ADLINK Edge AI Solutions # Deep Learning Acceleration Platforms Deliver the Optimal Mix of SWaP and AI Performance - Heterogeneous CPU - GPU Platforms - NVIDIA® Jetson™ - Enabled Edge AI Platforms - Graphics Solutions # DLAP # Table of Contents # Table of Contents.. .. III # About ADLINK . . . 01 # ADLINK Deep Learning Acceleration Platforms (DLAP) Deliver the Optimal Mix of SWaP and AI Performance .. 02 # DLAP-3000-CF Series. . . . 05 # DLAP-3100-CF Series. . . . 07 # DLAP-3200-CF Series. . . . 09 # DLAP-4000 Series. .. 11 # DLAP-8000 Series. . . . 13 # DLAP-201-JT2. . . . 15 # DLAP-211-Nano.. . . . 16 # DLAP-211-JNX.. . . . 17 # DLAP-301-Nano.. . . . 18 # DLAP-301-JNX... . . . 19 # DLAP-401-Xavier. . . . 20 # MXM Modules.. . . . 21 # PEG Cards.. . . . 22 ![ADLINK 01](.adlink-brochure-edge-ai-solutions-dlap-series/d959730b406b309568dc71d5f8167054ab788fff5aee17b41d1979e65115bf99.jpg) # About ADLINK ADLINK Technology, a global provider of leading edge computing solutions, is an NVIDIA® Quadro® Embedded Partner, Jetson™ Elite Partner, and OEM Preferred Partner and a Premier Member of the Intel® IoT Solutions Alliance. With deep industry experience in embedded systems and edge applications, ADLINK has formulated a hardware optimization strategy to enable edge computing and edge artificial intelligence (AI) deployment with GPUaccelerated, heterogeneous computing platforms. ![The image features the NVIDIA logo, which is a stylized eye. The graphic is divided vertically down the center. On the left side, a green curved shape is set against a white background. On the right side, a white curved shape is set against a green background. The two shapes join to form the complete eye.](.adlink-brochure-edge-ai-solutions-dlap-series/9cac696663f4d5c77dfcb72f206621efde584bfec58daf05e24005f9b5688c7c.jpg) NVIDIA. ![The image features the Intel logo, which consists of the lowercase word 'intel' in blue sans-serif font. A blue oval swoosh surrounds the text, curving from the top left over the 'i' and wrapping around the right side. A small registered trademark symbol (®) is positioned to the upper right of the letter 'l' against a white background.](.adlink-brochure-edge-ai-solutions-dlap-series/726e78357271534ba798d1d5bb86487ef6c553fb5870f8ca6ff6c19961036d73.jpg) loT Solutions Alliance Premier ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan, and China (Figure 1); an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485, and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166). Our products are currently available in over 40 countries across five continents and are supported by worldwide distribution networks and offices and more than 1,600 employees. ![ Region Value ------------ ----- Taiwan 100 Korea 80 Japan 70 China 60 Europe 50 South East Asia 40 ](.adlink-brochure-edge-ai-solutions-dlap-series/bf87386f5de1dca41c784c177614e4c2e08bb4485d9ab94e9c20a06cba06ba5a.jpg) Figure 1. ADLINK R&D and integration sites # DLAP # ADLINK Deep Learning Acceleration Platforms (DLAP) Deliver the Optimal Mix of SWaP and AI Performance # Powering AI in Edge Applications There is growing demand to perform image rendering, image analysis, compute acceleration, and artificial intelligence (AI) in many embedded market segments, including healthcare, manufacturing, maritime, aerospace, transportation, and gaming. AI technologies will also enable machines to improve their own performance and make insightful decisions, as is needed for autonomous manufacturing in the move to Industry 4.0. A trend in many industries is to transition from simple edge devices feeding data to the cloud for analysis to performing sophisticated inferencing and pattern-matching at the edge. Edge AI can respond faster than cloud AI by eliminating the need to send large data volumes to the cloud. Data security is also enhanced because less data is vulnerable to tampering as it is sent across networks. For mobile applications, edge AI reduces the reliance on unreliable network connections (i.e., dead zones, service outages) by performing AI functions locally. Some AI computing solutions are heterogeneous, meaning they use graphics processing units (GPUs) to speed up parallel task processing and CPUs to manage large amounts of data and run statistical computations. Compared to homogeneous systems (with either CPU or CPU), heterogeneous systems typically have better system responsiveness, but they also present some significant design challenges: Power consumption: GPU + CPU consumes more power than GPU or CPU z Form factor: GPU + CPU requires more space than GPU or CPU z Product availability: Many GPUs have relatively short life spans # ADLINK DLAP Series ADLINK’s experienced design team overcomes these challenges with the Deep Learning Acceleration Platforms (DLAP) Series, a set of compact, industrial-grade, and size, weight, and power (SWaP)-optimized platforms for AI-based applications. The DLAP series is designed for durability in harsh industrial and embedded environments, operating at extended temperature, shock, and relative-humidity ranges. These systems are built with long lifecycle products, including GPUs, to significantly extend their availability. The DLAP Series enables systems integrators, OEMs, and ODMs to lower development costs and shorten the time to market. Figure 1 shows the three categories of DLAP platforms, optimized for SWaP, AI processing, or both. # SWaP Choose from four compact units that contain an NVIDIA® Jetson™ supercomputer on a module. They are well-suited for AI-based inferencing and machine vision, and in some cases, autonomous machine control. # SWaP-Performance Optimized The DLAP 3000, 3100, and 3200 utilize Intel® Core™ processors and Mobile PCI Express Module (MXM) graphics cards to deliver compact, thermally-optimized, industrial designs with powerful inference capability. # High Performance The DLAP 4000 and 8000 are designed to handle heavy AI workloads, built with a server-grade Intel® Xeon® processor or an Intel® Core™ processor, and one or two dual-slot NVIDIA® Quadro® based PCI Express Graphics (PEG) cards. # Customization Services As an NVIDIA Quadro Embedded Partner, ADLINK can customize solutions for different embedded market segments, enabling customers to rapidly harness the power of AI at the edge. With long-term success in designing embedded modules, carrier boards, and systems, ADLINK can cater to individual projects by quickly developing edge AI platforms based on NVIDIA Quadro Embedded GPUs and Jetson modules. High Performance
Application ExamplesModelsSize (Liters)CPU OptionsGPU Performance (TFLOPS)GPU Form Factors
