# Express-ADP

COM Express COM.0 R3.1 Type 6 Module based on Intel® Alder Lake-P platform

![The image displays a blue oval shape tilted slightly upward to the right. Inside the oval, the word 'Preliminary' is written in white, sans-serif capital letters. In the extreme bottom right corner, a small fragment of another image is partially visible, showing a pair of eyes against an orange background.](.express-adp-20220906/ea0ed897eae9ba5ec7f19b3f2d09ce0d5a347548f427f66ad67992d6995cc0ac.jpg)

![Close-up of a green printed circuit board with visible components and gold contacts (no readable text or symbols)](.express-adp-20220906/f4f836f65a8f750885b411c9c3c92a70a6bda57c78d9be0390a3cd07c18253ac.jpg)

# Features

• Performance hybrid architecture (P-core, E-core)
• Up to 14 cores, 20 threads at 15W/28W/45W TDP
• Up to 64GB DDR5 SO-DIMM at max. 4800MT/s, non-ECC
• AI inference (AVX-512 VNNI, Iris Xe GPU 96EUs)

• 4 displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4 (TBC)
• 1 PCIe x8 Gen4, 2 PCIe x4 Gen4, 2.5GbE (TSN opt.)
• Extreme Rugged operating temperature (optional, selected SKUs)

Specifications

<table><tr><td rowspan="11">Core System</td><td rowspan="7">SoC</td><td colspan="5">12th Gen Intel $^{\textregistered}$  Core $^{\text{TM}}$  processors (formerly Alder Lake-P)</td></tr><tr><td>Processor</td><td>Cores/Threads</td><td>Cache</td><td>TDP</td><td>Graphics</td></tr><tr><td>Core $^{\text{TM}}$  i7-12800HE</td><td>6P+8E/20T</td><td>24MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i5-12600HE</td><td>4P+8E/16T</td><td>18MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i3-12300HE</td><td>4P+4E/12T</td><td>12MB</td><td>45W(35W cTDP)</td><td>UHD GPU</td></tr><tr><td colspan="5">Note: Some processor SKUs are supported by project basis only. Please consult your ADLINK representative.</td></tr><tr><td colspan="5">Supports: Intel $^{\textregistered}$  VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel $^{\textregistered}$  HT Technology, Intel $^{\textregistered}$  SSE4.2, Intel $^{\textregistered}$  64 Architecture, Intel $^{\textregistered}$  Turbo Boost Technology 2.0, Intel $^{\textregistered}$  AVX512-VNNI, Intel $^{\textregistered}$  TXT, Execute Disable Bit, Intel $^{\textregistered}$  Data Protection Technology with Intel $^{\textregistered}$  Secure Key, Intel $^{\textregistered}$  AES-NINote: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td colspan="5">Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s2 memory channels with 1DPC design</td></tr><tr><td>Embedded BIOS</td><td colspan="5">AMI UEFI with CMOS backup in 32 SPI BIOS (dual BIOS opt.)</td></tr><tr><td>Cache</td><td colspan="5">Core $^{\text{TM}}$  i7-12800HE : 24MBCore $^{\text{TM}}$  i5-12600HE / Core $^{\text{TM}}$  i7-1270PE : 18MBCore $^{\text{TM}}$  i3-12300HE / Core $^{\text{TM}}$  i5-1250PE / Core $^{\text{TM}}$  i3-1220PE / Core $^{\text{TM}}$  i7-1265UE / Core $^{\text{TM}}$  i5-1245UE : 12MBCore $^{\text{TM}}$  i5-1245UE : 10MBCeleron 7305E : 8MB</td></tr><tr><td>Expansion Busses</td><td colspan="5">PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)PCIe x4 Gen4, lanes 24-27PCIe x4 Gen4, lanes 28-318 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1Gen3: Lanes 4/5/6/7LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI(TBC)</td></tr></table>

Specifications

<table><tr><td rowspan="2"></td><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, genral purpose  $I^{2}C$ , UART, GPIO, watchdog timer, fan control</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr><tr><td rowspan="6">Video</td><td>GPU Feature Support</td><td>Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D supportOneVPLHDCP 2.3Graphics Hardware Virtualization (SRIOV)</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI</td></tr><tr><td>VGA</td><td>Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.4b</td></tr><tr><td>USB4</td><td>Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)Requires BIOS code modification by project basis, re-timer with PD on carrier</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On carrier Express-BASE6 (ALC886 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I225 series (I225-IT supports TSN by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC)</td></tr><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)2x SATA 6Gb/s (SATA 0-1)Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC)</td></tr><tr><td>On-board Storage</td><td>NVMe SSD in place of PCIe lanes 28-31 (build option, project basis)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>8x GPIO (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 125 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 10 IOT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit (TBC), VxWorks (TBC)</td></tr></table>

# Ordering Information

Starter Kit

<table><tr><td>COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6</td></tr></table>

