# cExpress-SL # COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ and Celeron® Processors # Features ● 6th Generation Intel® Core™ and Celeron® Processors ● Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz ● Two DDI channels, one LVDS (build option 4 lanes eDP), supports up to 3 independent displays ● GbE, up to 6 PCIe x1 (build option) ● Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0 ● Supports Smart Embedded Management Agent (SEMA® ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option) NeW ![Close-up of a green printed circuit board with ADLINK chip and memory chips (no readable text or symbols)](.cexpress-sl-20230922/ef200b019cb507fc6b4c1203dbebe4dcefb015254cbf8e368c62071c2ae5a7aa.jpg) # Specifications # ● Core System # CPU 6th Generation Intel® Core™ and Celeron® Processors - Mobile 14nm process (formerly “Skylake-U”) Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2) Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2) Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2) Celeron® 3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of features may vary between processor SKUs. # Memory Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket # Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel® AMT 11.0 support (AMT support available on Core™ i7/i5 only) # 4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron® # Expansion Busses Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option) Note: Gen3 for Core™ i7/i5/i3, Gen2 for Celeron® LPC bus, SMBus (system) , I2 C (user) # SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control # Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset # ● Video # GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support # Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC # eDP 4 lane support build option, in place of LVDS # ● Audio # Chipset Intel® HD Audio integrated in SOC # Audio Codec On carrier Express-BASE6 (ALC886 standard support) # ● Ethernet Intel® MAC/PHY: i219LM/V with AMT 11.0 support Interface: 10/100/1000 GbE connection # ● I/O Interfaces USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron® supports two ports only Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI from BMC # Specifications # ● Super I/O . Supported on carrier if needed (standard support for W83627DHG-P) # ● TPM (option) Chipset: Atmel AT97SC3204 Type: TPM 1.2 # ● Power Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 5-20V / 5Vsb ±5% or AT = 5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/ S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving # ● Operating Systems # Standard Support Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit # Extended Support (BSP) WES7 32/64-bit, Linux 64-bit # ● Mechanical and Environmental Form Factor: PICMG COM.0: Rev 2.1 Type 6 Dimension: Compact size: 95 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Extreme Rugged™: -40°C to +85°C (build option) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times. Functional Diagram ![Based on the provided flowchart, here is the accurate description of the labeled blocks and their connections:\n\n**Central Component**\n* **6th Generation Intel® Core®/Celeron Processor** containing **SoC (formerly “Skylake-U”)**\n\n**Right Side Connections (Column CD)**\n* **SODIMM 4-16 GB DDR4 non ECC** (two separate blocks)\n* **DDI1 (4 lanes) DP/HDMI**\n* **DDI2 (4 lanes) DP/HDMI**\n* **4x USB 3.0 upgrade (port 0-3)**\n* **XDP 60**\n\n**Left Side Connections (Column AB)**\n* **LVDS eDP to LVDS** (connected via **eDP**; a dashed line indicates **eDP 4 lanes (build option)**)\n* **8x USB 2.0/1.0 (ports 0-7)**\n* **4x PCIe x1 Gen3/2 (port 0-3) (support x2, x4)**\n* **1x PCIe x1 Gen3/2 (port 4)**\n* **1x PCIe x1 Gen3/2 (port 5, build option)** (indicated by a dashed line)\n* **GbE**\n* **2x SATA 6Gb/s (port 0/1)**\n* **1x SATA 6Gb/s (port 2) (only i7/i5/i3)**\n* **HD Audio**\n\n**Lower Connections**\n* **UART0, UART1**\n* **LPC to UART** (connected to UART0, UART1 and LPC bus)\n* **LPC bus** (connected to TPM)\n* **TPM**\n* **SMBus** (connects LPC bus and New SEMA BMC)\n* **GPIO PCA9535** (connected to **4x GPO, 4x GPI**, **GP I²C**, and **DDC I²C**)\n* **New SEMA BMC** (connected via SMBus)\n * Connected to **SPI 0 BIOS** (bidirectional arrows)\n * Connected to **SPI 1 BIOS** (bidirectional arrows)\n * Connected to **LM73**\n* **SPI_CS#**\n* **SPI**](.cexpress-sl-20230922/223604fa8cef2b2be827d06701be1ae2364130ac4ef3857fbab52490751b7b2a.jpg) # Ordering Information ● cExpress-SL-i7-6600U Compact COM Express® Type 6 module with Intel® Core™ i7- 6600U and GT2 graphics ● cExpress-SL-i5-6300U Compact COM Express® Type 6 module with Intel® Core™ i5- 6300U and GT2 graphics ● cExpress-SL-i3-6100U Compact COM Express® Type 6 module with Intel® Core™ i3- 6100U and GT2 graphics ● cExpress-SL-3955U Compact COM Express® Type 6 module with Intel® Celeron® 3955U and GT1 graphics # Starter Kit ● COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit # Accessories # Heat Spreaders ● HTS-cSL-B Heatspreader for cExpress-SL with threaded standoffs for bottom mounting ● HTS-cSL-BT Heatspreader for cExpress-SL with through hole standoffs for top mounting # Passive Heatsinks ● THS-cSL-B Low profile heatsink for cExpress-SL with threaded standoffs for bottom mounting ● THS-cSL-BT Low profile heatsink for cExpress-SL with through hole standoffs for top mounting THSH-cSL-B High profile heatsink for cExpress-SL with threaded standoffs for bottom mounting # Active Heatsink ● THSF-cSL-B High profile heatsink with Fan for cExpress-SL with threaded standoffs for bottom mounting [🔗 Link to the original document](.cexpress-sl-20230922/cexpress-sl-20230922.pdf)