# cExpress-RLP

COM Express Compact Size Type 6 Module based on 13th Gen Intel® Raptor Lake platform

# Features

• LPDDR5 soldered memory for mission-critical applications
• Longevity Core i3/i5/i7 SKU
• Additional Real-time / Industrial SKUs (14C/20T)

![Preliminary\nCOM +\nExpress](.cexpress-rlp-prelim-datasheet-20251017/0f0b7fce67cd016a5bf4366c27ea975c1cf4a92168bc8638fd6ca01a2a48399b.jpg)

• PCIe Gen4, 4x displays / 2x USB4 (optional)
• Extreme Rugged operating temperature (-40°C to 85°C, optional)

Specifications

<table><tr><td>Core System</td><td>SoC</td><td>13th Gen Intel® i7/i5/i3 at 45W/28W/15WFor more detailed information, please refer to the CPU SKUs section.</td></tr><tr><td rowspan="5"></td><td></td><td>Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0, Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NINote: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td>Dual-channel LPDDR5 non-ECC/IBECC at max. 6400 MHz8GB/16GB/32GB/64GB memory capacityIBECC (build option. selected SKU)</td></tr><tr><td>Embedded BIOS</td><td>AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS by build option)</td></tr><tr><td>Cache</td><td>Refer to the CPU SKUs section</td></tr><tr><td>Expansion Busses</td><td>PCIe x8 Gen4, lanes 16-23, available for 45W SKU)PCIe x4 Gen4, lanes 24-27PCIe x4 Gen4, lanes 28-31 (build option for NVMe SSD)8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4); Lanes 4/5/6/7 (configurable to x1, x2, x4); Lanes 6/7 muxed with SATA 1/0LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI(TBC)Note: A maximum of 7 PCIe devices are supported, including the onboard LAN controller (TBC).</td></tr><tr><td rowspan="2"></td><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control, and failsafe BIOS (dual BIOS by a build option)</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="6">Video</td><td>GPU Feature Support</td><td>Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4 4x 4K60Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D supportOneVPLHDCP 2.3Graphics Hardware Virtualization (SRIOV)</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP, HDMI, DVI</td></tr><tr><td>VGA</td><td>Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.4b</td></tr><tr><td>USB4</td><td>Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)Requires BIOS code modification by project basis, re-timer with PD on carrier</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Intel® HD Audio integrated in SoC</td></tr><tr><td>Codec</td><td>On carrier Express-BASE6 R3.1 (ALC888 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (I226-IT supports TSN in Linux OS by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection</td></tr><tr><td rowspan="6">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)USB 3.2 depends on the carrier design</td></tr><tr><td>USB4</td><td>Max. 2x USB4 (in place of DDI 1/2) by project basis depends on the carrier design</td></tr><tr><td>SATA</td><td>2x SATA 6Gb/s (SATA 0,1)SAT 0/1 muxed with PCIe lane 7/6. SATA function as default</td></tr><tr><td>On-board Storage</td><td>PCIe Gen4 NVMe SSD in place of PCIe lanes 28-31 (build option, 256GB+ capacity)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>4x GPIO and 4x GPI from EC (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support</td></tr><tr><td>Power States</td><td>C1-C6, S0, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 95 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)Extreme Rugged: -45°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 10 IoT Enterprise LTSC, Windows 11 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit, and VxWorks (by project basis)</td></tr></table>

