# cExpress-KL

# COM Express Compact Size Type 6 Module with

# Mobile 7th Gen Intel® Core™ and Celeron® Processors

# Features

● 7th Generation Intel® Core™ and Celeron® Processors
● Up to 32GB Dual Channel DDR4 at 1867/2133MHz
● Supports up to 3 independent displays in combinations of DDI, LVDS, VGA, eDP
● GbE, up to 6 PCIe x1 (build option)
● Three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
● Supports Smart Embedded Management Agent (SEMA) functions
● Extreme Rugged operating temperature: -40°C to +85°C (build option)

![5 AR6B\nADLINK\nG4CNA\nS/N\nS/N\nDEV-0019360\nCE\nADLINK\nTECHNOLOGY INC\nABL-A200\nPWR 0.5\nPWR 0.5\nPWR 0.5](.cexpress-kl-20230922/088ecefe5e2ae3ed2ed9a22865a6efcb395b87d01b05c5565b6c2ef927b39900.jpg)

# Specifications

# ● Core System

# CPU

Mobile 7th Generation Intel® Core™ and Celeron® Processors - 14nm (code name “Kaby Lake-U”)

Core™ i7-7600U 2.8/3.9GHz (Turbo), 4M, 15W (cTDP) (2C/GT2)

Core™ i5-7300U 2.6/3.5GHz (Turbo), 3M, 15W (cTDP) (2C/GT2)

Core™ i3-7100U 2.4GHz, 3M, 15W (2C/GT2)

Celeron® 3965U 2.2GHz, 2M, 15W (2C/GT1)

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64

Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX

Note: Availability of the features may vary between processor SKUs.

# Memory

Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets

# Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11.0 support

# Cache

4MB for Core™ i7, 3MB for Core™ i5 and i3, 2M for Celeron®

# Expansion Busses

Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option)

Note: Gen3 for Core™ i7/i5/i3

LPC bus, SMBus (system), I2 C (user)

# SEMA Board Controller

Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control

# Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs

60-pin XDP header for ICE debug of CPU/chipset

# ● Video

# GPU Feature Support

Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or VGA/ eDP outputs

Hardware encode/transcode HD content (including HEVC)

DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support

OpenGL 5.0, 4.4/4.3 and ES 2.0 support

OpenCL 2.1, 2.0/1.2 support

# Digital Display Interface

DDI1/2 supporting DisplayPort/HDMI/DVI

# VGA

Build option support through DP-to-VGA IC (in place of DDI2)

# LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC

# eDP

4 lane support by build option, in place of LVDS

# ● Audio

# Chipset

Intel® HD Audio integrated in SoC

# Audio Codec

Located on carrier Express-BASE6 (ALC886 standard support)

# ● Ethernet

Intel® MAC/PHY: Intel® I219LM/V

Interface: 10/100/1000 GbE connection

# Specifications

# I/O Interfaces

USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)

SATA: 3x SATA 6 Gb/s

Serial: 2 UART ports with console redirection

GPIO: 4 GPO and 4 GPI from BMC

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

# ● TPM (option)

Chipset: In ineon SLB 9665 XT2.0

Type: TPM 2.0

# ● Power

Standard Input: ATX = 12V±5%, 5Vsb ±5%; AT = 12V±5%

Wide Input: ATX = 5-20 V, 5Vsb ±5% ; AT = 5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

# ● Mechanical and Environmental

Form Factor: PICMG COM.0, Rev 2.1 Type 6

Dimension: Compact size: 95 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -45°C to +85°C (build option)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# Operating Systems

# Standard Support

Windows 10 IOT Enterprise 64-bit, Linux 64-bit

VxWorks 7 64-bit (TBD)

# Extended Support (BSP)

Linux 64-bit

VxWorks 64-bit (TBD)

