## Slide 1

![This slide features the ADLINK logo in the top right corner with the tagline 'LEADING EDGE AI COMPUTING.' The main title reads 'Semiconductor Equipment Solutions.' Below the title, a blue bar contains the date 'April 2026.' In the bottom left corner, smaller text reads 'ADLINK   Leading Edge AI Computing.' The background displays a futuristic, blue-tinted image of computer chips and circuitry.](.eng-semiconductor-solutions-0409/slide-001.jpg)

## Slide 2

![**DISCLAIMER**  Information in this document is confidential and is subject to legal privilege. This document includes ADLINK Technology Inc., (“ADLINK”) products. No license is expressed or implied, by estoppel or otherwise, and no intellectual property rights are granted in this document. ADLINK reserves the right to make changes to any information, specifications, products, and product descriptions at any time, without notice. Any products, dates, and drawings are preliminary and based on current expectations, and are subject to change without notice. ADLINK accepts no liability for any actions taken on the basis of the information provided in this document. ADLINK disclaims any expressed or implied warranty as to the use of the information acquired in this document.  This document shall be viewed by the intended recipient(s) only, and shall not be reproduced, distributed, published, shared or exchanged by or between any other parties without the prior written consent of ADLINK.  All ADLINK Technology, Inc. products are manufactured or assembled at the ADLINK owned and operated facilities in Taiwan, China, Germany, and the United States. ADLINK Technology, Inc., is not owned, directed, or subsidized by the People’s Republic of China. The ADLINK name and its logos are trademarks of ADLINK Technology, Inc., in the US and other countries. All product and company names are either trademarked ™ or registered ® trademarks of their respective holders.  ADLINK   Leading Edge AI Computing Confidential 2](.eng-semiconductor-solutions-0409/slide-002.jpg)

## Slide 3

![The slide features a dark blue background with the headline: 'ADLINK provides a unified smart control platform connecting them all.'  Below the headline are three labeled sections with corresponding images: *   **EMS**: Shows machinery working on a green circuit board. *   **Optoelectronics**: Displays a grid of small electronic components. *   **Semiconductor**: Features a blue, 3D-rendered graphic of a microchip.  The bottom left corner displays the text: 'ADLINK   Leading Edge AI Computing'.](.eng-semiconductor-solutions-0409/slide-003.jpg)

## Slide 4

![The slide features a title and subtitle, followed by a serpentine process flow diagram divided into three rows, and a footer logo.  **Title and Subtitle:** Proven Semiconductor Equipment Enablement with ADLINK Platforms Across front-end and back-end processes, powered by ADLINK computing and I/O platforms.  **Top Row (Blue Arrows pointing right):** Surface Prep Lithography Etching Deposition (CVD/PVD) Metallization Wafer Cleaning / Inspection  **Middle Row (Green Arrows pointing left):** Underfill/ Lid Attach Die Bonding Wafer Dicing Wafer Thinning Wafer Probing  **Bottom Row (Teal Arrows pointing right):** Wire Bond/ Ball Attach Molding Marking & Singulation Burn-In / Electrical Test AOI / X-ray / 3D Inspection Final Testing Sorting & Marking  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-004.jpg)

## Slide 5

![This slide is titled **'Value Proposition'** and features a blue background with faint circuitry patterns. It highlights three key benefits, each accompanied by an icon and a large upward-pointing arrow:  *   **Reduced system risk with proven, long-lifecycle platforms** (Icon: Stack of coins) *   **Faster time-to-market through reusable computing & I/O foundations** (Icon: Speedometer gauge) *   **Multi-generation scalability without system redesign** (Icon: Database stack with arrows)  At the bottom, under the label **'Partners'**, logos are displayed for: **intel**, **NVIDIA**, **arm**, and **euresys** (with subtext 'a TKH Vision brand').  In the bottom left corner, the text reads: **ADLINK   Leading Edge AI Computing**](.eng-semiconductor-solutions-0409/slide-005.jpg)

## Slide 6

![The slide is titled **Semiconductor Product Portfolio**. It features a grid layout displaying various hardware categories with corresponding images and labels.  **Top Row:** *   **Digital IO**: Displays two hardware modules. *   **Motion Controller**: Shows a circuit board and a 3D block diagram. Below the image are the texts **EtherCAT** and **SuperCAT**. *   **Frame Grabber**: Displays two circuit boards. Below the image are the texts **GIGE VISION**, **US3 VISION**, and **Camera Link**.  **Middle Row:** *   **DAQ**: Shows a grey device with dials and a green circuit board. *   **GPU**: Displays a green circuit board and a card with a fan labeled **ADLINK**. *   **SSD**: Shows three storage devices featuring the **ASD** logo.  **Bottom Row:** *   **Embedded Platform**: Displays several black computer chassis of varying sizes. *   **PXle Chassis & SMU**: Shows a large chassis labeled **ADLINK** and an expansion card. *   **IPC/ Server**: Displays server towers, small black boxes, and green circuit boards.  **Footer:** The bottom left corner contains the text **ADLINK   Leading Edge AI Computing**.](.eng-semiconductor-solutions-0409/slide-006.jpg)

