# COM-HPC-mPTL

COM-HPC Mini Module Based on Intel® Panther Lake Platform

Preliminary

![Close-up of a microprocessor on a circuit board (no visible text or symbols)](.com-hpc-mptl-prelim-datasheet-20251231-3-2/54e4756fcddf2dfb33a354c866d5e126940f20a210cbc40b570624efda1101da.jpg)

# Features

. Smallest COM-HPC form factor (Size: 95mm x 70mm)
Intel® Core™ Ultra processors, up to 16 cores
Integrated NPU up to 50 TOPS
. Intel® Arc™ graphics up to 12 Xe cores

. Up to 64GB LPDDR5X
High-speed I/O w/ PCIe Gen5 & USB4 (Optional)
Onboard NVMe SSD support (Optional)
. Extreme rugged operating temperature (selected SKUs, TBC)

Specifications

<table><tr><td rowspan="9">Core System</td><td rowspan="6">SoC</td><td colspan="5">Intel® CoreTM Ultra Series 3</td></tr><tr><td>Processor</td><td>Cores</td><td>TDP</td><td>Graphics</td><td>PEG (8-15)</td></tr><tr><td>Ultra X7 358H</td><td>16 (4P+8E+4LPE)</td><td>25W</td><td>12Xe</td><td>-</td></tr><tr><td>Ultra 7 356H</td><td>16 (4P+8E+4LPE)</td><td>25W</td><td>4Xe</td><td>Supported</td></tr><tr><td>Ultra 5 325</td><td>8 (4P+0E+4LPE)</td><td>25W</td><td>4Xe</td><td>-</td></tr><tr><td colspan="5">Note: Target SKUs will be supported by project basis.</td></tr><tr><td>NPU</td><td colspan="5">Integrated, up to 50 TOPS</td></tr><tr><td>Memory (soldered Down)</td><td colspan="5">Up to 64GB (4x 16GB) LPDDR5x at max. 8533MT/s</td></tr><tr><td>Embedded BIOS</td><td colspan="5">AMI UEFI with CMOS backup in 32MB SPI BIOS (Dual BIOS, TBC)</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="3">Core System</td><td>Expansion Busses</td><td>Up to 16 PCIe lanes8 PCIe Gen5 lanes (8-15): x8, x4 configurations4 PCIe Gen4 lanes (0-3): x4, x2, x1 configurations2 PCIe Gen4 lanes (4-5): x2, x1 configurations2 PCIe Gen5 lanes (6-7): x2 (lane 6-7), x1(only lane 6) configurationsNote: Lanes 4-7 can be combined as PCIe Gen5 x4. (available w/o onboard NVMe SSD function).SMBus (system), 2x I2C (user), 1x GP_SPI, 1x Boot_SPI and eSPI</td></tr><tr><td>SEMA Board Controller</td><td>ManageabilityVoltage/current monitoringPower-sequence debug supportLogistics &amp; forensic information (event/history)General-purpose interfaces:  $I^{2}C$ , UART, GPIOWatchdog timer and fan control</td></tr><tr><td>Debug Headers</td><td>40-pin FFC/FPC connector, compatible with the DB40-HPC debug module(For BIOS POST code LEDs, EC access, SPI BIOS flashing, power test points, and debug LEDs)</td></tr><tr><td rowspan="4">Video</td><td>GPU Feature</td><td>Support up to 4 independent displays: DP / HDMI / eDP + USB4 (DP Alt Mode)Intel® Xe + Intel® ArcTM iGPU, up to 12 Xe coresMax output: 4× 4K@60Hz (TBD)Hardware video encode/decodeStandards: DirectX® 12, OpenGL® 4.6, Vulkan® 1.2, Intel® VPL, HDCP 2.3Graphics hardware virtualization: SR-IOV</td></tr><tr><td>Digital Display Interface</td><td>2 DDI ports (DDI 0/1), support DP1.4a / HDMI2.1 (Default DDI0)</td></tr><tr><td>USB4</td><td>3x USB4 ports, support DP alt mode (Default USB4 0/1; USB4_1 optional USB3_2 or USB3_3)Note: Custom BIOS and re-timer/PD required (by project support)</td></tr><tr><td>eDP</td><td>eDP 1.4b</td></tr><tr><td rowspan="3">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Interface</td><td>HDA</td></tr><tr><td>Audio Codec</td><td>On COM-HPC mini Base Carrier (Realtek solution on carrier)</td></tr><tr><td>Camera</td><td>MIPI-CSI</td><td>2x MIPI-CSI on-board FFC connector (Optional, TBC)</td></tr><tr><td rowspan="2">NBASE-T Ethernet</td><td>Intel® MAC/PHY</td><td>2x Intel® i226 controllers (I226 supports TSN by build option)</td></tr><tr><td>Speed</td><td>2.5Gbps/1000M/100M/10M Ethernet connection</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>Up to 4x USB 3.2 Gen2x1 10Gbps (Default port 0,1)4x USB 2.0 (Port 4, 5, 6, 7)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection (Default from EC; SoC by project basis)</td></tr><tr><td>GPIO</td><td>12x GPIO (GPI with interrupt, TBC) (Default from EC; SoC by project basis)</td></tr><tr><td>On-board Storage</td><td>Onboard NVMe SSD (Optional; co-lay with PCIe lane 4 &amp; 5 w/ PCIex2 Gen5)Note: x2/x4 lanes support is on a project basis.</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="3">Power</td><td>Standard Input</td><td>AT mode 12V±5%; Vin 8-20V (Single power rail)</td></tr><tr><td>Wide Input</td><td>AT: 8.5-20V</td></tr><tr><td>Power States</td><td>C0-C6, S0, S3, S5; ECO mode (Wake-on-USB S3/S4, WoL S3/S4/S5; TBC)</td></tr><tr><td rowspan="5">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM-HPC: Rev 1.3 mini Type</td></tr><tr><td>Dimension</td><td>95mm x 70 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (Storage: -20°C to 80°C)Industrial: -40°C to 85°C (Storage: -40°C to 85°C, selected SKUs, TBC)</td></tr><tr><td>Humidity</td><td>Operating: 5-90% RH, non-condensingStorage: 5-95% RH, non-condensing</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I,Condition D</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 11 IoT Enterprise LTSCUbuntu 24.04 LTSVxWorks (by project)</td></tr></table>

