# cExpress-EL # COM Express Compact Size Type 6 Module with 6th Generation Intel Atom® Processor SoC # Features ● Quad-core Intel Atom® Processor SoC, boost up to 3.0GHz ● Gen11 LP GFX, max. 3x 4K60 (DDI/eDP), opt. legacy VGA ● In-band ECC, up to 32GB DDR4 at 3200 MT/s Intel® TCC, up to 2.5GbE with TSN ● Real-time I/O via ARM Cortex-M7 processor ● Six PCIe Gen3 lanes ● USB 3.2 10Gbps # Specifications # ● Core System # CPU 6th Gen Intel Atom® Processor (formerly “Elkhart Lake”) Intel Atom® x6425E, 2.0(3.0) GHz, 12W, 4C/32EU Intel Atom® x6413E, 1.5(3.0) GHz, 9W, 4C/16EU Intel Atom® x6211E, 1.3(3.0) GHz, 6W, 2C/16EU Intel Atom® x6425RE, 1.9 GHz, 12W, 4C/32EU Intel Atom® x6414RE, 1.5 GHz, 9W, 4C/16EU Intel Atom® x6212RE, 1.2 GHz, 6W, 2C/16EU Intel Atom® x6200FE, 1.0 GHz, 4.5W, 2C,no GPU Intel® Pentium® J6426, 2.0(3.0) GHz, 10W, 4C/32EU Intel® Celeron® J6413, 1.8(3.0) GHz, 10W, 4C/16EU Intel® Pentium® N6415, 1.2(3.0) GHz, 6.5W, 4C/16EU Intel® Celeron® N6211, 1.2(3.0) GHz, 6.5W, 2C/16EU Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, Execute Disable Bit, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key Notes: Availability of features may vary between processor SKUs. Some of the SKUs listed above are supported by project basis only. Please contact your ADLINK representative for availability. Intel Atom® x6200FE, x6425RE, x6414RE, x6412RE support Intel® TCC # Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC, max. 32GB in two SODIMM sockets (2x 16GB) Intel In-Band ECC (IBECC), provides ECC protection with normal type SO-DIMM memory (on Intel Atom® SKUs only, BIOS configurable) # Embedded BIOS AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (dual BIOS by build option) # Cache 1.5MB # Expansion Busses 6 PCIe x1 Gen3 (AB): Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1+1 x2, 1 x2+2 x1), Lanes 4/5 (only 2 x1 on Lane 4/5) LPC bus (via ESPI-to-LPC bridge IC), SMBus (system) , I2C (user) Note: I2 C can be managed by ARM M7 processor or x86 processor by BIOS setting. I2 C managed by ARM M7 core is for real-time usage. (TBC) Requires HW build option, by project basis. # SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option) # Debug Header 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs ![Close-up of a green printed circuit board with visible components and gold contacts (no readable text or symbols)](.cexpress-el-datasheet-20210804/7ff3393cb895484f9e6c9afad43a3a1764a585cc2bea0be4150cf1615aff6c31.jpg) # ● Video # GPU Feature Support Intel® Gen11 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (3x 4K60) • Hardware encode/transcode of HD content (including HEVC) • DirectX 12 support and Vulkan v1.1 support • OpenGL 4.5 and ES 3.2 support • OpenCL 1.2 support # Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI # VGA Support by build option via DP-to-VGA IC (in place of DDI2) max. resolution is 1920x1200@60Hz # LVDS Single/dual channel 18/24-bit LVDS via eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode) # eDP Optional 4 lane support, in place of LVDS (max. resolution is 4096x2160@60Hz) # ● Audio # Chipset Intel® HD Audio integrated in SoC # Audio Codec On Express-BASE6 carrier (ALC886 standard support) # ● Ethernet MAC: onboard Intel SoC PHY: MaxLinear GPY series (TSN support on Yocto Linux with selected GPY and CPU SKUs) # Interface 1000/100/10 Mbit/s or 2.5Gbit/s Ethernet connection GbE0\_SDP available if TSN support enabled # Specifications # ● I/O Interfaces USB: 2x USB 3.2/2.0/1.1 (USB 0,1: max. 10Gbps) and 6x USB 2.0/1.1 (USB 2-7) USB Hub supported by project basis provides 4x USB 3.2/2.0/1.1 (USB 0-3) and 4x USB 2.0/1.1 (USB 4-7) SATA: 2x SATA 6Gb/s (SATA 0, 1) Serial: 2x UART ports with console redirection eMMC: eMMC 5.0 (16/32/64GB by build option), functions as boot-up device on Windows 10 Enterprise and Yocto Linux GPIO/SD: 4x GPO and 4x GPI from EC (GPI with interrupt TBC) SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only on Windows (support on Yocto Linux is TBC) Note: USB 3.2 Gen2 support dependent on carrier design 2x UART and 8x GPIO can be managed by ARM M7 processor or x86 processor. UART, GPIO managed by ARM M7 is for real-time usage (TBC). Requires HW build option, by project basis. # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O support is by project basis) # ● TPM (build option) Chipset: Infineon Type: TPM 2.0 (SPI based) # . Power Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% Wide Input: ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving # ● Mechanical and Environmental Form Factor: PICMG COM.0 Rev 3.0 Type 6 Dimension: Compact size: 95 