# cExpress-TL

# COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors

# Features

● 11th Gen Intel® Core™ and Celeron® Processor SoC, Gen12 GFX integration
● AI inference (VNNI + Iris Xe graphics)
PCIe Gen4 and PCIe Gen3 lanes
2.5GbE Ethernet, with optional TSN
In-band ECC error correction

![Close-up of a green printed circuit board with ADLINK logo and RAM slots (no readable text or symbols beyond branding)](.cexpress-tl-datasheet-20250528/da7e69cf77da0a5ed639bc3b4d1d96ea5c5c11e46c920c0b8c1125ead4026c2a.jpg)

# Specifications

# ● Core System

# CPU

11th Gen Intel® Core™ and Celeron® Processors - Mobile 10nm++ process (formerly “Tiger Lake UP3”)

Intel® Core™ i7-1185G7E, 2.8(4.4)GHz, 12MB, 15-28W (4C/Iris Xe)

Intel® Core™ i5-1145G7E, 2.6 (4.1)GHz, 8MB, 15-28W (4C/Iris Xe)

Intel® Core™ i3-1115G4E, 3.0(3.9)GHz 6MB, 15-28W (2C/UHD)

Intel® Celeron® 6305E, 1.8 GHz, 4MB, 15W (2C/UHD)

Intel® Core™ i7-1185GRE, 2.8 (4.4) GHz, 12MB, 15-28W (4C/Iris Xe)

Intel® Core™ i5-1145GRE, 2.6 (4.1) GHz, 8MB, 15-28W (4C/Iris Xe)

Intel® Core™ i3-1115GRE, 3.0 (3.9) GHz, 6MB, 15-28W (2C/UHD)

Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT

Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost

Technology 2.0, Intel® AVX-512, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX-NI.

Notes: Availability of features may vary between processor SKUs.

Some of the SKUs listed above are supported by project basis only. Please contact your ADLINK representative for availability.

# Memory

Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC (BIOS

selectable), max. 64GB (2x 32GB) in two SODIMM sockets

One SO-DIMM on top side, one SO-DIMM on bottom side

Intel In-Band ECC (IBECC), provides ECC protection without additional ECC

device (i7-1185GRE, i5-1145GRE, i3-1115GRE support IBECC)

# Embedded BIOS

AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel® AMT

12.x support (dual BIOS by build option)

# Cache

12MB for Core™ i7, 8MB for Core™ i5, 6MB for Core™ i3, 4MB for Celeron®

# Expansion Busses

5 PCIe x1 Gen3 (AB): Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only)

Note: PCIe switch build option available by project basis to offer more x1 lanes (Lanes 5, 6, 7)

1 PCIe x4 Gen4 (CD): Lanes 16-19 (only x4)

LPC bus (through an ESPI-to-LPC bridge IC), SMBus (system) , I2 C (user)

# SEMA Board Controller

Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)

# Debug Header

30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs

# ● Video

# GPU Feature Support

Intel® Gen12 Graphics Core Architecture, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K60)

Hardware encode/transcode of HD content (including HEVC)

DirectX 12 support

OpenGL 4.5, 4.4/4.3 and ES 2.0 support

OpenCL 2.1, 2.0/1.2 support

# Digital Display Interface

DDI1/2/3 supporting DisplayPort/HDMI/DVI

# VGA

Support by build option via DP-to-VGA IC (in place of DDI3), max. resolution 1920x1200@60Hz

# LVDS

Single/dual channel 18/24-bit LVDS via eDP-to-LVDS IC, max. resolution

1920x1200@60Hz in dual mode

# eDP

Optional 4 lane support, in place of LVDS, max. resolution 4K@60Hz

# Specifications

# ● Audio

# Chipset

Intel® HD Audio integrated in SoC

# Audio Codec

On Express-BASE6 carrier (ALC886 standard support)

# ● Ethernet

# Intel® MAC/PHY

LAN Controller, Intel® i225 series (V/LM/IT versions)

