# COM-HPC-cRLS

Client Type COM-HPC Size C Module based on Intel® Raptor Lake-S platform

![Close-up of a computer motherboard with visible CPU socket and surrounding components (no readable text or symbols)](.com-hpc-crls-datasheet-20241220/b8ae61e45efe1f85fa56dd2909d7f13675bffb07fbb86720995d73030f7490f0.jpg)

# Features

• Advanced hybrid architecture combining Performance-cores with Efficient–cores supporting up to 24 cores / 32 threads for superior multi-threaded performance
• Up to 128GB DDR5 SODIMM at max. 4000MT/s
• 1x PCIe Gen5 x16, 4x PCIe Gen4 x4, Multiple PCIe Gen3
• 2x 2.5 GbE LAN
• Best-in-class longevity support

Specifications

<table><tr><td rowspan="13">Core System</td><td rowspan="10">SoC</td><td colspan="4">13th Gen Intel® Core Processors (formerly Raptor Lake-S)</td></tr><tr><td>Processor</td><td>Cores/Threads</td><td>Cache</td><td>TDP</td></tr><tr><td>i9-13900E</td><td>8P 16E/32T</td><td>36MB</td><td>65W 32EU</td></tr><tr><td>i7-13700E</td><td>8P 8E/24T</td><td>30MB</td><td>65W 32EU</td></tr><tr><td>i5-13500E</td><td>6P 8E/20T</td><td>24MB</td><td>65W 32EU</td></tr><tr><td>i3-13100E</td><td>4P/8T</td><td>12MB</td><td>65W 24EU</td></tr><tr><td colspan="4">Note:</td></tr><tr><td colspan="4">1. Lower TDP 35W SKUs and specific 125W SKUs are supported by project basis.Please consult your local ADLINK representative.</td></tr><tr><td colspan="4">2. ECC and TCC are supported by pairing with R680E PCH.</td></tr><tr><td colspan="4">Supports: Intel® VT (including VT-x / VT-d), Intel® Turbo Boost Technology 2.0,Intel® VNNI, Intel® TCC and Time-Sensitive Networking (TSN),Intel® HardwareShield, Intel® TXT, Intel® System Security Report, Intel® APIC-v, Intel® PTT,Intel® TDT, Intel® CET, Intel® AMT, Intel® UPID, Intel® PMT, Intel® ThermalVelocity Boost (TVB) (by SKU)Note: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td colspan="4">Up to 128GB (4x 32GB) DDR5 SODIMM memory,max. 4000MT/s at four sockets (two on top, two at the bottom)Note: It is recommended to check that the bottom side specifications are suitable foryour application purposes.</td></tr><tr><td>Embedded BIOS</td><td colspan="4">AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS opt.)</td></tr><tr><td>Cache</td><td colspan="4">36/30/24/12MB</td></tr></table>

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="3">Core System</td><td>Expansion Busses</td><td>1 PCIe Gen5 x16 at 16-31 and 1 PCIe Gen4 x4 at 8-116 PCIe Gen3 x1 at 0-5 (x4, x2, x1)More lanes with R680E/ 670E (all x4, x2, x1):o 1 PCIe Gen4 x4 at 12-15o 1 PCIe Gen4 x4 at 32-35o 1 PCIe Gen4 x4 at 36-39Note: PCIe lanes 0-5, USB 3.0, SATA, NBASE-T and PCIe_BMC source from HSIO. The available total raw bandwidth is equivalent to PCIe x16 Gen3SMBus, 2x I2C, 1x GP SPI, 1x Boot SPI and eSPI</td></tr><tr><td>SEMA Board Controller</td><td>Voltage/current monitoring, power se uence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)</td></tr><tr><td>Debug Headers</td><td>40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing BIOS POST code LED, MMC/EC access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr><tr><td rowspan="3">Video</td><td>GPU Feature Support</td><td>Intel UHD Graphics 770 driven by Xe architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI, eDP outputs (4x 4K60)Hardware encode/transcode of HD content (including HEVC)DirectX 12 supportOpenGL 4.6 support</td></tr><tr><td>Display Interface</td><td>DDI 0/1/2 supporting DisplayPort/HDMI/DVIDP1.4a and HDMI2.0b</td></tr><tr><td>eDP</td><td>4 lane support, eDP 1.4b</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Intel HD Audio integrated on CPU</td></tr><tr><td>Audio Codec</td><td>On COM-HPC Client Base Carrier (Realtek solution on carrier, TBC)</td></tr><tr><td rowspan="2">NBASE-T Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 Series (I226 supports TSN by build option, TBC)</td></tr><tr><td>Interface</td><td>2x 2.5GbE and 1000/100/10 Mbit/s Ethernet connection</td></tr><tr><td rowspan="5">Multi I/O and Storage</td><td rowspan="2">USB</td><td>4x USB 3.2/2.0/1.1 (USB 0,1,2,3)</td></tr><tr><td>4x USB 2.0/1.1 (USB 4,5,6,7)</td></tr><tr><td>SATA</td><td>2x SATA (SATA 0, 1)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>12x GPIO (GPI with interrupt, TBC)</td></tr><tr><td rowspan="2">TPM (Optional)</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="4">Power</td><td>Standard Input</td><td>ATX (TBC): 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant</td></tr><tr><td>Power States</td><td>TBC</td></tr><tr><td>ECO mode</td><td>TBC</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM-HPC: Rev 1.1 Client Type</td></tr><tr><td>Dimensions</td><td>Size C 160X120 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I,Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 10 IoT Enterprise LTSCYocto project-based Linux 64-bit</td></tr></table>

