000) / x4 (R1000)** to **AMD SOC**. * **USB 2.0**, **USB 2.0**, **USB 2.0**, **1x Dual USB 2.0 CONN**, and **USB 2.0 (Vertical)** connect to **USB HUB #1**, which connects via **USB 2.0 P5** to **AMD SOC**. * **USB 2.0/3.0**, **USB 2.0/3.0**, **USB 2.0/3.0**, and **USB 2.0/3.0** connect to **USB HUB #2**, which connects via **USB 2.0 P4** and **USB 3.0 P0~P3** to **AMD SOC**. * **COM 1** connects via **RS-232/422/485** to **EXAR SP339**, which connects to **Super IO (F81866AD)**. * **COM 2** connects via **RS-232** to **ADM213**, which connects to **Super IO (F81866AD)**. * **COM 3** connects via **RS-232** to **ADM213**, which connects to **Super IO (F81866AD)**. * **COM 4** connects via **RS-232** to **ADM213**, which connects to **Super IO (F81866AD)**. * **COM 5** connects via **RS-232/CCTALK** to **MAX3232**, which connects to **Super IO (F81866AD)**. * **COM 6** connects via **RS-232/CCTALK** to **MAX3232**, which connects to **Super IO (F81866AD)**. * **Super IO (F81866AD)** connects via **LPC** to **AMD SOC**. * **TPM 2.0 (SLB9665)** connects via **LPC** to **AMD SOC**. **Right Side Blocks and Connections:** * **Vertical SODIMM DDR4 (Un buffered ECC)** connects via **Channel A** and **Channel B** to **AMD SOC**. * **SATA 3.0 (PCIe #6)** connects to **SATA CONN #1 (SATA 0)**. * **SATA 3.0 (PCIe #7)** connects to **SATA CONN #2 (SATA 1)**. * **PCIe #2** connects to **PCIe1 Slot**. * **PCIe x2 (PCIe #0~1)** connects to **M.2 CONN #1 (M Key) (SATA 3)**. * **PCIe #3** connects to **ASM 1061**, which connects via **SATA 3.0 (SATA #3)** and **SATA 3.0 (SATA #4)** to **mSATA CONN Full size**. * **SMBUS** connects **AMD SOC** to **STM32L071R BH6TR**. * **STM32L071R BH6TR** connects to **Feature CONN**. * **STM32L071R BH6TR** connects via **BMC_I2C 5** to **Sensor MAX6642**. * **STM32L071R BH6TR** connects to **CPU FAN**, **SYS FAN 1**, and **SYS FAN 2**. * **STM32L071R BH6TR** connects via **GPIO** to **BIOS #1(Socket)**, **BIOS#1(Header)**, **BIOS #2(Socket)**, and **BIOS#2(Header)**. * **SPI 0/1** connects **AMD SOC** to **BIOS #1(Socket)**, **BIOS#1(Header)**, **BIOS #2(Socket)**, and **BIOS#2(Header)**. * **HDA** connects **AMD SOC** to **Realtek ALC892 (Co-deign ALC888)**. * **Realtek ALC892 (Co-deign ALC888)** connects to **Audio Header** and **5.1 CH Jack**. * **Buzzer** connects to **AMD SOC**.](.2021-gpu-solutions-brochure/91362ae13004e1c9848e7306c046e47fdf0978d58ead5a2820b536b3963b210c.jpg) Features marked in red are only available with AMD® Ryzen™ Embedded V1000 Series # DLAP-201-JT2 # NVIDIA® Jetson™ TX2 Edge Inference Platform # Features . Deep learning acceleration with NVIDIA® Jetson™ TX2 ● Compact fanless system 148(W)x105(D)x50(H)mm ● Wide temperature range from -20°C to 70°C ![Front view of a black ADLINK network device with heat sinks and ports (no visible text or symbols on main body)](.2021-gpu-solutions-brochure/f0b297ab2e97a7698cfa2826e99839359773e45bbdf6646ceb3900d9e41fff93.jpg) ![Black electronic device with heat sinks and two connected ports (no visible text or symbols)](.2021-gpu-solutions-brochure/8dd3bc372d508754f65dd90810074665e5fbb113e014614b1a17913fa254ebac.jpg) Specifications
DLAP-201-JT2
System Core
ProcessorNVIDIA® JetsonTM TX2
