# cExpress-AR # COM Express Compact Size Type 6 Module with New AMD Ryzen™ Embedded V2000 APU # Features ● Up to 8 cores based on AMD Zen 2 architecture ● Improved graphics performance (new Radeon Vega GPU) Up to 4x 4K displays (DP, eDP) ● 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes ● Configurable TDP down to 10W (8, 6 cores) ![Close-up of a green printed circuit board with integrated circuits and connectors (no readable text or symbols)](.cexpress-ar-datasheet-20231011/281a41860806cfb19f879d3f5664a61967ddd12ed51392b623d6e85e5b74bad9.jpg) # Specifications # ● Core System # CPU New AMD Ryzen™ Embedded V2000 APU - 7nm process AMD V2748 2.9/4.25GHz, 4MB L2, 35-54W (8C/7CU) AMD V2546 3.0/3.95GHz, 3MB L2, 35-54W (6C/6CU) AMD V2718 1.7/4.15GHz, 4MB L2, 10-25W (8C/7CU) AMD V2516 2.1/3.95GHz, 3MB L2, 10-25W (6C/6CU) # Memory Dual channel up to 3200 MT/s ECC/non-ECC DDR4 memory up to 64GB in two SODIMM sockets • ECC, non-ECC support # Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option # Cache 4MB L2 for V2748/V2718, 3MB L2 for V2546/V2516 # Expansion Busses 6 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5 (x1, x2) Note: PCIe switch by build option for additional x1 on Lanes 6/7 1 PCIe x8 Gen3: Lanes 16-23 (configurable to 1 x8, 2 x4) LPC bus, SMBus (system) , I2C (user) # SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) # Debug Headers 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs # ● Video # GPU Feature Support AMD Radeon™ Vega Graphics, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K at DP, eDP) • Hardware encode/decode (including HEVC 10-bit) • DirectX 12 support • OpenGL 4.6 and ES 3.X support • OpenCL 2.1 support # Digital Display Interface DDI1/2/3 supporting DisplayPort 1.4, HDMI 2.1, DVI DisplayPort 1.4, max. resolution 4096x2160@60Hz HDMI 2.1, max. resolution 4096x2160 @60Hz (max. resolution support dependent on carrier) # VGA Supported by build option through DP-to-VGA IC (in place of DDI3) Max. resolultion 1920x1200 @60Hz # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Max. resolution 1920x1200 @60Hz in dual mode # eDP Optional 4 lane eDP1.3 support, in place of LVDS Max. resolution 4096X2160@60Hz (max. resolution dependent on carrier) # Specifications # ● Audio # Chipset AMD Audio coprocessor integrated in APU # Audio Codec On carrier Express-BASE6 (ALC886 standard support) # ● Ethernet # LAN Controller Intel® Ethernet Controller i225 Series (V/IT versions) # Interface 2.5Gbit/s, 1000/100/10 Mbit/s Ethernet connection # ● Multi I/O and Storage USB: 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7) SATA: 2x SATA 6Gb/s (SATA 0,1) Serial: 2x UART ports with console redirection GPIO: 4x GPO and 4x GPI from EC (GPI with interrupt TBC) Note: USB 3.2 Gen2 support dependent on carrier design # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis) # ● TPM Chipset: Infineon Type: TPM 2.0 (LPC based, build option) # ● Power # Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% # Wide Input ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving # ● Mechanical and Environmental Form Factor: PICMG COM.0: Rev 3.0 Type 6 Dimensions: Compact size: 95 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C (Storage: -20°C to 80°C) Extreme Rugged: -45°C to 85°C (optional, selected SKUs; Storage: -40°C to 85°C, TBC) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating Systems # Standard Support Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Ubuntu 20.04 (planning) # Functional Diagram ![**Central Block:**\n* New AMD Ryzen™ Embedded V2000 Series\n\n**Left Column Blocks:**\n* VGA\n* eDP/LVDS\n* USB 2.0 Lane 0-7\n* SATA Port 0-1\n* SATA Port 2-3\n* PCIe Lane 0-3\n* PCIe Lane 4-5\n* 2.5GbE/GbE\n* HDA\n* SPI\n* SMBus\n* I2C\n* GPIO/SDIO\n* UART/CAN\n* LPC/eSPI\n\n**Right Column Blocks:**\n* DDI 1\n* DDI 2\n* DDI 3\n* USB 3.0 Lane 3\n* USB 3.0 Lane 2\n* USB 3.0 Lane 1\n* USB 3.0 Lane 0\n* PCIe Lane 6\n* PCIe Lane 7\n* PEG Port PCIe 16-23\n* PCIe 24-27\n* PCIe 28-31\n\n**Intermediate and Bottom Blocks:**\n* build option DP to VGA\n* eDP to LVDS\n* build option , eDP 4 lanes\n* Gen3/2 switch\n* LAN i225 V/IT\n* BIOS Flash\n* build option\n* TPM 2.0\n* Embedded Controller\n* TM102 (board)\n* USB Hub\n* USB 3.2 (10Gbps)\n* DDR 4 SODIMM (top side) 3200 MT/s, non-ECC/ECC\n* DDR 4 SODIMM (bottom side) 3200 MT/s, non-ECC/ECC\n* ECC support on specific APU SKUs\n* 4 x 1, 2 x 2, 1 x 4\n* 1 x 8, 2 x 4\n* GPP 8, 9\n* GPP 4, 5, 6, 7\n* GPP 2-3\n* GPP 0/1\n* DP 0\n* DP 1\n* DP 2\n* DP 3\n* GFX (0:7)\n* UART\n* LPC\n\n**Connections:**\n* **DP 0** connects to **eDP to LVDS** (solid line) which connects to **eDP/LVDS**.