## Slide 1 ![The slide displays a promotional image for ADLINK and AMD hardware. **Top Left:** The logos for 'ADLINK' and 'AMD' are displayed side-by-side. **Center:** A collection of computer hardware is showcased against a dark blue background with light rays. This includes: * Server chassis (white and black) * Motherboards (green circuit boards) * Small form factor boxes * Three green COM Express modules in the front center * A blue box labeled 'AMD v16 Embedded Processor-based Development Kit' **Bottom Left (Red Banner):** The text reads: 'ADLINK AMD Advanced Edge AI Platforms' 'Scalable Performance for Intelligent Edge' **Bottom Right:** Two AMD logos are displayed: 'AMD EPYC Embedded' 'AMD RYZEN Embedded' A QR code is visible in the far bottom right corner.](.adlink-x-amd-ebook-20260402/slide-001.jpg) ## Slide 2 ![**Header:** Technology Highlights **Left Section:** **Title:** Advanced Graphics with AMD RDNA™ 3 Architecture **Bullet Points:** * Delivers stunning 4K resolution graphics performance * Supports up to four independent displays * Ideal for rich, multi-screen industrial and AI visualization **Middle Section:** **Title:** AI-Enhanced Video Processing **Bullet Points:** * Integrated NPU for real-time video analytics acceleration * Supports leading codecs: AV1, H.264, and H.265 * Optimized for efficient video streaming and playback **Right Section:** **Title:** High-Speed Connectivity and Memory Reliability **Bullet Points:** * Up to 20 lanes of PCIe Gen4 for high-bandwidth expansion * Supports DDR5 memory with ECC * Designed for high data throughput and enhanced reliability in demanding imaging workloads **Footer:** 02.](.adlink-x-amd-ebook-20260402/slide-002.jpg) ## Slide 3 ![**Title:** What ADLINK x AMD Offer **High-Performance Computing** • Scalable AI-ready computing for advanced gaming, embedded, and networking applications **Graphics Capabilities** • Integrated AMD Radeon™ graphics **Seamless OS Compatibility** • Windows • Linux • Yocto Linux **Industrial-Grade Reliability** • Operating temperature: -40°C to 85°C • Shock & vibration certification **Reduced TCO** • Performance per watt & cost **DMS+ Service** • End-to-end customization excellence (DMS+: Design, Manufacturing and Service) **Long Lifecycle Support** • Up to 10 years longevity (Varies by product line) **Comprehensive Testing and Validation Services** • High-speed signal verification and simulation • HALT testing and MTBF analysis **Footer:** 03.](.adlink-x-amd-ebook-20260402/slide-003.jpg) ## Slide 4 ![**Product Offerings** **Top Row** **COM Express Type 6 Compact** * **cExpress-R8** * PICMG COM.0: Rev 3.1 Type 6 Compact * **Key features** * AMD Ryzen™ Embedded 8000 Series processors * AMD Radeon™ RDNA™ 3 graphics * AMD XDNA™ NPU * Up to 8x Zen4 cores at 15W-54W TDP * Up to 96GB DDR5 (ECC/non-ECC) * Up to 16x PCIe Gen4 lanes **COM Express Type 6 Compact** * **cExpress-AR** * PICMG COM.0: Rev 3.0 Type 6 Compact * **Key features** * AMD Ryzen™ Embedded V2000 Processors * Up to 4x 4K displays (DP, eDP) * 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes * Configurable TDP down to 10W (8, 6 cores) **COM Express Type 7** * **Express-VR7** * PICMG COM.0: Rev 3.1 Type 7 basic * **Key features** * AMD Embedded Ryzen V3000 Processors * Up to 64GB DDR5 SO-DIMM at 4800 MT/s, ECC * 14x PCIe Gen4 lanes * 2x 10G Ethernet, 1x 2.5G Ethernet * Industrial temperature: -40°C to 85°C (optional) **Bottom Row** **Gaming