# nanoX-ASL

COM Express Mini Size Type 10 Module Based on Intel® Amston Lake Platform

# Features

• Delivers efficient performance with up to 8 cores, turboing up to 3.8 GHz
• Intel® UHD Graphics supports up to three independent 4K @ 60 Hz displays
• Supports up to 32 GB of on-board LPDDR5-4800 memory with in-band ECC

![The image features a large blue oval containing the word 'Preliminary' in white, sans-serif text that is slanted upwards. Partially visible at the bottom right is a small rectangular object, likely a sticker or label, displaying a yellow circular icon and some small, illegible black text or markings.](.20260508-598fe9e4-952/400dbbb43737a02a0817ffc789347338cedca15578396b1bce2f520104a2cc11.jpg)

![Close-up of a green circuit board with a central processor and multiple microcontroller chips (no visible text or symbols)](.20260508-598fe9e4-952/73ee2df0eb84348c8882f21b2173f487f3b6825ea8da819c655fc82e0fc8bfe0.jpg)

• 2.5GbE with Intel® TSN/TCC enables deterministic, real-time control
Offers flexible I/O with four PCIe Gen 3 lanes and USB 3.2/2.0 for easy expansion
• Extended temperature options ensure reliable operation in harsh environments; SDIO support optional via BOM

Specifications

<table><tr><td rowspan="11">Core System</td><td rowspan="6">SoC</td><td colspan="6">Intel® CoreTM Atom® x7000 Series Processors</td></tr><tr><td>CPU SKU</td><td>Core</td><td>Cache</td><td>Base Frequency</td><td>TDP</td><td>Graphics</td></tr><tr><td>x7835RE</td><td>8</td><td>6MB</td><td>1.3GHz</td><td>12W</td><td>UHD 32EUs</td></tr><tr><td>x7433RE</td><td>4</td><td>6MB</td><td>1.5GHz</td><td>9W</td><td>UHD 32EUs</td></tr><tr><td>x7213RE</td><td>2</td><td>6MB</td><td>2GHz</td><td>9W</td><td>UHD 16EUs</td></tr><tr><td>x7211RE</td><td>2</td><td>6MB</td><td>1GHz</td><td>6W</td><td>UHD 16EUs</td></tr><tr><td>Memory (Soldered Down)</td><td colspan="6">Up to 32GB (2x 16GB) LPDDR5 at max. 4800MT/s, IBECC (build option)</td></tr><tr><td>Embedded BIOS</td><td colspan="6">AMI Aptio V</td></tr><tr><td>Expansion</td><td colspan="6">Up to 4 PCIe1 Gen3 lanesPCIe Gen3 x4 (lane 0-3): configurable as x2, x1</td></tr><tr><td>Buses SEMA Board Controller</td><td colspan="6">ManageabilityVoltage/current monitoringPower-sequence debug supportAT/ATX mode controlLogistics &amp; forensic information (event/history)General-purpose interfaces:  $I^{2}C$ , UART, GPIOWatchdog timer and fan control</td></tr><tr><td>Debug Headers</td><td colspan="6">30-pin FFC/FPC connector, compatible with the DB30-x86 debug module(For BIOS POST code LEDs, EC access, SPI BIOS flashing, power test points, and debug LEDs)</td></tr></table>

Specifications

<table><tr><td rowspan="3">Video</td><td>GPU Feature Support</td><td>Support up to 3 independent displays resolution up to 4K60: DP / HDMI / eDP• Intel® Gen 12 UHD graphics, up to 32EU• Standards: DirectX® 12, OpenGL® 4.6, Vulkan® 1.2• Graphics hardware virtualization: SR-IOV 1</td></tr><tr><td>Digital Display Interface</td><td>DDI port (DDI 0), support DP1.4/HDMI2.0b</td></tr><tr><td>LVDS/eDP</td><td>Default LVDS (Option eDP)LVDS: Single channel 18/24-bit, resolution up to (1366 × 768 @60Hz)eDP: 1.4b HBR3, resolution up to (TBC).</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On the carrier miniBASE-10R</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (TSN by build option)</td></tr><tr><td>Speed</td><td>2.5Gbps/1000M/100M/10M Ethernet connection</td></tr><tr><td rowspan="2">Multi I/O and Storage</td><td>USB</td><td>2 x USB 3.28 x USB 2.0 (USB 2 port 7 colay with SDIO, by project support)2 x SATAIII(600 MB/s)</td></tr><tr><td>eMMC</td><td>eMMC 5.1, 32GB to 128GB (Optional)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on the carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 4.75-20 V / 5Vsb ±5%; or AT: 4.75-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 10</td></tr><tr><td>Dimension</td><td>Mini size: 84 mm x 55 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°CExtreme Rugged: -40°C to 85°C (Selected SKIs)</td></tr><tr><td>Humidity</td><td>Operating: 5-90% RH, non-condensingStorage: 5-95% RH, non-condensing</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 11 IoT Enterprise LTSCUbuntu 24.04 LTS</td></tr></table>