Memory8GB
eMMC32GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.03x Type A
AudioMic-in, line-out (Optional)
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM
CAN Bus1 CAN bus (2.0b)
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionmSATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
CMOS Battery
HolderBR2032
ProtectionReverse charge protection
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x105(D)x50(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-211-Nano # NVIDIA® Jetson Nano™ Edge Inference Platform # Features Deep learning acceleration with NVIDIA® Jetson Nano™ Compact fanless system 148(W)x120(D)x49.1(H)mm Wide temperature range from -20°C to 70°C ![The image displays a blue oval tilted slightly upward to the right. Inside the oval is the word 'Preliminary' written in white, italicized, sans-serif capital letters. There is a thin white curve or swoosh along the bottom right edge of the blue oval. The entire graphic is set against a white background.](.2021-gpu-solutions-brochure/e54fb538bd4455d7378a88042850c5f1dfd038af08909cccdb90cd4f8ddff559.jpg) ![Front view of a black ADLINK network device with multiple ports and ventilation grilles (no visible text or symbols)](.2021-gpu-solutions-brochure/27f011fb4185df40c9c9e725690bba0bebb143ef1a9bc290a87ecba616dd1dc5.jpg) ![Black industrial electronic device with heat sinks and ports (no visible text or symbols)](.2021-gpu-solutions-brochure/90e6d247ee322765bdcb7fef92d1473754e3045007b1a282a0736cee10a771be.jpg) Specifications
DLAP-211-Nano
System Core
ProcessorNVIDIA® Jetson NanoTM
Memory4GB
eMMC16GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.04x Type A
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM RS-232
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
M.2M.2 B key 3042 socket
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionM.2 B key support SATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x120(D)x49.1(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-211-JNX # Jetson Xavier™ NX Edge Inference Platform # Features ● Deep learning acceleration with Jetson Xavier™ NX ● Compact fanless system 148(W)x120(D)x49.1(H)mm Wide temperature range from -20°C to 70°C ![The image features a blue oval centered on a white background. Inside the oval, the word 'Preliminary' is written in white, sans-serif text that is slanted upwards from left to right. A thin white curved line accents the bottom right edge of the blue shape. The image is flanked by thin black vertical bars on the far left and right sides.](.2021-gpu-solutions-brochure/ba44109a2084250bb08e3f6c09651d3e9735ec65957c85dcc887dd3ae36b3b5e.jpg) ![Front view of a black industrial device with heat sinks and multiple ports (no visible text or symbols)](.2021-gpu-solutions-brochure/8a746f027da836b72c97a8f8856ebf9499bd92103c260f316d3885ce7c21687e.jpg) ![Black industrial electronic device with heat sinks and ports (no visible text or symbols)](.2021-gpu-solutions-brochure/7327d6a33f48c9b414ae253792d484123ad655ea0291072fcb674e5be45653a9.jpg) Specifications
DLAP-211-JNX
System Core
ProcessorJetson XavierTM NX
Memory8GB
eMMC16GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.04x Type A