Mini-ITX Mainboard** * **AmITX-RZ-G** * Compact performance with flexible expansion * **Key features** * AMD Ryzen Embedded R2000 processors * Dual DDR4 SO-DIMM slots, supporting up to 32GB * Rich expansion with PCIe Gen3 x8 (via x16 slot), PCIe Gen3 x1, M.2 and Mini-PCIe * 4x DisplayPort outputs **Gaming Mini-ITX Mainboard** * **AmITX-RZ-E8K** * Next-gen performance for data- and media-intensive workloads * **Key features** * AMD Ryzen Embedded 8000 Processors * Dual DDR5 SO-DIMM slots, supporting up to 64GB * Rich expansion with PCIe Gen4 x8 (x16 slot), 2x M.2 2280 M-key, and 1x M.2 2242 B-key * 4x DisplayPort 1.4a (HBR2) * Integrated 7.1-channel audio and serial ports with ccTalk support **Gaming Platform** * **ADi-SA3X-RZ** * Enterprise-grade graphics, security, and scalability * **Key features** * AMD Ryzen Embedded V2000 processors * PCIe Gen3 x8 (via x16 slot), PCIe Gen3 x1, M.2 and Mini-PCIe for broad I/O expansion * Supports up to 8x independent displays * Advanced security feature set * ADLINK Advanced Gaming Architecture (AGA) reduces development time and speeds time-to-market **Gaming Platform** * **ADi-SA6X-RZ-E8K** * Modern memory and I/O for future-proof embedded designs * **Key features** * AMD Ryzen Embedded 8000 Processors * Dual DDR5 SO-DIMM slots, supporting up to 64GB * PCIe Gen4 x8 (via x16 slot) plus 2x M.2 2280 M-key and 1x M.2 2242 B-key * 4x DisplayPort 1.4a (HBR2) * Built-in 7.1-channel audio and ccTalk-enabled serial ports 04](.adlink-x-amd-ebook-20260402/slide-004.jpg) ## Slide 5 ![**Product Offerings** **Edge AI Server Board** ISB-TR10 CEB : Easy integration into systems **Key features** * CEB Form Factor 12' x 10.5' (305 x 267mm) * Single socket SP5 (LGA 6096), supports AMD EPYCTM 9005/9004 Series processors * 8x DIMM slots (1DPC), supports DDR5 RDIMM 6400 MT/s * 4x PCIe5.0 x16, 2x PCIe5.0 x8, 1 MCIO (PCIe5.0 x8 or 8 SATA 6Gb/s), 4 MCIO (PCIe5.0 x8) * 2x M.2 NVMe, 8x SATAIII slots **1U Edge AI Server** AXE-5100R7/ R9 Compact & short-depth Design **Key features** * 1U chassis with single AMD RyzenTM 7000/9000 Series processors * Optional PCIe slot up to 1x PCIe Gen5 x8 * Supports 1x FH, 3/4LSW GPU * Short-depth chassis (440mm) maximizes rack space efficiency for compact deployments * 5x smart fan speed control fans modules **2U Edge AI Server** AXE-7220TR SFF GPU server **Key features** * Supports AMD EPYC 9005/9004 Series processors * 2U short-depth chassis (450mm) maximizes rack space efficiency * Up to 2x FHFLDW GPU Gen5 x16 * Up to 8x DDR5 RDIMM 6400 MT/s DIMM slots * 4x hot-swappable fan modules and SSD drive bays **4U Edge AI Server** AXE-7440TR High-complexity GenAI & multimodal AI **Key features** * Supports AMD EPYC 9005/9004 Series processors * Optional PCIe slot up to 4x PCIe Gen5 x16, 3x PCIe Gen5 x8 via MICO * Up to 4x FHFLDW GPU Gen5 x16 * Supports 6x 2.5' hot-swap NVMe SSD or 8x 2.5' hot-swap SATA SSD * 3x Internal fan modules, 2x optional external fan modules 05](.adlink-x-amd-ebook-20260402/slide-005.jpg) ## Slide 6 ![**Immersive Gaming Experiences – Reliable, Secure, Long-Term Value** **Scenario Requirement** Next-generation slot machines require high graphics performance, long-term stability, and reliable operation in a 24/7 gaming environment. The system must support multiple high-resolution displays, secure I/O connectivity, and efficient power management, while meeting regulatory and lifecycle requirements typical of the gaming