## Slide 1

![The slide features a background image of robotic arms operating on an assembly line with circuit boards. Overlaid text reads 'Smart at the Core. Strong at the Edge.' Below this, a red banner displays the text 'ADLINK Embedded Computing Solutions.' On the bottom right, three computer hardware units are displayed next to the ADLINK logo. The text 'MATRIX' is visible on the side of the black hardware unit.](.ebook-matrix-2025/slide-001.jpg)

## Slide 2

![The slide features the **MATRIX** logo at the top left. Below, three product categories are displayed with hardware images:  *   **/// Compact Series**: 'Palm-sized for space-limited environments' *   **/// Integrated Series**: 'Balanced size-to-performance ratio' *   **/// Expandable Series**: 'Up to 4 expansion slots for peak performance'  On the right, a red text box contains the title '**Shaping the Future with Matrix Embedded Computers**' followed by the paragraph:  'Harsh industrial and urban environments demand edge computing solutions that won’t fail under pressure. ADLINK’s Matrix embedded platforms are purpose-built to address these challenges, ensuring rugged durability, real-time processing, and seamless integration across diverse applications. Paired with ADLINK’s edge software services such as BIOS customization, OS image management, and edge sensing APIs, Matrix is uniquely equipped to simplify development and accelerate deployment. There is a Matrix for every need. With three distinct lines, each optimally tailored for size, performance, and expansion, Matrix brings powerful computing straight to the edge.'  Page numbers '**02**' and '**03**' appear in the bottom corners.](.ebook-matrix-2025/slide-002.jpg)

## Slide 3

![Built on Experience. Engineered for the Edge.  With decades of embedded design experience, ADLINK’s Matrix series is expertly built for reliable performance in the field. These rugged edge platforms are designed to operate in challenging environments and deliver the durability, stability, and uptime that mission-critical systems require. Every detail, from thermal design to component integration, reflects technical insight and experience. The result is a resilient, future-ready solution that keeps pace with evolving requirements without compromising reliability.  Versatile Platform Options • Featuring Intel®, Core™, and Atom® processors • Integrated NVIDIA Ampere GPUs • Multiple form factors  Resilient Engineering • -20 - 60°C fanless operating temperature • Shock and vibration resistant • Stainless steel enclosure, corrosion-resistant  High Bandwidth RF Connectivity • High-speed data with low-latency transmission • 4G & 5G WWAN • Wi-Fi 6E (802.11ax) WLAN  Flexible I/O and Expansion • Application-specific connectors • Add-on expansion slots  Application Focused Design • Customizable I/O via AFM • Modular motion, vision, and frame grabber cards • Industrial-grade cameras and peripheral  Remote Edge Management with EdgeGO • Real-time device monitoring and control • Secure OTA updates for seamless software deployment • Remote diagnostics and troubleshooting • Scalable management for large device networks  04 05](.ebook-matrix-2025/slide-003.jpg)

## Slide 4

![The slide features a dark industrial background with robotic arms visible on the left.  **Text on the left:** 'Build your system your way with Adaptive Function Modules'  'When standard systems hit their limits, Adaptive Function Modules unlock a new level of design freedom. Built on Matrix’s unique modular architecture, AFMs allow application-specific expansion from a wide selection of connectors, circuits, slots, and I/O options. This flexibility transforms a fixed platform into a tailored solution without added complexity.'  **Text and graphics on the right:** Large text reads 'AFM'. Below it is an image of an ADLINK device. Three red banners point to specific hardware sections with the text: - 'Integrated Circuit' - 'Add-on Expansion Slots' - 'Std. Industrial I/O Ports'  Page numbers '06' and '07' are visible in the bottom corners.](.ebook-matrix-2025/slide-004.jpg)

## Slide 5

![**Left Side Text:** *   **Header:** QuickSet *   **Title:** Simplifying System Configuration & Maintenance with Flexible Modularity *   **Description:** QuickSet is ADLINK’s signature modular design feature. It enables industrial users to build, configure, and scale with confidence. From creating a new system to upgrading an existing one, its intuitive setup delivers tool-free, plug-and-play access to CPU, memory, and storage. Built on the Matrix product line’s rugged architecture, QuickSet is proven to reduce deployment time and streamline field maintenance.  **Right Side Graphic (Process Flow):** *   **Main Header:** Lift ) Swap ) GO *   **Under 'Lift':** Lift top cover with only 8 screws *   **Under 'Swap':** Easy maintenance & reconfigurations for any setup *   **Under 'GO':** Field-ready in minutes  **Hardware Labels:** *   CPU *   Memory *   M.2 SSD  **Page Numbers:** *   08 (bottom left) *   09 (bottom right)](.ebook-matrix-2025/slide-005.jpg)

