# cExpress-R8

COM Express Compact Size Type 6 Module based on AMD Ryzen 8000 Platform

# Features

COM Express® R3.1 Compact Module Type 6 Pinout
Integrated AMD Radeon™ RDNA™ 3 Graphics
• AMD XDNA™ NPU up to 16 TOPs

![Close-up of a green printed circuit board with visible components and no readable text or symbols.](.cexpress-r8-datasheet-260316/d29372c68a6f445a73284df3769ea22ebea81629ce5a624dffcd27a32b3a897a.jpg)

• AVX512 support
• All PCIe Lanes up to PCIe GEN4 Spec
• Support DDR5 5600 MHz up to 96 GB and ECC option

Specifications

<table><tr><td>Core System</td><td>SoC</td><td>AMD Ryzen 8000 series at 45W/28WFor more detailed information, please refer to the CPU SKUs section.</td></tr><tr><td rowspan="4"></td><td>Memory</td><td>Dual-channel DDR5 non-ECC/ECC at max. 5600 MHzUp to 96GB memory capacity</td></tr><tr><td>Embedded BIOS</td><td>AMI UEFI with CMOS backup in 32MB SPI BIOS</td></tr><tr><td>Cache</td><td>Refer to the CPU SKUs section</td></tr><tr><td>Expansion Busses</td><td>PCIe x8 Gen4, lanes 16-23, support 1x8 or 2 x44 PCIe x1 Gen4: Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4)2 PCIe x2 Gen4, Lanes 4/5/6/7 (configurable to 2 x2/1 x2, 2 x1)Lanes 6/7 muxed with SATA 1/0LPC bus (via ESPI-to-LPC bridge IC), SMBus (system),  $I^{2}C$  (user)Note: A maximum of 10 PCIe devices are supported, including the onboard LAN controller and PCIe to SATA bridge chip.</td></tr><tr><td rowspan="2"></td><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose  $I^{2}C$ , watchdog timer, fan control</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr></table>

Specifications

<table><tr><td rowspan="4">Video</td><td>GPU Feature Support</td><td>AMD RadeonTM RDNA $^{TM}$  3 Graphics Core Architecture, up to 6 Workgroups, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP, HDMI, DVI</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.5</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>AMD HD Audio integrated in SoC</td></tr><tr><td>Codec</td><td>On carrier Express-BASE6 R3.1 (ALC888 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (I226-IT supports TSN in Linux OS by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection</td></tr><tr><td rowspan="5">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)USB 3.2 depends on the carrier design</td></tr><tr><td>SATA</td><td>4x SATA 6Gb/s (SATA 0,1,2,3)SATA muxed with PCIe lane 7/6. SATA function as default</td></tr><tr><td>On-board Storage</td><td>PCIe Gen4 NVMe SSD in place of SATA port (build option, 256GB+ capacity)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>4x GPIO and 4x GPI from EC (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5% (TBD); or AT: 8.5-20V (TBD)</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support</td></tr><tr><td>Power States</td><td>C1-C6, S0, S4, S5, S5 ECO mode (Wake on USB S4, WOL S4/S5)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 95 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 11 22H2 GAC, Ubuntu 64-bit, Yocto project-based Linux 64-bit, and VxWorks (by project basis)</td></tr></table>