industry. The ADLINK AmITX-RZ-G-E8K mainboard, together with the ADLINK gaming platform ADi-SA6X-RZ-E8K, leverages AMD Ryzen™ E8000 Processors to deliver strong graphics capability, compact system integration, and dependable thermal and power design suitable for casino-grade slot machine applications. The cExpress-R8 COM Express Type 6 module, featuring DDR5 memory support, enables 4K multi-display capabilities without requiring a discrete GPU, helping to reduce total cost of ownership and accelerate time-to-market for gaming system designs. **Benefits** • Immersive Graphics: High-quality, smooth visuals powered by AMD Ryzen™ Embedded 8000 Processors for engaging slot machine experiences • Multi-Display Support: Enables gameplay, bonus, and interaction panels simultaneously • Gaming-Grade Reliability: Ensures stable 24/7 performance in demanding environments • Secure I/O Connectivity: Flexible support for validators, printers, buttons, and peripherals • Compact, Energy-Efficient Design: Optimized for lower total cost of ownership and efficient system integration **(Image Labels)** COM Express Type 6 Compact cExpress-R8 Gaming Mainboard AmITX-RZ-G-E8K Gaming Platform ADi-SA6X-RZ-E8K 06](.adlink-x-amd-ebook-20260402/slide-006.jpg) ## Slide 7 ![**Header:** Medical Imaging AI Agent - Diagnostic Intelligence, Low-latency, Secure **Scenario Requirement** Modern diagnostic and surgical workflows increasingly depend on AI-driven analysis of high-resolution medical imaging data — both before and during procedures. Large volumes of CT scans and live imaging streams must be processed with high accuracy and minimal latency to support medical decision-making. AI agents assist physicians by analyzing imaging data, detecting abnormalities, highlighting anatomical structures, and identifying potential risk areas. In the operating room, AI can integrate with surgical camera systems (e.g., endoscopy) to overlay real-time visual markers on high-resolution displays — enhancing situational awareness. These AI workloads require powerful on-premise computing to ensure real-time responsiveness, data privacy, and reliability. To address these requirements, the ADLINK AXE-7440TR provides a compact, high-performance edge AI platform powered by AMD EPYC™ 9005/9004 processors. The system supports up to 4x double-deck GPU/FPGA accelerator cards for real-time imaging analysis, delivering scalable performance and enhanced interoperability within space-constrained healthcare environments. **Benefits** * **Precision AI:** High-performance, low-latency computing enabling real-time surgical imaging and decision-making * **Secure Edge Deployment:** Low-latency, cloud-independent AI services ensure patient data privacy and reliable operation **Labels/Annotations:** * PCIE cards x 2 * Frame Grabber x2 * Edge AI Server (4U) * AXE-7440TR * 07](.adlink-x-amd-ebook-20260402/slide-007.jpg) ## Slide 8 ![**Title:** AOI Six-Side Inspection - Accurate, High Throughput, Scalable **Scenario Requirement** Modern AOI systems for semiconductor and PCBA manufacturing require high-performance platforms to support high-camera-count inspection (e.g., six-sided inspection) within a single architecture. Sustaining ultra-high speed and accuracy demands simultaneous multi-channel frame grabber capture and intensive GPU acceleration — placing heavy requirements on PCIe bandwidth, system stability, and long-term reliability. The key challenge