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

# Block diagram

![The diagram is a system block diagram centered around a large pink rectangular block labeled **Intel Core Ultra® Panther Lake-H**.\n\n**Top Connections (Memory):**\nTwo light blue blocks labeled **LPDDR5x** (with subtext **2/4/8/16GB**) are connected via vertical lines to the top edge of the main block. The top edge of the main block is labeled **TCP3 TCP2 TCP1 TCP0 DDI**.\n\n**Left Side Connections (I/O and Interfaces):**\nA grey column lists various interfaces connected horizontally to the main block:\n*   **eDP**\n*   **DDI_0/USB4_2**\n*   **USB4_0/DDI_1**\n*   **USB4_1/USB3_2 or 3**\n*   **USB3_0/1/USB4_3**\n*   **USB2 0-7**\n*   **PCIe 0-3**\n*   **PCIe 4-7**\n*   **PCIe 8-11** (labeled **Target CPUs only**)\n*   **PCIe 12-15** (labeled **Target CPUs only**)\n*   **HDA**\n*   **Boot_SPI** connects to a block labeled **BIOS**.\n*   **GP_SPI** connects to a block labeled **TPM 2.0**.\n*   **SMBus**\n*   **I2C 0-1**\n*   **GPIO 0-11**\n*   **UART 0-1**\n*   **eSPI**\n\n**Specific Sub-Blocks on the Left:**\n*   Between the PCIe lines, there is a box labeled **X2 (Optional)** containing **NVMe SSD 64-256GB**, connected to the lines above it.\n*   **NBASE-T_1** connects to a blue box labeled **LAN** with subtext **(Intel i226)**.\n*   **NBASE-T_0** connects to a blue box labeled **LAN** with subtext **(Intel i226)**.\n\n**Bottom Connections (Embedded Controller):**\n*   A large light blue block labeled **Embedded Controller** is situated at the bottom.\n*   It connects to the main block via a line labeled **eSPI** (at the bottom edge of the main block).\n*   It connects to two blocks on the right: **Thermal sensor (SOC)** and **Thermal sensor (Board)**.\n*   Solid and dashed lines connect the **Embedded Controller** to the left-side labels **SMBus**, **I2C 0-1**, **GPIO 0-11**, and **UART 0-1**.\n*   Dashed lines originate from inside the bottom-left of the main block labeled **2x I2C**, **12x GPIO**, and **2x HSUART**, connecting to the respective external signals and the Embedded Controller.](.com-hpc-mptl-prelim-datasheet-20251231-3-2/f81dfbc6e15988fb74ce9becfa73b060e8c64658c975fb701eb39c0137153877.jpg)

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

# Ordering Information

# Module

#

COM-HPC-mPTL-358H-32G COM-HPC mini module with Intel Panther Lake Core Ultra X7 358H, 32GB LPDDR5 memory COM-HPC-mPTL-325-16G COM-HPC mini module with Intel Panther Lake Core Ultra 5 325, 16GB LPDDR5 memory

Note: For certain processor or memory capacity SKUs not listed, please contact our ADLINK representative.

# Accessories

# Heat Spreaders

HTS-mPTL-B Heatspreader for COM-HPC-mPTL with threaded standoffs for bottom mounting

# Active Heatsinks

THSF-mPTL-B High-profile Heatsink with Fan for COM-HPC-mPTL with threaded standoffs for bottom mounting
[🔗 Link to the original document](.com-hpc-mptl-prelim-datasheet-20251231-3-2/com-hpc-mptl-prelim-datasheet-20251231-3.pdf)