## Slide 6

![**Page 10 (Left Panel):** *   **Header:** Applications *   **Image Labels:**     *   Smart Manufacturing     *   Public Safety     *   Oil & Gas     *   Transportation     *   Maritime *   **Page Number:** 10  **Page 11 (Right Panel):** *   **Header:** Use Case *   **Title:** Production Monitoring *   **Section: Overview**     *   'In modern production environments, stable performance and continuous visibility are essential for keeping operations on track. However, expanding existing systems with additional I/O or motion control often introduces complexity, while harsh conditions can undermine reliable performance. The MXC-3340 is engineered to overcome these barriers with stable industrial communication, energy-efficient operation, and flexible expansion options. By combining rugged reliability with adaptable design, it provides a future-ready platform that keeps production lines efficient, resilient, and easy to manage.' *   **Sidebar Section: Smart Manufacturing**     *   **Subsection: Challenges & Requirements**         *   'Integration complexity makes it difficult to add I/O or motion control to existing systems'         *   'Environmental sensitivity challenges stable performance in extreme conditions without constant monitoring'     *   **Subsection: Solution & Insight**         *   'MXC-3340 ensures stable communication with isolated RS232/485 and DIO for harsh environments'         *   'Low power design helps reduce energy consumption and operating costs'         *   'Three PCIe slots enable easy expansion for DIO and motion control' *   **Diagram Labels:**     *   Server     *   Ethernet     *   MXC-3340     *   USB     *   HDMI/DP     *   KB/MS     *   Display     *   Ethernet     *   I/O *   **Page Number:** 11](.ebook-matrix-2025/slide-006.jpg)

## Slide 7

![The image displays two side-by-side slides (numbered 12 and 13) detailing use cases for the MXE-230 device.  **Slide 12: Motor Driver Controller** *   **Header:** Use Case Motor Driver Controller *   **Overview:** Industrial robots demand precise, responsive motion, especially when operating in compact environments where every millimeter counts. However, achieving high-speed, multi-axis control in such a limited space introduces both performance and integration challenges. The MXE-230 delivers powerful motion control in a small footprint, ensuring fast cycle times and reliable accuracy. With the flexibility to expand connectivity as systems evolve, it provides a future-ready solution that keeps robotic operations smooth, efficient, and adaptable. *   **Sidebar (Smart Manufacturing):**     *   **Challenges & Requirements:** Hard to find compact systems that support complex motion in tight spaces; Sub-500 µs EtherCAT cycle times for 8-axis control demand advanced integration     *   **Solution & Insight:** MXE-230 delivers powerful motion control in a compact form factor; Achieves 250 µs cycle time with SuperCAT for fast, precise motor control; Offers LAN expansion via AFM and M.2 for flexible robotic connectivity *   **Diagram Labels:** EdgeGO Remote Device Management, LAN / WIFI 6E, SuperCAT LAN, MXE-230, Multi-axis Motor Driver, Ethernet, Wireless.  **Slide 13: Data Acquisition Through PLC** *   **Header:** Use Case Data Acquisition Through PLC *   **Overview:** Factories rely on real-time insight from PLC systems to keep processes accurate, efficient, and continuously running. Yet collecting high-speed data across different brands and fitting everything into compact control cabinets can be a major challenge. The MXE-230 solves this by delivering fast, reliable PLC data acquisition with cycle times as short as 10 ms, while EdgeGO enables remote monitoring to minimize downtime. With a rugged, fanless design and broad protocol support, it ensures smooth integration and dependable performance in demanding industrial environments. *   **Sidebar (Smart Manufacturing):**     *   **Challenges & Requirements:** Requires high-speed data collection across devices; Must support multiple PLC brands and fit into compact cabinets; Needs efficient monitoring to minimize system downtime     *   **Solution & Insight:** MXE-230 collects data from multiple PLCs within a 10 ms cycle; EdgeGO enables remote monitoring and control to reduce downtime; Fanless and wide-temp design ensures reliable, rugged operation; Supports seamless integration with various PLC brands and protocols *   **Diagram Labels:** EdgeGO Remote Device Management, LAN / WIFI 6E, MXE-230, Signal Indicators, Sensors, Actuators, PLC, Serial, Ethernet, Wireless.](.ebook-matrix-2025/slide-007.jpg)

