# VPX3010 Series

# Rugged 3U VPX Intel® Xeon® Processor D-1500 Processor Blade

# Features

● Intel® Xeon® Processor D-1500 SoC up to 12 cores (formerly “Broadwell-DE”)
● DDR4-2133 soldered ECC SDRAM up to 32GB
● Dual 10G-KR, up to three 1G Ethernet ports
● Up to PCIe x16 Gen3 interface supporting non-transparent bridge
● One XMC expansion slot, PCIe x8 Gen3 with Rear I/O to P2

![The image shows a logo on a white background featuring the text 'VPX' in a bold, dark blue sans-serif font. To the upper right of the text is a small 'TM' trademark symbol in grey. Surrounding the right side of the text are two curved, grey swoosh lines—one thicker line curving underneath and a thinner line curving over the top, creating an orbital effect around the letters.](.datasheet-vpx3010-series-20220817/639f20558c832d0446aee9ab82be4afcdcb6177284e879da17c339fd1b8c5176.jpg)

![The image displays a logo on a white background featuring the text 'VPXREDDI'. The letters 'VP' are blue. The letter 'X' is black with horizontal white lines cutting through it. The letters 'R' and 'E' are orange. The letters 'D', 'D', and 'I' are grey. A dark, swooping curve underlines the text, starting beneath the 'P' and curving upwards to the right. A small 'TM' symbol appears to the top right of the 'I'.](.datasheet-vpx3010-series-20220817/ef50460b736feb59b9adee2e778df45ce0b700500de6848154dfe3ff803cc446.jpg)

![The image displays the logo for OpenVPX. The word 'Open' is written in orange lowercase letters, followed by 'VPX' in bold, dark blue capital letters. To the right of the text, a dark blue curved line arcs around the 'X' and ends near a small 'TM' trademark symbol at the top right.](.datasheet-vpx3010-series-20220817/b6f9ca6080a23c61fece138742b520cb9b398becb71c39ccfb8b20293fb5ce72.jpg)

![The image features the text 'CONDUCTION COOLED' printed in large, red, distressed capital letters. The text is centered within a thin, red rectangular border against a white background. The letters have a rough, stamped appearance.](.datasheet-vpx3010-series-20220817/e21efbc8f425d461d7d5c0277eb5f6a533274250cb04dd6a8fa824e47306bc02.jpg)

![Close-up of a green printed circuit board with integrated circuits and gold contacts (no readable text or symbols)](.datasheet-vpx3010-series-20220817/aca6b264723082d7e359b79638af4807e05f4d353da80c0cde011e45f45cf42f.jpg)

# Specifications

# ● Processor & System

# CPU

Intel® Xeon® D-1559 12-core, 45W TDP

Intel® Xeon® D-1539 8-core, 35W TDP

Intel® Pentium® D1519 4-core, 25W TDP

# RAM

Dual channel DDR4-2133 ECC soldered SDRAM, up to 32GB

# BIOS

AMI EFI on 64Mbit SPI flash

# VITA Specifications

VITA 46.0 VPX Base Standard

VITA 46.4 PCI Express on VPX Fabric Connector

VITA 46.6 Gigabit Ethernet Control Plane on VPX

VITA 46.9 PMC/XMC/Ethernet Signal Mapping to 3U/6U VPX

VITA 46.10 Rear Transition Module on VPX

VITA 46.11 System Management on VPX

VITA 48.0 Ruggedized Enhanced Design Implementation Mechanical Base Specification

VITA 65 OpenVPX Architecture Framework for VPX

# Module Profile

MOD3-PAY-2F2T-16.2.5-3

# Slot Profile

SLT3-PAY-2F2T-14.2.5

# ● Connectivity

# XMC

PCIe x8 Gen3 with Rear IO to P2 X8d+X12d

# Ethernet

Dual 10G-KR to P2

Two 1000BASE-T to P1 (or one 1000BASE-T and two 1000BASE-BX by BOM option)

# Graphics

SMI750 on PCIe x1

One VGA to P2

# USB

One USB 3.0 to P1 and one to P2

One USB 2.0 to P1

# Serial Port

One RS-232 to P1

One RS-232/422 to P1

# PCI Express

PCIe x8 Gen3, configurable to 1 x8 or 2 x4 to P1, supports DMA and non-transparent bridge for peer-to-peer communication

PCIe x8 Gen3 to P2 (combined with PCIe x8 Gen3 to P1 for PCIe x16 Gen3, no XMC BOM option)

PCIe x1 Gen3 to P1 (no XMC BOM option)

