## Slide 1

![**Header and Title** ADLINK Leading EDGE COMPUTING For The Intelligent Edge OSM-IMX95 / LEC-IMX95 NXP® i.MX 95-based OSM/SMARC Computer on Modules  **Image Labels and Logos** OPEN STANDARD MODULE™ SMARC module NXP Partner Program  **Descriptive Text** ADLINK’s modules bring the full power of the NXP® i.MX 95 application processor to space-constrained, next-generation edge systems. Designed for advanced AI, vision, and real-time control applications, these modules integrate a high-performance NPU, enhanced security architecture, and rich connectivity options. The OSM-IMX95 offers an ultra-compact footprint for embedded, rugged designs, while the SMARC-based LEC-IMX95 provides maximum flexibility for scalable industrial deployments.  Built on open standards and backed by ADLINK’s extensive engineering expertise, both modules accelerate time-to-market. 15 years of availability, robust design, and optimized performance-per-watt make these platforms ideal for mission-critical environments.  **Technical Specifications** NXP® i.MX 95 with 6x Arm® Cortex®-A55 Arm® Cortex®-M7 and Arm® Cortex®-M33 NXP® eIQ® Neutron NPU, ISP and VPU, Arm® Mali G310 3D GPU Up to 8GB LPDDR4 (OSM), 16GB LPDDR5 (SMARC) HDMI / LVDS / MIPI-DSI / MIPI-CSI SMARC V2.2 (82 x 50mm), OSM R1.2 (45 x 45mm)  **Footer** adlinktech.com/en/computer-on-module-nxp-imx95](.flyer-nxp-imx95/slide-001.jpg)

## Slide 2

![**Header:** ADLINK Leading EDGE COMPUTING  **Main Title:** Smarter, Scalable, Secure I-Pi Development Kits  **Description:** The ADLINK I-Pi SMARC IMX95 Development Kit gives engineers a fast, practical way to bring NXP® i.MX 95–based designs to life. With a ready-to-use SMARC module, carrier board, and pre-integrated software stack, the kit removes hardware complexity so you can focus on application innovation. Rapid prototyping, easy expansion, and reliable performance make it the ideal starting point for accelerating edge AI, vision, and industrial solutions.  **Image Text:** I-Pi SMARC IMX95 Industrial Prototyping for IoT/AIoT  **Logo:** NXP Partner Program  **Key Features:** *   High Scalability *   Power Efficiency *   Reduced TCO *   Longevity (15 Years)  **Specifications Table:**    Specifications   OSM-IMX95   LEC-IMX95     :---   :---   :---     **CPU**   NXP® i.MX 95 series with 2/4/6-core Arm® Cortex®-A55 1x Arm® Cortex®-M7, 1x Arm® Cortex®-M33   NXP® i.MX 95 series with 2/4/6-core Arm® Cortex®-A55 1x Arm® Cortex®-M7, 1x Arm® Cortex®-M33     **Memory/Storage**   Up to 8 GB LPDDR4X   Up to 16 GB LPDDR5     **Cache**   512KB   512KB     **Boot Loader**   U-Boot   U-Boot     **Graphics Outputs**   Dual Channel LVDS, HDMI or DSI   Dual Channel LVDS, HDMI or DSI     **Camera**   1x MIPI CSI Camera   2x MIPI CSI Camera (1x shared from DSI)     **LAN**   2x GbE with TSN   2x GbE with TSN, 1x 10GbE with TSN (optional)     **USB**   1x USB 3.1, 1x USB 2.0 (host)   2x USB 3.1, 4x USB 2.0 (one shared with WIFI on port 1)     **Extension ports**   4x UART, 3x SPI, 2x I2C, 14x GPIO, 2x SDIO   4x UART(SER2 shared with SPI1), 2x SPI, 3x I2C, 14x GPIO, 1x SDIO     **Audio**   2x I2S (located on the carrier)   1x I2S     **PCI Express**   1x PCIe x1 Gen3   2x PCIe x1 Gen3 (one shared with WIFI on port B)     **TPM**   Yes (located on the carrier)   Yes     **SEMA Support**   No   No     **Power Supply**   5.0 V DC±5%   5.0 V DC±5%     **Operating Temperature**   -40°C to +85°C   -40°C to +85°C     **Form Factor & Compatibility**   OSM Size-L, 45 x 45 mm, OSM specification v1.2   SMARC short size, 82 x 50 mm, SMARC specification v2.2    **Footer:** All products and company names listed are trademarks or trade names of their respective companies. Updated Nov. 5, 2025. ©2025 ADLINK Technology, Inc. All Rights Reserved. All pricing and specifications are subject to change without further notice. **Link:** Purchase at www.ipi.wiki](.flyer-nxp-imx95/slide-002.jpg)

[🔗 Link to the original document](.flyer-nxp-imx95/flyer-nxp-imx95.pdf)