## Slide 8

![**Slide 14**  **Use Case: Industrial Robotic Machines**  **Overview** Robotic systems play a central role in automating complex industrial tasks, where stable I/O control and smooth integration are critical for consistent performance. Yet connecting robots to existing systems can be time-consuming, while frequent maintenance in harsh environments raises costs and risks downtime. The MVP-6200 addresses these needs with high-isolation I/O for reliable operation, customizable expansion for fieldbus integration, and flexible storage and connectivity options. This compact platform simplifies deployment and ensures dependable performance across demanding robotic applications.  **Smart Manufacturing**  **Challenges & Requirements** *   Integration with existing systems is time-consuming and complex *   Frequent maintenance increases operational costs in harsh environments  **Solution & Insight** *   MVP-6200 supports 16x DI and 16x DO with 2.5 kV isolation for reliable I/O protection *   Includes M.2 2280 for SSD with SED support and optional M.2 2230 for Wi-Fi *   Features latch switch power button with configurable S0 and S5 behaviour *   Customizable chassis allows pre-installation of fieldbus control board using consigned parts  **(Diagram Labels)** MVP-6200 *   USB: Motion Control Sensor *   Ethernet: Robotic Arm *   HDMI/DP: Multi-Display *   PCIe: EtherCAT Card  ***  **Slide 15**  **Use Case: Inspection System for Border Control**  **Overview** Border control operations demand constant accuracy and efficiency to verify documents in high-security environments. These systems must run continuously in compact spaces while handling complex integration with legacy infrastructure and real-time analysis requirements. The MVP-3120 meets these challenges with dual monitor support for streamlined inspections, automated document scanning for faster throughput, and a fanless, GPU-ready design that ensures durable, low-maintenance operation. Built for reliability, it keeps border checkpoints efficient and secure under demanding conditions.  **Public & Safety**  **Challenges & Requirements** *   Operates 24/7 in compact, high-security environments *   Complex integration with legacy border control systems and real-time document analysis  **Solution & Insight** *   MVP-3120 improves inspection speed with dual monitor support and real-time analysis *   Fanless, GPU-ready design ensures quiet, efficient operation *   Durable and dust-resistant for reliable performance in harsh conditions with low maintenance  **(Diagram Labels)** MVP-3120 *   Ethernet: Facial Recognition Camera *   USB: Fingerprint Scanner *   HDMI/DP: Display *   RS-485: eGate](.ebook-matrix-2025/slide-008.jpg)

## Slide 9

![**Slide 16**  **Use Case** **AI Object Detection**  **Overview** Cities and industries are turning to AI object detection to improve safety, efficiency, and automation in daily operations, from traffic monitoring to facility security. Yet deploying AI in the field often means working with limited space, restricted power budgets, and the need for seamless integration into existing infrastructure. The MXE-230 makes this possible with a compact, fanless design that fits easily into confined environments and efficient processing that supports real-time analysis. Combined with scalable AI acceleration, it enables accurate detection and faster response in a practical, deployable form.  **Public & Safety**  **Challenges & Requirements** • Accurate object detection with limited processing power • AI deployment in compact spaces like parking meters or traffic cabinets • Seamless integration into existing systems without major changes  **Solution & Insight** • The MXE-230 is powered by Intel® N97 for balanced performance with only 12W power draw • Compact 1.2L fanless design fits easily into tight spaces • Supports 26 TOPS AI performance with Hailo-8 via M.2 for efficient AI integration  **Diagram Text:** EdgeGO Remote Device Management LAN / WIFI 6E MXE-230 HDMI/DP Dual Displays Up to 4Kp60 USB Cameras M.2 2280 M Key Hailo-8™ AI Accelerator I/O Ethernet Wireless  16  ***  **Slide 17**  **Use Case** **Production Monitoring**  **Overview** Land-based drilling sites require centralized control to ensure safe, efficient, and cost-effective operations under challenging environmental conditions. Dust, sand, and high heat make it difficult to maintain stable performance while ensuring continuous monitoring of equipment and resources. The MVP-5200 provides the reliability these sites need, with high-speed LAN for real-time data transmission, a compact, fanless design for maintenance-free operation, and rugged durability built to withstand harsh onshore environments. This ensures consistent performance and reduced downtime across critical drilling operations.  **Oil & Gas**  **Challenges & Requirements** • Reliable operation in dusty, sandy, and harsh environments • 24/7 performance required in remote, rugged locations  **Solution & Insight** • MVP-5200 supports 6x 2.5GbE LAN for fast, stable data transmission • Fanless, compact system with Intel CPU ensures efficient, reliable performance • Rugged, maintenance-free design built for harsh environments  **Diagram Text:** EdgeGO Remote Device Management LAN / WIFI 6E MVP-5200 USB KB/MS Ethernet Display HDMI/DP PLC I/O Ethernet Wireless  17](.ebook-matrix-2025/slide-009.jpg)