is ensuring validated PCIe expansion and system-level compatibility to shorten bring-up time and guarantee stable 24/7 operation. The ADLINK ISB-TR10 Edge AI Server Board enables deployment of AMD EPYC™ 9005/9004 processors in industrial imaging systems, delivering scalable PCIe bandwidth and server-class performance for complex AOI applications. **Benefits** * **High-Bandwidth Industrial Imaging:** Optimized PCIe architecture ensures massive throughput and stable 24/7 operation * **Massive PCIe Expansion:** Supports up to 4× PCIe 5.0 x16 and 2× PCIe x8 slots for frame grabbers and GPU acceleration * **Pre-Validated Stability:** Qualified PCIe compatibility reduces integration effort and ensures reliable continuous operation * **Compact Server-Class Performance:** CEB form factor with AMD EPYC 9005/9004 processors delivers powerful performance in space-constrained industrial designs **Hardware Images and Labels (Bottom Right)** * Edge AI Server Board ISB-TR10 * Frame Grabber x 4 * Frame Grabber Card PCIe-10GPoE (Features a '10 GbE' logo) * Frame Grabber Card PCIe-CPL64V Full (Features a 'NEW!' badge and 'Camera Link' logo) **Page Number:** 08.](.adlink-x-amd-ebook-20260402/slide-008.jpg) ## Slide 9 ![**Header:** Network Cloud Appliances - High-Performance, Agile, Scalable **Scenario Requirement** To meet the demands of hyperscalers and neoClouds, top-tier AI infrastructure developers sought an Ethernet alternative to InfiniBand that could deliver high-performance, low-latency networking for next-generation cloud and AI workloads. This challenge was creating a platform that maximized system performance and utilization while reducing validation effort and accelerating deployment, ADLINK’s COM Express Type 7 solution was selected to build a radical new “Network Cloud-AI” architecture, providing DDR5 memory support, streamlined integration, and scalable high-speed connectivity to optimize AI infrastructure efficiency and reliability. The ADLINK COM Express Type 7 Dev Kit features the AMD Ryzen™ Embedded V3000 Processor, a low-power design ideal for edge AI deployments. It includes RunBMC remote management for secure and efficient monitoring of devices deployed anywhere. **Benefits** • **High-Performance AI Networking:** Optimized AI workloads, reduced validation effort, and faster deployment • **DDR5 Support:** High-speed memory on COM Express Type 7 enables faster, more efficient AI data processing • **Reduced Validation Effort:** Pre-validated platform minimizes integration time and lowers total cost of ownership (TCO) • **Accelerated Deployment:** Streamlined design allows faster time-to-market for cloud and AI solutions **Bottom Right Visuals** * Image of a circuit board labeled: **COM Express Type 7** / **Express-VR7** * Logo box: **IPMB** / **OOB MGMT** **Footer:** 09.](.adlink-x-amd-ebook-20260402/slide-009.jpg) ## Slide 10 ![**Autonomous Welding Systems – Fast, Resilient, Intelligent** **Scenario Requirement** Autonomous welding systems demand low-latency edge computing, massive computational power, and real-time 3D computer vision for AI-driven path planning in demanding industrial environments. The system must process complex sensor data, including cameras and USB-connected devices, execute heavy AI inferencing, and adapt to part variability without manual programming, all while ensuring secure local data handling. The ADLINK Edge AI 4U Server AXE-7440TR combines server-grade