Module

<table><tr><td>Express-ADP-i7-12800HE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i7-12800HE 3.5GHz/14C 45W</td></tr><tr><td>Express-ADP-i5-12600HE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i5-12600HE 3.3GHz/12C 45W</td></tr><tr><td>Express-ADP-i3-12300HE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i3-12300HE 3.3GHz/8C 45W</td></tr><tr><td>Express-ADP-i7-1270PE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i7-1270PE 3.3GHz/12C 28W</td></tr><tr><td>Express-ADP-i5-1250PE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i5-1250PE 3.2GHz/12C 28W</td></tr><tr><td>Express-ADP-i3-1220PE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i3-1220PE 3.1GHz/8C 28W</td></tr><tr><td>Express-ADP-i7-1265UE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i7-1265UE 3.5GHz/10C 15W</td></tr><tr><td>Express-ADP-i5-1245UE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i5-1245UE 3.3GHz/10C 15W</td></tr><tr><td>Express-ADP-i3-1215UE</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P i3-1215UE 3.3GHz/6C 15W</td></tr><tr><td>Express-ADP-7305E</td><td>Basic size COM Express Type 6 module based on Intel Alder Lake-P Celeron 7305E 1.0GHz/5C 15W</td></tr></table>

# Accessories

Heat Spreaders

<table><tr><td>HTS-ADP-B</td><td>Heatspreader for Express-ADP with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-ADP-BT</td><td>Heatspreader for Express-ADP with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-ADP-BL</td><td>Low-profile Heatsink for Express-ADP with threaded standoffs for bottom mounting</td></tr><tr><td>THS-ADP-BTL</td><td>Low-profile Heatsink for Express-ADP with through-hole standoffs for top mounting</td></tr><tr><td>THSH-ADP-BL</td><td>High-profile Heatsink for Express-ADP with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-ADP-BL</td><td>High-profile Heatsink with Fan for Express-ADP with threaded standoffs for bottom mounting</td></tr></table>

![The diagram is a block diagram for the **12th Gen Intel® Core™ Processor (Alder Lake - P)**, which is the large central pink block.\n\n**Left-Side Connections (Inputs/Interfaces):**\n*   **Memory:** Two blocks labeled **DDR 5 SODIMM max. 4800 MT/s 8-32 GB, non-ECC** connect to the top left of the processor.\n*   **Display:**\n    *   **eDP/LVDS** connects via a dashed box labeled **eDP to LVDS** and text **eDP x 4**.\n    *   **VGA** connects via a dashed box labeled **DP to VGA**.\n*   **USB:** **USB 2.0 Lane 0-7** connects directly.\n*   **Ethernet:** **Max. 2.5GbE** connects via a blue box labeled **LAN controller I225**.\n*   **PCIe:** **PCIe Lane 0-3**, **PCIe Lane 4**, and **PCIe Lane 5** connect to a dashed box labeled **PCIe switch**.\n*   **Storage/Audio:** **SATA 0-1**, **SATA 2-3**, and **HDA** connect directly.\n*   **Boot/Security:** **SPI** connects to a blue box labeled **BIOS Flash** and a dashed box also labeled **BIOS Flash**. **SMBus** connects directly.\n*   **Low-Level Interfaces:** **I2C** connects to lines labeled **2x I2C** and **2x HSUART** (near the processor) and down to the bottom section. **8xGPIO /SDIO** and **2xUART /CAN** connect to the bottom section. **LPC /eSPI** connects to a blue box labeled **TPM 2.0**.\n*   **Bottom Text:** **eSPI build option (TBC)** is listed at the bottom left.\n\n**Right-Side Connections (Outputs/Interfaces):**\n*   **Top:** **TCP** connects to **DDI/USB4/TBT4 Port 1** and **DDI/USB4/TBT4 Port 2**. Below that, **DDI only Port 3** connects directly.\n*   **USB:** **4x USB 10Gbps** connects to **USB 3.x Lane 0**, **USB 3.x Lane 1**, **USB 3.x Lane 2**, and **USB 3.x Lane 3**.\n*   **PCIe:**\n    *   Inside the processor block: **1 PCIe Gen 3 (HSIO)**, **4 PCIe Gen 3 (HSIO)**, and **1 PCIe Gen 3 (HSIO)** are labeled.\n    *   **2 PCIe x1** connects to **PCIe Lane 6-7**.\n    *   **PCIe Gen 4 x8 (CPU)** connects to **PEG Port PCIe 16-23**. Small text notes **available for 45W(35W CTDP) SKUs**.\n    *   Two instances of **PCIe Gen 4 x4 (CPU)** connect to **PCIe 24-27** and **PCIe 28-31** respectively.\n*   **SSD:** **PCIe 28-31** also connects to a dashed box labeled **NVMe BGA SSD** with text **build option** below it.\n\n**Bottom Section (Embedded Controller):**\n*   A large blue box labeled **Embedded Controller** is at the bottom.\n*   It connects to **Fan connector** (blue box) and **LM73 (board)** (blue box).\n*   It connects via a dashed box labeled **eSPI to LPC** to the main processor block.](.express-adp-20220906/bd4e3c39dcffd7dfbf9a969bc6869a9489324f340ae1c6c3ab2efa838ebe7103.jpg)
[🔗 Link to the original document](.express-adp-20220906/express-adp-20220906.pdf)