## Slide 10

![The slide displays two 'Use Case' panels side-by-side, labeled pages 18 and 19.  **Left Panel (Page 18): EV Charging** *   **Header:** Use Case EV Charging *   **Overview:** As EV infrastructure scales, operators face growing demands for system stability, durability, and ease of integration to ensure minimal downtime. The MXE-230 addresses these challenges with a fanless aluminium enclosure built for outdoor environments, ensuring long-term performance stability. Empowered with edge computing and remote management, it delivers real-time insights and predictive maintenance for optimal uptime. AWS certification enables effortless cloud integration and scalable IoT management across distributed charging networks. *   **Transportation** *   **Challenges & Requirements:**     *   System stability for minimal downtim     *   Durability and environmental resistance     *   System integration and maintenance challenges *   **Solution & Insight:**     *   MXE-230 has a fanless aluminium enclosure that withstands heat, humidity, and dust     *   Empowers edge computing and remote management for real-time insights and uptime     *   AWS-certified for seamless cloud integration and scalable IoT deployment *   **Diagram Text:** Relay Control, Camera, Barcode Scanner, Management System, Navigation Equipment, Communication, Charging Module, MXE-230  **Right Panel (Page 19): Intelligent eBus Management** *   **Header:** Use Case Intelligent eBus Management *   **Overview:** Public transit systems are adopting eBuses to provide more eco-friendly and efficient transportation while cutting costs and easing urban congestion. Managing these vehicles, however, requires reliable systems that can handle frequent maintenance and connect with a wide range of devices without disrupting daily operations. The MXC-6200 provides a practical solution with a removable SSD tray for simplified servicing, versatile I/O support for smooth integration, and wide-range power input to ensure stable performance on the road. This enables eBus fleets to stay dependable, efficient, and easier to maintain. *   **Transportation** *   **Challenges & Requirements:**     *   SSD replacements need careful handling and can disrupt operations     *   Diverse I/O interfaces may lead to compatibility issues and added setup effort *   **Solution & Insight:**     *   MXC-6200 features a removable SSD tray for easy maintenance     *   Multiple I/O interfaces ensure seamless device integration     *   Supports 9–36V input for flexible, stable power across applications *   **Diagram Text:** Cloud Computing, Diagnostics Management, 4G / 5G, MXC-3300, HDMI/DP, DIO, HDMI/DP, TCP/IP, RS232/485, PIDS, Alarm, Operator Display, CCTV, Sensor, Serial, Ethernet, Wireless](.ebook-matrix-2025/slide-010.jpg)

## Slide 11

![**Left Panel (Slide 20)**  **Use Case** **Marine Control Room System**  **Overview** Vessel control rooms are the backbone of maritime operations, responsible for safe navigation and reliable communication around the clock. In these environments, systems must not only withstand vibration, humidity, and electrical interference but also comply with strict international standards. The MXC-3340 is purpose-built to meet these demands, combining a certified design with stable, isolated communication interfaces. Ensuring dependable performance in harsh maritime conditions enables efficient vessel management and reduces integration challenges across both new and legacy ship systems.  **Maritime**  **Challenges & Requirements** *   Meeting multiple marine certifications adds design complexity *   Integrating with legacy vessel systems increases setup time and cost  **Solution & Insight** *   Marine-certified with DC module and compliant design, including: IEC 60945, IACS E10, and DNVGGL-CG-0339 *   Isolated RS232/485 and DIO provide stable, high-performance communication in harsh conditions  *Diagram Text:* xN, MXC-3300, DIO, HDMI/DP, Ethernet, Alarm, Display, Camera, Navigation Equipment, RS232/485, PLC, Sensor  ***  **Right Panel (Slide 21)**  **Use Case** **Maritime Navigation Control System**  **Overview** Accurate navigation requires systems that can process radar, GPS, AIS, and ECDIS data without interruption. Managing these inputs demands strong rendering performance and seamless integration to avoid delays or errors that could compromise safety. The MVP-5200 is designed for this environment, delivering high-performance rendering and seamless data integration in a compact, fanless platform. With marine-grade compliance and dual-slot flexibility for GPU and network expansion, it ensures reliable navigation control and long-term stability at sea.  **Maritime**  **Challenges & Requirements** *   Processing multiple data sources like ECDIS, radar, and GPS strains system performance *   Dual PCIe slot integration may require complex configuration for navigation systems  **Solution & Insight** *   MVP-5200 delivers high-performance rendering for ECDIS and radar, with stable AIS, radar, and GPS data integration *   Complies with IEC 60945 marine standards for certified reliability *   Fanless dual-slot design supports GPU and network cards for maintenance-free operation  *Diagram Text:* LAN, Ethernet, MVP-5200, USB, HDMI/DP, AFM, RS232/422, Control Console, Display, Power Module, Compass, Ethernet, I/O](.ebook-matrix-2025/slide-011.jpg)