AudioMic-in, line-out (Optional)
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM RS-232
CAN Bus1 CAN bus (2.0b)
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
M.2M.2 B key 3042 socket
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionM.2 B key support SATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x120(D)x49.1(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-301-Nano # AI-enabled Embedded NVR Powered by NVIDIA® Jetson Nano™ # Features ● NVIDIA® Jetson Nano™ processing/inference engine - Quad-core ARM® Cortex® -A57 MPCore processor - 128 NVIDIA CUDA® cores 8x PoE for IP cameras ● HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink Easy to maintain 2.5” SATA storage 12V DC input, AC adapter, AC-DC board ![The image displays a blue oval shape containing the word 'Preliminary' written in white, bold, sans-serif text. The text is slanted diagonally upwards from left to right. A thin, white curved line accents the bottom right edge of the blue oval.](.2021-gpu-solutions-brochure/a5d62e11d6d25cc21fd60753caf47fd093633164d313d9d98b10e2781ab63eaa.jpg) ![ADLINK H00 POWER USB 1.5 RECOVERY / RESET USB 2.3 EXT PW SW](.2021-gpu-solutions-brochure/ad829c12bd474a4a8644df1c927c700f27ae9dc4fff66595d7d6dda6fb4677ff.jpg) ![DIO 12V IN POE PORTS 1 2 3 4 5 6 7 8 #9G- COM1 COM2](.2021-gpu-solutions-brochure/da932dc072d87c9c84afc8933e637d560f4d5454ae06d56a0e7e1b602222f3aa.jpg) Specifications
DLAP-301-Nano
System Core
ProcessorNVIDIA® Jetson NanoTM
Memory4GB LPDDR4
eMMC16GB eMMC 5.1
Graphic Output
Graphic Output1x HDMI 2.0
Front Panel I/O Interface
USB 3.01x Type A
USB 2.0OTG
Graphic Output1 vertical HDMI connector
Rear Panel I/O Interface
Ethernet1x GbE
POE8x PoE (15W each, 10/100 Ethernet)
USB 3.02x Type A
Serial Port2x COM
DIO4x input/ 4x output w/ 1.5KV isolation
Storage Device
SATA Extention2.5" SATA SSD
Power Requirements
DC Input12V DC input
AC InputAC adapterAC-DC board
Fail ResetReset/recovery button
Power LED IndicatorPower Button
Mechanical
Dimensions210 x 170 x 55 (mm)
WeightTBD
MountingWall mount/ DIN-RAIL
Environmental
Operating TemperatureStandard: 0°C ~ +50°CExtended: -20°C ~ +70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C ~ +85°C
# DLAP-301-JNX # AI-enabled Embedded NVR Powered by NVIDIA® Jetson Xavier™ NX # Features NVIDIA® Jetson Xavier™ NX processing/inference engine - 6-core NVIDIA Carmel ARM® v8.2 64-bit CPU - 384-core NVIDIA Volta™ GPU with 48 Tensor Cores 8x PoE for IP cameras ● HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink ● Easy to maintain 2.5” SATA storage 12V DC input, AC adapter, AC-DC board ![The image displays a blue, tilted oval shape centered on a white background. Inside the oval, the word 'Preliminary' is written in white, sans-serif text that follows the upward curve of the shape. The oval has a glossy appearance with highlights on the left side. Vertical black bars frame the left and right edges of the image.](.2021-gpu-solutions-brochure/2c9bd81eebdc3a6e1063af696c24922569693fddf1acf082705196622d9fe4f8.jpg) ![ADLINK HDMI USB 3.5 RECOVERY WORLD USB 2.0 EXT PIN DW HDD](.2021-gpu-solutions-brochure/37b80f0407ef9008919250e8eab999c75e9f79b6ff193dac93d6f630d249bc9c.jpg) ![DIO 12V IN POE PORTS 1 2 3 4 5 6 7 8 8+G- COM1 COM2](.2021-gpu-solutions-brochure/5b155355a7e9e4eca926f6760aabc035e151beed816172b62aea776ae6994e96.jpg) Specifications
DLAP-301-JNX