multi-core processors with a flexible multi-GPU and PCIe architecture supporting up to four cards, rich I/O connectivity for cameras and USB devices, scalable memory capacity, and robust thermal and power management, delivering high-performance, secure, and reliable edge computing for autonomous welding applications. **Benefits** * **Precision Welding AI:** Massive computing power, multi-GPU support, and high-speed storage for real-time 3D vision and autonomous welding accuracy * **High-Density AI Computing:** Supports a single server-grade AMD EPYC™ 9004/9005 processor (up to 400W) for low-latency, edge computing, and secure local AI processing. Scalable memory up to 1,024GB RDIMM handles intense robotic workloads * **Multi-GPU & PCIe Expansion:** Accommodates up to 4x double-deck GPU/FPGA accelerator cards to drive complex 3D vision, AI pathfinding, and compute-intensive robotics tasks * **Rich I/O & High-Speed Industrial Storage:** Supports USB devices and industrial cameras, as well as 8x 2.5' SATA SSDs or 6x 2.5' NVMe drives for rapid data logging, high-capacity storage, and secure system operation **Images/Captions** PCIE cards x 4 Edge AI 4U Server AXE-7440TR 10](.adlink-x-amd-ebook-20260402/slide-010.jpg) ## Slide 11 ![**Header:** Edge AI Controllers for Energy Management - Continuous, Reliable **Scenario Requirement** Modern energy management systems require massive computational power, real-time processing, and AI-driven decision-making for complex electricity distribution networks. The system must execute high-speed inferencing, adapt to fluctuating grid conditions without manual intervention, and support extensive memory, multi-core processing, and local serviceability to ensure continuous, reliable operation. By leveraging the ADLINK cExpress-R8, the customers developed a hypervisor-based industrial controller capable of managing legacy logic alongside modern AI workloads efficiently and securely. **Benefits** * **Precision Energy Management:** High-performance computing and real-time hypervisor support for reliable electricity distribution * **High-Density Embedded Computing:** AMD Ryzen™ Embedded 8000 Series with SoC core and BIOS optimized for deterministic, low-latency control, and Type 1 Xen Domless hypervisor for secure, efficient workload separation * **Modern OS Compatibility:** Full Windows 11 support for flexible deployment and application integration * **Reduced TCO:** Integrated high-performance computing lowers operational costs * **Faster Time-to-Market:** Accelerates deployment of energy management solutions **Visual Elements & Labels:** * **Background:** High-voltage transmission towers and power lines overlaid with glowing blue digital network lines against a sunset sky. * **Bottom Left Diagram:** Two line drawings showing 'Multiple chassis variations' and 'Two types of white boxes across the entire network'. * **Bottom Right:** An image of a green circuit board module labeled 'COM Express Type 6 Compact cExpress-R8'. * **Footer:** 11.](.adlink-x-amd-ebook-20260402/slide-011.jpg) ## Slide 12 ![**Slide Title:** Ultra-Secure Communication Gateway – Government-Grade Security **Scenario Requirement** Providers of encrypted smartphones and secure communication platforms require massive computational power, real-time processing, and dedicated encryption support for government- and enterprise-level privacy. The system must handle intensive encryption protocols