TSN supported by IT versions only on Linux, by project basis

# Interface

2.5Gbe, 1000/100/10 Mbit/s Ethernet connection

GbE0\_SDP available if TSN support enabled

# ● I/O Interfaces

USB: 4x USB 3.2/2.0/1.1 (USB 0, 1, 2, 3) and 4x USB 2.0/1.1 (USB 4, 5, 6, 7)

SATA: 2x SATA 6Gb/s (SATA 0, 1)

Serial: 2x UART ports with console redirection

GPIO: 4x GPO and 4x GPI from EC (GPI with interrupt)

Note: USB 3.2 Gen2 support dependent on carrier design

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis)

# ● TPM

Chipset: Infineon

Type: TPM 2.0 (SPI based, build option)

# ● Power

Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

Wide Input: ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO mode: support deep S5 mode for power saving

# ● Mechanical and Environmental

Form Factor: PICMG COM.0 Rev 3.0 Type 6

Dimension: Compact size: 95 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C (Storage: -20°C to 80°C)

Extreme Rugged: -45°C to 85°C (optional, selected SKUs; Storage: -45°C to 85°C)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operating Systems

# Standard Support

Windows 10 IOT Enterprise 64-bit, Yocto Linux 64-bit, VxWorks 64-bit (TBC) Ubuntu (TBC)

Functional Diagram
![Based on the provided block diagram, here is an accurate and concise description of the labeled blocks and their connections:\n\n**Central Component**\n*   **11th Generation Intel® Core™, Celeron® ULT (formerly Tiger Lake-UP3)**: This large red block is the central processor unit. It contains internal labels such as 'DDI A', 'TCP0', 'TCP1', 'DDI B', 'SATA 6Gb/s', '1 PCIe Gen3 (HSIO 8)', '4 PCIe Gen3 (HSIO 4-7)', '1 PCIe Gen3 (HSIO 9)', 'USB 3.2 Gen2 x1' (x4 instances), '1 PCIe Gen4 x4', 'SMBus', 'I2C', 'HSUART', and 'eSPI'.\n\n**Left-Side Connections (Inputs)**\n*   **VGA**: Connected via a dashed line.\n*   **eDP/LVDS**: Connects to the block **'eDP to LVDS'**, which connects to **DDI A**. It also connects via a dashed line labeled **'(build option), eDP 4lanes'** to **DDI A**.\n*   **USB 2.0 Lane 0-7**: Connects directly to the central block.\n*   **SATA Port 0-1** & **SATA Port 2-3**: Connect to **SATA 6Gb/s**.\n*   **Max. 2.5GbE**: Connects to the block **'LAN Controller'** (labeled 'TSN dependent on controller SKU'), which connects to **1 PCIe Gen3 (HSIO 8)**.\n*   **PCIe Lane 0-3**: Connects to the block **'1 x4, 2 x2, 4 x1'**, which connects to **4 PCIe Gen3 (HSIO 4-7)**.\n*   **PCIe Lane 4** & **PCIe Lane 5**: Connect to the block **'PCIe Gen3/2 Switch'**, which connects to **1 PCIe Gen3 (HSIO 9)**.\n*   **HDA**: Connects directly to the central block.\n*   **SPI**: Connects to the blocks **'TPM 2.0'** (labeled 'build option') and **'BIOS'**.\n*   **SMBus** & **I2C**: Connect directly to the central block.\n*   **GPIO/SDIO**: Connects to the **'Embedded Controller'**.\n*   **UART/CAN**: Connects to **HSUART** and the **'Embedded Controller'**.\n*   **LPC/eSPI**: Connects to **eSPI**, which goes to the block **'eSPI to LPC'**, which connects to the **'Embedded Controller'**.\n\n**Right-Side Connections (Outputs)**\n*   **DDI 1**: Connected via a dashed line from **'(build option) DP to VGA'**, which connects to **DDI A**. Also connected via a solid line from **TCP0**.\n*   **DDI 2**: Connected via a solid line from **TCP0**.\n*   **DDI 3**: Connected via a solid line from **TCP1** and **DDI B**.\n*   **USB 3.0 Lane 3**, **USB 3.0 Lane 2**, **USB 3.0 Lane 1**, **USB 3.0 Lane 0**: Connect to four instances of **USB 3.2 Gen2 x1**.\n*   **PCIe Lane 6-7**: Connected via a dashed line labeled **'2 x1 only'** to the **'PCIe Gen3/2 Switch'**.\n*   **PEG Port PCIe 16-19**: Connects to **1 PCIe Gen4 x4**.\n*   **PCIe 20-31**: Connected via a dashed line from the block **'DB30 x86 connector'** (labeled '(build option)').\n\n**Bottom Connections**\n*   **DDR4 SODIMM (top side) 3200 MT/s, non-ECC/IBECC**: Connects to the bottom of the central block.\n*   **DDR4 SODIMM (bottom side) 3200 MT/s, non-ECC/IBECC**: Connects to the top SODIMM block.\n*   **Embedded Controller**: Connects to the block **'Thermal Sensor (board)'**.](.cexpress-tl-datasheet-20250528/54d2d22a408811d88824e75e5e278cd81e69d7c7af6c69766a1328e12e296718.jpg)