## Slide 12

![**Selection Guide: Expandable Series (Page 22)**      MVP-3120   MVP-6200   MVP-6100   MXC-3340     :---   :---   :---   :---   :---     **System**             CPU   Intel® Core™ 200S Series and 14/13/12th Gen Core™ Processors, up to 65W   9th Gen Intel® Core™ processors, up to 80W   Intel® Processor N-series & Atom X-series, up to 12W   Intel® Processor N-series & Atom X-series, up to 12W     Chipset   Intel® H610E   Intel® R680E   Intel® C246 (optional: Intel® H310)   -     Memory   DDR5 4800MHz, 2x SO-DIMM, up to 64GB   DDR4 2400 MHz, 2x SODIMM, up to 128GB (Support ECC memory)   DDR5 3600 MHz, 4x SODIMM, up to 32GB (Support ECC memory, only for Intel® chipset C246)   1x DDR5 4800MHz SO-DIMMs, up to 32G     Storage   4x SATA for 2.5 drive (support RAID 0/1/5/10)   2x SATA for 2.5 drive (support RAID 0/1/5/10)   2x SATA for 2.5 drive (support RAID 0/1 only for Intel® chipset C246) 1x CFast type II   -     OS   Windows® 10 IoT, Windows® 11 IoT, Ubuntu 22.04   Windows® 10 IoT LTSC or Ubuntu 22.04   Windows® 10/11 IoT Enterprise LTSC 21H2 (64bit) Ubuntu 22.04   Windows® 10/11 IoT Enterprise LTSC 21H2 (64bit) Ubuntu 22.04     TPM   -   TPM 2.0 support   -   -     **I/O Interfaces**             Display   1x HDMI 1.4b 1x DP++ 1.4   2x HDMI 1.4b 2x DP++ 1.4   2x DP++ 1.2 1x DVI-D 1x VGA   2x DP 1x HDMI     Serial Ports   -   -   2x isolated RS-232/422/485 DB9   2x isolated RS-232/422/485 DB9     USB   4x USB 3.2 Gen1 (Type-A) 4x USB 2.0 (Type-A)   4x USB 3.2 Gen2 (Type-A) 2x USB 3.2 Gen1 (Type-A)   3x USB 3.1 Gen1 3x USB 2.0 1x USB 2.0 internal dongle (2x USB 3.1 up to Gen 2 with C246)   1x USB 3.2 Gen 2 3x USB 2.0     Ethernet   1x 2.5GbE (Intel® i226) 2x 1.0GbE (Intel® i210) 1x 1.0GbE (Intel® i219)   3x 2.5GbE with TSN supported (i225) 1x vPro supported   2x 1.0GbE (Intel® i225) 1x 1.0GbE (Intel® i219) Support Intel® AMT/vPro™ with Intel® C246   4x GbE ports/I210IT     COM   COM1/2: RS-232/422/485 COM3: RS-232   COM1/2: RS-232/422/485 COM3/4: RS-232   COM1/2: RS-232/422/485 COM3/4: RS-232 COM5/6: RS-232 (optional)   -     DIO   8 DI + 8 DO   8 DI + 8 DO   -   -     Audio   Line-out, Mic-in   Line-out, Mic-in   -   1x USB 3.2 Gen 2 + 3x USB 2.0     SMA Antenna Connector   2   6   -   -     CAN   -   -   2x DB9 isolated CAN ports   -     USIM   -   -   2   -     I2C   -   2 (3.3V/5V)   -   -     **Extension Slots**             Backplane Extension   1x PCIe 4.0 x16, 1x PCI x1   2 slots: 1x PCIe4.0 x16, 1x PCI x1   4 slots: 1x PCIe4.0x16, 2x PCIe3.0x4, 1x PCI   3x PCIe slots     M.2   1x A+E Key 2230 1x M Key 2280   1x A+E Key 2230 1x B Key 3052/3042 1x M Key 2280   1x B+M key 2280/3042   M.2 2280 M Key (PCleX2) M.2 2230 E Key with (Wi-Fi(PCleX1), BT(USB2.0)) M.2 3042 B-key (USB3.0/2.0) with SIM card     **Power Supply**             DC Input   12 to 24V, 280W adapter (optional)   9 to 32V, 280W adapter (optional)   12-24V (± 10% tolerance)   9V-36V DC input pluggable connectors with latch (GND, V-, V+)     AC Input   280W AC/DC adapter (optional)   220 with 280W AC/DC adapter (optional)   100W external AC/DC adapter for AC input (optional)       **Environmental**             Operating Temperature   -20°C to 60°C (35W CPU) -20°C to 50°C (65W CPU)   -20°C to 50°C (35W CPU) -20°C to 40°C (80W CPU)   -20°C to 55°C (No air flow)   -15°C to 55°C (No air flow)    ***  **Selection Guide: Integrated