![This block diagram illustrates the connectivity of the **New Generation AMD Ryzen 8000 Processor (Hawk Point 1)** to various external components and interfaces.\n\n**Central Processor and Memory**\nThe central block is labeled **New Generation AMD Ryzen 8000 Processor (Hawk Point 1)**.\n*   **Memory:** On the top left, a block labeled **One on top, one on bottom** connects to two identical blocks: **DDR5 SODIMM max. 5600MT/s 8-64GB, non-ECC/ECC**.\n\n**Left Side Connections (Inputs/Interfaces)**\n*   **Display:** **eDP/LVDS** connects to **eDP x4**, which connects to **eDP to LVDS**, and finally to the processor. **VGA** connects directly to the processor.\n*   **USB:** **USB 2.0 Lane 0**, **USB 2.0 Lane 1-3**, and **USB 2.0 Lane 4-7** connect directly to the processor.\n*   **Networking/Storage:**\n    *   **Max. 2.5GbE** connects to **LAN controller i226**, which connects to the processor at pin **PB1 (DXIO 18-19)**.\n    *   **PCIe Lane 0-3** connects via **4x1 or 2x2 or 1x4** and **x2** to the processor at pin **PB0 (DXIO 12-15)**.\n    *   **PCIe Lane 4-5** connects to the processor at pin **PA2 (DXIO 8-9)**.\n    *   **SATA 0**, **SATA 1**, **SATA 2**, and **SATA 3** connect to a **PCIe to SATA** block. This block connects to the processor at pin **PB1 (DXIO 16-17)** and has a dashed connection to **NVMe BGA SSD**.\n*   **Other Interfaces:**\n    *   **HDA** connects to the processor.\n    *   **GP_SPI (TBC)** connects to the processor.\n    *   **SPI** connects to **BIOS flash**, which connects to **TPM 2.0**.\n    *   **SMBus** connects to the processor.\n    *   **I2C** connects to the processor.\n    *   **8xGPIO/SDIO** connects to the processor.\n    *   **2xUART/CAN** connects to the processor.\n    *   **LPC/eSPI** connects to the **Embedded Controller**.\n\n**Right Side Connections (Outputs/Interfaces)**\n*   **Display/USB4:**\n    *   **DDI2/USB4(0)** connects to **DDI1**.\n    *   **DDI3/USB4(1)** connects to **DDI2**.\n    *   **DDI1** connects to **DDI3**.\n*   **USB Hub:** **USB 3.x Lane 0** connects to the processor and then to a **USB Hub 10Gb**. The hub outputs to **USB 3.x Lane 1**, **USB 3.x Lane 2**, and **USB 3.x Lane 3**.\n*   **PCIe:**\n    *   **PA3 (DXIO 10-11)** connects via **x2** to **PCIe Lane 6-7**.\n    *   **PA1, PA2 (DXIO 0-7)** connects via **1x8 or 2x4** to **PEG Port PCIe 16-23**.\n    *   **PCIe 24-27** connects to the processor.\n    *   **PCIe 28-31** connects to the processor.\n\n**Bottom Section (Embedded Controller)**\n*   The processor outputs **SMB**, **I2C**, **2x HSUART**, and **8x GPIO**.\n*   **SMB** connects to **TPM 2.0**.\n*   **I2C**, **2x HSUART**, and **8x GPIO** have dashed lines connecting to **TPM 2.0** or the **Embedded Controller**.\n*   **eSPI to LPC** connects to the **Embedded Controller**.\n*   The **Embedded Controller** connects to **FAN connector** and **LM73 (board)**.](.cexpress-r8-datasheet-260316/e5c835a8070a050d7378ec20f9e615fb41e9fd776749f10c60552cc3bbd63ade.jpg)

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

CPU SKUs

<table><tr><td rowspan="5"></td><td>Processor</td><td>Cores</td><td>Frequency</td><td>Cache</td><td>TDP</td><td>GPU Cores</td></tr><tr><td>8845HS</td><td>8</td><td>3.8 (5.1) GHz</td><td>24MB</td><td>45W(35-54W)</td><td>6</td></tr><tr><td>8840U</td><td>8</td><td>3.3 (5.1) GHz</td><td>24MB</td><td>28W(15-30W)</td><td>6</td></tr><tr><td>8645HS</td><td>6</td><td>4.3 (5.0) GHz</td><td>22MB</td><td>45W(35-54W)</td><td>4</td></tr><tr><td>8640U</td><td>6</td><td>3.5 (4.9) GHz</td><td>22MB</td><td>28W(15-30W)</td><td>4</td></tr></table>

Note:
1. Some processor SKUs are supported by project basis only. Please consult our ADLINK representative.

Ordering Information

<table><tr><td>Module Number</td><td>Description/Configuration</td></tr><tr><td>91-72223-000E</td><td>Compact COM Express Type 6 module with New AMD RyzenTM 7 pro 8845HS at 3.8/5.1GHz, Octa-core processor.</td></tr><tr><td>91-72223-200E</td><td>Compact COM Express Type 6 module with New AMD RyzenTM 5 pro 8645HS at 4.3/5.0GHz, Hexa-core processor.</td></tr><tr><td>91-72223-300E</td><td>Compact COM Express Type 6 module with New AMD RyzenTM 7 pro 8640U at 3.5/4.9GHz, Hexa-core processor.</td></tr></table>

Note:
1. For processor SKUs that are not listed, please contact our ADLINK representative.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-cR8-B</td><td>Heatspreader for cExpress-R8 with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-cR8-BT</td><td>Heatspreader for cExpress-R8 with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-cR8-BL</td><td>Low-profile Heatsink for cExpress-R8 with threaded standoffs for bottom mounting</td></tr><tr><td>THS-cR8-BT</td><td>Low-profile Heatsink for cExpress-R8 with through-hole standoffs for top mounting</td></tr><tr><td>THSH-cR8-B</td><td>High-profile Heatsink for cExpress-R8 with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-cR8-B</td><td>High-profile Heatsink with Fan for cExpress-R8 with threaded standoffs for bottom mounting</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.cexpress-r8-datasheet-260316/cexpress-r8-datasheet-260316.pdf)