# cExpress-AR # COM Express Compact Size Type 6 Module with New AMD Ryzen™ Embedded V2000 APU # Features ● Up to 8 cores based on AMD Zen 2 architecture ● Improved graphics performance (new Radeon Vega GPU) Up to 4x 4K displays (DP, eDP) 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes Configurable TDP down to 10W (8, 6 cores) # Preliminary ![Close-up of a green printed circuit board with integrated circuits and connectors (no readable text or symbols)](.cexpress-ar-preliminary-datasheet-20210901/a4bfe615da702cdc20defd2ca067aff5f93ae1db364e85d2bb27804bb79b89e0.jpg) # Specifications # ● Core System # CPU New AMD Ryzen™ Embedded V2000 APU - 7nm process AMD V2748 2.9/4.25GHz, 4MB L2, 35-54W (8C/7CU) AMD V2546 3.0/3.95GHz, 3MB L2, 35-54W (6C/6CU) AMD V2718 1.7/4.15GHz, 4MB L2, 10-25W (8C/7CU) AMD V2516 2.1/3.95GHz, 3MB L2, 10-25W (6C/6CU) # Memory Dual channel up to 3200 MT/s ECC/non-ECC DDR4 memory up to 64GB in two SODIMM sockets • ECC, non-ECC support # Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option # Cache 4MB L2 for V2748/V2718, 3MB L2 for V2546/V2516 # Expansion Busses 6 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5 (x1, x2) Note: PCIe switch by build option for additional x1 on Lanes 6/7 1 PCIe x8 Gen2: Lanes 16-23 (configurable to 1 x8, 2 x4) LPC bus, SMBus (system) , I2 C (user) # SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) # Debug Headers 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs # ● Video # GPU Feature Support AMD Radeon™ Vega Graphics, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K at DP, eDP) • Hardware encode/decode (including HEVC 10-bit) • DirectX 12 support • OpenGL 4.6 and ES 3.X support • OpenCL 2.1 support # Digital Display Interface DDI1/2/3 supporting DisplayPort 1.4, HDMI 2.1, DVI DisplayPort 1.4, max. resolution 4096x2160@60Hz HDMI 2.1, max. resolution 4096x2160 @60Hz (max. resolution support dependent on carrier) # VGA Supported by build option through DP-to-VGA IC (in place of DDI3) Max. resolultion 1920x1200 @60Hz # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Max. resolution 1920x1200 @60Hz in dual mode # eDP Optional 4 lane eDP1.3 support, in place of LVDS Max. resolution 4096X2160@60Hz (max. resolution dependent on carrier) # Specifications # ● Audio # Chipset AMD Audio coprocessor integrated in APU # Audio Codec On carrier Express-BASE6 (ALC886 standard support) # ● Ethernet # LAN Controller Intel® Ethernet Controller i225 Series (V/IT versions) # Interface 2.5Gbit/s, 1000/100/10 Mbit/s Ethernet connection # ● Multi I/O and Storage USB: 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7) SATA: 2x SATA 6Gb/s (SATA 0,1) Serial: 2x UART ports with console redirection GPIO: 4x GPO and 4x GPI from EC (GPI with interrupt TBC) Note: USB 3.2 Gen2 support dependent on carrier design # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis) # ● TPM Chipset: Infineon Type: TPM 2.0 (LPC based, build option) # ● Power # Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% # Wide Input ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving # ● Mechanical and Environmental Form Factor: PICMG COM.0: Rev 3.0 Type 6 Dimensions: Compact size: 95 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C (Storage: -20°C to 80°C) Extreme Rugged: -45°C to +85°C (optional, selected SKUs; Storage: -40°C to 85°C, TBC) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating Systems # Standard Support Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Ubuntu 20.04 (planning) # Functional Diagram ![**Central Block:**\n* **New AMD Ryzen™ Embedded**\n* **V2000 Series**\n\n**Left Column (Input/Output Headers):**\n* VGA\n* eDP/LVDS\n* USB 2.0 Lane 0-7\n* SATA Port 0-1\n* SATA Port 2-3\n* PCIe Lane 0-3\n* PCIe Lane 4-5\n* 2.5GbE/GbE\n* HDA\n* SPI\n* SMBus\n* I2C\n* GPIO /SDIO\n* UART /CAN\n* LPC /eSPI\n\n**Right Column (Input/Output Headers):**\n* DDI 1\n* DDI 2\n* DDI 3\n* USB 3.0 Lane 3\n* USB 3.0 Lane 2\n* USB 3.0 Lane 1\n* USB 3.0 Lane 0\n* PCIe Lane 6\n* PCIe Lane 7\n* PEG Port PCIe 16-23\n* PCIe 24-27\n* PCIe 28-31\n\n**Intermediate & Peripheral Blocks:**\n* build option DP to VGA\n* eDP to LVDS\n* build option, eDP 4 lanes\n* Gen3/2 switch\n* LAN i225 V/IT\n* BIOS Flash (two blocks)\n* build option (text label)\n* USB Hub\n* TPM 2.0\n* Embedded Controller\n* TM102 (board)\n* DDR 4 SODIMM (top side) 3200 MT/s, non-ECC/ECC\n* DDR 4 SODIMM (bottom side) 3200 MT/s, non-ECC/ECC\n* ECC support on specific APU SKUs (text label)\n\n**Connections:**\n* **Display/Top:**\n * VGA connects to 'build option DP to VGA'.