Series (Page 23)**      MVP-3100   MVP-5200   MVP-5100   MXC-3300     :---   :---   :---   :---   :---     **System**             CPU   Intel® Core™ 200S Series and 14/13/12th Gen Core™ Processors, up to 65W   9th Gen Intel® Core™ processors, up to 65W   Intel® Processor N-series & Atom X-series, up to 12W   Intel® Processor N-series & Atom X-series, up to 12W     Chipset   Intel® H610E   Intel® R680E   Intel® H310 (optional: Intel® C246)   -     Memory   DDR5 4800MHz, 2x SO-DIMM, up to 64GB   DDR5 3600 MHz, 4x SODIMM, up to 128GB (Support ECC memory)   DDR4 2400 MHz, 2x SODIMM, up to 32GB (Support ECC memory, only for Intel® chipset C246)   1x DDR5 4800MHz SO-DIMMs, up to 32G     Storage   2x SATA for 2.5 drive (support RAID 0/1/5/10)   2x SATA for 2.5 drive (support RAID 0/1/5/10)   2x SATA for 2.5 drive (support RAID 0/1 only for Intel® chipset C246) 1x CFast type II   -     OS   Windows® 10 IoT, Windows® 11 IoT, Ubuntu 22.04   Windows® 10 IoT LTSC or Ubuntu 22.04   Windows® 10/11 IoT Enterprise LTSC 21H2 (64bit) Ubuntu 22.04   Windows® 10/11 IoT Enterprise LTSC 21H2 (64bit) Ubuntu 22.04     TPM   -   TPM 2.0 support   -   -     **I/O Interfaces**             Display   1x HDMI 1.4b 1x DP++ 1.4   2x HDMI 1.4b 2x DP++ 1.4   2x DP++ 1.2 1x DVI-D 1x VGA   2x DP 1x HDMI     Serial Ports   -   -   2x isolated RS-232/422/485 DB9   2x isolated RS-232/422/485 DB9     USB   4x USB 3.2 Gen1 (Type-A) 4x USB 2.0 (Type-A)   6x USB 3.2 Gen2 (Type-A) 1x USB 2.0 internal dongle   3x USB 3.1 Gen1 3x USB 2.0 1x USB 2.0 internal dongle (2x USB 3.1 up to Gen 2 with C246)   1x USB 3.2 Gen 2 3x USB 2.0     Ethernet   1x 2.5GbE (Intel® i226) 2x 1.0GbE (Intel® i210) 1x 1.0GbE (Intel® i219)   3x 2.5GbE (Intel® i225) support TSN   2x 1.0GbE (Intel® i225) 1x 1.0GbE (Intel® i219) Support Intel® AMT/vPro™ with Intel® C246   4x GbE ports/I210IT     COM   COM1/2: RS-232/422/485 COM3: RS-232   COM1/2: RS-232/422/485 COM3/4: RS-232   COM1/2: RS-232/422/485 COM3/4: RS-232 COM5/6: RS-232 (optional)   -     DIO   8 DI + 8 DO   8 DI + 8 DO   -   -     Audio   Line-out, Mic-in   Line-out, Mic-in   -   1x USB 3.2 Gen 2 + 3x USB 2.0     SMA Antenna Connector   2   6   -   -     CAN   -   -   2x DB9 isolated CAN ports   -     USIM   -   -   2   -     I2C   -   2 (3.3V/5V)   -   -     **Extension Slots**             Mini PCIe   -   1x Full size (USB2.0, PCIe)   -   -     Backplane Extension   1x PCIe 4.0 x16, 1x PCI x1   2 slots: 1x PCIe4.0 x16, 1x PCI x1   4 slots: 1x PCIe4.0x16, 2x PCIe3.0x4, 1x PCI   3x PCIe slots     M.2   1x A+E Key 2230 1x M Key 2280   1x A+E Key 2230 1x B Key 3052/3042 1x M Key 2280   1x B+M key 2280/3042   M.2 2280 M Key (PCleX2) M.2 2230 E Key with (Wi-Fi(PCleX1), BT(USB2.0)) M.2 3042 B-key (USB3.0/2.0) with SIM card     **Power Supply**             DC Input   12 to 24V, 280W adapter (optional)   9 to 32V, 280W adapter (optional)   12-24V (± 10% tolerance)   9V-36V DC input pluggable connectors with latch (GND, V-, V+)     AC Input   280W AC/DC adapter (optional)   220 with 280W AC/DC adapter (optional)   100W external AC/DC adapter for AC input (optional)       **Environmental**             Operating Temperature   -20°C to 60°C (35W CPU) -20°C to 50°C (55W CPU)   -20°C to 60°C (35W CPU) -20°C to 50°C (65W CPU)   -20°C to 55°C (No air flow)   -15°C to 55°C (No air flow)  ](.ebook-matrix-2025/slide-012.jpg)