![The diagram illustrates the connectivity of an **Intel Core™ Processor (Raptor Lake-H/U Refresh) (Raptor Lake-H/U)**.\n\n**Central Processor Connections:**\n*   **Top Left (Memory):** Four blocks labeled **LPDDR5 2-16GB** connect directly to the processor.\n*   **Top Left (Display):**\n    *   **eDP/LVDS** connects to a dashed box labeled **eDP to LVDS**, which connects to **DDI A** on the processor.\n    *   **VGA** connects to a dashed box labeled **DP to VGA**, which connects to **DDI B** on the processor.\n*   **Left Side (Connectivity):**\n    *   **USB 2.0 Lane 0-7** connects directly.\n    *   **Max. 2.5GbE** connects to a solid box labeled **LAN controller i226**, which connects directly.\n    *   **PCIe Lane 0-3** connects through a dashed box labeled **PCIe 0-3: x1, x2, x4 config.**\n    *   **PCIe Lane 4-5** connects through a dashed box labeled **PCIe 4-7: x1, x2, x4 config.**\n    *   **SATA 0** and **SATA 1** connect to two dashed boxes labeled **MUX**.\n    *   **HDA** connects directly.\n    *   **GP_SPI (OEM)** connects directly.\n    *   **SPI** connects to a solid box labeled **BIOS flash**. A dashed outline of **BIOS flash** is adjacent to it.\n    *   **SMBus** connects to a solid box labeled **TPM 2.0**.\n    *   **I2C** connects to a label **I2C** near the bottom of the processor, and dashed lines connect to labels **2x HSUART** and **8x GPIO**.\n*   **Right Side (Ports):**\n    *   **TCP 0** connects to **DDI/USB4 Port 1**.\n    *   **TCP 1** connects to **DDI/USB4 Port 2**.\n    *   **TCP 2** connects to **DDI only Port 3**.\n    *   **USB 3.x Lane 0**, **USB 3.x Lane 1**, **USB 3.x Lane 2**, and **USB 3.x Lane 3** connect directly.\n    *   **PCIe Lane 7** connects via a dashed line.\n    *   **PCIe Lane 6** connects via a dashed line.\n    *   **GEN4 x8 (CPU)** connects to **PEG Port PEG 0-7**. The text **available for 45W SKUs** is adjacent to this connection.\n    *   **GEN4 x4 (CPU)** connects to **PEG 8-11**.\n    *   **GEN4 x4 (CPU)** connects to **PEG 12-15**.\n\n**Bottom Section (Embedded Controller):**\n*   A solid block labeled **Embedded Controller** is at the bottom center.\n*   It connects to **eSPI to LPC** (dashed box).\n*   It connects to **FAN connector** and **LM73 (board)**.\n*   It receives connections from the left column:\n    *   **I2C** (via dashed lines connecting to **I2C**, **2x HSUART**, **8x GPIO**).\n    *   **8xGPIO/SDIO**.\n    *   **2xUART/CAN**.\n    *   **LPC/eSPI**.\n\n**Other Blocks:**\n*   A dashed box labeled **Gen4 NVMe BGA SSD 256GB+ build option** connects to the line for **PEG 12-15**.](.cexpress-rlp-prelim-datasheet-20251017/4fca943046e5f51b5db8c09a256f8635e3926cf92e5e740ac83a140adc4cd379.jpg)