System Core
ProcessorNVIDIA® Jetson XavierTM NX
Memory8GB LPDDR4
eMMC16GB eMMC 5.1
Graphic Output
Graphic Output1x HDMI 2.0
Front Panel I/O Interface
USB 3.01x Type A
USB 2.0OTG
Graphic Output1 vertical HDMI connector
Rear Panel I/O Interface
Ethernet1x GbE
POE8x PoE (15W each, 10/100 Ethernet)
USB 3.02x Type A
Serial Port2x COM
DIO4x input/ 4x output w/ 1.5KV isolation
Storage Device
SATA Extention2.5" SATA SSD
Power Requirements
DC Input12V DC input
AC InputAC adapterAC-DC board
Fail ResetReset/recovery button
Power LED IndicatorPower Button
Mechanical
Dimensions210 x 170 x 55 (mm)
WeightTBD
MountingWall mount/ DIN-RAIL
Environmental
Operating Temperature-20°C ~ +70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C ~ +85°C
# DLAP-401-Xavier # Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™ # Features Deep learning acceleration with NVIDIA Jetson AGX Xavier Compact system 150(W) x 145(D) x 85(H) mm. ● 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG Internal function expansions by M.2 E key 2230, M.2 B key 3042 ● 24V DC input Additional storage by M.2 B key 2242 Specifications
DLAP-401-Xavier
System Core
ProcessorNVIDIA® Jetson AGX XavierTM
MemoryOnboard 32GB
eMMC32GB on module
Graphic Output
Graphic Output1x HDMI
Front Panel I/O Interface
Ethernet2x GbE
USB 3.1 Type C1
CAN BUS1 CAN bus (2.0b)
Side Panel I/O Interface
USB 3.1 GEN13
Debug headerReset, Recovery, power button, power mode switch (Default set as Auto Power On)
Storage Device
eSATAeSATA + USB connector on the side
M.2M.2 B key 2242 for SATA SSD (optional 3042 to support LTE module)
Optional Interface
M.2 ExtensionM.2 E key 2230 for Wi-Fi
IMUBMI160 (optional)
Power Requirements
DC Input24V
AC InputOptional 160W adapter
Fail ResetRecovery / Reset
Mechanical
Dimensions150mm x 145mm x 85mm
WeightTBD
MountingWall mount
SMA Antenna2
Environmental
Operating Temperature0°C ~ +50°C
Operating Humidity~95% @40°C (non-condensing, optional with fanless solution)
Storage Temperature-40°C ~ +85°C
# ADLINK Technology, Inc. 9F, No.166 Jian Yi Road, Zhonghe District New Taipei City 235, Taiwan 新北市中和區建一路166號9樓 Tel: +886-2-8226-5877 Fax: +886-2-8226-5717 Email: service@adlinktech.com # Ampro ADLINK Technology, Inc. 6450 VIA DEL ORO, SAN JOSE, CA 95119-1208, USA Tel: +1-408-360-0200 Toll Free: +1-800-966-5200 (USA only) Fax: +1-408-600-1189 Email: info@adlinktech.com # ADLINK Technology Singapore Pte, Ltd. 84 Genting Lane #07-02A, Axxel Innovation Centre, Singapore 349584 Tel: +65-6844-2261 Fax: +65-6844-2263 Email: singapore@adlinktech.com # ADLINK Technology Singapore Pte. Ltd. (Indian Liaison Office) #50-56, First Floor, Spearhead Towers, Margosa Main Road (between 16th/17th Cross), Malleswaram, Bangalore - 560 055, India. Tel: +91-80-42246107, +91-80-23464606 Fax: +91 80 23464606 Email: india@adlinktech.com # ADLINK Technology Japan Corporation 〒101-0045 東京都千代田区神田鍛冶町3-7-4 ユニゾ神田鍛冶町三丁目ビル4F Unizo Kanda Kaji-cho 3 Chome Bldg. 4F, 3-7-4 Kanda Kajicho, Chiyoda-ku, Tokyo 101-0045, Japan Tel: +81-3-4455-3722 Fax: +81-3-5209-6013 Email: japan@adlinktech.com # ADLINK Technology Korea Ltd. 