## Slide 13

![The image displays two technical specification tables under the heading 'Selection Guide'.  **Table 1: Compact Series** This table compares two models: **MXE-310** and **MXE-230**.  *   **System Core:**     *   **Processor:** Intel® Raptor Lake Processor i3/i5/i7 15/28W (MXE-310); Intel® Processor N-series & Atom X-series, up to 12W (MXE-230)     *   **Core:** 6 (MXE-310); 4 (MXE-230)     *   **Base Freq:** 1.6 GHz (MXE-310); 2 GHz (MXE-230)     *   **MAX Turbo Freq.:** 4.5 GHz (MXE-310); 3.6 GHz (MXE-230)     *   **Memory:** 2x DDR5 SO-DIMMs, up to 4800MHz (MXE-310); 1x 8G DDR5 SO-DIMMs, up to 32G (MXE-230)     *   **OS Support:** Windows® 10/11 IoT Enterprise LTSC 21H2 (64bit) Ubuntu 22.04 *   **I/O Interfaces:**     *   **Display:** 1x DP 1x HDMI (optional: 2x HDMI) 1x (Type-C) (MXE-310); 1x DP 1x HDMI (MXE-230)     *   **Ethernet:** 2x LAN (LAN1 Intel® i219IT LAN2 Intel® i225IT, support 2.5Gbps) 6x LAN (optional) (MXE-310); 2x Gbe (Intel® i210IT, support 1Gbps/ 100Mbps/ 10Mbps) 4x GBE ports (Optional) (MXE-230)     *   **Serial Ports:** 2x RS-232/422/485 DB9 connector 2x RS-232 DB9 connector (MXE-310); 2x RS-232/422/485 DB9 Connector 4x RS-232/422/485 DB9 Connector (Optional) (MXE-230)     *   **USB:** 3x USB 2.0 2x USB 3.2 1x USB4 (Type-C) 6x USB 3.2 Gen1 (Optional) (MXE-310); 1x USB 3.2 Gen 2x1 ports (10Gbps) (Type-A) 3x USB 2.0 (Type-A) 7x USB 2.0 (optional) (MXE-230)     *   **Audio:** ALC888S, 1x line-in/ line-out, MIC-in     *   **M.2:** M.2 2280 M Key (PCIe x4) M.2 2230 E Key (PCIe x1, USB 2.0) M.2 3042 B-key (USB 3.0/2.0) (MXE-310); M.2 2280 M Key (PCIex2) M.2 2230 E Key with (Wi-Fi (PCIex1), BT(USB2.0)) M.2 3042 B-key (USB3.0/2.0) with SIM card (MXE-230)     *   **DI/O:** 8-ch DI and 8-ch DO (optional) (MXE-310); Isolated 8x DI + 8x DO (optional) (MXE-230)     *   **Expansion Slots:** Yes (Function Board) *   **Storage Devices Mechanical:**     *   **2.5 SATA:** 1x SATA III 6Gb/s for 2.5inch SSD     *   **M.2:** M.2 2280 M Key (PCIex4) (MXE-310); M.2 2280 M Key (PCIex2) (MXE-230) *   **Power Supply:**     *   **DC Input:** 12-24V +-5%     *   **AC Input:** 120W AC/DC adapter (optional) *   **Environmental:**     *   **Operating Temperature:** -20°C to 60°C  **Table 2: IIoT Gateways** This table compares two models: **MXA-312M** and **MXA-200**.  *   **System:**     *   **CPU:** Genio 520 MT8371, 2 ARM Cortex-A78 + 6 ARM Cortex-A55 (MXA-312M); NXP i.MX8M Plus with Quad core ARM Cortex-A53, 1.8GHz (MXA-200)     *   **Memory:** 1 x LPDDR5(X), up to 6400MHz 16GB (MXA-312M); LPDDR4 2GB/4GB 4000 MT/s (MXA-200)     *   **Main storage:** 64GB UFS3.1 (onboard) (MXA-312M); 32GB/64GB eMMC (onboard) (MXA-200)     *   **Sub storage:** 1 x Micro SD socket     *   **TPM:** TPM 2.0     *   **RTC:** Monthly difference max.180sec *   **I/O Interfaces:**     *   **USB:** 1 x USB 3.2 Gen 1 (Type-A) 1 x USB 2.0 (Type-A) (MXA-312M); 2x USB 3.0 (Type-A) (MXA-200)     *   **Ethernet:** 2x GbE     *   **COM:** 1 x RS-232 1 x RS-485 Terminal Connector (MXA-312M); 2x isolated RS-232/422/485 4-wire (MXA-200)     *   **Display output:** 2 x HDMI (up to 4K@60fps) (MXA-312M); 1x HDMI up to 3840 x 2160 at 30Hz (MXA-200)     *   **M.2:** M.2 2230 E Key with Wi-Fi/BT (USB2.0) M.2 3042 B-key with SIM card (USB2.0) (option by installed AFM board ) (MXA-312M); 1x M.2 2230 E-key for WiFi/BT 1x M.2 2242 B-key (USB 3.0) for 5G or 4G/LTE (MXA-200) *   **Mechanical:**     *   **Power supply:** 12V Terminal connector (MXA-312M); 12-24V DC (MXA-200) *   **Environmental:**     *   **Operating Temperature:** -20°C to 70°C](.ebook-matrix-2025/slide-013.jpg)