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

CPU SKUs

<table><tr><td rowspan="22"></td><td>Processor</td><td>Cores</td><td>Frequency(P-core)</td><td>Cache</td><td>TDP</td><td>GPU Cores</td></tr><tr><td>i7-13800HRE</td><td>6P+8E</td><td>2.5(5.0) GHz</td><td>24MB</td><td>45W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-13600HRE</td><td>4P+8E</td><td>2.7(4.8) GHz</td><td>18MB</td><td>45W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-13300HRE</td><td>4P+4E</td><td>2.1(4.6) GHz</td><td>12MB</td><td>45W</td><td>UHD 48EU</td></tr><tr><td>i7-1370PRE</td><td>6P+8E</td><td>1.9(4.8) GHz</td><td>24MB</td><td>28W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-1350PRE</td><td>4P+8E</td><td>1.8(4.6) GHz</td><td>18MB</td><td>28W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-1320PRE</td><td>4P+4E</td><td>1.7(4.5) GHz</td><td>12MB</td><td>28W</td><td>UHD 48EU</td></tr><tr><td>i7-1365URE</td><td>2P+8E</td><td>1.7(4.9) GHz</td><td>12MB</td><td>15W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-1345URE</td><td>2P+8E</td><td>1.4(4.6) GHz</td><td>12MB</td><td>15W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-1315URE</td><td>2P+4E</td><td>1.2(4.5) GHz</td><td>10MB</td><td>15W</td><td>UHD 64EU</td></tr><tr><td>i7-13800HE</td><td>6P+8E</td><td>2.5(5.0) GHz</td><td>24MB</td><td>45W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-13600HE</td><td>4P+8E</td><td>2.7(4.8) GHz</td><td>18MB</td><td>45W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-13300HE</td><td>4P+4E</td><td>2.1(4.6) GHz</td><td>12MB</td><td>45W</td><td>UHD 48EU</td></tr><tr><td>i7-1370PE</td><td>6P+8E</td><td>1.9(4.8) GHz</td><td>24MB</td><td>28W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-1350PE</td><td>4P+8E</td><td>1.8(4.6) GHz</td><td>12MB</td><td>28W</td><td>Iris Xe 80EU</td></tr><tr><td>i5-1340PE</td><td>4P+8E</td><td>1.8(4.5) GHz</td><td>12MB</td><td>28W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-1320PE</td><td>4P+4E</td><td>1.7(4.5) GHz</td><td>12MB</td><td>28W</td><td>UHD 48EU</td></tr><tr><td>i7-1365UE</td><td>2P+8E</td><td>1.7(4.9) GHz</td><td>12MB</td><td>15W</td><td>Iris Xe 96EU</td></tr><tr><td>i5-1345UE</td><td>2P+8E</td><td>1.4(4.6) GHz</td><td>12MB</td><td>15W</td><td>Iris Xe 80EU</td></tr><tr><td>i5-1335UE</td><td>2P+8E</td><td>1.3(4.5) GHz</td><td>12MB</td><td>15W</td><td>Iris Xe 80EU</td></tr><tr><td>i3-1315UE</td><td>2P+4E</td><td>1.2(4.5) GHz</td><td>10MB</td><td>15W</td><td>UHD 64EU</td></tr><tr><td>U300E</td><td>1P+4E</td><td>1.1(4.3) GHz</td><td>8MB</td><td>15W</td><td>UHD 48EU</td></tr><tr><td></td><td colspan="6">Note:</td></tr><tr><td></td><td colspan="6">1. Raptor Lake-P supports Embedded and Industrial SKUs.</td></tr><tr><td></td><td colspan="6">2. Some processor SKUs are supported by project basis only. Please consult our ADLINK representative.</td></tr></table>

Ordering Information

<table><tr><td>Module Number</td><td>Description/Configuration</td></tr><tr><td>cExpress-RLP-i7-13800HRE-32GB</td><td>Compact size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HRE 2.5GHz/14C 45W with LPDDR5 32GB</td></tr><tr><td>cExpress-RLP-i3-13300HRE-16G</td><td>Compact size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HRE 2.1GHz/8C 45W with LPDDR5 16GB</td></tr><tr><td>cExpress-RLP-i3-1320PRE-16G</td><td>Compact size COM Express Type 6 module based on Intel Raptor Lake-P i3-1320PRE 1.7GHz/8C 28W with LPDDR5 16GB</td></tr><tr><td>cExpress-RLP-i7-1365URE-16G</td><td>Compact size COM Express Type 6 module based on Intel Raptor Lake-P i7-1365URE 1.7GHz/10C 15W with LPDDR5 16GB</td></tr><tr><td colspan="2">Note:1. For processor SKUs that are not listed, please contact our ADLINK representative.</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-cRLP-B</td><td>Heatspreader for cExpress-RLP with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-cRLP-BT</td><td>Heatspreader for cExpress-RLP with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-cRLP-BL</td><td>Low-profile Heatsink for cExpress-RLP with threaded standoffs for bottom mounting</td></tr><tr><td>THS-cRLP-BT</td><td>Low-profile Heatsink for cExpress-RLP with through-hole standoffs for top mounting</td></tr><tr><td>THSH-cRLP-B</td><td>High-profile Heatsink for cExpress-RLP with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-cRLP-B</td><td>High-profile Heatsink with Fan for cExpress-RLP with threaded standoffs for bottom mounting</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
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