## Slide 7

![This slide, titled 'EtherCAT Motion Control Solutions,' presents a layered architecture of hardware and software products organized by function: Software, Master, and Slave.  **Software Layer:** At the top, under the label 'Software,' the slide displays logos for 'APS DK Automation Software' and 'APS Automation Software.' Accompanying text reads: 'Automation Product Software (APS SDK) 400+ motion functions with no-code testing.'  **Master Layer:** The middle layer, labeled 'Master,' features two hardware options flanking the central 'EtherCAT' logo: *   **Left:** A server-like unit labeled 'SuperCAT' and 'RTOS.' Text reads: 'SuperCAT Series Super-performance Soft EtherCAT Master Controller with up to 128-axis support.' *   **Right:** A PCIe card. Text reads: 'PCIe-8332/8334/8338 PCIe motion control card with up to 64-axis support.'  **Slave Layer:** The bottom layer, labeled 'Slave,' categorizes various modules into three groups: *   **I/O Module:** Features 'ECAT-IO Series Modular IO module' and 'ES Series EtherCAT Slice I/O Module.' *   **Trigger Module:** Features 'ECAT-TRG4 4-CH high-speed position comparetrigger module.' *   **Drives & Bridges:** Features 'Nu-Step DA 2-phase EtherCAT stepper driver' and 'ECAT-4XMO 4-CH motion control module bridge pulse train to EtherCAT.'  **Key Benefits:** The bottom section highlights three features with icons: *   **Great Flexibility:** 'Scalable axis control up to 128 axes via EtherCAT' *   **Strong Compatibility:** 'Seamless integration with 100+ tier-one motor brands' *   **Deterministic Real-time Control:** 'Stable cycle time and low jitter for precise multi-axis synchronization in semiconductor equipment.'  **Footer:** The bottom left corner displays 'ADLINK   Leading Edge AI Computing.'](.eng-semiconductor-solutions-0409/slide-007.jpg)

## Slide 8

![**Slide Title:** APC Series: Software-defined Motion Controller **Subtitle:** Empowering Machine Builders with Highly Flexible Motion Architectures.  **Left Column (Key Features):** *   **Ultimate 3-in-1 Convergence** (Overlaid text reads: 'Unity Motion, Vision,') **and Edge Computing in one.** *   **PC-Powered Control**     *   Accelerate integration with advanced PC computing. *   **Simplified Software EtherCAT**     *   Zero motion cards.     *   Minimal wiring.  **Right Side (Architecture & Hardware):** *   A 3D stack diagram sits atop a black industrial PC chassis labeled **ADLINK**. *   The software stack layers include:     *   Top Red Block: **RTOS** (with **SuperCAT** logo).     *   Middle Layer: **DAQ**, **VISION**, and **HYPERVERISOR**.     *   Bottom Layer: Two instances of **Windows**. *   Bottom Right Logo: **EtherCAT**  **Background:** Dark blue theme with faint circuit board and data visualization graphics.](.eng-semiconductor-solutions-0409/slide-008.jpg)

## Slide 9

![**Mainstream Electronics Automation Platform**  Highly integrated, cost-effective software-defined control for high-throughput manufacturing.  **Applications:** SMT   Component Pick & Place   Dispensing  **Verified Platform:** Mainstream Controller (APC-C47 with Intel® Core™ i5-12500E) + SuperCAT Classic Edition  **Key Features:** *   **Reliable Motion Control:** Built-in gantry control for smooth multi-axis sync *   **Vision Integration:** Optimized for high-throughput, rule-based inspection *   **Rapid Deployment:** Designed for minimized system bring-up time  **ADLINK   Leading Edge AI Computing**  **(Right Side Diagram)** *   **Top:** SuperCAT logo above a 3D stack labeled RTOS, PAQ, VISION. *   **Middle:** Red banner 'APC-' pointing to an image of a motherboard labeled **Value Series ATX Motherboard** with an Intel Core i5 logo. *   **Connection:** Arrow labeled **EtherCAT** pointing down to icons labeled **Servo Driver / Motor**. *   **Bottom:** Arrow pointing down to a card labeled **ECAT-IO Series Modular IO module**. Below that is a box listing **DIO** and **AIO**. *   **Footer:** *Configurations vary by application](.eng-semiconductor-solutions-0409/slide-009.jpg)

## Slide 10

![**Left Side Text:** Premium Semiconductor Control Platform Ultimate precision and force control engineered for advanced packaging and component handling. Applications: Advanced Die Bonding   Wafer Probing   High-End AOI  Verified Platform: Premium Controller (APC-M47 with Intel® Core™ i9-14900) + SuperCAT Ultimate Edition.  Key Features: • Soft Landing Control: Prevents die or bump damage • Sub-Micron Accuracy: Advanced 2D/3D Dynamic error compensation • System Consolidation: Integrates motion, vision, and edge computing  ADLINK   Leading Edge AI Computing  **Right Side Diagram Text:** SuperCAT RTOS VISION DAQ APC-M47 EtherCAT Pro Series ATX Motherboard intel CORE i9 Servo Driver / Motor ECAT-TRG4 4-CH high-speed position compare trigger module ES Series EtherCAT Slice I/O Module Light Camera Pulse train motor driver RS-232 RS-485 Serial TC/ RTD Hub DIO AIO *Configurations vary by](.eng-semiconductor-solutions-0409/slide-010.jpg)