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C (Storage: -20°C to 80°C) Extreme Rugged: -40°C to +85°C (optional, selected SKUs; Storage: -45°C to +85°C) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating Systems # Standard Support Windows 10 IOT Enterprise 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC) Ubuntun (TBC) Functional Diagram ![Based on the provided block diagram, here is the accurate description of the labeled blocks and connections:\n\n**Central Component**\n* **6th Generation Intel Atom® x6000E (formerly “Elkhart Lake”)**\n\n**Left-Side Blocks & Connections**\n* **VGA** connects to **DP to VGA** (dashed box), which connects to the central block's **eDP** interface (via a 'build option' label).\n* **eDP/LVDS** connects to **eDP to LVDS** (blue box), which connects to the central block's **eDP** interface (via a 'build option, eDP 4 lanes' label).\n* **USB 2.0 Lane 0-7** connects directly to the central block.\n* **SATA Port 0-1** connects to the central block (labeled **SATA 6Gbps (HSIO 10-11)**).\n* **Max. 2.5GbE** connects to **LAN PHY (MaxLinear GPY Series)**, which connects to the central block.\n* **PCIe Lane 0-3** connects via **x4, x2, x1 config.** to the central block (labeled **4 PCIe Gen3 (HSIO 2-5)**).\n* **PCIe Lane 4-5** connects via **2 x1 config. only** to the central block (labeled **2 PCIe Gen3 (HSIO 8, 6)**).\n* **HDA** connects to **BIOS** (dashed box), which connects to the central block.\n* **SPI** connects to **TPM 2.0** (dashed box, 'build option'), which connects to the central block.\n* **SMBus** connects directly to the central block (labeled **SMBus**).\n* **I²C** connects directly to the central block (labeled **I²C**).\n* **GPIO/SDIO** connects to **MUX**, which connects to the central block.\n* **UART 0-1** connects to the central block (labeled **HSUART**).\n* **LPC** connects to **eSPI to LPC**, which connects to the central block (labeled **eSPI**).\n\n**Right-Side Blocks & Connections**\n* **DDI-3** connects to **DP to VGA** (via a 'build option' label).\n* **DDI 2** connects to **eDP to LVDS**.\n* **DDI 1** connects directly to the central block's **eDP** interface.\n* **USB 3.2 Lane 0** through **USB 3.2 Lane 3** connect to **USB 3 Hub** (dashed box, 'build option'), which connects to the central block (labeled **(HSIO 0) USB 3.2 Gen2 x1** and **(HSIO 1) USB 3.2 Gen2 x1**).\n* **PCIe Lane 6** connects directly to the central block.\n* **PCIe Lane 7** connects directly to the central block.\n* **PEG-Port PEG 0-15** connects directly to the central block.\n* **eMMC 5.1 16GB-64GB** (dashed box, 'build option') connects to the central block (labeled **SDIO 3.0**).\n\n**Bottom Blocks & Connections**\n* **DDR4 SODIMM (top side) 3200 MT/s, non-ECC/IBEECC** connects to the central block.\n* **DDR4 SODIMM (bottom side) 3200 MT/s, non-ECC/IBEECC** connects to the central block.\n* **Embedded Controller** connects to **Thermal sensor (SoC)** and **Thermal sensor (board)**.\n* **Embedded Controller** also connects to the central block via the **eSPI** label.](.cexpress-el-datasheet-20210804/3820e7d2732114c8a69782dc5316b407d67d8db6a1a82196cb9013a84b4d9310.jpg) # Ordering Information ● cExpress-EL-x6425E Compact COM Express Type 6 with Intel Atom® x6425E (4C) ● cExpress-EL-x6413E Compact COM Express Type 6 with Intel Atom® x6413E (4C) ● cExpress-EL-x6211E Compact COM Express Type 6 with Intel Atom® x6211E (2C) ● cExpress-EL-x6200FE Compact COM Express Type 6 with Intel Atom® x6200FE (2C, no GPU) ● t1cExpress-EL-x6425RE Compact COM Express Type 6 with Intel Atom® x6425RE (4C), -40°C to +85°C \*For processor SKUs not listed, please contact your ADLINK representative for availability. # Accessories # Heat Spreaders ● HTS-cEL-B-I Heatspreader for cExpress-EL with threaded standoffs for bottom mounting ● HTS-cEL-BT-I Heatspreader for cExpress-EL with through hole standoffs for top mounting # Passive Heatsinks ● THS-cEL-B-I Low profile heatsink for cExpress-EL with threaded standoffs for bottom mounting ● THS-cEL-BT-I Low profile heatsink for cExpress-EL with through hole standoffs for top mounting THSH-cEL-B-I High profile heatsink for cExpress-EL with threaded standoffs for bottom mounting # Active Heatsink ● THSF-cEL-B High profile heatsink with Fan for cExpress-EL with threaded standoffs for bottom mounting Note: Above solutions are for Intel Atom® SKUs. Thermal solutions for Pentium® / Celeron® are supported by project basis. # Starter Kit ● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 [🔗 Link to the original document](.cexpress-el-datasheet-20210804/cexpress-el-datasheet-20210804.pdf)