## Slide 14

![The slide contains contact information for ADLINK Technology, Inc. offices worldwide.  **Top Section (Red Background)** *   **Head Office:** ADLINK Technology, Inc.     *   No. 66, Huaya 1st Rd., Guishan Dist., Taoyuan City 333411, Taiwan     *   Tel : +886-3-216-5088     *   Fax: +886-3-328-5706 *   **Website:** www.adlinktech.com (with social media icons)  **Worldwide Offices Section** *   **Ampro ADLINK Technology, Inc.**     *   6450 Via Del Oro, San Jose, CA 95119-1208, USA Tel: +1-408-360-0200     *   Toll Free: +1-800-966-5200 (USA only) Fax: +1-408-360-0222     *   Email: info@adlinktech.com *   **ADLINK Technology (China) Co., Ltd.**     *   上海市浦东新区张江高科技园区芳春路 300 号 (201203)     *   300 Fang Chun Rd., Zhangjiang Hi-Tech Park Pudong New Area, Shanghai, 201203 China     *   Tel: +86-21-5132-8988     *   Fax: +86-21-5192-3588     *   Email: market@adlinktech.com *   **ADLINK Technology Beijing**     *   北京市海淀区上地东路 1 号盈创动力大厦 E 座 801 室 (100085)     *   Rm. 801, Power Creative E, No. 1 Shang Di East Rd. Beijing, 100085 China     *   Tel: +86-10-5885-8666     *   Fax: +86-10-5885-8626     *   Email: market@adlinktech.com *   **ADLINK Technology Shenzhen**     *   深圳市南山区科技园南区高新南七道数字技术园 A1 栋 2 楼 C 区 (518057)     *   2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7 High-Tech Industrial Park S., Shenzhen, 518054 China     *   Tel: +86-755-2643-4858     *   Fax: +86-755-2664-6353     *   Email: market@adlinktech.com *   **ADLINK Technology Singapore Pte. Ltd.**     *   84 Genting Lane #07-02A, Axxel Innovation Centre, Singapore 349584     *   Tel: +65-6844-2261     *   Fax: +65-6844-2263     *   Email: singapore@adlinktech.com *   **ADLINK Technology Singapore Pte Ltd. (Indian Liaison Office)**     *   #50-56, First Floor, Spearhead Towers Margosa Main Road (between 16th/17th Cross) Malleswaram, Bangalore - 560 055, India     *   Tel: +91-80-42246107, +91-80-23464606     *   Fax: +91-80-23464606     *   Email: india@adlinktech.com *   **ADLINK Technology Japan Corporation**     *   〒 101-0045 東京都千代田区神田鍛冶町 3-7-4 ユニゾ神田鍛冶町三丁目ビル 4F     *   Unizo Kanda Kaji-cho 3 Chome Bldg. 4F, 3-7-4 Kanda Kajiicho, Chiyoda-ku, Tokyo 101-0045, Japan     *   Tel: +81-3-4455-3722     *   Fax: +81-3-5209-6013     *   Email: japan@adlinktech.com     *   〒 450-0002 愛知県名古屋市中川区名駅 5-31-10 リンクス名駅ビル 3F     *   LINKS Meieki Bldg. 3F, 5-31-10 Meieiki, Nakamura-ku, Nagoya-city, Aichi 450-0002, Japan     *   Tel: +81-52-589-9018     *   Fax: +81-52-583-2807     *   Email: japan@adlinktech.com *   **ADLINK Technology Korea Ltd.**     *   경기도 용인시 수지구 신수로 767 A 동 1503 호 (동천동, 분당수지유타워) (우) 16827     *   A-1503, U-TOWER, 767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, Republic of Korea, 16827 Toll Free:+82-80-000-0585     *   Tel: +82-31-786-0585     *   Fax: +82-31-786-0583     *   Email: korea@adlinktech.com *   **ADLINK Technology, Inc. (Israel Liaison Office)**     *   MIXER Herzliya (Building B, 9 Floor) 3 Arik Einstein st., Zip code 4610301 Herzliya, Israel, P.O.Box - 351     *   Tel: +972-54-632-5251     *   Fax: +972-77-208-0230     *   Email: israel@adlinktech.com *   **ADLINK Technology GmbH**     *   Hans-Thoma-Straße 11     *   D-68163 Mannheim, Germany     *   Tel: +49 621 43214-0     *   Fax: +49 621 43214-30     *   Email: germany@adlinktech.com     *   Ulrichsbergerstraße 17     *   D-94469 Deggendorf, Germany     *   Tel: +49 991 290 94-10     *   Fax: +49 991 290 94-29     *   Email: germany@adlinktech.com *   **ADLINK Technology, Inc. (French Liaison Office)**     *   Bâtiment Thalès - Parc des Algorithmes, Route de l'Orme des Merisiers, 91190 SAINT AUBIN, France     *   Tel: +33 (0) 1 60 12 35 66     *   Email: france@adlinktech.com *   **ADLINK Technology, Inc. (UK Liaison Office)**     *   First Floor West Exeter House,     *   Chichester fields Business Park Tangmere, West Sussex, PO20 2FU, United Kingdom     *   Tel:+44-1243-859677     *   Email: uk@adlinktech.com  **Bottom Section (White Background)** *   **Logos:** NXP Gold Partner, intel prestige partner, NVIDIA Elite Partner *   **Disclaimer:** All products and company names listed are trademarks or trade names of their respective companies. ©2025 ADLINK Technology, Inc. All Rights Reserved. All pricing and specifications are subject to change without further notice. *   **QR Code:** Located on the bottom right.](.ebook-matrix-2025/slide-014.jpg)

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