## Slide 11

![**Header:** Feature Matrix: APC-C47 vs. APC-M47 Premium vs. Mainstream capabilities to accelerate your deployment decisions.  **Visuals and Column Headers:** *   **Left:** SuperCAT *   **Middle Column:**     *   Mainstream Electronics Automation Platform     *   Applications :     *   SMT     *   Dispensing     *   Component Pick & Place     *   APC-C47 *   **Right Column:**     *   Premium Semiconductor Control Platform     *   Applications :     *   Advanced Die Bonding     *   Wafer Probing     *   High-End AOI     *   APC-M47  **Table:** *   **Headers:** SuperCAT Edition   Classic   Ultimate *   **Row 1:** Control Mode   Soft Landing     *   **Row 2:** (Control Mode continued)   PT / PVT Motion Mode     *   **Row 3:** Motion   Linear / Circular / Helical Interpolation     *   **Row 4:** (Motion continued)   E-Gear / Gantry   V   *   **Row 5:** (Motion continued)   2D / 3D Dynamic Error Compensation     *   **Row 6:** Application   Position Comparison Trigger Output   V   *   **Row 7:** (Application continued)   User RTOS Application Dev. Environment     *   **Row 8:** (Application continued)   User Task Framework (by API supported)     *   **Row 9:** Utility & GUI   IO Address Mapping   V   V (intel CORE i7) *   **Row 10:** (Utility & GUI continued)   Simulation Axis and IO   V   V](.eng-semiconductor-solutions-0409/slide-011.jpg)

## Slide 12

![**Title:** Edge Vision Solution  **Software Layer:** *   Software *   euresys a TKH Vision brand *   Open eVision Image Analysis Tools *   OpenVINO  **Hardware Layer (Frame Grabbers / Video Capture Cards):** *   **1Gb:** PCIe-GIE74V/P, GiGE VISION *   **5Gb:** PCIe-U304, PCIe-U308, US3 VISION *   **10Gb:** NEW, PCIe-CPL64V Full, PCIe-10GPoE, 10 GIGE, CAMERA LINK *   **50-100Gb:** Euresys Coaxlink series, CoaXPress  **Key Benefits:** *   **Market Proven:** Recommended by top camera brands, with over 1 million connected cameras *   **Comprehensive Reliability:** PoE protection prevents card and camera damage from overcurrent and overvoltage *   **Low-Latency, Deterministic Capture:** Stable, low-latency image capture for precise inspection and real-time decision making in semiconductor equipment  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-012.jpg)

## Slide 13

![The slide is titled 'Ultra-high Speed AOI' at the top left. Below are three images labeled 'PCBA', 'Semiconductor', and 'Micro LED'.  The left section features the header 'Server-Grade High-Performance Platform' followed by the paragraph: 'Pre-validated server-grade AOI platform for high-camera-count inspection (e.g., 6-side inspection), supporting various frame grabber capture and optional GPU acceleration in a single system.'  Under the red header 'Solutions', the text reads: 'Validated PCIe expansion and system-level compatibility to reduce bring-up time and ensure stable operation under sustained AOI workloads.'  Under the red header 'Verified platform', the text reads: 'Server Motherboard (ISB-W890) + up to 11× frame grabbers or Up to 4 GPUs (RTX PRO 6000 Blackwell Max-Q Workstation Edition)-Via Extension'  Under the red header 'Benefits', the bullet points are: *   'Comprehensive power supply and chassis offering' *   'Dedicated bandwidth for multi-GPU hardware acceleration'  The bottom left corner displays 'ADLINK   Leading Edge AI Computing'.  The right section is titled 'Ultimate Bandwidth for Massive Inspection'. The bullet points are: *   'Total PCIe Lanes: Up to 128 lanes' *   'Expansion Capacity: 11 PCIe Expansion Slots (via Extension Board)' *   'Maximum Expandability: Up to 11x Frame Grabbers / 4x GPUs'  A diagram illustrates the hardware. A motherboard image is labeled 'NEW' and 'Server-Grade Platform (ISB-W890)'. A dotted line connects it to 'Or (via Extension Board)'. Below this, text reads: 'Supports any combination of ADLINK's full frame grabber (1G to 50G bandwidths)'.  At the bottom right, hardware images are labeled: *   'PCIe-CPL64V NE W' *   'CAMERA Link' *   'CoaXPress' *   'Euresys Coaxlink Series' *   'Up to 4 GPUs (Optional)' *   'RTX PRO 6000 Blackwell Max-Q Workstation Edition'  The bottom right corner displays the 'intel prestige partner' logo.](.eng-semiconductor-solutions-0409/slide-013.jpg)

