PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor

CMx-SLx

Datasheet

![The image displays a ring of eight orange trapezoids arranged in a circular pattern on a white background.](.datasheet-cmx-slx-20250606/abd54b74453b6d60b00a7c8d8bbf92100a3bf3ff80554c7b270fd5b5d9460fc5.jpg)

PC104

![Close-up of a green printed circuit board with multiple electronic components and connectors (no readable text or symbols)](.datasheet-cmx-slx-20250606/8ce5f6e9642e51686371812dfc955799d5422e5c9ce0f23f1676ae1279f08130.jpg)

# Features

• 6th Gen. Intel® Core™ Processor
• Up to 16GB DDR4-ECC soldered memory
• 3x DDI channels, 1x micro HDMI, 1x mini DP and 1x 18/24 bit single channel LVDS
• 4x PCIe x1 and 1x PCIe x16 (PEG) configurable as 1x PCIe x16 or 2x PCIe x8 or 1x PCIe x8 + 2x PCIe x4
• 2x GbE LAN, 2x SATA 6Gb/s, 1x USB 3.1, 6x USB 2.0 (2x to PCIe/104 bus connector), 2x COM, 8x GPIO
• Featuring SEMA® for easy integration of Hardware monitoring and control
• Extreme Rugged operating temperature -40°C to +85°C (build by BOM options)

Specifications

<table><tr><td rowspan="7">Processor &amp; System</td><td>CPU</td><td>6th generation Intel® Processor (formerly Skylake)Intel® CoreTM i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2)Intel® CoreTM i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2)Intel® CoreTM i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2)Intel® Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2)</td></tr><tr><td>PCH</td><td>Intel® CM236 (supports ECC memory, Intel® AMT)</td></tr><tr><td>Memory</td><td>Up to 16GB single channel 1866/2133 MHz DDR4-ECC soldered memory</td></tr><tr><td>Onboard Storage</td><td>Soldered 8GB SLC SATA-SSDDepending on application requirements, variants with following processors can be offered:16GB SLC/MLC32GB SLC/MLC64GB MLC</td></tr><tr><td>Embedded BIOS</td><td>AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.00 support</td></tr><tr><td>Cache</td><td>3MB for CoreTM i3 (Option: 8MB for Xeon® processor)</td></tr><tr><td>Expansion Busses</td><td>PCI/104-Express Type 1 (stack-down)PCI-104 (stack-down)</td></tr><tr><td>Audio</td><td>Chipset</td><td>Intel® HD Audio integrated in chipset available on “DisplayPort” and “HDMI” ports</td></tr></table>

Specifications

<table><tr><td rowspan="7">Ethernet</td><td>Intel® MAC/PHY</td><td>1x Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support)1x Intel® MAC/PHY: i210IT</td></tr><tr><td>Interface</td><td>10/100/1000 GbE connection</td></tr><tr><td>TPM</td><td>TPM supported by BIOS</td></tr><tr><td>Video</td><td>GPU Feature SupportIntel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS</td></tr><tr><td>Hardware encode/transcode</td><td>HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 supportOpenGL 4.4/4.3 and ES 2.0 supportOpenCL 2.1, 2.0/1.2 support</td></tr><tr><td>Digital Display Interface</td><td>DDI1/2 supporting DisplayPort/HDMI</td></tr><tr><td>LVDS</td><td>Single channel 18/24-bit LVDS from eDP-to-LVDS IC</td></tr><tr><td rowspan="6">I/O Interfaces</td><td>USB</td><td>1x USB 3.1 and 6x USB 2.0 (2x USB 2.0 to PCIe/104 bus connector)</td></tr><tr><td>SATA</td><td>2x SATA 6Gb/s and 1x SATA to onboard SATA-SSD</td></tr><tr><td>Serial</td><td>2x RS-232</td></tr><tr><td>GPIO</td><td>8x</td></tr><tr><td>SMBus</td><td>1x</td></tr><tr><td>I2C</td><td>1x</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX = 5V±5% / 5Vsb ±5% or AT = 5V±5%</td></tr><tr><td>Optional Input</td><td>Depending on customer application and processor, “5VDC single voltage supply” variant can be offered.</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)</td></tr><tr><td>ECO mode</td><td>Supports deep S5 for power saving</td></tr><tr><td>Operation System</td><td>Standard Support</td><td>Windows 10 (64-bit), Windows 7 (32/64-bit), Linux YOCTO 64-bit, VxWorks 7 (64-bit), QNX 6.6</td></tr><tr><td rowspan="7">Mechanical and Environmental</td><td>Form Factor</td><td>PCI/104-Express Specification, Version 3.0</td></tr><tr><td>Dimension</td><td>117.4 mm x 96 mm</td></tr><tr><td>Operating</td><td>Standard: 0°C to +60°C</td></tr><tr><td>Temperature</td><td>Extreme Rugged: -40°C to +85°C</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Intelligent Middleware</td><td>SEMA®</td><td>Local management, control of embedded computer systemsExtended EAPI for monitoring, controlling and analytics applicationsMultiple OS support and across platforms (x86, ARM)</td></tr></table>