![Based on the provided flowchart/block diagram, here is the accurate and concise description:\n\n**Labeled Blocks:**\n*   PICMG COM R3.1 Compliant\n*   7th Generation Intel Atom® x7000 series Processor (Amston Lake)\n*   LPDDR5 4800 MHz max 2~16GB (x2)\n*   Embedded Controller\n*   TPM2.0\n*   BIOS\n*   USB to SDIO\n*   eSPI to LPC\n*   I226 V/IT\n*   eDP to LVDS\n*   eMMC 5.1 32~128GB\n*   DDIO\n*   eDP/LVDS\n*   USB 3.0 (0:1)\n*   USB 2.0 (0:6)\n*   USB 2.0 (7)\n*   SATA (0:1)\n*   Max 2.5GbE\n*   PCIe(0:1)\n*   PCIe(2:3)\n*   HDA\n*   SPI\n*   GSPI\n*   SMBus\n*   GPIO/SDIO\n*   I2C\n*   UART(0:1)\n*   LPC/eSPI\n*   USB 3.2(0:1)\n*   USB2.0(0:6)\n*   USB2.0(7)\n*   SATA(0:1)\n*   LAN\n*   HSIO(2:3)\n*   HSIO(8:9)\n*   HDA\n*   SPI\n*   GSPI\n*   SMBus\n*   GPIO\n*   I2C\n*   UART\n*   eSPI\n*   eMMC\n\n**Connections:**\n*   **DDIO:** Left 'DDIO' connects directly to Processor 'DDIO'.\n*   **Display:** Left 'eDP/LVDS' connects to Processor 'eDP' via the 'eDP to LVDS' block. A dashed line labeled 'eDP 4 Lanes. Build option' runs parallel to this connection.\n*   **USB:** Left 'USB 3.0 (0:1)' connects to 'USB 3.2(0:1)'. Left 'USB 2.0 (0:6)' connects to 'USB2.0(0:6)'. Left 'USB 2.0 (7)' connects to 'USB2.0(7)'.\n*   **Storage:** Left 'SATA (0:1)' connects to 'SATA(0:1)'.\n*   **Network:** Left 'Max 2.5GbE' connects to the 'I226 V/IT' block, which connects to Processor 'LAN'.\n*   **PCIe/HSIO:** Left 'PCIe(0:1)' connects via 'X2, x1 config' to Processor 'HSIO(2:3)'. Left 'PCIe(2:3)' connects via 'X2, x1 config' to Processor 'HSIO(8:9)'.\n*   **Audio:** Left 'HDA' connects to Processor 'HDA'.\n*   **SPI/TPM:** Left 'SPI' connects to Processor 'SPI'. It also connects to 'TPM2.0', which connects to 'BIOS'. The 'BIOS' block connects back to 'SPI' via a dashed line labeled 'Build option'.\n*   **GPIO/SDIO:** Left 'GPIO/SDIO' connects to Processor 'GPIO'. It also connects via a dashed line labeled 'SDIO' through the 'USB to SDIO' block to the 'Embedded Controller'.\n*   **UART:** Left 'UART(0:1)' connects via a dashed line to Processor 'UART' and continues to the 'Embedded Controller'.\n*   **LPC/eSPI:** Left 'LPC/eSPI' connects to the 'eSPI to LPC' block, which connects to Processor 'eSPI'. Left 'LPC/eSPI' also connects directly to the 'Embedded Controller'. Processor 'eSPI' connects to the 'Embedded Controller'.\n*   **SMBus:** Left 'SMBus' connects to Processor 'SMBus' and the 'Embedded Controller'.\n*   **GSPI:** Left 'GSPI' connects to Processor 'GSPI' and the 'Embedded Controller'.\n*   **I2C:** Left 'I2C' connects via a dashed line to Processor 'I2C'.\n*   **Memory:** The Processor connects to two blocks labeled 'LPDDR5 4800 MHz max 2~16GB'.\n*   **eMMC:** Processor 'eMMC' (dashed line) connects to the 'eMMC 5.1 32~128GB' block.](.20260508-598fe9e4-952/adc638e1e37e3a5e32549e5b717ca8b66713a170b94fe074b1406c8b4c095e13.jpg)

Ordering Information

<table><tr><td>Module</td><td>Description</td></tr><tr><td>nanoX-ASL-x7211RE-8G</td><td>Mini COM Express Type 10 module with Intel Amston Lake Atom x7211RE, 8GB memory</td></tr><tr><td>nanoX-ASL-x7213RE-16G</td><td>Mini COM Express Type 10 module with Intel Amston Lake Atom x7213RE, 16GB memory</td></tr><tr><td>nanoX-ASL-x7835RE-32G</td><td>Mini COM Express Type 10 module with Intel Amston Lake Atom x7835RE, 32GB memory</td></tr><tr><td>t1nanoX-ASL-x7433RE-8G</td><td>Mini COM Express Type 10 module with Intel Amston Lake Atom x7433RE, 8GB memory, -40°C to +85°C</td></tr><tr><td>t1nanoX-ASL-x7835RE-32G</td><td>Mini COM Express Type 10 module with Intel Amston Lake Atom x7835RE, 32GB memory, 40°C to +85°C</td></tr></table>

Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-nASL-B</td><td>Heatspreader for nanoX-ASL with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-nASL-B</td><td>Low profile heatsink for nanoX-ASL with threaded standoffs for bottom mounting</td></tr><tr><td>THSH-nASL-B</td><td>High profile heatsink for nanoX-ASL with threaded standoffs for bottom mounting</td></tr></table>
[🔗 Link to the original document](.20260508-598fe9e4-952/20260508-598fe9e4-952.pdf)