## Slide 14

![**Header:** Precision Stream AOI **Images:** PCB, EV Battery, IC Packaging  **Left Column:** **Title:** Intel Core i-level Optimized Platform **Description:** Pre-validated AOI platform for multi-camera, high-bandwidth inspection in IC packaging and electronics manufacturing.  **Solutions:** ADLINK provides a pre-validated multi-frame grabber AOI platform, ensuring stable PCIe bandwidth allocation and reliable system operation under sustained high-bandwidth inspection workloads.  **Verified platform:** Industrial IPC Platform (IMB-M47) + up to 6x Frame grabbers + 1 GPU (RTX PRO 5000 Blackwell)  **Benefits:** *   System-level pre-validation, no compatibility issues or frame drops. *   Reducing customer time-to-market and integration effort.  **Footer:** ADLINK   Leading Edge AI Computing  **Right Column:** **Title:** Optimized for High-Efficiency Capture **Bullets:** *   Total PCIe Lanes: 27 Lanes *   Expansion Capacity: 7 PCIe Expansion Slots *   Maximum Expandability: Up to 6X Frame Grabbers & 1x GPU  **Diagram Labels:** *   Industrial IPC Platform (IMB-M47) *   Supports any combination of ADLINK's full frame grabber (1G to 50G bandwidths)  **Hardware Labels (Bottom Row):** *   GiGE VISION / PCIe-GIE74V/P *   CAMERA Link / PCIe-CPL64V / NE W *   CoaXPress / Euresys Coaxlink Series *   1 GPU (Optional) / RTX PRO 5000 Blackwell  **Logo:** intel prestige partner](.eng-semiconductor-solutions-0409/slide-014.jpg)

## Slide 15

![This slide presents the 'Essential Industrial IPC Platform' by ADLINK.  **Top Left Section:** *   **Header:** 'Essential AOI' *   **Images:** Three small photos are displayed with captions: 'Electronics Assembly', 'General Manufacturing', and 'Food & Beverage'.  **Left Text Column:** *   **Title:** 'Essential Industrial IPC Platform' *   **Subtitle:** 'Pre-validated AOI platform providing fundamental processing power and reliable connectivity for standard multi-camera inspection.' *   **Solutions:** 'ADLINK provides a streamlined, pre-validated platform that ensures seamless integration with ADLINK's full frame grabber, delivering stable and reliable performance for everyday inspection workloads.' *   **Verified platform:** 'Industrial IPC Platform (IMB-C47/DDR5) + up to 6x Frame grabbers' *   **Benefits (Red Header):**     *   'Optimized TCO with guaranteed system-level compatibility for standard applications.'     *   'Streamlined integration and rapid deployment for standard multi-camera setups.'  **Right Side:** *   **Header:** 'Essential Capacity for Standard Capture' *   **Bullet Points:**     *   'Total PCIe Lanes: 32 Lanes'     *   'Expansion Capacity: 6 PCIe Expansion Slots'     *   'Maximum Expandability: Up to 6X Frame Grabbers' *   **Hardware Image:** An image of a motherboard labeled 'Industrial IPC Platform (IMB-C47/DDR5)' with a yellow tag reading 'Samples Available in (26,Q3)'. *   **Text:** 'Supports any combination of ADLINK's full frame grabber (1G to 50G bandwidths)' *   **PCIe Cards:** Two circuit boards are shown below.     *   Left card: Labeled 'PCIe-CPL64V' with a 'Camera Link' logo and a small 'NE W' badge.     *   Right card: Labeled 'PCIe-GIE74V/P' with a 'GigE Vision' logo.  **Footer:** *   Bottom Left: 'ADLINK   Leading Edge AI Computing' *   Bottom Right: 'intel prestige partner' logo.](.eng-semiconductor-solutions-0409/slide-015.jpg)

## Slide 16

![**Title:** PXIe Platforms and Modules  **Top Section:** *   **PXIe Module:**     *   PXIe-9908     *   Source Measurement Unit Module *   **PXIe Controller:**     *   PXIe-3900-TL     *   S Series     *   6th Gen. Intel Xeon & Core i7/i5/i3     *   PXIe-3988     *   9th Gen. Intel Xeon E     *   PXIe-3987/3977/3937     *   7th Gen. Intel Core i7/i5/i3  **Middle Section (PXIe Chassis):** *   **NEW**     *   PXES-2596     *   9/12-slot, 16GB/s, 58W per slot *   PXES-2788     *   18/21-slot, 24GB/s, 102W per slot *   PXES-2785     *   18-slot, 24GB/s, 50W per slot *   PXES-2301     *   6-slot, 8GB/s, 38W per slot  **Bottom Features:** *   **Precise Sourcing & Measurement:** Parallel testing with 100kS/s update and 1M sampling rate *   **High Computing Performance:** Intel® Xeon®/Core™ processors with up to 64 GB dual-channel DDR4, and supports embedded NVMe SSD *   **Scalable but Stable:** 6 to 21-slot PXIe Chassis with up to 1700W high power and 102W per slot cooling capacity  **Footer:** *   ADLINK   Leading Edge AI Computing *   PXI Systems Alliance *   intel prestige partner](.eng-semiconductor-solutions-0409/slide-016.jpg)

