# cExpress-WL

# COM Express Compact Size Type 6 Module with 8th Gen Intel® Core™ and Celeron® Processors

# Features

● 8th Gen quad/dual-core Intel® Core™ Processors
● Up to 64GB Dual Channel non-ECC DDR4 at 2133/2400MHz
● Two DDI channels, one LVDS (opt. 4 lanes eDP), one opt. VGA, supports up to 3 independent displays
● Up to eight PCIe lanes, GbE
. Up to three SATA 6 Gb/s, four USB 3.1 Gen2 and four USB 2.0
● Supports Smart Embedded Management Agent (SEMA) functions
● Extreme Rugged operating temperature: -40°C to +85°C (optional)

# Specifications

# ● Core System

# CPU

8th Gen Intel® Core™ and Celeron® Processors - Mobile 14nm process (formerly “Whiskey Lake-U”)

Core™ i7-8665UE, 1.7 (4.4 Turbo) GHz, 8MB, 15W (25W-12.5W cTDP), 4C/GT2 Core™ i5-8365UE, 1.6 (4.1 Turbo) GHz, 6MB, 15W (25W-12.5W cTDP), 4C/GT2 Core™ i3-8145UE, 2.2 (3.9 Turbo) GHz, 4MB, 15W (25W-12.5W cTDP), 2C/GT2 Celeron® 4305UE, 2.0GHz, 2MB, 15W, 2C/GT1

Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX-NI.

Note: Availability of features may vary between processor SKUs.

# Memory

Dual channel 2133/2400 MHz non-ECC DDR4 memory up to 64GB in two SODIMM sockets

# Embedded BIOS

AMI EFI with CMOS backup in 32 or 16MB SPI BIOS with Intel® AMT 11.0 support (AMT support available on Core™ i7/i5 only)

# Cache

8MB for Core™ i7, 6MB for Core™ i5, 4MB for Core™ i3, 2MB for Celeron®

# Expansion Busses

• 6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4)
• 2 PCI Express x1 Gen3 (CD): Lanes 6/7
• 1 PCI Express x1 Gen3 (CD): Lane 16 (muxed with SATA port 3, by build option)
Note: Maximum of 5 PCIe devices supported
• LPC bus, SMBus (system) , I2 C (user)

# SEMA Board Controller

Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control

# Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs

![Green printed circuit board with multiple microphones and connectors, no visible text or symbols on the chip itself.](.cexpress-wl-20230922/e81a517d136e1a765fc18427c4309e8e85eb59ebd83076ad13ac385e01d82eb9.jpg)

# ● Video

# GPU Feature Support

Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs

• Hardware encode/transcode of HD content (including HEVC)
• DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
• OpenGL 4.5, 4.4/4.3 and ES 2.0 support
• OpenCL 2.1, 2.0/1.2 support

# Digital Display Interface

DDI1/2 supporting DisplayPort/HDMI/DVI

#

Support by build option through DP-to-VGA IC (in place of DDI2, max. resolution 1920x1200 @60Hz)

# LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200 @60Hz in dual mode)

# eDP

Optional 4 lane support, in place of LVDS (max. resolution 4096x2304 @60Hz, 24bpp)

# ● Audio

# Chipset

Intel® HD Audio integrated in SoC

# Audio Codec

On carrier Express-BASE6 (ALC886 standard support)

# ● Ethernet

# Intel® MAC/PHY

Intel® I219-LM/V (LM supports AMT 12.x)

# Interface

10/100/1000 Mbit/s Ethernet connection

# Specifications

# Multi I/O and Storage

USB: 4x USB 3.1 Gen2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7)

SATA: 3x SATA 6Gb/s (SATA 0,1,2), SATA port 3 muxed with PCIe lane 16 (SATA port 3 is default)

Serial: 2x UART ports with console redirection, from a LPC to UART IC (opt. HSUART from SOC by build option)

eMMC: eMMC 5.0 (8/16/32GB by build option)

GPIO/SD: 4x GPO and 4x GPI from BMC (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only

Note: USB 3.1 Gen2 support dependent on carrier design

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

# ● TPM (option)

Chipset: In ineon

Type: TPM 2.0

# ● Power

Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

Wide Input: ATX: 5-20 V / 5Vsb ±5%; or AT: 5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/ S4, WOL S3/S4/S5)

ECO mode: support deep S5 mode for power saving

# ● Mechanical and Environmental

Form Factor: PICMG COM.0: Rev 3.0 Type 6

Dimension: Compact size: 95 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -45°C to +85°C (optional, selected SKUs)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operating Systems

# Standard Support

Windows 10 64-bit, Yocto project based Linux 64-bit, Ubuntu LTS 64-bit (TBD), CentOS 64-bit (TBD)