Ordering Information

<table><tr><td colspan="2">Module</td></tr><tr><td>COM-HPC-cRLS-i9-13900E</td><td>Client Type COM-HPC Size C module with 13th Gen Intel i9-13900E processor with R680E chipset, 4 SO-DIMM</td></tr><tr><td>COM-HPC-cRLS-i7-13700E</td><td>Client Type COM-HPC Size C module with 13th Gen Intel i7-13700E processor with R670E chipset, 4 SO-DIMM</td></tr></table>

Note: For processor SKUs not listed, please contact your ADLINK representative for availability.

![**Labeled Blocks:**\n\n*   **J1** (Left column)\n*   **J2** (Right column)\n*   **13th Gen Intel Core Processor** / **Raptor Lake-S** (Top center red block)\n*   **Chipset** / **R680E, Q670E, H610E** (Bottom center red block)\n*   **DDR5 SODIMM** / **4800 MT/s** (Two blocks on the left)\n*   **Intel i226** (Two small blocks under NBASE-T)\n*   **BIOS flash**\n*   **TPM 2.0**\n*   **EEPROM**\n*   **Embedded Controller** (Bottom center blue block)\n*   **fan connector**\n*   **LM73** / **(board)**\n*   **DB40-HPC connector**\n\n**Connections and Labels:**\n\n**J1 to Processor/Chipset:**\n*   **eDP**, **DDI 0**, **DDI 1** connect via **eDP x4** to **J2 DDI 2**.\n*   **DDR5 SODIMM** blocks connect to the Processor.\n*   **PCIe 0-5** connects via **PCIe 0-3 (4 x1 or 1 x4 or 2 x2)** and **PCIe 4-5 (2 x1 or 1 x2) x4 only** to the Processor.\n*   **PCIe 8-11** connects to the Processor.\n*   **PCIe 12-15** connects via **x4, x2, x1** to the Processor.\n*   **NBASE-T 0** connects via **Intel i226** to the Processor (labeled **1 PCIe (HSIO16)**).\n*   **NBASE-T 1** connects via **Intel i226** to the Processor (labeled **1 PCIe (HSIO17)**).\n*   **USB3.x_0** connects via **USB3.2 Gen2 x1 (HSIO0)** to the Chipset.\n*   **USB3.x_1** connects via **USB3.2 Gen2 x1 (HSIO1)** to the Chipset.\n*   **USB 2.0 0-7** connects to the Chipset.\n*   **SATA 0-1** connects via **(HSIO26-27)** to the Chipset.\n*   **HDA** connects to the Chipset.\n*   **BOOT_SPI** / **GP_SPI** connect to the area containing **BIOS flash** and **TPM 2.0**.\n*   **SMBus** connects to **EEPROM**.\n*   **I2C_0**, **I2C_1**, **12xGPIO**, **2xUART**, and **eSPI** connect to the **Embedded Controller**.\n\n**Processor to J2:**\n*   **PCIe x16 GEN5** connects to **J2 PCIe 16-31**.\n*   **4 PCIe Gen4 (HSIO30-33) (Q670E, R680E)** connects via **x4, x2, x1** to **J2 PCIe 32-35**.\n*   **4 PCIe Gen4 (HSIO34-37) (Q670E, R680E)** connects via **x4, x2, x1** to **J2 PCIe 36-39**.\n\n**Chipset to J2:**\n*   **USB3.2 Gen1 x1 (HSIO2)** connects to **J2 USB3.x_2**.\n*   **USB3.2 Gen1 x1 (HSIO3)** connects to **J2 USB3.x_3**.\n\n**Other Connections:**\n*   The **Chipset** connects to **DB40-HPC connector**.\n*   The **Embedded Controller** connects to **fan connector** and **LM73 (board)**.](.com-hpc-crls-datasheet-20241220/2af4ccff75681354fff93358e43fad2de427d3192293d229c342008fd95f5151.jpg)

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.com-hpc-crls-datasheet-20241220/com-hpc-crls-datasheet-20241220.pdf)