CMx-SLx
![**Labeled Blocks:**\n\n*   18/24-bit LVDS (single channel)\n*   PTN3460 eDP to LVDS\n*   Intel Skylake-H Processor (Intel Core i3-6102E, i3-6100E, Intel Xeon E3-1505L v5)\n*   Up to 16GB DDR4 w/ECC memory down (8+1)\n*   Mini DisplayPort\n*   Micro HDMI\n*   PCIe/104 Type1\n*   Intel Mobile H Series Chipset (PCH-H CM236 (w/ ECC support))\n*   8/16/32/64GB SATA-SSD (supporting 'SLC' and 'MLC')\n*   SATA1\n*   SATA2\n*   2x USB 2.0\n*   1x USB 3.1\n*   GbE1 (iAMT)\n*   i219LM GbE\n*   GbE2\n*   i210IT GbE\n*   COM1\n*   COM2\n*   F81216HD-I LPC-to-UART\n*   DB40 Service Connector\n*   BIOS 1\n*   BIOS 2\n*   SMB\n*   Hardware Monitor\n*   SPD EEPROM\n*   4x PCIe x1\n*   2x USB 2.0\n*   1x PCIe x1\n*   XIO2001 PCIe-to-PCI\n*   PCIe-to-PCI EEPROM\n*   PCI-104\n*   CPLD\n*   Utility Header\n*   VBAT\n*   Battery Header\n*   GPIO1 (4x GPIO)\n*   GPIO2 (4x GPIO)\n*   1x I2C, 1x SMB\n*   BMC / SEMA\n*   DIAG\n*   LM73\n*   Power Supply\n*   Board Power Options (a) ATX / AT (b) 5V DC (c) PCI-104 Stack (d) PCIe/104 Stack\n\n**Connections:**\n\n*   **18/24-bit LVDS (single channel)** connects to **PTN3460 eDP to LVDS**, which connects to **Intel Skylake-H Processor** via **eDP**.\n*   **Up to 16GB DDR4 w/ECC memory down (8+1)** connects to **Intel Skylake-H Processor**.\n*   **Intel Skylake-H Processor** connects to **Mini DisplayPort** via **DDI1** and to **Micro HDMI** via **DDI2**.\n*   **Intel Skylake-H Processor** connects to **PCIe/104 Type1** via **PCIe x16 (PEG) Configurable as 1x16/2x8/1x8+2x4**.\n*   **Intel Skylake-H Processor** connects to **Intel Mobile H Series Chipset** via **DMI Gen3**.\n*   **Intel Skylake-H Processor** connects to **Intel Mobile H Series Chipset** via a dotted line labeled **XDP interface to 'test points'**.\n*   **8/16/32/64GB SATA-SSD (supporting 'SLC' and 'MLC')** connects to **Intel Mobile H Series Chipset**.\n*   **SATA1**, **SATA2**, **2x USB 2.0** (appears twice), and **1x USB 3.1** connect to **Intel Mobile H Series Chipset**.\n*   **GbE1 (iAMT)** connects to **i219LM GbE**, which connects to **Intel Mobile H Series Chipset** via **1x PCIe x1**.\n*   **GbE2** connects to **i210IT GbE**, which connects to **Intel Mobile H Series Chipset** via **1x PCIe x1**.