Object recognition for pick and place <img src="images/051547203e0d2cf94161add592c7082b50bb7ac37f8d13ab4e3c067d614ed98d.jpg"/>Edge serversDLAP-40009.9Intel® Xeon® or Intel CoreTM Processor130.5 (FP32)Full-Height, Full-Length PEG card
DLAP-800015>200 (FP32)
Mobile medical imaging Endoscopy systems <img src="images/0c0cf9df5074284f2b4c53309a1065129ee8beb42897b22d1a26bd6dabd7862b.jpg"/>DLAP-30003.2Intel® CoreTM Processor75.2 (FP32)MXM Type A/B/B+
DLAP-31003.2
DLAP-32005.6
Machine vision Edge autonomous systems <img src="images/5015562be505fad878295220f801a5f1565c5ae612d9cc6cf718be5d795d7621.jpg"/>DLAP-201-JT20.8NVIDIA® JetsonTM System on Module1.5 (FP16)NVIDIA® JetsonTM System on Module
DLAP-211-JNX0.96 (FP16)
DLAP-211-Nano0.90.5 (FP16)
DLAP-301-JNX2.06 (FP16)
DLAP-301-Nano2.00.5 (FP16)
DLAP-401-Xavier1.85.5-11 (FP16)
Figure 1. ADLINK DLAP Series Low SWaP # DLAP Series in Action ![The image displays a white line-art icon on a dark background. It features a rectangular serving tray with rounded ends. Inside the tray, arranged horizontally from left to right, are a fork, a circular plate, and a knife.](.adlink-brochure-edge-ai-solutions-dlap-series/ae56d3403cea20f33cebcd87ee8844812ad8a2d9365570d58a8b0805f97227e4.jpg) # Cashierless Cafeteria An AI-based, cashierless checkout system scans all items on a customer’s tray and requests contactless payment for the total amount in less than 1.5 seconds. ![This image displays a white line-art icon on a dark background. On the left side, there is a vertical rectangular shape with horizontal lines, resembling a document or list. To the right of this shape is a magnifying glass. The magnifying glass features a vertical rectangular handle connected to a large circular lens frame. Inside the circular frame, there are white dashed lines forming a triangle pointing downwards.](.adlink-brochure-edge-ai-solutions-dlap-series/e288fae808b93d5ac301f648bc0221d4868df41e0be4712669c3213fac67c236.jpg) # Mobile Medical Imaging An all-in-one mobile C-ARM provides sharp, detailed medical images and maneuverability to doctors. # Deep-Learning Consultancy Services ADLINK offers consultancy services via deep learning profiling to help users determine the right hardware platform to cost-effectively satisfy t h e i r p e r f o r m a n c e a n d S W a P requirements. Taking into account the types of neural networks (e.g., AlexNet and MobileNet), batch size, and other inputs, ADLINK’s profiling tool models the performance of computing platforms. The tool runs these inputs against a large database of AI and deep learning accelerators, and generates statistics, such as inferences per second; performance per watt; and performance per dollar, for popular neural networks. # Why ADLINK The ADLINK DLAP Series gives system developers the flexibility they need to cost-effectively achieve the right mix of SWaP and AI performance. They can choose from a wide variety of CPUs, GPU modules and cards, form factors, and power consumption ranges to satisfy their specific application requirements. DLAP is designed for the embedded market, meaning the products are compact, industrial-grade, thermally-optimized, and supported with an extended lifecycle. With the DLAP series, there is no need to buy a server to run AI inferencing, facial recognition, object detection, or other AI-based applications at the edge. ![Illustration of a glowing brain-shaped circuit board emerging from a starry space, with additional hardware units and server racks in the background (no text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/6f90ec267e8ca780e5591b435f531844d4e3cea7e1b4d6f821bade6be0b08df2.jpg) ![A white line drawing of a truck on a dark background. The vehicle faces right and consists of a cab with a window and a roof light, followed by a rectangular cargo bed containing five vertical lines. It has three wheels and a curved plow blade attached to the front.](.adlink-brochure-edge-ai-solutions-dlap-series/27d898fd55f46db9873fc8b73b632523a568c231732b888e5ef43a22c1b93e49.jpg) # Snow Plowing Vision An AI-enabled vision system identifies living or inanimate objects in the road and alerts the snow plow driver before a collision may occur. ![A white line drawing on a dark background depicts a stylized car in profile facing left, featuring a boxy body, a window, and two wheels, with horizontal lines above suggesting motion.](.adlink-brochure-edge-ai-solutions-dlap-series/b0d75ab2101e52cdd24896d27d37280447136a7c4d04b369077ae8c03eb1822b.jpg) # Sushi Express Checkout An AI-enabled vision system monitors the sushi plates customers pick off a conveyer belt and presents them the bill for autopayment. ![The image features a white line drawing of a robotic vehicle or rover set against a dark blue background. The vehicle has a rectangular body with large, round wheels. A vertical stalk rises from the top of the body, supporting a rectangular sensor or camera unit. Dashed lines extend horizontally to the right from this unit, indicating a beam of vision, laser scanning, or a field of view.](.adlink-brochure-edge-ai-solutions-dlap-series/b7019d8fa173129e9637fcf45969ba39252b2f762729526364da5f1533f72f20.jpg) # Logistics Automation An AI-guided autonomous transport robot employs simultaneous localization and mapping (SLAM) and 3D pose estimations to navigate challenging logistics environments. # DLAP-3000-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module ● Reliable Molex type 12V DC-in connector . 1x Intel® i219-LM and 3x Intel® i210-AT ![Back view of a black ADLINK network device with ports and connectors (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/a8a2681cb02fc5cdacf08f134d121ba4d5bf4c6befdd807486b7f5b11262560b.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO 91-95266-0010 Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3000-CFP1EGX-MXM-P1000H31012V
DLAP-3000-CFP2EGX-MXM-P2000H31012V
DLAP-3000-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)H31012V
DLAP-3000-CFP3EGX-MXM-P3000H31012V
DLAP-3000-CFP5EGX-MXM-P5000H31012V
DLAP-3000-CFP35EGX-MXM-P3000/5000(not incl.)H31012V
DLAP-3000-CFT1EGX-MXM-T1000H31012V
DLAP-3000-CFT3EGX-MXM-RTX3000H31012V
Specifications
ModelDLAP-3000-CFP1DLAP-3000-CFP2DLAP-3000-CFT1DLAP-3000-CFT3DLAP-3000-CFP3DLAP-3000-CFP5
DLAP-3000-CFP12*DLAP-3000-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® H310 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB4x USB 3.1 Gen1 x1 ports, 4x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module
Digital IODefault: w/o DIOOptional: 1x DI/DO with 4 in, 4 outNote: Optional DIO, Audio and TPM 2.0 must be chosen together.