## Slide 17

![**Title:** Data Acquisition Solutions  **Top Row Products:** *   **Left (Multi-Function DAQ Card):**     *   PCIe-9100 Series     *   Analog I/O/DI/DO with up to 16-bit resolution, 4M sampling rate *   **Right (Programmable Smart DAQ system):**     *   DAQ-218 16/8-ch voltage/current input, 250kS/s     *   DAQ-216 16-ch voltage input, 16-bit, 250kS/s     *   DAQ-204 4-ch sound and vibration input, 24-bit, 128kS/s     *   DAQPilot logo  **Bottom Row Categories:** *   GPIB & Digitizer *   USB DAQ *   High-speed DIO  **Key Features (Bottom Section):** *   **Comprehensive Data Coverage:**     *   High-density design supporting AI/AO/DI/DO     *   Vibration, voltage and current analog signal support     *   GPIB, Digitizer and high-speed DIO modules *   **Flexible DAQ Interface:**     *   PCIE, Ethernet, and USB-based for broad application coverage *   **Developer-Friendly:**     *   Full SDK and API support for LabView, C/C++, C# and Python developers to simplify integration  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-017.jpg)

## Slide 18

![**Header** IPC Boards & Systems Intel® Core™ 200S Series and 12-14th Gen Core™ Processors  **Expansion Flow** Expansion Slots Cost Optimized 7 Slots High-Performance Expansion 7 Slots PICMG Expansion ~12 Slots  **Industrial Automation Platform** IAP-M47-4U • Intel® Q670E • 7 PCIe  IAP-E47-4U • Intel® Q670E • Up to 12 PCIe/ PCI (PICMG Backplane)  **IPC Mainboards** IMB-C47H ATX MB • Intel® H610 3 PCI, 4 PCIe  IMB-C47 ATX MB • Intel® Q670 1 PCI, 6 PCIe  IMB-M47H ATX MB • Intel® H610 4 PCI, 3 PCIe  IMB-M47 ATX MB • Intel® Q670 7 PCIe  IMB-M47-R680E ATX MB • Intel® R680E 7 PCIe  NuPRO-E47 PICMG 1.3 SBC • Intel® Q670E • Up to 12 PCI/PCIe (PICMG Backplane)  **Footer Benefits** Industrial-Grade Reliability Proven durability under shock, vibration, and temperature extremes  Global Safety & Compliance Meeting CB, ESD, EMC, LVD, and UL global industrial standards  Long-Term Stability Endurance tested for continuous operation and long lifecycle support  **Logos** ADLINK   Leading Edge AI Computing intel prestige Windows Ubuntu](.eng-semiconductor-solutions-0409/slide-018.jpg)

## Slide 19

![**Title:** ASD+ Enterprise Series SSDs  **Performance Scale:** 0° C Superior Performance 70° C  **Product Series Details:**  **Left Column:** ASD+EDC18 Series M.2 2280/22110 PCIe 4.0 SSD ■ PCIe 4.0 High-Speed ■ PLP for Data Protection ■ TCG OPAL 2.0 & Flash Optimization  **Middle Column:** ASD+EDCP1 Series U.2 PCIe 4.0 SSD ■ PCIe 4.0 with Thermal ■ Throttling High MTBF, Shock- ■ Resistant ■ TCG OPAL 2.0 Security  **Right Column:** ASD+SDC12 Series 2.5 SATA III SSD ■ TRIM & Flash ■ Management Thermal ■ Stability ■ TCG OPAL 2.0 & 1.5M MTBF  **Connection Types (Bottom of Box):** PCIe (NVMe) SATA III  **Features & Software (Bottom Row):** Data Security Flash Optimization Power Loss Protection Customization Service EdgeGO Device Management Software  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-019.jpg)

## Slide 20

![**Title:** ADLINK Tailored Chassis Solutions  **Left Section (Quiet Safety Chassis):** *   Quiet Safety Chassis *   4U Rack Mount *   1U Rack Mount *   Wall Mount *   Mini-ITX Chassis *   Low Acoustic ≤45 dB *   Safety Certified  **Right Section (Economical LightChassis):** *   Economical LightChassis *   4U Rack Mount *   Wall Mount *   2U Rack Mount *   EMC Certified *   Cost Effective  **Footer:** *   ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-020.jpg)