\n * 'build option DP to VGA' connects to 'eDP/LVDS'.\n * 'eDP/LVDS' connects to 'eDP to LVDS'.\n * 'eDP to LVDS' connects to the top-left of the central chip.\n * A dashed line labeled 'build option, eDP 4 lanes' connects 'eDP/LVDS' to the central chip.\n * Central chip ports 'DP 0', 'DP 1', 'DP 2', and 'DP 3' connect to the right column. 'DP 0' connects to 'DDI 1', 'DP 1' connects to 'DDI 2', and 'DP 2'/'DP 3' connect to 'DDI 3'.\n\n* **Left Side to Central Chip:**\n * 'USB 2.0 Lane 0-7' connects directly.\n * 'SATA Port 0-1' and 'SATA Port 2-3' connect directly.\n * 'PCIe Lane 0-3' connects directly (labeled '4 x1, 2 x2, 1 x4').\n * 'PCIe Lane 4-5' connects directly (labeled 'GPP 2-3').\n * '2.5GbE/GbE' connects via 'LAN i225 V/IT' to the central chip (labeled 'GPP 0/1').\n * 'HDA' connects directly.\n * 'SPI' connects via two 'BIOS Flash' blocks to the central chip (labeled 'build option').\n * 'SMBus', 'I2C', and 'GPIO /SDIO' connect via dashed lines.\n * 'UART /CAN' connects via 'UART'.\n * 'LPC /eSPI' connects via 'LPC'.\n\n* **Right Side to Central Chip:**\n * 'USB 3.0 Lane 3', 'USB 3.0 Lane 2', 'USB 3.0 Lane 1', and 'USB 3.0 Lane 0' connect via the 'USB Hub' to the central chip (labeled 'USB 3.2 (10Gbps)').\n * 'PCIe Lane 6' and 'PCIe Lane 7' connect via a dashed line passing through the 'Gen3/2 switch'.\n * 'PEG Port PCIe 16-23' connects to the central chip (labeled 'GFX (0:7)', '1 x8, 2 x4').\n * 'PCIe 24-27' and 'PCIe 28-31' connect directly to the bottom right of the central chip.\n\n* **Bottom/Peripherals:**\n * Central chip 'UART' and 'LPC' connect to the 'Embedded Controller'.\n * 'Embedded Controller' connects to 'TM102 (board)'.\n * 'Embedded Controller' connects to the 'I2C' line via a dashed line.\n * 'TPM 2.0' connects to the 'Embedded Controller'.\n * The bottom edge of the central chip connects to 'DDR 4 SODIMM (top side)...' and 'DDR 4 SODIMM (bottom side)...'.](.cexpress-ar-preliminary-datasheet-20210901/fbe5ee90bce387ad5b33c52c56dbf0f439211471faba32b103591bcde12410e9.jpg) Note: General Purpose Ports GPP 2-9 can support up to a maximum of 6 devices (SATA 0/1 count as one device). # Ordering Information ● cExpress-AR-V2748 Compact COM Express Type 6 module with New AMD Ryzen™ V2748 at 2.9/4.15GHz, otca-core processor, Radeon™ Vega graphics with 7CU ● cExpress-AR-V2546 Compact COM Express Type 6 module with New AMD Ryzen™ V2546 at 3.0/3.95GHz, hexa-core processor, Radeon™ Vega graphics with 6CU ● cExpress-AR-V2718 Compact COM Express Type 6 module with New AMD Ryzen™ V2718 at 1.7/4.15GHz, otca-core processor, Radeon™ Vega graphics with 7CU ● cExpress-AR-V2516 Compact COM Express Type 6 module with New AMD Ryzen™ V2516 at 2.1/3.95GHz, hexa-core processor, Radeon™ Vega graphics with 6CU \*For processor SKUs not listed, please contact your ADLINK representative for availability. # Accessories # Heat Spreaders ● HTS-cAR-B Heatspreader for cExpress-AR with threaded standoffs for bottom mounting ● HTS-cAR-BT Heatspreader for cExpress-AR with through hole standoffs for top mounting # Passive Heatsinks ● THS-cAR-B Low profile heatsink for cExpress-AR with threaded standoffs for bottom mounting ● THS-cAR-BT Low profile heatsink for cExpress-AR with through hole standoffs for top mounting THSH-cAR-B High profile heatsink for cExpress-AR with threaded standoffs for bottom mounting # Active Heatsink ● THSF-cAR-B High profile heatsink with fan for cExpress-AR with threaded standoffs for bottom mounting # Starter Kit ● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 [🔗 Link to the original document](.cexpress-ar-preliminary-datasheet-20210901/cexpress-ar-preliminary-datasheet-20210901.pdf)