AudioDefault: w/o AudioOption 1: Mic-in, Line-out, Line-inOption 2: Mic-in, L/R speaker-out (6W + 6W)Option 3: Line-in, L/R speaker-out (6W + 6W)
TPM 2.0Default: w/o TPM
eSIMOptional
Storage
SATA2x 2.5" SATA 6Gb/s external drive bays1x SATA 6Gb/s signal via M.2 B key connector
Mechanical
Dimensions235 x 182 x 75mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
\*Note: These models do not include an MXM graphics module. # DLAP-3100-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module ● Reliable Molex type 12V DC-in connector ● 1x Intel® i219-LM) and 5x Intel® i210-AT ![Back view of a black ADLINK network device with ports and connectors (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/94e8ae0ec4b27e708ecb8bad03d352a690240b3963b0fee96d4dad4dcbe33568.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3100-CFP1EGX-MXM-P1000Q37012V
DLAP-3100-CFP2EGX-MXM-P2000Q37012V
DLAP-3100-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)Q37012V
DLAP-3100-CFP3EGX-MXM-P3000Q37012V
DLAP-3100-CFP5EGX-MXM-P5000Q37012V
DLAP-3100-CFP35EGX-MXM-P3000/5000 (not incl.)Q37012V
DLAP-3100-CFT1EGX-MXM-T1000Q37012V
DLAP-3100-CFT3EGX-MXM-RTX3000Q37012V
Specifications
ModelDLAP-3100-CFP1DLAP-3100-CFP2DLAP-3100-CFT1DLAP-3100-CFT3DLAP-3100-CFP3DLAP-3100-CFPS
DLAP-3100-CFP12*DLAP-3100-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® Q370 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 5x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB6x USB 3.1 Gen1x1 ports, 2x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
Digital IO1x DI/DO with 4 in, 4 out
AudioMic-in, L/R speaker-out (6W + 6W)
TPM 2.0Yes
eSIMOptional
Storage
SATA2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel® RST RAID Support
Mechanical
Dimensions235 x 182 x 75mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
\*Note: These models do not include an MXM graphics module. # DLAP-3200-CF Series Embedded System supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features ● ADLINK MXM Graphics module support (Type A/B, up to 120W) ● 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor ● Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU) ● DisplayPort (2 from CPU, 4 from MXM) ● 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module ● Reliable Molex type 12V DC-in connector ● 1x Intel® i219-LM and 3x Intel® i210-AT ● 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support ![Front view of a black ACLink device chassis with ports, connectors, and ventilation grilles (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/078037e158b50c479ffd1d781d9a0ced76d64569b5a0880cd9012a8c0d696f22.jpg) # Software Support ● Win10 IoT Enterprise SAC 64bit ● Ubuntu 18.04.1 LTS 64bit # Optional Accessories . CPU cooler: 32-20495-0000 . CPU cooler bracket 32-50015-0100-A0 . MXM cooler for P1000/P2000: 32-20797-0200-A0 . MXM cooler for P3000/P5000: 32-20823-0020-A0 . MXM cooler for T1000: 32-20830-0200-A0 . MXM cooler for RTX3000: 32-20823-1100-A0 ● 12V/240W adaptor: 31-62164-0010-A0 ● Wall Mount Bracket 34-34546-0000-A0 2pcs . Wifi Kit INTEL AC9260 Non-VPRO Ordering Information
ModelMXM SupportChipsetDC-in
DLAP-3200-CFP1EGX-MXM-P1000Q37012V
DLAP-3200-CFP2EGX-MXM-P2000Q37012V
DLAP-3200-CFP12EGX-MXM-P1000/2000/T1000/RTX3000 (not incl.)Q37012V
DLAP-3200-CFP3EGX-MXM-P3000Q37012V
DLAP-3200-CFP5EGX-MXM-P5000Q37012V
DLAP-3200-CFP35EGX-MXM-P3000/5000(not incl.)Q37012V
DLAP-3200-CFT1EGX-MXM-T1000Q37012V
DLAP-3200-CFT3EGX-MXM-RTX3000Q37012V
Specifications
ModelDLAP-3200-CFP1DLAP-3200-CFP2DLAP-3200-CFT1DLAP-3200-CFT3DLAP-3200-CFP3DLAP-3200-CFP5
DLAP-3200-CFP12*DLAP-3200-CFP35*
MXM SupportEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-P3000EGX-MXM-P5000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® Celeron® G4900, 3.1GHz, 2M Cache, 54W TDP, LGA1151, DDR4 2400MHz support (2C/2T) Intel® Celeron® G4900T, 2.9GHz, 2M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (2C/2T)
ChipsetIntel® Q370 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 64GB (dependent on CPU)
I/O Interfaces
Display6x DisplayPort (2 from CPU, 4 from MXM)
Ethernet1x GbE (Intel® i219-LM), 3x GbE (Intel® i210-AT)
Serial Ports1x RS-232/422/485, 1x RS-232
USB6x USB 3.1 Gen1x1 ports, 2x USB 2.0 ports
M.21x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
Digital IO1x DI/DO with 4 in, 4 out
AudioMic-in, L/R speaker-out (6W + 6W)
TPM 2.0Yes
eSIMOptional
Expansion slot2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
Storage
SATA2x SATA 6Gb/s, one SATA power connector 2x SATA 6Gb/s signals via M.2 M & B key connector Intel® RST RAID Support
Mechanical
Dimensions235 x 182 x 130mm (W x D x H, without foot pads)
MountingOptional wall-mount bracket
Power Supply
DC InputDC 12V input (Molex DC-in jack)
AC InputOptional: 240W (12V/20A) AC/DC adapter
Environmental
Operating Temperature0°C to 50°C (W/MXM, W/SSD)
Storage Temperature-20°C to 60°C
Humidity5% to 95%, non-condensing
EMCEN55032/EN55035
SafetyUL/cUL and CB