## Slide 21

![**Chassis with PICMG 1.3 Full-size** **Rack Mount / Wall Mount** **SHB** **Quiet Safety Chassis**  **Table Content:**  *   **Type:** Rack Mount Industrial Chassis   Wall Mount Industrial Chassis *   **Model:** RK-110SE   RK-620B   RK-420B   RK-609B *   **Hight:** 1U   4U   4U   Wall Mount *   **Dimension W x D x H (mm):** 19 x 17.7 x 1.75 in (483 x 450 x 44 mm)   16.8 x 17.4 x 7 in (427 x 448 x 177 mm)   16.8 x 17.4 x 7 in (427 x 448 x 177 mm)   21.1 x 17.5 x 12.4 in (535 x 445 x 315 mm) *   **Motherboard Option:** PICMG 1.3 SHB   PICMG 1.3 SHB   PICMG 1.3 SHB   PICMG 1.3 SHB *   **Backplane Option:** EBP-D3E1   EBP-10E5 EBP-13E2 EBP-13E4 WBP-12E7   EBP-10E5 EBP-13E2 EBP-13E4 WBP-12E7   EBP-5E1 EBP-6E2 EBP-7E2 EBP-9E2 EBP-9E5 *   **Chassis Color:** Black   Beige/ Black   White   Beige *   **External 5.25':** 1   2   2   2 *   **External 3.5':** 1   1   1   2 *   **Internal 3.5':** 0   1   1   0 *   **Internal 2.5':** 0   1   1   0 *   **Supported PSU:** 300W (1U PSU)   400,500,600,750, 1200,2000W (PS2 ATX)   400,500,600,750, 1200,2000W (PS2 ATX)   400,500,600W *   **Supported Expansion Card (Quantity):** FHFL PCIe x4 cards (1)   FHFL cards (14)   FHFL cards (15)   FHFL cards(10)  **Footer:** AD LINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-021.jpg)

## Slide 22

![Chassis with ATX Rack Mount / Wall Mount  Quiet Safety Rack Mount Chassis Type   Rack Mount Industrial Chassis   Wall Mount Industrial Chassis Model   RK-620MB   RK-609MB Hight   4U   Wall Mount Dimension W x D x H (mm)   16.8 x 17.4 x 7 in (427 x 448 x 177 mm)   21.1 x 17.5 x 12.4 in (535 x 445 x 315 mm) Motherboard Option   ATX   ATX Chassis Color   Beige/ Black   Beige Extern al   5.25'   2   1   3.5'   1   2 Interna l   3.5'   1   1   2.5'   1   0 Supported PSU   400,500,600,750, 1200,2000W (PS2 ATX)   400,500,600W (PS2 ATX) Supported Expansion Card (Quantity)   FHFL cards (7)   FHFL cards (7)  Economical Light Rack Mount Chassis Type   Rack Mount Industrial Chassis   Wall Mount Industrial Chassis   Wall Mount/ Tower Industrial Chassis Model   RK-270MB-LH   RK-620MB-L   RK-609MB-L   RK-500MB-L Hight   2U   4U   Wall Mount/ Tower   Wall Mount/ Tower Dimension W x D x H (mm)   16.9 x 3.5 x 19 in (428 x 88.5 x 483mm)   16.8 x 17.4 x 7 in (427 x 447.9 x 177mm)   14.7 x 14.17 x 7.87 in (375 x 360 x 200 mm)   14.96 x 6.46 x 12.52 in (380 x 164 x 318 mm) Motherboard Option   ATX   ATX   ATX   ATX Chassis Color   Black   Beige   Beige   Beige External   5.25'   1   1   0   1   3.5'   1   2   0   0 Internal   3.5'   2   1   2   2   2.5'   0   0   0   0 Supported PSU   500W(1U)   400,500,600W (PS2 ATX)   400,500,600W (PS2 ATX)   400,500,600W (PS2 ATX) Supported   FHFL cards (7)  ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-022.jpg)

## Slide 23

![**Title:** Fanless Edge Computing Platforms  **Column 1: Compact** *   MXE-230 *   MXE-310 *   Small Footprint *   Energy Efficient *   Sensor & Utility Control  **Column 2: Integrated** *   MVP-3100 *   MVP-5200 *   Customizable I/O (AFM) *   High Performance *   Subsystem Control  **Column 3: Expandable** *   MVP-3120 *   MXC-3340 *   MVP-6200 *   Versatile Function Expansion (2-4 slots) *   Flexible Storage Expansion (SSD) *   AOI & High-Speed Inspection  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-023.jpg)

## Slide 24

![**High-Performance Inference Platforms** Intel® Xeon® 6 for Workstation Series/ AMD EPYC™ 9004/9005 Series  **3 Expansion Slots** AXE-7220GW • Intel® Xeon® 6 W • Up to 3 PCIe slots AXE-7220TR • AMD EPYC™ 9004/9005 • Up to 3 PCIe slots  **7~8 Expansion Slots** AXE-7440TR • AMD EPYC™ 9004/9005 • Up to 7 PCIe slots AXE-7440GW intel ai • Intel® Xeon® 6 W • Up to 8 PCIe slots  **10~11 Expansion Slots** ISB-TR10 • AMD EPYC™ 9004/9005 • Up to 10 PCIe slots ISB-W890 • Intel® Xeon® 6 W • Up to 11 PCIe slots AXE-7420GWA • Intel® Xeon® 6 W • Up to 11 PCIe slots  **Deterministic Latency** Predictable AI inference timing for synchronized inline metrology  **High-Throughput Expansion** Scalable Multi-GPU supports optimized for intensive multi-camera AOI  **Secure Tool-Side AI** 100% on-premises processing f maximum IP protection  ADLINK   Leading Edge AI Computing NVIDIA Certified intel prestige partner](.eng-semiconductor-solutions-0409/slide-024.jpg)