Functional Diagram
![**Central Block:**\n*   **7th Generation Intel® Core®/Celeron® Processor SoC (code name “Kaby Lake-U”)**\n\n**Top Right Blocks (Memory & Display Interfaces):**\n*   **SODIMM 4-16 GB DDR4 non-ECC** (Two identical blocks)\n*   **DDI1 (4 lanes) DP/HDMI**\n*   **DDI2 (4 lanes) DP/HDMI**\n*   **LVDS eDP to LVDS** (Connected via text 'Single/dual channel 18/24-bit LVDS' and 'eDP')\n    *   *Note:* A dashed line labeled 'eDP 4 lanes (build option)' connects the processor to the LVDS block.\n*   **VGA DP to VGA** (Dashed box labeled '(build option)')\n\n**Right Side Blocks:**\n*   **4x USB 3.0 upgrade (port 0-3)**\n*   **XDP 60**\n\n**Left Side Blocks (IO & Network):**\n*   **8x USB 2.0/1.0 (ports 0-7)**\n*   **4x PCIe x1 Gen3/2 (port 0-3) (support x2, x4)**\n*   **1x PCIe x1 Gen3/2 (port 4)**\n*   **1x PCIe x1 Gen3/2 (port 5, build option)** (Dashed line)\n*   **3x SATA 6Gb/s (port 0/1)**\n*   **HD Audio**\n*   **GbE**\n*   **UART0, UART1**\n\n**Bottom Left Blocks (LPC & GPIO):**\n*   **LPC bus** (Connects to **LPC to UART** and **TPM 2.0**)\n*   **SMBus**\n*   **GPIO PCA9535**\n\n**Bottom Right Blocks (BMC & SPI):**\n*   **New SEMA BMC**\n*   **SPI 0 BIOS**\n*   **SPI 1 BIOS**\n*   **LM73**\n\n**Labels on Connections/Arrows:**\n*   **eDP** (Arrow from Processor to LVDS)\n*   **eDP 4 lanes (build option)** (Dashed arrow)\n*   **(build option)** (Arrow to VGA)\n*   **4x GPO, 4x GPI** (Output from GPIO PCA9535)\n*   **GP I²C** (Output from GPIO PCA9535)\n*   **DDC I²C** (Output from GPIO PCA9535)\n*   **SPI_CS#** (Output from New SEMA BMC)\n*   **SPI** (Output from New SEMA BMC)\n*   **I²C** (Dashed line from Processor to New SEMA BMC)\n*   **SMBus** (Line from Processor to New SEMA BMC)\n\n**Side Bar Labels:**\n*   **AB** (Left vertical bar)\n*   **CD** (Right vertical bar)](.cexpress-kl-20230922/9cd74078d432c3b6f19619f27358afb11f91e299d88b5d0ab998725c38c6abef.jpg)

# Ordering Information

● cExpress-KL-i7-7600U
Compact COM Express® Type 6 module with Intel® Core™ i7-7600U and GT2 graphics
● cExpress-KL-i5-7300U
Compact COM Express® Type 6 module with Intel® Core™ i5-7300U and GT2 graphics
● cExpress-KL-i3-7100U
Compact COM Express® Type 6 module with Intel® Core™ i3-7100U and GT2 graphics
● cExpress-KL-3965U
Compact COM Express® Type 6 module with Intel® Celeron® 3965U and GT1 graphics

# Starter Kit

COM Express Type 6 Starter Kit Plus

COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

# Accessories

# Heat Spreaders

● HTS-cKL-B
Heatspreader for cExpress-KL with threaded standoffs for bottom mounting
● HTS-cKL-BT
Heatspreader for cExpress-KL with through hole standoffs for top mounting

# Passive Heatsinks

● THS-cKL-B
Low profile heatsink for cExpress-KL with threaded standoffs for bottom mounting
● THS-cKL-BT
Low profile heatsink for cExpress-kL with through hole standoffs for top mounting
. THSH-cKL-B
High profile heatsink for cExpress-KL with threaded standoffs for top mounting

# Active Heatsink

● THSF-cKL-B

High profile heatsink with Fan for cExpress-KL with threaded standoffs for bottom mounting
[🔗 Link to the original document](.cexpress-kl-20230922/cexpress-kl-20230922.pdf)