# DLAP-4000 Series Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket # Features NVIDIA® Quadro® PEG card support ● 8th/9th Gen Intel® Core™ i7/i5/i3 processor ● Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU) ● 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards ● 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module, 1x M.2 M key supporting 2280 SATA SSD module, 1x PCIe x16 slot for PEG card ● 300W/500W Flex ATX PSU ![Interior view of a computer setup showing external hardware and a central UADRO device (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/9078b538df7c5b029411e9344c6731446ee56897f37053c829bb646fe5be6623.jpg) ![Back view of a black ADLINK desktop computer chassis with ports and ventilation slots (no visible text or labels)](.adlink-brochure-edge-ai-solutions-dlap-series/837ab441a66c108e633346706be968a34fa8fb087536f7d34da5cfd594c3c87c.jpg) # Software Support ● Windows 10 IoT Enterprise CBB 64-bit ● Ubuntu 16.04 LTS # Optional Accessories ● 3.5" SATA HDD, 2.5" SATA SSD/HDD, M.2 2280 SATA SSD ● Wireless Module Wi-Fi/Bluetooth or 4G LTE wireless kit (w/ antenna) Ordering Information
ModelCPUMemory
DLAP-4001/M8G/[PEG]Intel® CoreTM i7-9700E8GB non-ECC DDR4
DLAP-4002/M8G/[PEG]Intel® CoreTM i5-9500E8GB non-ECC DDR4
DLAP-4003/M8G/[PEG]Intel® CoreTM i3-9100E8GB non-ECC DDR4
DLAP-4004/M8G/[PEG]Intel® CoreTM i7-9700TE8GB non-ECC DDR4
DLAP-4005/M8G/[PEG]Intel® CoreTM i5-9500TE8GB non-ECC DDR4
DLAP-4006/M8G/[PEG]Intel® CoreTM i3-9100TE8GB non-ECC DDR4
DLAP-4007/M8G/[PEG]Intel® CoreTM i7-87008GB non-ECC DDR4
DLAP-4008/M8G/[PEG]Intel® CoreTM i5-85008GB non-ECC DDR4
DLAP-4009/M8G/[PEG]Intel® CoreTM i3-81008GB non-ECC DDR4
DLAP-400A/M8G/[PEG]Intel® CoreTM i7-8700T8GB non-ECC DDR4
DLAP-400B/M8G/[PEG]Intel® CoreTM i5-8500T8GB non-ECC DDR4
DLAP-400C/M8G/[PEG]Intel® CoreTM i3-8100T8GB non-ECC DDR4
PEG Card Options
PEGModelPowerCUDA® CoresGraphics Memory
P2200NVIDIA® Quadro® P220075W1280GDDR5 5GB
RTX4000NVIDIA® Quadro® RTX 4000160W2304GDDR6 8GB
RTX5000NVIDIA® Quadro® RTX 5000265W3072GDDR6 16GB
RTX6000NVIDIA® Quadro® RTX 6000295W4608GDDR6 24GB
RTX8000NVIDIA® Quadro® RTX 8000295W4608GDDR6 48 GB
Specifications
ModelDLAP-4000
ProcessorIntel® CoreTM i7-9700E, 2.6GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500E, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100E, 3.1GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (4C/4T) Intel® CoreTM i7-9700TE, 1.8GHz, 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (8C/8T) Intel® CoreTM i5-9500TE, 2.2GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-9100TE, 2.2GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (4C/4T) Intel® CoreTM i7-8700, 3.2GHz, 12M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500, 3.0GHz, 9M Cache, 65W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100, 3.6GHz, 6M Cache, 65W TDP, LGA1151, DDR4 2400MHz support (4C/4T) Intel® CoreTM i7-8700T, 2.4GHz 12M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/12T) Intel® CoreTM i5-8500T, 2.1GHz, 9M Cache, 35W TDP, LGA1151, DDR4 2666MHz support (6C/6T) Intel® CoreTM i3-8100T, 3.1GHz, 6M Cache, 35W TDP, LGA1151, DDR4 2400MHz support (4C/4T)
ChipsetIntel® H310 Chipset
MemoryNon-ECC DDR4 2666/2400MHz, 2x SO-DIMM, up to 32GB (dependent on CPU) system memory
PEG Card SupportNVIDIA® Quadro® P2200NVIDIA® Quadro® RTX 4000NVIDIA® Quadro® RTX 5000NVIDIA® Quadro® RTX 6000NVIDIA® Quadro® RTX 8000
I/O Interfaces
Display1x DVI-D connector (rear), resolution up to 1920 x 1200 @ 60 Hz1x DP connector (rear), resolution up to 4096 x 2304 @ 60 Hz1x HDMI connector (rear) resolution up to 4096 x 2160 @ 30 HzAdditional display output from PEG cards
Ethernet2x GbE (Realtek RTL8111G)
Serial Ports1x RS-232/422/485, 4x RS-232
USB4x USB 3.1 Gen1 ports, 2x USB 2.0 ports
DIO1x 8-bit GPIO
Mini PCIe1x Mini PCIe slot (USB 2.0 and PCIe x1)
M.21x M.2 M key (SATA 6Gb/s)
Expansion Slot1x PCIe x16 slot
AudioMic-in, Line-out, Line-in
TPM 2.0Optional
Storage
2.5" SATA2x 2.5" SATA 6Gb/s internal drive bays
Mechanical
Dimensions220 x 300 x 150 mm (W x D x H)
Power Supply
AC Input100 to 240 VAC
Output Rating300W500W500W500W500W
Environmental
Operating Temperature0°C to 50°C0°C to 50°C0°C to 40°C0°C to 40°C0°C to 40°C
Storage Temperature-20°C to 60°C
Humidity5% to 90%, non-condensing
VibrationOperating: 1Grms, 5-500Hz, 3 axes (with 2.5" SSD and PEG card)Non-operating: 2Grms, 5-500Hz, 3 axes
ShockOperating: 20G, 11ms duration, half sineNon-operating: 30G, 11ms duration, half sine
EMCEN55032/35, EN61000-6-2/-4, CE, FCC Part 15B Class B
SafetyUL/cUL, CB
# DLAP-8000 Series # 9th Gen Intel® Xeon® , Core™ i7/i5/i3-Based Compact Industrial GPU Workstation # Features ● 9th Gen Intel® Xeon® , Core™ i7/i5/i3 LGA processors with workstation C246 chipset ● Dual SODIMMs for up to 64GB DDR4 / ECC options\* ● Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0 ● 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0 ● Rich storage: • Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280 ● Embedded expansion: 1x Mini PCIe, 1x M.2 key B+M 2280/3042, 2x USIM ● Front accessible I/O and adaptive Function Module v.2 option Flexible and powerful PCIe expansions via backplane • 2x FHFL PCI Express cards (e.g. Quadro RTX 8000) accommodation w/ AUX power inlets • PCIe x8, x1, x4, x8, and x4 signals with physical x16, x4, x8, x16, and x8 slots ● Optional AC or DC SKUs in power inputs \*Available on Xeon/i3 SKUs ![Front view of a black rack-mounted server with visible ports, connectors, and ventilation slots (no readable text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/32f71e27a801ed8e8dc9f29defc00c3aac68862e7883ffce33df3233ce7d6a45.jpg) ![Interior view of a black server rack with exposed internal components including a green circuit board and drive bays (no text or labels visible)](.adlink-brochure-edge-ai-solutions-dlap-series/28c45a1870ef421c54b694ba646b3e82333759ccb20ea5a9a7088d6850ba1ffc.jpg) # Software Support ● Windows 10 IoT Enterprise CBB 64-bit ● Linux Ubuntu 18.04 # Optional Accessories 2.5" SSD, HDD, M.2, CFast Storage ● Wireless Module Wi-Fi, BT, 3G, 4G LTE, wireless kit (w/ antenna) Ordering Information
ModelCPUExpansion Slots2.5” SATA