## Slide 25

![**Title:** Etching Machine  **Left Column:**  **ADLINK Solution:** *   PXIe Gen 3 Chassis *   Multi-Function DAQ *   Digital I/O *   Analog Output *   Serial Communication  Integrated high-speed I/O and control solutions ensure precise regulation of gas, pressure, and RF power. This maintains a stable plasma environment for uniform etching and multi-chamber synchronization.  **Challenges** 1.  **Process Instability:** Small drifts in gas, pressure, or RF power lead to non-uniform etching. 2.  **EMI Interference:** Plasma noise distorts analog feedback. 3.  **Multi-Chamber Control:** Requires synchronized yet independent operation.  **Why ADLINK:** 1.  **High-Speed Analog & Digital I/O:** Deliver real-time gas, pressure, and RF control for stable, uniform etching. 2.  **Robust Isolation & Interlock:** Ensure reliable valve and pump control under high EMI. 3.  **Deterministic Multi-Chamber Sync:** cPCI Backplane provides low-latency, synchronized chamber communication.  **ADLINK   Leading Edge AI Computing**  ***  **Right Column (Diagram):**  **Upper-level Controller** Industrial Automation Platforms  **cPCI-based Controller** Real-time Control & Interlock (Gas, Vacuum, RF, Temp)  (Image of hardware components) *   Multi-function DAQ card *   Digital I/O *   Analog Output *   Serial Communication *   PXIE Gen3 Chassis  **Sensors (Feedback to cPCI)** *   Chamber Pressure (Baratron) *   MFC Flow Feedback *   RF Fwd / Ref Power  **Actuator** (Icon)  **Chamber** (Icon) Plasma](.eng-semiconductor-solutions-0409/slide-025.jpg)

## Slide 26

![**Wafer Dicing Machine**  *   Software-defined Motion Controller (APC-M47), *   Frame Grabber/Video Capture Card (PCIe-CPL64V Full) *   Integrated motion control and DAQ solutions ensure precise movement and detect the cutting tool to verify clean, accurate wafer dicing into individual dies. *   Multi-Function DAQ Card (PCIe-9121)  **Requirements / Challenges** 1.  Compact equipment with EtherCAT solutions and needs higher accuracy 2.  Integrated with AOI inspection system for immediate defect detection 3.  2-ch at ≥62.5 kS/s per channel to detect potential defects on the cutting tool rotating (75 points/rev @ 50,000 RPM) 4.  2-ch at 10 kS/s per channel for vibration monitoring 5.  Vision system for wafer alignment, dicing guidance, and post-dicing inspection  **Why ADLINK:** 1.  Integrated and Modular Solutions:     *   APC-M47 unifies SuperCAT SoftMotion, DAQ, and AOI in a single controller     *   SuperCAT supports user-defined mapping functions for flexibility across machine types 2.  Precise Multi-channel Data Acquisition:     *   Support 4-ch total 400kS/s for 120 sampling points of the cutting tool     *   Support 14-bit resolution for detecting minor cutting defects     *   Support channel gain queue function to manage data 3.  High-throughput Image Capturing:     *   Support CameraLink full camera with up to 850MB/s, lower CPU  **Diagram Text:** *   Software-defined Motion Controller *   SuperCAT *   EtherCAT *   EtherCAT SOlution *   EtherCAT SOlution *   Frame Grabber PCIe-CPL64V Full *   Multi-Function DAQ-912 1 *   AIO *   DIO *   RS-232 RS-485 *   Serial I *   TC/ RTD *   Hub *   Pulse train *   Camera & motor driver *   Light *   Industrial Cameras *   Link *   Vibration Sensors / Spindle Encoder](.eng-semiconductor-solutions-0409/slide-026.jpg)

## Slide 27

![**Die Bonder**  **ADLINK Solution:** *   Software-defined Motion Controller (APC-M47), *   Frame Grabbers / Video Capture Cards (PCIe-CPL64V Full)     Pre-Heel alignment and stable bonding force are essential for ensuring reliable die attach performance and preventing bump or die damage.  **Challenges** 1.  Real-time vision-motion synchronization for die positioning 2.  Stable Z-axis pressure control (20-30N) during bonding to ensure consistent attach force and prevent die or bump damage 3.  Integration of multi-axis motion and vision inspection  **Why ADLINK:** 1.  Synchronized Vision-Motion Control: SuperCAT controller and CPL64V frame grabber synchronize image capture and motion execution for accurate die alignment. 2.  Dynamic Compensation & Soft-Landing: SuperCAT provides 2D/3D position error compensation and Z-axis soft-landing control to ensure smooth contact and prevent die or bump damage. 3.  High-Bandwidth, Reliable Vision Interface: CPL64V supports up to 850 MB/s DMA transfer with PoCL-safe power and stable image capture for high-speed inspection.  ADLINK   Leading Edge AI Computing  **Step 1** **Camera Positioning** Capture and align die position with PCIe-CPL64V Frame Grabber for precise placement.  **Step 2** **Soft-Landing Control** Perform smooth Z-axis approach and stable bonding using SuperCAT SoftMotion.  **Step 3** **Post-Bond AOI** Inspect bonding quality with synchronized vision capture via CPL64V Frame Grabber.  **Software-defined Motion Controller** APC-M47  **Frame Grabber** PCIe-CPL64V Full  CAMERA Link](.eng-semiconductor-solutions-0409/slide-027.jpg)