\n* **DP 0** connects to **build option DP to VGA** (dashed line) which connects to **VGA**.\n* **DP 0, DP 1, DP 2, DP 3** connect to **build option , eDP 4 lanes** (dashed lines).\n* **DP 1** connects to **DDI 1**.\n* **DP 2** connects to **DDI 2**.\n* **DP 3** connects to **DDI 3**.\n* **USB 2.0 Lane 0-7** connects to **New AMD Ryzen™ Embedded V2000 Series**.\n* **SATA Port 0-1** connects to **GPP 8, 9**.\n* **SATA Port 2-3** connects to **GPP 4, 5, 6, 7**.\n* **PCIe Lane 0-3** connects to **GPP 4, 5, 6, 7** (labeled **4 x 1, 2 x 2, 1 x 4**).\n* **PCIe Lane 4-5** connects to **GPP 2-3**.\n* **PCIe Lane 4-5** connects to **Gen3/2 switch** (dashed line).\n* **Gen3/2 switch** connects to **PCIe Lane 6** and **PCIe Lane 7** (dashed lines).\n* **PCIe Lane 6** and **PCIe Lane 7** connect to **New AMD Ryzen™ Embedded V2000 Series** (dashed lines).\n* **2.5GbE/GbE** connects to **LAN i225 V/IT** which connects to **GPP 0/1**.\n* **HDA** connects to **New AMD Ryzen™ Embedded V2000 Series** (dashed line).\n* **SPI** connects to **BIOS Flash** (two boxes).\n* **BIOS Flash** connects to **build option** (text) which connects to **New AMD Ryzen™ Embedded V2000 Series** (dashed line).\n* **SMBus** connects to **New AMD Ryzen™ Embedded V2000 Series**.\n* **I2C** connects to **Embedded Controller**.\n* **GPIO/SDIO** connects to **Embedded Controller**.\n* **UART/CAN** connects to **Embedded Controller**.\n* **LPC/eSPI** connects to **Embedded Controller**.\n* **UART** connects to **Embedded Controller** (solid line) and **TPM 2.0** (dashed line).\n* **LPC** connects to **TPM 2.0** (dashed line) and **Embedded Controller** (dashed line).\n* **TPM 2.0** connects to **Embedded Controller** (dashed line).\n* **Embedded Controller** connects to **TM102 (board)**.\n* **USB 3.2 (10Gbps)** (two labels) connect to **USB Hub**.\n* **USB Hub** connects to **USB 3.0 Lane 3**, **USB 3.0 Lane 2**, **USB 3.0 Lane 1**, **USB 3.0 Lane 0**.\n* **PEG Port PCIe 16-23** connects to **GFX (0:7)** (labeled **1 x 8, 2 x 4**).\n* **New AMD Ryzen™ Embedded V2000 Series** connects to **DDR 4 SODIMM (top side)** and **DDR 4 SODIMM (bottom side)**.](.cexpress-ar-datasheet-20231011/fbe5ee90bce387ad5b33c52c56dbf0f439211471faba32b103591bcde12410e9.jpg) Note: General Purpose Ports GPP 2-9 can support up to a maximum of 6 devices (SATA 0/1 count as one device). # Ordering Information ● cExpress-AR-V2748 Compact COM Express Type 6 module with New AMD Ryzen™ V2748 at 2.9/4.15GHz, otca-core processor, Radeon™ Vega graphics with 7CU ● cExpress-AR-V2546 Compact COM Express Type 6 module with New AMD Ryzen™ V2546 at 3.0/3.95GHz, hexa-core processor, Radeon™ Vega graphics with 6CU ● cExpress-AR-V2718 Compact COM Express Type 6 module with New AMD Ryzen™ V2718 at 1.7/4.15GHz, otca-core processor, Radeon™ Vega graphics with 7CU ● cExpress-AR-V2516 Compact COM Express Type 6 module with New AMD Ryzen™ V2516 at 2.1/3.95GHz, hexa-core processor, Radeon™ Vega graphics with 6CU \*For processor SKUs not listed, please contact your ADLINK representative for availability. # Accessories # Heat Spreaders ● HTS-cAR-B Heatspreader for cExpress-AR with threaded standoffs for bottom mounting ● HTS-cAR-BT Heatspreader for cExpress-AR with through hole standoffs for top mounting # Passive Heatsinks ● THS-cAR-B Low profile heatsink for cExpress-AR with threaded standoffs for bottom mounting ● THS-cAR-BT Low profile heatsink for cExpress-AR with through hole standoffs for top mounting THSH-cAR-B High profile heatsink for cExpress-AR with threaded standoffs for bottom mounting # Active Heatsink ● THSF-cAR-B High profile heatsink with fan for cExpress-AR with threaded standoffs for bottom mounting # Starter Kit ● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 [🔗 Link to the original document](.cexpress-ar-datasheet-20231011/cexpress-ar-datasheet-20231011.pdf)