DLAP-800X-DC /M16GIntel® Xeon® E2278GE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-800X-AC/M16GIntel® Xeon® E2278GE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8001-DC/M8GIntel® CoreTM i7-9700TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8001-AC/M8GIntel® CoreTM i7-9700TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8002-DC/M8GIntel® CoreTM i5-9500TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8002-AC/M8GIntel® CoreTM i5-9500TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8003-DC/M8GIntel® CoreTM i3-9100TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
DLAP-8003-AC/M8GIntel® CoreTM i3-9100TE2 PCIe x8 + 2 PCIe x4 + 1 PCIe x14
Specifications
ModelDLAP-800XDLAP-8001DLAP-8002DLAP-8003
System Core
ProcessorIntel® Xeon®E-2278GE 80WIntel® CoreTMi7-9700TE 35WIntel® CoreTMi5-9500TE 35WIntel® CoreTMi3-9100TE 35W
Core #8864
Base Freq.3.3 GHz2.6 GHz2.2 GHz2.2 GHz
MAX Turbo Freq.4.7 GHz4.4 GHz3.6 GHz3.2 GHz
ChipsetWorkstation Intel® C246
Memory4GB DDR4 2400MHz, dual SODIMMs, up to 64GBOptional: 8, 16, 32GB DDR4 ECC 2400MHz (Xeon® and i3 support ECC)
Display2x DP++ and 1x DVI-I
I/O Interfaces
Ethernet3x Intel® GbE: 2x i211AT + 1x i219iAMT support
Serial PortsCOM1/2: RS-232/422/485, COM3/4: RS-232
USB2x USB 3.1 Gen 2 + 1x USB 3.1 Gen 1 + 3x USB 2.0, 1x internal USB 2.0 dongle
AudioLine-out, Mic-in (Optional: speaker-out)
Mini PCIe1x Full size (USB 2.0 + PCIe)
M.21x socket, key B+M, 2280/3042: USB 3.1 Gen 1, SATA 6 Gb/s and PCIe x2
USIM2 (1 for Mini PCIe and 1 for M.2)
DI/O8-ch DI and 8-ch DO
I2C2 (3.3V & 5V)
TPM 2.0Supported
Expansion SlotsPhysical: 2x PCIe x16, 2x PCIe x8, 1x PCIe x4;Signal: 2x PCIe x8, 2x PCIe x4, 1x PCIe x1
Storage Devices
2.5" SATA4x external swappable trays (supports RAID 0, 1, 5, 10)
CFast1x Type II
Mechanical
Dimensions210 (W) x 210 (D) x 350 (H) mm (8.27" x 8.27" x 13.8")
Weight7kg for PC sku, 10kg for AC sku
MountingWall mount
Power Supply
DC Input24 Vdc
AC InputOptional AC SKU for 90-260 Vac
Environmental
Operating TemperatureStandard: 0°C to 50°C
Storage Temperature-40°C to 85°C (-40°F to 185°F) (excluding storage)
Humidity~95% @ 40°C (104°F) (non-condensing)
VibrationOperating: 3 Grms, 5-500 Hz, 3 axes (w/ SSD/CFast)Operating: 0.1 Grms, 5-500 Hz, 3 axes (w/ HDD)
ShockOperating: 30 Grms, half sine 11ms duration (w/ SSD/CFast)
ESDContact ±4KV, Air ±8KV
EMCEN61000-6-4/-2, CE & FCC Class A
SafetyUL/cUL, CB, CCC
# DLAP-201-JT2 # NVIDIA® Jetson™ TX2 Edge Inference Platform # Features Deep learning acceleration with NVIDIA® Jetson™ TX2 Compact fanless system 148(W)x105(D)x50(H)mm ● Wide temperature range from -20°C to 70°C ![Front view of a black ADLINK network device with heat sinks and ports (no visible text or symbols on main body)](.adlink-brochure-edge-ai-solutions-dlap-series/9b9c6d6e9779ef843f82fda7da328e05f62019facd3309867bdb9f6269cf4d84.jpg) ![Black industrial electronic device with heat sinks and ports (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/1f19a5ba7ecb55052d89f0fb75966239dc77c66d95fa50ae70d251b88b54cb9b.jpg) Specifications
DLAP-201-JT2
System Core
ProcessorNVIDIA® JetsonTM TX2
Memory8GB
eMMC32GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.03x Type A
AudioMic-in, line-out (Optional)
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM
CAN Bus1 CAN bus (2.0b)
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionmSATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
CMOS Battery
HolderBR2032
ProtectionReverse charge protection
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x105(D)x50(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-211-Nano # NVIDIA® Jetson Nano™ Edge Inference Platform # Features Deep learning acceleration with NVIDIA® Jetson Nano™ Compact fanless system 148(W)x120(D)x49.1(H)mm Wide temperature range from -20°C to 70°C ![The image displays a blue, tilted oval shape containing the white word 'Preliminary' in a sans-serif font.](.adlink-brochure-edge-ai-solutions-dlap-series/3ea83a56edd71834e665efa9e68ecbd946ff531d446f5d264fa708c5824a3c44.jpg) ![Front view of a black ADLINK network device with multiple ports and ventilation grilles (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/bbd57aa96d0f8620f3b601938cc8dd4115d4ad1dc9d52ed8c0d67b99623edfe7.jpg) ![Black electronic device with heat sinks and ports (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/91910df30d54ae1cc55237c197b3bb2dee8d9f031634883bec18a361fb48a9f5.jpg) Specifications
DLAP-211-Nano
System Core
ProcessorNVIDIA® Jetson NanoTM
Memory4GB
eMMC16GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.04x Type A
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM RS-232
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
M.2M.2 B key 3042 socket
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionM.2 B key support SATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x120(D)x49.1(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-211-JNX # Jetson Xavier™ NX Edge Inference Platform # Features ● Deep learning acceleration with Jetson Xavier™ NX Compact fanless system 148(W)x120(D)x49.1(H)mm ● Wide temperature range from -20°C to 70°C ![The image displays a graphic logo on a white background. It features the word 'Preliminary' written in white, sans-serif capital letters. The text is centered inside a blue, horizontally oriented oval and follows its curvature. Beneath the bottom right edge of the main oval, there is a curved blue swoosh or arc.](.adlink-brochure-edge-ai-solutions-dlap-series/b86a7c8c630858a229a32ceb912e4bad284bd98a4d6bebf7abf36ef7288b7ef5.jpg) ![Front view of a black industrial device with heat sinks and ports (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/beeb7a8a79fd7129681b53b30b04d13b63cb677964505f134abdf97eae3d52ea.jpg) ![Black industrial electronic device with heat sinks and ports (no visible text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/a36ec54cf195bcbee7700f2c0368075976d160a6698710cc3292fba82f63ea16.jpg) Specifications