# ● Storage

# SBC

Soldered SLC NAND flash up to 64GB SATA 6Gb/s

# RTM

One SATA 6Gb/s to P1

One SATA 6Gb/s to P2 (no XMC BOM option)

# Specifications

# ● Security Mechanism

TPM

Atmel TPM version 1,2

IPMC

Smart Fusion A2F200 with VPX code base

BIOS

Dual BIOS mechanism

# ● Operating System

Red Hat Enterprise Linux 6.5

Wind River VxWorks 7.0

Microsoft Windows 7 32/64-bit

Microsoft Windows 7 Embedded (Please contact ADLINK for other OS support)

# ● Miscellaneous

LEDs

Blade status LEDs on front and rear

# Watchdog Timer

System reset or NMI with programmable interval

GPIO

Eight 5V tolerance GPIO to P1 and P2

# Reset Button

Reset button on front panel

# ● Miscellaneous

Form Factor

Conduction cooled: 3U VPX 0.8 in.

Air cooled: 3U VPX 0.85 and 1 in.

# Operating Temp.

Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional)

Air cooled version: -40°C to +75°C

# Storage Temp.

-50°C to +100°C

# Relative Humidity

95% non-condensing

# Altitude

60,000 feet, operating

# Power Consumption

52.84 W

# Weight

Conduction cooled: 535.25g

Air cooled: 491.15g

# Thermal Dissipation

Convection and conduction

# ● Safety & EMI

# Certifications

CE, FCC Class A

VPX3010 Block Diagram
![**Central Block:**\n*   **Intel® Xeon D** (Large green rectangle)\n\n**Top Connections:**\n*   **NAND Flash** (Grey box) connects to the central block via **SATA III**.\n*   Two **DDR4** (Grey boxes) connect to the central block.\n*   **SPI** connects the central block to **BIOS_0** and **BIOS_1** (Grey boxes).\n\n**Left Side Connections:**\n*   **PCIe x1 Gen2** connects to **SM750** (Blue box), which connects via **VGA** to **P2** (Orange box).\n*   **\*PCIe x8 Gen3** connects to **XMC** (Blue box), which connects via **x8d+x12d** to **P2**.\n*   **USB 3.0 x1** connects to **10G-KR**, which connects to **P2**.\n*   **10G-KR** connects directly to **P2**.\n\n**Bottom Center Connections (Leading to P1):**\n*   **PCIe x1 Gen3** (with sub-label **SKu 2 BOM Option**) connects to **P1**.\n*   **SATAIII x1** (with sub-label **SKu 2 BOM Option**) connects to **P1**.\n*   **SMBUS** connects to **GPIO Expansion** (Blue box), which connects to **P1**.\n*   **USB 3.0 x1** connects to **P1**.\n*   **USB 2.0 x1** connects to **P1**.\n*   **\*PCIe x8 Gen3** connects to **P1**.\n*   **PCIe x4 Gen2** connects to **GLAN Intel 82580EB** (Blue box).\n    *   The GLAN block has outputs labeled **1000BASE-T** (twice) and **1000BASE-BX** (twice) connecting to **P1**.\n    *   Red text nearby reads: **2x 1000BASE-T or 1x1000BASE-T + 2x 1000BASE-BX**.\n\n**Right Side Connections:**\n*   **LPC** connects to **TPM** (Blue box), **COM IC** (Blue box), and **IPMC** (Blue box).\n*   **COM IC** connects via **RS-232** to **P0** (Orange box).\n*   **IPMC** connects to **SPI Flash** (Grey box).\n*   **IPMC** connects via **RS-232/RS422** to **P2**.\n*   **IPMC** connects via **IPMB_1** and **IPMB_0** to **P0**.](.datasheet-vpx3010-series-20220817/fd855959437ad7b662ea63ba9818a0fbee7b17b9eeaff3697a6f7eed4c1312b2.jpg)

Combined with PCIe x8 Gen3 to P1 and PCIe x8 to PCIe x16 Gen3, No XMC BOM option
The data transfer rate will be limited by device specification

# 3U VPX Test Frame

Product Type 9-slot Test Frame

Form Factor VPX 3U

Dimensions 142.6mm (H) x 209.9mm (W) x 276.28mm (D)