## Slide 28

![**Wafer Probing Machine**  **ADLINK Solution:** *   Software-defined Motion Controller(APC-M47), *   Frame Grabber/Video Capture Card (PCIe-CPL64V Full) *   Multi-Function DAQ Card (PCIe-9121)  Precise probe-pad alignment and real-time probe condition monitoring are critical to ensure accurate electrical contact and testing reliability.  **Requirements / Challenges** 1. 2-ch AO for displacement control and camera signal trigger 2. Precise Probe-pad alignment 3. Probe condition inspection  **Why ADLINK:** 1. Integrated Motion and Trigger Control:     *   PCIe-9121 supports 16-ch multi-function DAQ card, ±10 V, 250 KS/s, dual AO outputs 2. Real-time Image Transmission:     *   CPL64V frame grabber supports up to 850MB/s data transfer 3. Simple Setup:     *   PoCL support simplifies camera power delivery and cabling     *   Support SDK for AE/FAE development  **ADLINK   Leading Edge AI Computing**  **Step 1** **Probe-pad Alignment** Align probe-to-pad position with PCIe-CPL64V for precise electrical contact placement.  **Step 2** **Probe Contact & Test** Execute precise XYZ movement via SuperCAT SoftMotion with PCIe-9121 AO control.  **Step 3** **Probe Condition Inspection** Monitor probe tip condition in real-time via synchronized CPL64V vision capture.  **Hardware Labels (Bottom Row):** *   SuperCAT *   Software-defined Motion Controller APC-M47 *   Multi-Function DAQ PCIe-912 1 *   Frame Grabber PCIe-CPL64V Full *   CAMERA Link](.eng-semiconductor-solutions-0409/slide-028.jpg)

## Slide 29

![**Final IC Testing**  **ADLINK Solution:** *   GPIB(USB-3488), *   High-speed DIO (PCIe-7350)  The Last stage of semiconductor production to ensure IC meets the specification by verified parametric performance.  **Requirements / Challenges** 1. Collect key parameters (temperature, power, loading) via proprietary SPI protocol 2. Ensure IEEE-488 (GPIB) compliance for handler and instrument integration 3. Easily expansion system for additional test requirement  **Why ADLINK:** 1. High-density & High-speed:     *   PCIe-7350 DIO supports 10-CH 50MHz sampling rate 2. Fast & Compatible Communication:     *   USB-3488 GPIB with FIFO, up to 1.5MB/s     *   NI-488.2 drivers and industry-standard VISA libraries support 3. Scalable & Modular     *   Compact PXI chassis and SMU modules for future expansion  **Product Labels:** *   GPIB USB-3488 *   High-speed DIO PCIe-7350  **Footer:** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-029.jpg)

## Slide 30

![**IC Sorter**  **ADLINK Solution:** *   Expandable Fanless Embedded Computers (MVP-6200), *   Dual-card EtherCAT arPCIe-8332 and PCIe-8334) motion synchronization, low control cycle time, and improved response speed for IC sorting operations.  **Challenges** 1.  Multi-axis Coordination: 38-axis motion control requires precise synchronization between high-speed testing and load/unload stages. 2.  High I/O Density: Over 400 I/O points for handling actuators, sensors, and tester signals increase EtherCAT communication load. 3.  CPU Utilization: Concurrent motion, I/O control, and tester data exchange increase IPC workload and reduce real-time responsiveness.  **Why ADLINK:** 1.  Dual-card distributed motion control: PCIe-8334 manages high-performance testing motion, while PCIe-8332 controls load/unload axes, ensuring smooth coordination. 2.  Deterministic EtherCAT Communication: Hardware EtherCAT master ensures low control cycle time and stable operation under heavy I/O load. 3.  Asynchronous computing for higher UPH: Offloading motion computation reduces CPU load and improves system throughput and software execution speed.  **(Image Captions)** *   Expandable Fanless Embedded Computers MVP-6200 *   EtherCAT Solution PCIe-8332, PCIe-8334  **(Logo)** ADLINK   Leading Edge AI Computing](.eng-semiconductor-solutions-0409/slide-030.jpg)

## Slide 31

![The slide features a dark grey background with a large, light grey central rectangle.  **Text Content:** *   **Top Left:** 'Thank you.' *   **Bottom Right (inside rectangle):** 'www.adlinktech.com' *   **Bottom Left (outside rectangle):** 'ADLINK   Leading Edge AI' with 'Computing' underneath 'ADLINK'.  **Visual Elements:** *   A repeating geometric pattern of white triangles fills the center of the white rectangle. *   Four social media icons (Twitter, Facebook, YouTube, LinkedIn) appear next to the website URL.](.eng-semiconductor-solutions-0409/slide-031.jpg)

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