# Ordering Information

● cExpress-TL-i7-1185G7E

Compact COM Express Type 6 module with 11th Gen Intel® Core™ i7-1185G7E at 2.8/4.4GHz, quad-core with Intel Iris Xe graphics

● cExpress-TL-i5-1145G7E

Compact COM Express Type 6 module with 11th Gen Intel® Core™ i5-1145G7E at 2.6/4.1GHz, quad-core with Intel Iris Xe graphics

● cExpress-TL-i3-1115G4E

Compact COM Express Type 6 module with 11th Gen Intel® Core™ i3-1115G4E at 3.0/3.9GHz, dual-core with Intel UHD graphics

● cExpress-TL-6305E

Compact COM Express Type 6 module with 11th Gen Intel® Celeron® 6305E at 1.8GHz, dual-core with Intel UHD graphics

t1cExpress-TL-i7-1185GRE

Compact COM Express Type 6 module with 11th Intel Core i7-1185GRE quad core at 2.8GHz/4.4GHz, with Intel Iris Xe graphics

t1cExpress-TL-i5-1145GRE

Compact COM Express Type 6 module with 11th Intel Core i5-1145GRE quad core at 2.6GHz/4.1GHz, with Intel Iris Xe graphics

● t1cExpress-TL-i3-1115G4E

Compact COM Express Type 6 module with 11th Intel Core i3-1115GRE dual core at 3.0GHz/3.9GHz, with Intel UHD graphics

● t2cExpress-TL-i7-1185GRE

Compact COM Express Type 6 module with 11th Intel Core i7-1185GRE quad core at 2.8GHz/4.4GHz, with Intel Iris Xe graphics. ETT -40° to 85°

t2cExpress-TL-i5-1145GRE

Compact COM Express Type 6 module with 11th Intel Core i5-1145GRE quad core at 2.6GHz/4.1GHz, with Intel Iris Xe graphics. ETT -40° to 85°

● t2cExpress-TL-i3-1115GRE

Compact COM Express Type 6 module with 11th Intel Core i3-1115GRE dual core at 3.0GHz/3.9GHz, with Intel UHD graphics. ETT -40° to 85°

\*For processor SKUs not listed, please contact your ADLINK representative for availability.

# Accessories

# Heat Spreaders

● HTS-cTL-B

Heatspreader for cExpress-TL with threaded standoffs for bottom mounting

● HTS-cTL-BT

Heatspreader for cExpress-TL with through hole standoffs for top mounting

# Passive Heatsinks

● THS-cTL-B

Low profile heatsink for cExpress-TL with threaded standoffs for bottom mounting

● THS-cTL-BT

Low profile heatsink for cExpress-TL with through hole standoffs for top mounting

THSH-cTL-B

High profile heatsink for cExpress-TL with threaded standoffs for bottom mounting

# Active Heatsink

● THSF-cTL-B

High profile heatsink with Fan for cExpress-TL with threaded standoffs for bottom mounting

# Starter Kit

. COM Express Type 6 Starter Kit Plus

Starter kit for COM Express Type 6
[🔗 Link to the original document](.cexpress-tl-datasheet-20250528/cexpress-tl-datasheet-20250528.pdf)