\n*   **COM1** and **COM2** connect to **F81216HD-I LPC-to-UART**, which connects to **Intel Mobile H Series Chipset** via **LPC**.\n*   **DB40 Service Connector** connects to **BIOS 1** (dotted line). **BIOS 1** connects to **BIOS 2**. **BIOS 1** connects to **Intel Mobile H Series Chipset** via **SPI(0)**.\n*   **Intel Mobile H Series Chipset** connects to **Hardware Monitor** and **SPD EEPROM** via **SMB**.\n*   **Intel Mobile H Series Chipset** connects to **PCIe/104 Type1** via **4x PCIe x1**.\n*   **Intel Mobile H Series Chipset** connects to **XIO2001 PCIe-to-PCI** via **2x USB 2.0** and **1x PCIe x1**. **XIO2001 PCIe-to-PCI** connects to **PCI-104**.\n*   **PCIe-to-PCI EEPROM** connects to **XIO2001 PCIe-to-PCI**.\n*   **Intel Mobile H Series Chipset** connects to **Utility Header** via **CPLD**.\n*   **Intel Mobile H Series Chipset** connects to **Battery Header** via **VBAT**.\n*   **Intel Mobile H Series Chipset** connects to **GPIO1 (4x GPIO)**, **GPIO2 (4x GPIO)**, and **1x I2C, 1x SMB**.\n*   **Intel Mobile H Series Chipset** connects to **BMC / SEMA** via **SMB** and a dashed **I2C** line.\n*   **BMC / SEMA** connects to **DIAG** and **LM73**.\n*   **BMC / SEMA** connects to **Power Supply** via **I2C**.\n*   **Power Supply** connects to **Board Power Options (a) ATX / AT (b) 5V DC (c) PCI-104 Stack (d) PCIe/104 Stack**.](.datasheet-cmx-slx-20250606/25c4a3eed4d30b2d7ba73365dc7bef4ef3f9566a235382a7b6b173784bc943d3.jpg)

Ordering Information

<table><tr><td>CM4-SL2-6102E-8G-8G</td><td>PCI/104-Express Type 1 SBC, Intel® CoreTM i3-6102E (1.9GHz), CM236 chipset, 8GB DDR4-ECC, 8GB SLC SATA-SSD, 0°C to +60°C</td></tr><tr><td>CM4-SL4-6822E-8G-8G-ETT</td><td>PCI/104-Express Type 1 SBC, Intel® CoreTM i7-6822EQ (max. 2.8GHz), CM236 chipset, 8GB DDR4-ECC, 8GB SLC SATA-SSD, -40°C to +85°C</td></tr></table>

For other CPU, RAM or SATA-SSD configurations, please contact your local sales representative

Optional Accessories

<table><tr><td>CMx-SLx-X-10</td><td>CMx-SLx Cable Kit</td></tr><tr><td>CMx-SLx-TM-00</td><td>CMx-SLx Heat Spreader</td></tr><tr><td>CMx-SLx-TM-10</td><td>CMx-SLx Passive Heat Sink (0°C to +60°C)</td></tr><tr><td>CMx-SLx-TM-20</td><td>CMx-SLx Active Heat Sink for i3-6102E CPU (-40°C to +85°C)</td></tr></table>
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