Blade Support Conduction cooled VPX 3U blades

Backplane Support 3-slot

RTM Support

Cooling Passive fins

Power User define

![The image displays a black computer chassis or server tower viewed from a front-left angle. The right side panel features a grid of vertical ventilation slats. The front face also has vertical slats. The far left edge shows a panel with horizontal slats. The left side of the enclosure is open, revealing the internal components. Inside, a green motherboard is mounted vertically, secured by white plastic standoffs. Black rectangular components are visible at the top and bottom of the internal cavity. The top surface is a solid, flat black panel.](.datasheet-vpx3010-series-20220817/8f4c338845ce109d7781bbfbe000719bcfab3cd2ab059b0624a001272507b7a9.jpg)
3U VPX Test Frame

![This image displays a green printed circuit board (PCB) of a single-board computer, oriented vertically. At the top, a large, black, finned heatsink covers the processor. Below the heatsink on the left side are a USB Type-C port, two stacked Ethernet (RJ45) ports, and a USB Type-A port. Near the bottom left, there are two small, rectangular white stickers.\n\nTowards the bottom center, a blue HDMI port and a microSD card slot are visible. Along the right edge runs a 26-pin GPIO header. The board is populated with various black integrated circuits, capacitors (some yellow), small white connectors, and several small yellow LEDs. There is no legible text visible on the board itself.](.datasheet-vpx3010-series-20220817/47a5298b53c1e2ce55ca7109750486041364b582b7c2ed94814e6cc43b1e57c7.jpg)
VPX-R3010

![The image displays a green, L-shaped printed circuit board (PCB). On the upper left section, there is a white label with the text 'M5161 17811913' and a 'CE' mark. This area also features a silver heatsink covering a chip, solder points, and four mounting holes surrounded by white rings. The lower right section extends into an edge connector slot lined with gold pins. Vertical text reading 'FOXCONN' is printed along the right edge, while 'P80012' is visible near the bottom edge. Several small black chips and capacitors in purple and yellow are scattered across the board.](.datasheet-vpx3010-series-20220817/b9ef450717bee6a022c07f17336ecd2eaea96d336feb508881688816ab902823.jpg)
VPX-R3010L2

![The image displays an L-shaped green printed circuit board (PCB). The upper section features various surface-mounted electronic components, including integrated circuits and capacitors. A white label on the left side reads 'HP' with a logo, followed by 'P/N: 636012-001', 'S/N: 4835541M17', 'MFG: 0812', and 'Made in China'. The text 'J1' is printed on the board near the top edge, and 'CE' along with a recycling symbol are visible near the center. The lower, extended section of the board is covered by a silver metal shield with a grid of small holes, likely protecting a connector interface. Gold-plated contact pins are situated in the corners of the board.](.datasheet-vpx3010-series-20220817/e03278329496f20334ea85028df664d603219298c8435db8d248763675fd36a3.jpg)
VPX-R3010L2-1

# Ordering Information

# Processor Blades

● VPX3010/1559/M16/S32/XMC-R1

3U VPX processor board with Intel® Xeon® D-1559, DDR4 16GB, SLC 32GB, dual 10G-KR, dual GbE Base-T, VGA, 2x USB 3.0, XMC slot with coating & ETT -40°C to +75°C, conduction cooled

● VPX3010/1559/M16/S32/P16-R1

3U VPX processor board with Intel® Xeon® D-1559, DDR4 16GB, SLC 32GB, PCIe x16, dual 10G-KR, 1GbE Base-T and GbE Base-BX, VGA, 2x USB 3.0, with coating & ETT -40°C to +75°C, conduction cooled

● VPX3010/1539/M16/S32/P16-R1

3U VPX Processor Board with Intel® Xeon® D-1539, DDR4 16GB, 32GB, PCIe x16, dual 10G-KR,1GbE Base-T and GbE Base-BX, VGA, 2x USB 3.0, with coating & ETT -40°C to +75°C, conduction cooled

● VPX3010/1559/M32/S64/XMC-R1

3U VPX processor board with Intel® Xeon® D-1559, DDR4 32GB, SLC 64GB, dual 10G-KR, dual GbE Base-T, VGA, 2x USB 3.0, XMC slot with coating & ETT -40°C to +75°C, conduction cooled

# Rear Transition Modules

● VPX-R3010

RTM for VPX3010 with GbE, SATA, USB 3.0/2.0, RS-232, GPIO, XMC, 0.8” front panel

● VPX-R3010L2

RTM for VPX-R3010 with PCIe x16 slot, PCIe x1 slot

● VPX-R3010L2-1

RTM for VPX-R3010 with 10G SFP+ connector

# Accessories

● VPX-TF3090

3U VPX conduction cooled test frame with tBP-VPX3000
[🔗 Link to the original document](.datasheet-vpx3010-series-20220817/datasheet-vpx3010-series-20220817.pdf)