without compromising throughput, support extensive memory and high-speed I/O, and ensure reliable operation under continuous, mission-critical workloads. By leveraging the ADLINK Express-VR7, the customers built a high-performance gateway capable of executing complex encryption tasks efficiently and securely. **Benefits** * **Precision Security AI:** Hardware-accelerated encryption and high-speed processing for ultra-secure communication * **Optimized Encryption Performance:** COM Express Type 7 with DDR5 support for fast, secure handling of complex encryption protocols * **Simplified Validation & Lower TCO:** Streamlined hardware design reduces development effort and operational costs * **Rapid Deployment:** Enables fast rollout of secure communication gateways for enterprise and government applications **Image Label:** COM Express Type 7 Express-VR7 ](.adlink-x-amd-ebook-20260402/slide-012.jpg) ## Slide 13 ![**Product Specifications** **Board Types (Top Row):** * COM Express Type 6 Compact * COM Express Type 6 Compact * COM Express Type 7 * Gaming Mini-ITX Mainboard * Gaming Mini-ITX Mainboard * Server Motherboard **Table Data:** cExpress-R8 cExpress-AR Express-VR7 AmITX-RZ-G AmITX-RZ-G-E8K ISB-TR10 :--- :--- :--- :--- :--- :--- :--- **AMD Processor** AMD Ryzen™ Embedded 8000 Series Processors AMD Ryzen Embedded V2000 Processors AMD Ryzen Embedded V3000 Processors AMD Ryzen Embedded R2000 Processors AMD Ryzen Embedded 8000 Processors AMD EPYC™ 9005/9004 Series Processors **Memory** Up to 96GB DDR5 SO-DIMM Up to 64GB DDR4 SO-DIMM Up to 64GB DDR5 SO-DIMM Dual Channel DDR4 3200 ECC SO-DIMM Up to 32GB Dual Channel DDR5 5600 SO-DIMM Up to 64GB 8x DIMM DDR5 6400 R-DIMM MT's Up to 1 TB **BIOS** AMI AMI AMI AMI EFI in 16MB SPI BIOS AMI EFI in 32MB SPI BIOS AMI **Display** DP/HDMI/LVDS/eDP HDMI/DP/LVDS/eDP N/A Up to 4x DP Up to 4x DP 1x VGA **I/O Interface** USB/SATA/UART/GPIO USB/SATA/UART/GPIO USB/SATA/UART/GPIO PCIe Gen3 x8 (via x16 slot), PCIe Gen3 x1, M.2 and Mini-PCIe Expansion PCIe Gen4 x8 (via x16 slot), 2x M.2 2280 M-Key, 1x M.2 2242 B-Key 2x 1GbE, 2x 10GbE 2x USB Type-A 3.2 Gen1 **Power Input** ATX or AT 12V+/-5% ATX or AT 12V+/-5% ATX or AT 12V+/-5% 12V ±5% 12V ±5% ATX 12V ±5% **Power Consumption** 15W - 54W 15W - 54W 15W - 45W 10W – 54W 15W – 54W Up to 400W **Operating Temperature** 0°C to 60°C 0°C to 60°C -45°C to 85°C (optional) 0°C to 60°C -45°C to 85°C (optional) 0°C to 60°C 0°C to 60°C 10°C to 35°C **Form Factor** COM Express Type 6 Compact COM Express Type 6 Compact COM Express Type7 Basic Mini-ITX Mini-ITX CEB **Dimensions** 95 mm x 95 mm 95 mm x 95 mm 125 mm x 95 mm 170mm x 170 mm 170mm x 170 mm 305mm x 267 mm](.adlink-x-amd-ebook-20260402/slide-013.jpg) ## Slide 14 ![**Product Specifications** **1U Edge AI Server (AXE-5100R7/ R9)** * **AMD Processor:** AMD Ryzen™ 7000/9000 Series Processors * **Memory:** 4x DIMM DDR5 5600MT/s UDIMM Up to 128GB * **BIOS:** AMI * **Display:** 1x HDMI * **I/O Interface:** 8x GbE Ports, 1x GbE Port Dedicated for IPMI, 2x USB 3.0, 1x USB 3.0 internal * **Power Input:** 1+1 300W-800W * **Power Consumption:** 120W * **Operating Temperature:** 0°C to 45°C * **Form Factor:** 1U 19' Rackmount * **Dimensions:** 438(W) x 420(D) x 43.6(H) mm **2U Edge AI Server (AXE-7220TR)** * **AMD Processor:** AMD EPYC™ 9005/9004 Series Processors * **Memory:** 8x DIMM DDR5 6400 R-DIMM MT/s Up to 1TB * **BIOS:** AMI * **Display:** 1x VGA * **I/O Interface:** 2x 