경기도 용인시 수지구 신수로 767 A동 1503호 (동천동, 분당수지유타워) (우) 16827 A-1503, U-TOWER, 767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, Republic of Korea, 16827 Toll Free: +82-80-800-0585 Tel: +82 31 786-0585 Fax: +82 31 786-0583 Email: korea@adlinktech.com # ADLINK Technology (China) Co., Ltd. 上海市浦东新区张江高科技园区芳春路300号 (201203) 300 Fang Chun Rd., Zhangjiang Hi-Tech Park Pudong New Area, Shanghai, 201203 China Tel: +86-21-5132-8988 Fax: +86-21-5192-3588 Email: market@adlinktech.com # ADLINK Technology Beijing 北京市海淀区上地东路1号盈创动力大厦E座801室(100085) Rm. 801, Power Creative E, No. 1 Shang Di East Rd. Beijing, 100085 China Tel: +86-10-5885-8666 Fax: +86-10-5885-8626 Email: market@adlinktech.com # ADLINK Technology Shenzhen 深圳市南山区科技园南区高新南七道数字技术园 A1栋2楼C区 (518057) 2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7 High-Tech Industrial Park S., Shenzhen, 518054 China Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: market@adlinktech.com # ADLINK Technology GmbH Hans-Thoma-Straße 11 D-68163 Mannheim, Germany Tel: +49 621 43214-0 Fax: +49 621 43214-30 Email: germany@adlinktech.com # ADLINK Technology, Inc. (French Liaison Office) 6 allée de Londres, Immeuble Ceylan 91940 Les Ulis, France Tel: +33 (0) 1 60 12 35 66 Fax: +33 (0) 1 60 12 35 66 Email: france@adlinktech.com # ADLINK Technology, Inc. (UK Liaison Office) First Floor West Exeter House, Chichester Fields Business Park Tangmere, West Sussex, PO20 2FU, United Kingdom Tel: +44-1243-859677 Email: UK@adlinktech.com # ADLINK Technology, Inc. (Israel Liaison Office) SPACES OXYGEN, 62 Medinat, Ha-yehudim st 4673300, Herzliya, Israel, P.O.Box – 12960 Tel: +972-54-632-5251 Fax: +972-77-208-0230 Email: israel@adlinktech.com ![The image features the AT&T logo against a white background. It consists of a red, upward-pointing triangle with curved horizontal white stripes running across its center. To the right of the logo is a registered trademark symbol (®).](.2021-gpu-solutions-brochure/ff219e34597f2cc380e9b433f9a925fbb299a426947e15cbac2d74443ea5d663.jpg) ADLINK Leading EDGE COMPUTING ![The image displays the NVIDIA logo on a black background. At the top is a green square containing a stylized black eye with a green outline. Below the graphic is the word 'NVIDIA' in white capital letters, followed by a small trademark symbol.](.2021-gpu-solutions-brochure/bc8f644f925b67e79f403b4193bfd8fbf3e7f5a3ef3e7a962bfb2fd9444eaac5.jpg) ELITE PARTNER ![The image displays a horizontal green banner featuring the NVIDIA Quadra Certified logo. On the left is a white square containing the NVIDIA eye symbol. To the right of the logo, the text 'NVIDIA QUADRO' appears in large white capital letters on the top line, with the word 'CERTIFIED' centered below it in smaller white capital letters.](.2021-gpu-solutions-brochure/b585582d6d5e1b7cf8e074dc468d480071a22f4629e625d7d643cff5d316e2db.jpg) [🔗 Link to the original document](.2021-gpu-solutions-brochure/2021-gpu-solutions-brochure.pdf) [🔗 Link to the original document](.2021-gpu-solutions-brochure/2021-gpu-solutions-brochure.md) [🔗 Link to the original document](.2021-gpu-solutions-brochure/2021-gpu-solutions-brochure.md)