# DLAP-IGX

Edge AI Platform Powered by NVIDIA® IGX Thor™

# Features

• Extreme AI Performance: Embedded with NVIDIA IGX T7000™ up to 4,293 TFLOPS (FP4-Sparse) for multi-model generative AI workloads.
• Rich High-Speed I/O: Includes 1x USB 3.2 Type-C, 4x USB 3.2 Type A, and comprehensive expansion options.
• Industry-Grade Design: designed for Humanoid Robot /Vision Sensing System (VSS) / Autonomous Mobile Robot (AMR) applications.

![The image displays a blue, tilted oval containing the word 'Preliminary' in white, sans-serif text. A thin white curve accents the bottom right edge of the oval, all set against a white background.](.dlap-igx-20260212/4aedb392b83eff0760da9094a0d2cf1c02cfda0e01335c03ac5a7235f1187a3c.jpg)

![Exterior view of a black ADLINK 3D device with ventilation grille and control buttons (no readable text or symbols beyond branding)](.dlap-igx-20260212/925f9ca1bd4337b4f71f2a7ad8f319eb994f88289c1e8ba9a4b57306f8adb48a.jpg)

Specifications

<table><tr><td>Model</td><td>DLAP-IGX</td></tr><tr><td>AI Performance</td><td>Up to 4,293 TFLOPS (FP4-Sparse)</td></tr><tr><td>iGPU</td><td>2,560-core NVIDIA Blackwell architecture GPU with fifth generation Tensor Cores Multi-Instance GPU with 10 TPCs</td></tr><tr><td>iGPU Max Frequency</td><td>1.57 GHz</td></tr><tr><td>CPU</td><td>14-core Arm Neoverse-V3AE64-bit CPU 64 KB I-cache, 64 KB dCache 1 MB L2 cache per core 16 MB shared system L3 cache</td></tr><tr><td>CPU Max Frequency</td><td>2.6 GHz</td></tr><tr><td>Vision Accelerator</td><td>1x PVA v3</td></tr><tr><td>Memory</td><td>128 GB 256-bit LPDDR5X | 273 GB/s 48 GB dGPU memory | 1,344 GB/s</td></tr><tr><td>Storage</td><td>1 TB M.2 NVMe (PCIE Gen5 x2)</td></tr><tr><td>Video Encode</td><td>2x NVEncode (iGPU) 3x NVEncode (dGPU)</td></tr><tr><td>Video Decode</td><td>2x NVDecode (iGPU) 3x NVDecode (dGPU)</td></tr><tr><td>PCIe</td><td>2x PCIe Gen5 (x8, x16)</td></tr><tr><td>Discrete GPU</td><td>NVIDIA RTX PROTM 5000 Blackwell (optional) 14,080-core Blackwell architecture GPU with fifth-generation Tensor Cores</td></tr><tr><td>USB</td><td>1x USB 3.2 Type-C 4x USB 3.2 Type A</td></tr><tr><td>Networking</td><td>2x RJ45 (1GbE each) 2x QSFP28 (200GbE each)</td></tr><tr><td>Integrated ConnectX</td><td>Yes</td></tr><tr><td>Display</td><td>1x VESA DisplayPort 1.4a</td></tr><tr><td>Other I/O</td><td>Two 3.5mm AUX jack (MIC, line-out)</td></tr><tr><td>BMC</td><td>Yes</td></tr><tr><td>Safety Support</td><td>Functional Safety Island on SoC Safety MCU on the carrier board</td></tr><tr><td>Power</td><td>100-240 VAC, 10-5A, 60-50Hz, 700W power supply</td></tr><tr><td>Mechanical</td><td>330 x 375 x 170 mm</td></tr></table>
[🔗 Link to the original document](.dlap-igx-20260212/dlap-igx-20260212.pdf)