DLAP-211-JNX
System Core
ProcessorJetson XavierTM NX
Memory8GB
eMMC16GB
Graphic Output
Graphic Output1 HDMI 2.0 (w. lock)
Front Panel I/O Interface
Ethernet2x GbE
USB 3.04x Type A
AudioMic-in, line-out (Optional)
Rear Panel I/O Interface
USB 2.01x OTG
Serial Port1x COM RS-232
CAN Bus1 CAN bus (2.0b)
Internal I/O Interface
Mini PCIe1x PCIe mini-card slot
M.2M.2 B key 3042 socket
USIM1x USIM slot
DIO4 channel DIO
Debug Port1x debug console
Storage Device
SATA ExtensionM.2 B key support SATA
SD Card1x SD
Power Requirements
DC Input12V
AC InputOptional 60 W AC-DC adapter
Fail ResetReset/recovery button
Power LED IndicatorPower button
Mechanical
Antenna Hole4 x SMA
Dimensions148(W)x120(D)x49.1(H)mm
WeightTBD
IP GradeIP40
MountingWall mount & VESA & din rail
Environmental
Operating TemperatureStandard -20°C~70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C~85°C
# DLAP-301-Nano # AI-enabled Embedded NVR Powered by NVIDIA® Jetson Nano™ # Features ● NVIDIA® Jetson Nano™ processing/inference engine - Quad-core ARM® Cortex® -A57 MPCore processor - 128 NVIDIA CUDA® cores 8x PoE for IP cameras ● HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink Easy to maintain 2.5” SATA storage 12V DC input, AC adapter, AC-DC board ![The image features a blue oval shape with the word 'Preliminary' written in white, sans-serif font across the center. The text is slanted upwards. A white curved line follows the bottom edge of the blue oval.](.adlink-brochure-edge-ai-solutions-dlap-series/e266479cac4f62db699fe514668f1a6350c2b2a7d2ee118fc7a17e2e5a072194.jpg) ![ADLINK H00 H00B USB 13 RECORDER RESET USB 24 EXT PM SW](.adlink-brochure-edge-ai-solutions-dlap-series/89697644a59025de77ad0d9d4104fd3f6afb23be34bd61038d1bb8394d3307f4.jpg) ![DIO POE PORTS SPC COM1 COM2 12V IN 5 6 7 8](.adlink-brochure-edge-ai-solutions-dlap-series/52cf73dea300cc9dad87388312de92768b567636f5f133550da4bbb1a5b32e62.jpg) Specifications
DLAP-301-Nano
System Core
ProcessorNVIDIA® Jetson NanoTM
Memory4GB LPDDR4
eMMC16GB eMMC 5.1
Graphic Output
Graphic Output1x HDMI 2.0
Front Panel I/O Interface
USB 3.01x Type A
USB 2.0OTG
Graphic Output1 vertical HDMI connector
Rear Panel I/O Interface
Ethernet1x GbE
POE8x PoE (15W each, 10/100 Ethernet)
USB 3.02x Type A
Serial Port2x COM
DIO4x input/ 4x output w/ 1.5KV isolation
Storage Device
SATA Extention2.5" SATA SSD
Power Requirements
DC Input12V DC input
AC InputAC adapterAC-DC board
Fail ResetReset/recovery button
Power LED IndicatorPower Button
Mechanical
Dimensions210 x 170 x 55 (mm)
WeightTBD
MountingWall mount/ DIN-RAIL
Environmental
Operating TemperatureStandard: 0°C ~ +50°CExtended: -20°C ~ +70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C ~ +85°C
# DLAP-301-JNX # AI-enabled Embedded NVR Powered by NVIDIA® Jetson Xavier™ NX # Features NVIDIA® Jetson Xavier™ NX processing/inference engine - 6-core NVIDIA Carmel ARM® v8.2 64-bit CPU - 384-core NVIDIA Volta™ GPU with 48 Tensor Cores 8x PoE for IP cameras ● HDMI, 8-bit digital inputs/outputs, 2x COM, 3x USB, 1x GbE for uplink ● Easy to maintain 2.5” SATA storage 12V DC input, AC adapter, AC-DC board ![The image features a blue, elongated oval shape tilted slightly upward to the right. Inside the blue background, the word 'Preliminary' is written in white, sans-serif capital letters. A faint white curved line appears near the bottom edge of the blue shape.](.adlink-brochure-edge-ai-solutions-dlap-series/7cb9242d6de7310bebfe591ca10b4d395e69ae91464dd764e5b2e36ca45621c2.jpg) ![ADLINK HDMI USB 1.0 RECOVERY POINT USB 2.0 EXT PW DV HDD](.adlink-brochure-edge-ai-solutions-dlap-series/4b517f144256279a0147086983dd60e58dbd3d9465c9b739c7f163614e9c51f9.jpg) ![Front view of a network device rear panel showing ports, connectors, and ventilation slots (no readable text or symbols)](.adlink-brochure-edge-ai-solutions-dlap-series/15651ed36bc04afaab8f73ec8120ea4796883baaa4231b21474029fc2b7f90e6.jpg) Specifications
DLAP-301-JNX
System Core
ProcessorNVIDIA® Jetson XavierTM NX
Memory8GB LPDDR4
eMMC16GB eMMC 5.1
Graphic Output
Graphic Output1x HDMI 2.0
Front Panel I/O Interface
USB 3.01x Type A
USB 2.0OTG
Graphic Output1 vertical HDMI connector
Rear Panel I/O Interface
Ethernet1x GbE
POE8x PoE (15W each, 10/100 Ethernet)
USB 3.02x Type A
Serial Port2x COM
DIO4x input/ 4x output w/ 1.5KV isolation
Storage Device
SATA Extention2.5" SATA SSD
Power Requirements
DC Input12V DC input
AC InputAC adapterAC-DC board
Fail ResetReset/recovery button
Power LED IndicatorPower Button
Mechanical
Dimensions210 x 170 x 55 (mm)
WeightTBD
MountingWall mount/ DIN-RAIL
Environmental
Operating Temperature-20°C ~ +70°C
Operating Humidity~95% @40°C (non-condensing)
Storage Temperature-40°C ~ +85°C
# DLAP-401-Xavier # Edge AI platfom Powered by NVIDIA® Jetson AGX Xavier™ # Features Deep learning acceleration with NVIDIA Jetson AGX Xavier Compact system 150(W) x 145(D) x 85(H) mm. ● 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG Internal function expansions by M.2 E key 2230, M.2 B key 3042 ● 24V DC input Additional storage by M.2 B key 2242 Specifications
DLAP-401-Xavier