10 GbE RJ45 Ports, 2x GbE Ports (1x GbE is dedicated for IPMI), 2x USB Type-A 3.2 Gen1 * **Power Input:** 1+1 1300W/1600W/2000W * **Power Consumption:** 300W * **Operating Temperature:** 10°C to 35°C * **Form Factor:** 2U 19' Rackmount * **Dimensions:** 438(W) x 450(D) x 87(H) mm **4U Edge AI Server (AXE-7440TR)** * **AMD Processor:** AMD EPYC 9005/9004 Series Processors * **Memory:** 8x DIMM DDR5 6400 R-DIMM MT/s Up to 1TB * **BIOS:** AMI * **Display:** 1x VGA * **I/O Interface:** 2x USB 2.0, 2x 10 GbE RJ45 Ports, 2x GbE Ports (1x GbE is dedicated for IPMI), 2x USB Type-A 3.2 Gen1 * **Power Input:** 1+1 1600W/2000W * **Power Consumption:** 400W * **Operating Temperature:** 10°C to 35°C * **Form Factor:** 4U 19' Rackmount * **Dimensions:** 437.5(W) x 650(D) x 176.5(H) mm **Gaming Platform (ADI-SA6X-RZ-E8K)** * **AMD Processor:** AMD Ryzen Embedded 8000 Processors * **Memory:** Dual Channel DDR5 5600 SO-DIMM Up to 64GB * **BIOS:** AMI uEFI on 32MB SPI BIOS * **Display:** Up to 4x 4K60 Displays * **I/O Interface:** PCIe Gen4 x8 (via x16 slot), 2x M.2 2280 M-Key, 1x M.2 2242 B-Key * **Power Input:** 12V ±5% * **Power Consumption:** 15W – 54W * **Operating Temperature:** 0°C to 50°C * **Form Factor:** - * **Dimensions:** 208(W) x 221.3(D) x 91(H) mm **Gaming Platform (ADI-SA2X-RZ)** * **AMD Processor:** AMD Ryzen V2000 Processors * **Memory:** Dual Channel Non-ECC DDR4 3200 Up to 32GB * **BIOS:** AMI uEFI on 32 MB SPI BIOS * **Display:** Up to 8x DP (incl. 4K UHD) * **I/O Interface:** PCIe Gen3 x8 (via x16 slot), PCIe Gen3 x1, M.2 (M Key, 2242/2260/2280) * **Power Input:** 12V or 24V Input (optional) * **Power Consumption:** 15W – 54W * **Operating Temperature:** 0°C to 50°C * **Form Factor:** - * **Dimensions:** 265(W) x 240(D) x 91(H) mm](.adlink-x-amd-ebook-20260402/slide-014.jpg) ## Slide 15 ![**Title:** Global Reach, Local Touch **Subtitle:** Bringing On-Time Support Closer to Customers **Map Locations:** San Jose, Newcastle, Hengelo OV, Mannheim, Paris, Deggendorf, Herzliya, Beijing, Seoul, Tokyo, Nagoya, Nanjing, Shanghai, Chengdu, Shenzhen, Taoyuan, Taichung, Tainan, Bangalore, Chennai, Singapore **Building Photos (Captions):** * Taoyuan, Taiwan Headquarters * San Jose USA * Mannheim Germany * Shanghai China **Statistics:** * **5** Design Centers: USA, Europe, Taiwan, China, and India * **2** Factories: China & Taiwan * **20** Support Offices: USA, Europe, Asia, Taiwan, and China * **4** Logistics & Service Centers: USA, Europe, and Asia **Page Number:** 15](.adlink-x-amd-ebook-20260402/slide-015.jpg) ## Slide 16 ![**Head Office** ADLINK Technology, Inc. No. 66, Huaya 1st Rd., Guishan Dist., Taoyuan City 333411, Taiwan Tel : +886-3-216-5088 Fax: +886-3-328-5706 www.adlinktech.com **Worldwide Offices** **ADLINK Technology, Inc. (Taichung Liaison)** 12F-2, No. 262, Sec. 2, Henan Rd., Xitun Dist., Taichung City 407026, Taiwan Tel: +886-4-2708-2338 Fax: +886-4-2708-2056 Email: tw@adlinktech.com **ADLINK Technology, Inc. (Tainan Liaison)** Room A, 6F., No. 1-5, Zhonghua Rd., Yongkang Dist., Tainan City 710, Taiwan Tel: +886-6-313-7768 Fax: +886-6-313-3166 Email: tw@adlinktech.com **Ampro ADLINK Technology, Inc.