# Extended Support (BSP)

Yocto project based Linux 64-bit

Functional Diagram
![**Central Hub**\n*   **Block:** 8th Gen Intel® Core™ Intel® Celeron® SoC\n*   **Subtext:** (formerly “Whiskey Lake-U”)\n\n**Left Side Connections (Column AB)**\n*   **Text:** Single/dual channel 18/24-bit LVDS\n*   **Block:** LVDS eDP to LVDS\n*   **Connection:** eDP (from SoC to LVDS)\n*   **Connection:** eDP 4 lanes (build option) (dashed line returning to SoC)\n*   **Block:** VGA DP to VGA\n*   **Text:** (build option)\n*   **Connection:** 8x USB 2.0/1.0 (ports 0-7)\n*   **Connection:** 6x PCIe x1 Gen3 (port 0-5, supports x2, x4)\n*   **Connection:** 2x SATA 6Gb/s (port 0-1)\n*   **Connection:** 1x SATA 6Gb/s (port 2)\n*   **Text:** Mixed with PCIe port 16\n*   **Block:** GbE\n*   **Connection:** HD Audio\n*   **Connection:** LPC bus (eSPI as build option)\n*   **Block:** LPC to UART\n*   **Connection:** UART0 UART1\n*   **Block:** TPM 2.0\n*   **Connection:** SMBus\n*   **Connection:** GPIO SD\n*   **Block:** Switch\n*   **Block:** GPIO\n*   **Connection:** GP I2C\n*   **Connection:** DDC I2C\n*   **Connection:** SPI_CS#\n*   **Connection:** SPI\n\n**Right Side Connections (Column CD)**\n*   **Block:** SODIMM 4-32 GB DDR4 non-ECC (top side)\n*   **Block:** SODIMM 4-32 GB DDR4 non-ECC (bottom side)\n*   **Connection:** DDI1 (4 lanes) DP/HDMI\n*   **Connection:** DDI2 (4 lanes) DP/HDMI\n*   **Connection:** 2x PCIe x1 Gen3 (port 6-7, x1 only)\n*   **Connection:** 1x PCIe x1 Gen3 (port 16) (build option, in place of SATA2) (dashed line)\n*   **Block:** eMMC 8-64GB\n*   **Connection:** 4x USB 3.1 Gen2 upgrade (port 0-3)\n\n**Bottom/Management Connections**\n*   **Labels on SoC:** HSUART, SD, I2C\n*   **Block:** New SEMA BMC\n*   **Connection:** SMBus (connecting SoC to BMC)\n*   **Block:** SPI 0 BIOS\n*   **Block:** SPI 1 BIOS\n*   **Block:** Thermal Sensor](.cexpress-wl-20230922/00637610ac1e684a227ed8252f5eec0bc9fb0aa2f0aae22b2e35023d0cab4658.jpg)

# Ordering Information

● cExpress-WL-i7-8665UE

Compact COM Express Type 6 module with 8th Gen Intel® Core™ i7-8665UE at 1.7GHz/4.4GHz, quad-core with GT2 level graphics

● cExpress-WL-i5-8365UE

Compact COM Express Type 6 module with 8th Gen Intel® Core™ i5-8365UE at 1.6GHz/4.1GHz, quad-core with GT2 level graphics

● cExpress-WL-i3-8145UE

Compact COM Express Type 6 module with 8th Gen Intel® Core™ i3-8145UE at 2.2GHz/3.9GHz, dual-core with GT2 level graphics

● cExpress-WL-4305UE

Compact COM Express Type 6 module with 8th Gen Intel® Celeron® 4305UE at 2.0GHz, dual-core with GT1 level graphics

\*For processor SKUs not listed, please contact your ADLINK representative for availability.

# Accessories

# Heat Spreaders

● HTS-cWL-B

Heatspreader for cExpress-WL with threaded standoffs for bottom mounting

● HTS-cWL-BT

Heatspreader for cExpress-WL with through hole standoffs for top mounting

# Passive Heatsinks

● THS-cWL-B

Low profile heatsink for cExpress-WL with threaded standoffs for bottom mounting

● THS-cWL-BT

Low profile heatsink for cExpress-WL with through hole standoffs for top mounting

THSH-cWL-B

High profile heatsink for cExpress-WL with threaded standoffs for bottom mounting

# Active Heatsink

● THSF-cWL-B

High profile heatsink with Fan for cExpress-WL with threaded standoffs for bottom mounting

# Starter Kit

● COM Express Type 6 Starter Kit Plus

Starter kit for COM Express Type 6
[🔗 Link to the original document](.cexpress-wl-20230922/cexpress-wl-20230922.pdf)