System Core
ProcessorNVIDIA® Jetson AGX XavierTM
MemoryOnboard 32GB
eMMC32GB on module
Graphic Output
Graphic Output1x HDMI
Front Panel I/O Interface
Ethernet2x GbE
USB 3.1 Type C1
CAN BUS1 CAN bus (2.0b)
Side Panel I/O Interface
USB 3.1 GEN13
Debug headerReset, Recovery, power button, power mode switch (Default set as Auto Power On)
Storage Device
eSATAeSATA + USB connector on the side
M.2M.2 B key 2242 for SATA SSD (optional 3042 to support LTE module)
Optional Interface
M.2 ExtensionM.2 E key 2230 for Wi-Fi
IMUBMI160 (optional)
Power Requirements
DC Input24V
AC InputOptional 160W adapter
Fail ResetRecovery / Reset
Mechanical
Dimensions150mm x 145mm x 85mm
WeightTBD
MountingWall mount
SMA Antenna2
Environmental
Operating Temperature0°C ~ +50°C
Operating Humidity~95% @40°C (non-condensing, optional with fanless solution)
Storage Temperature-40°C ~ +85°C
# MXM Modules MXM GPU Modules with NVIDIA Turing™ Architecture
Model NameEGX-MXM-T1000EGX-MXM-RTX3000EGX-MXM-RTX5000
<img src="images/10fde341bdec81dc7310af49f56480f469bbd9dcf1f0c5cfd4f697b23a7a2f34.jpg"/><img src="images/3a7cc2cc1a3ad4938a368398d07d870a03a4deb7201b74d77d7c67bc6260f295.jpg"/><img src="images/d54a2f6eaf2df099d36e95d1e99dafd7e855ef956c35bd546d3fe39e9e216f2a.jpg"/>
Graphic Core
GPUQuadro® T1000Quadro® RTX3000Quadro® RTX5000
Memory4GB GDDR6 memory, 128-bit,Bandwidth: 192 GB/s6GB GDDR6 memory, 192-bit,Bandwidth: 336 GB/s16GB GDDR6 memory, 256-bit,Bandwidth: 448 GB/s
GPGPU Computing
CUDA Cores896 CUDA® cores,2.6 TFLOPS Peak FP32 performance1920 CUDA® cores,5.3 TFLOPS Peak FP32 performance3072 CUDA® cores,9.4 TFLOPS Peak FP32 performance
Tensor Cores-240 Tensor Cores384 Tensor Cores
Compute APICUDA Toolkit 8.0 and above, CUDA Compute version 6.1 and above, OpenCLTM 1.2
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX® 12, Vulkan 1.0
Display
Display Outputs4x DisplayPort 1.4a digital video outputs4K at 120Hz or 8K at 60Hz4x DisplayPort 1.4b digital video outputs4K at 120Hz or 8K at 60Hz
InterfaceMXM 3.1, PCI Express 3.0 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm82 (W) x 105 (D) x 4.8 (H) mm82 (W) x 110 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type AStandard MXM 3.1 Type BStandard MXM 3.1 Type B+
Environmental
Operating Temp.Standard: 0°C to 55°CStandard: 0°C to 55°CStandard: 0°C to 45°C
Storage Temp.-40°C to 85°C
Module Power Consumption50W TGP80W TGP110W TGP
SW Support
OS SupportWindows 10 & Linux Drivers, 64-bit
MXM GPU Modules with NVIDIA Pascal™ Architecture
Model NameEGX-MXM-P1000EGX-MXM-P2000EGX-MXM-P3000EGX-MXM-P5000
<img src="images/837cf164bc3c14e7788e31973729238035c1cefa18f0d6adaf923b79f61e4e8d.jpg"/><img src="images/d6c125ee58ecad837830f068a00f2bf20ff232ebb6d3535b77a5b490bbc38338.jpg"/><img src="images/d40392fa220382058afffa0a775f6f3939a3dc8c3bd176de9742d5dc077b935a.jpg"/><img src="images/003d54a0ba35c93254ae77030261f02adc380f886550ee462e165b426b0ccfdd.jpg"/>
Graphic Core
GPUQuadro® P1000Quadro® P2000Quadro® P3000Quadro® P5000
Memory4GB GDDR5 memory, 128-bit,Bandwidth: 96 GB/s6GB GDDR5 memory, 192-bit,Bandwidth: 168.2 GB/s16GB GDDR5 memory, 256-bit,Bandwidth: 192.2 GB/s
GPGPU Computing
CUDA Cores512 CUDA® cores,1.8 TFLOPS SP Peak768 CUDA® cores,2.3 TFLOPS SP Peak1280 CUDA® cores,3.9 TFLOPS peak FP32 Performance2048 CUDA® cores,6.4 TFLOPS peak FP32 performance
Compute APICUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2CUDA Toolkit 8.0,CUDA Compute version 6.1, OpenCLTM 1.2, Direct Compute
Graphics APIOpenGL 4.5, DirectX® 12, Vulcan 1.0Shader Model 5.1, OpenGL 4.5, DirectX® 12, Vulkan 1.0
Display
Display Outputs4x DisplayPort 1.4 digital video outputs (DP++)4K at 120Hz or 5K at 60Hz4x DisplayPort 1.4 digital video outputs (DP++),1x HDMI, 2x DVI, 1x eDP
InterfaceMXM 3.1, PCI Express 3.0 x16 support
Mechanicals
Dimensions82 (W) x 70 (D) x 4.8 (H) mm82 (W) x 105 (D) x 4.8 (H) mm
Form FactorStandard MXM 3.1 Type AStandard MXM 3.1 Type B
Environmental
Operating Temp.Standard: 0°C to 55°C, ETT: -20°C to 70°C0°C to 55°C
Storage Temp.-40°C to 85°C-40°C to 125°C
Module Power Consumption48W58W75W100W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bit
PEG Cards
ModelQuadro PEG RTX4000Quadro PEG RTX5000Quadro PEG RTX6000Quadro PEG RTX8000Quadro-E PEG P620Quadro-E PEG P1000Quadro-E PEG P2200
<img src="images/8a38b415407298c573b18e018ac84d25b4416d0ed93c057f1203ec7b95891fb7.jpg"/><img src="images/7482a81060b43a0954a93f6b9e0d6798ce711fe932598d877a750b71ca01fd45.jpg"/><img src="images/4e53497b87f33263748f751f205c292e5b575bb50a071fff2b68082afbb1035c.jpg"/><img src="images/9ac6d0a2d6b14cf432ee05777e2b3c26c19c14b4cc85f19d880595ee1eff6ce0.jpg"/><img src="images/0f38ea4861c7037c35c0ee51fcad98ecb21c6f0a836ae10ab44e8dab85b70900.jpg"/><img src="images/dccfbaac6519a8ea56c2566be8ea188c097ee3103c94a9b578540afa8f2e1ff8.jpg"/><img src="images/3d7093dbafac9a632380ac3d2daf6dfbf0333e99f6d22a34961024be332c017c.jpg"/>
Graphic Core
Graphic CoreNVIDIA TuringTM TU106NVIDIA TuringTM TU104NVIDIA TuringTM TU102NVIDIA PascalTM GP107NVIDIA PascalTM GP106
GPUQuadro® RTX4000Quadro® RTX5000Quadro® RTX6000Quadro® RTX8000Quadro® P620Quadro® P1000Quadro® P2200
Memory8 GB GDDR6 memory, 256-bit, Bandwidth: Up to 416 GB/s16 GB GDDR6 memory, 256-bit, Bandwidth: Up to 448 GB/s24 GB GDDR6 memory, 384-bit, Bandwidth: Up to 672 GB/s48 GB GDDR6 memory, 384-bit, Bandwidth: Up to 672 GB/s2GB GDDR5 memory, memory, 128-bit, Bandwidth: 80 GB/s4GB GDDR5 memory, 128-bit, Bandwidth: 80 GB/s5GB GDDR5 memory, 160-bit, Bandwidth: 200 GB/s