** 6450 Via Del Oro, San Jose, CA 95119, USA Tel: +1-408-360-0200 Toll Free: +1-800-966-5200 Fax: +1-408-600-1189 Email: info@adlinktech.com **Shanghai ADLINK Intelligence Technology Co., Ltd. (AITC)** 300 Fang Chun Rd., Zhangjiang Hi-Tech Park Pudong New Area, Shanghai, 201203 China Tel: +86-21-5132-8988 Fax: +86-21-5192-3588 Email: market@adlinktech.com **ADLINK Technology Beijing** Rm. 801, Power Creative E, No. 1 Shang Di East Rd. Beijing, 100085 China Tel: +86-10-5885-8666 Fax: +86-10-5885-8626 Email: market@adlinktech.com **ADLINK Technology Shenzhen** 2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7, High-Tech Industrial Park S., Shenzhen, 518057 China Tel: +86-755-2643-4858 Fax: +86-755-2664-6353 Email: market@adlinktech.com **ADLINK Technology Nanjing** Rm. 1908, 105 Zhongshan N Rd, Gulou, Nanjing, Jiangsu, China, 210093 Tel: +86-25-86652110 Fax: +86-25-86652110 Email: market@adlinktech.com **ADLINK Technology Chengdu** Rm. 4207, 500 Tianfu Blvd Middle Section, Wuhou District, Chengdu, Sichuan, China, 610023 Tel: +86-28-85216698 Fax: +86-28-85258206 Email: market@adlinktech.com **ADLINK Technology Japan Corporation (Tokyo Office)** 〒 101-0045 東京都千代田区神田鍛冶町 3-7-4 KDX 神田駅前ビル 4F KDX Kanda Ekimae Bldg. 4F, 3-7-4 Kanda Kajicho, Chiyoda-ku, Tokyo 101-0045, Japan Tel: +81-3-5209-6001 Fax: +81-3-5209-6013 Email: japan@adlinktech.com **ADLINK Technology Japan Corporation (Nagoya office)** 〒 450-0002 愛知県名古屋市中川区名駅 5-31-10 リンクス名駅ビル 3F LINKS Meieki Bldg. 3F, 5-31-10 Meieki, Nakamura-ku, Nagoya-city, Aichi 450-0002, Japan Tel: +81-52-589-9018 Fax: +81-52-583-2807 Email: japan@adlinktech.com **ADLINK Technology Korea Ltd.** 경기도 용인시 수지구 신수로 767 A 동 1503 호 ( 동천동 , 분당수지유타워 ) ( 우 ) 16827 A-1503, U-TOWER, 767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, Republic of Korea, 16827 Tel: +82-31-786-0585 Toll Free:+82-80-800-0585 Fax: +82-31-786-0583 Email: korea@adlinktech.com **ADLINK Technology Singapore Pte. Ltd.** 1008 Toa Payoh North, 07-17/18 Singapore 318996 Tel: +65-6844-2261 Fax: +65-6844-2263 Email: singapore@adlinktech.com **ADLINK Technology India Private Limited** Ground Floor, 317, Samanvitha Complex, Mayura Street, Outer Ring Road, Byatarayanapura, Bangalore North, Bangalore- 560092, Karnataka Tel: +91-80-2346-4606 / +91-80-3121-3332 Fax: +91-80-2346-4606 Email: india@adlinktech.com **ADLINK Technology GmbH** Hans-Thoma-Straße 8-10 68163 Mannheim, Germany Tel: +49-621-43214-0 Fax: +49-621-43214-30 Email: emea@adlinktech.com **ADLINK Technology GmbH (Healthcare Business Center)** Ulrichsbergerstraße 17 94469 Deggendorf, Germany Tel: +49-991-29094-10 Email: info.deg@adlinktech.com **ADLINK Technology, Inc. (Israel Liaison Office)** MIXER Herzliya (Building B, 8 Floor ) 3 Arik Einstein st. 4610301, Herzliya, Israel Tel: +972-54-632-5251 Email: israel@adlinktech.com **ZettaScale Technology Limited** Suite 1, First Floor The Honeycomb The Watermark Gateshead, Tyne & Wear. United Kingdom, NE11 9SZ Tel: +44-(0)-191-4979900 Mail: info@zettascale.tech **ZettaScale Technology B.V.** Amarilstraat 30, 7554TV Hengelo (OV), Netherlands Tel: +31-(0)-7424-72570 Mail: ist_info@adlinktech.com **ZettaScale Technology SARL** Bâtiment Thalès – Parc des Algorithmes Route de l’Orme des Merisiers, 91190 SAINT AUBIN, France Tel: +33-(0)-1-60-12-35-66 Fax: +33-(0)-1-60-12-35-66 Mail: france@adlinktech.com All products and company names listed are trademarks or trade names of their respective companies. ©2026 ADLINK Technology, Inc. All Rights Reserved. All pricing and specifications are subject to change without further notice.](.adlink-x-amd-ebook-20260402/slide-016.jpg) [🔗 Link to the original document](.adlink-x-amd-ebook-20260402/adlink-x-amd-ebook-20260402.pdf)