ECCN/AYesN/A
GPGPU Computing
CUDA Cores2304 CUDA® cores, 7.1 TFLOPS SP Peak3072 CUDA® cores, 11.2 TFLOPS SP Peak4608 CUDA® cores, 16.3 TFLOPS SP Peak512 CUDA® cores, 1.38 TFLOPS peak FP32 performance640 CUDA® cores, 1.89 TFLOPS peak FP32 performance1280 CUDA® cores, 3.8 TFLOPS peak FP32 performance
Tensor Cores288 57 TFLOPS384 89.2 TFLOPS576 130.5 TFLOPS-
RT Cores364872-
Compute APICUDA Toolkit 8.0, CUDA Compute version 6.1, OpenCLTM 1.2CUDA Toolkit 8.0, CUDA Compute version 6.1, OpenCLTM 1.2, Direct Compute
Graphics APIShader Model 5.1, OpenGL 4.6, DirectX® 12.0, Vulkan 1.1Shader Model 5.1, OpenGL 4.5, DirectX® 12.0, Vulkan 1.0
Display
Display Outputs3x DisplayPort 1.4 digital video outputs (DP++) 1x USB-C 4x 3840x2160 @ 120 Hz 4x 5120x2880 @ 60 Hz 2x 7680x4320 @ 60 Hz4x DisplayPort 1.4 digital video outputs (DP++) 1x USB-C 4x 4096x2160 @ 120 Hz 4x 5120x2880 @ 60 Hz 2x 7680x4320 @ 60 Hz4x mDP 1.4, 4096x2160 @ 60Hz 5120x2880 @ 60Hz HDCP 2.2 support * VGA/DVI/HDMI support via adapter/connector/bracket4x DP 1.4, 4096x2160 @ 60Hz 5120x2880 @ 60Hz HDCP 2.2 support * VGA/DVI/HDMI support via adapter/connector/ bracket
InterfacePCI Express 3.0 x16PCI Express 3.0 x16
Mechanicals
Dimensions4.4" H x 9.5" L, single slot4.4" H x 10.5" L, dual slot2.713" H x 5.7" L, single slot4.4" H x 7.9" L, single slot
Form FactorFull height, full lengthFull height, full lengthLow profile-
Environmental
Operating Temp.0°C~55°C0°C~45°C0°C to 55°C
Storage Temp.-40°C~75°C-40°C to 75°C
Module Power Consumption160W265W295W40W47W75W
SW Support
OS SupportWindows 10 & Linux drivers, 64-bitWindows 7/10 & Linux drivers, 64-bit
# ADLINK Technology, Inc. 9F, No.166 Jian Yi Road, Zhonghe District New Taipei City 235, Taiwan 新北市中和區建一路166號9樓 Tel: +886-2-8226-5877 Fax: +886-2-8226-5717 Email: service@adlinktech.com # Ampro ADLINK Technology, Inc. 6450 VIA DEL ORO, SAN JOSE, CA 95119-1208, USA Tel: +1-408-360-0200 Toll Free: +1-800-966-5200 (USA only) Fax: +1-408-600-1189 Email: info@adlinktech.com # ADLINK Technology Singapore Pte, Ltd. 84 Genting Lane #07-02A, Axxel Innovation Centre, Singapore 349584 Tel: +65-6844-2261 Fax: +65-6844-2263 Email: singapore@adlinktech.com # ADLINK Technology Singapore Pte. Ltd. (Indian Liaison Office) #50-56, First Floor, Spearhead Towers, Margosa Main Road (between 16th/17th Cross), Malleswaram, Bangalore - 560 055, India. Tel: +91-80-42246107, +91-80-23464606 Fax: +91 80 23464606 Email: india@adlinktech.com # ADLINK Technology Japan Corporation 〒101-0045 東京都千代田区神田鍛冶町3-7-4 ユニゾ神田鍛冶町三丁目ビル4F Unizo Kanda Kaji-cho 3 Chome Bldg. 4F, 3-7-4 Kanda Kajicho, Chiyoda-ku, Tokyo 101-0045, Japan Tel: +81-3-4455-3722 Fax: +81-3-5209-6013 Email: japan@adlinktech.com # ADLINK Technology Korea Ltd. 경기도 용인시 수지구 신수로 767 A동 1503호 (동천동, 분당수지유타워) (우) 16827 A-1503, U-TOWER, 767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, Republic of Korea, 16827 Toll Free: +82-80-800-0585 Tel: +82 31 786-0585 Fax: +82 31 786-0583 Email: korea@adlinktech.com # ADLINK Technology (China) Co., Ltd. 上海市浦东新区张江高科技园区芳春路300号 (201203) 300 Fang Chun Rd., Zhangjiang Hi-Tech Park Pudong New Area, Shanghai, 201203 China Tel: +86-21-5132-8988 Fax: +86-21-5192-3588 Email: market@adlinktech.com # ADLINK Technology Beijing 北京市海淀区上地东路1号盈创动力大厦E座801室(100085) Rm. 801, Power Creative E, No. 1 Shang Di East Rd. Beijing, 100085 China Tel: +86-10-5885-8666 Fax: +86-10-5885-8626 Email: market@adlinktech.com # ADLINK Technology Shenzhen 深圳市南山区科技园南区高新南七道数字技术园 A1栋2楼C区 (518057) 2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7 High-Tech Industrial Park S., Shenzhen, 518054 China Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: market@adlinktech.com # ADLINK Technology GmbH Hans-Thoma-Straße 11 D-68163 Mannheim, Germany Tel: +49 621 43214-0 Fax: +49 621 43214-30 Email: germany@adlinktech.com # ADLINK Technology, Inc. (French Liaison Office) 6 allée de Londres, Immeuble Ceylan 91940 Les Ulis, France Tel: +33 (0) 1 60 12 35 66 Fax: +33 (0) 1 60 12 35 66 Email: france@adlinktech.com # ADLINK Technology, Inc. (UK Liaison Office) First Floor West Exeter House, Chichester Fields Business Park Tangmere, West Sussex, PO20 2FU, United Kingdom Tel: +44-1243-859677 Email: UK@adlinktech.com # ADLINK Technology, Inc. (Israel Liaison Office) SPACES OXYGEN, 62 Medinat, Ha-yehudim st 4673300, Herzliya, Israel, P.O.Box – 12960 Tel: +972-54-632-5251 Fax: +972-77-208-0230 Email: israel@adlinktech.com ![The image displays a logo consisting of a red, triangular shape that resembles the letter 'A' with a curved bottom edge. Inside the upper portion of the red triangle are three horizontal white stripes. To the bottom right of the red shape is a small black registered trademark symbol (®). The graphic is centered on a white background, flanked by vertical black bars on the far left and right sides.](.adlink-brochure-edge-ai-solutions-dlap-series/35d567e38902bf6a4d257a96940239327d9d8c3207b0703f190eea163eb21c26.jpg) ADLINK Leading EDGE COMPUTING [🔗 Link to the original document](.adlink-brochure-edge-ai-solutions-dlap-series/adlink-brochure-edge-ai-solutions-dlap-series.pdf) [🔗 Link to the original document](.adlink-brochure-edge-ai-solutions-dlap-series/adlink-brochure-edge-ai-solutions-dlap-series.md) [🔗 Link to the original document](.adlink-brochure-edge-ai-solutions-dlap-series/adlink-brochure-edge-ai-solutions-dlap-series.md)