# Express-BD7 # COM Express Basic Size Type 7 Module with Intel® Xeon® D and Pentium® D SoC # Features ● Intel® Xeon® D and Pentium® D SoC (up to 16 cores) ● Up to 32GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU) Two 10G Ethernet and NC-SI support Up to 32 PCIe lanes (24x Gen3, 8x Gen2) GbE, two SATA 6 Gb/s, four USB 3.0/2.0 ● Supports Smart Embedded Management Agent (SEMA® ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option with selected SoC SKU) # Specifications # ● Core System # CPU Intel® Xeon® D and Pentium® D SoC, 14nm process (formerly”Broadwell-DE”) Xeon® D1559 1.6/2.1GHz 18MB, 45W (12C) (eTEMP) Xeon® D1539 1.6/2.2GHz 12MB, 35W (8C) (eTEMP) Xeon® D1577 1.3/2.1GHz 24MB, 45W (16C) Xeon® D1548 2.0/2.6GHz 12MB, 45W (8C) Xeon® D1527 2.2/2.7GHz 6MB, 35W (4C) Pentium® D1508 2.2/2.6GHz 3MB, 25W (2C) Pentium® D1519 1.5/2.1GHz 6MB, 25W (4C) (eTEMP) Note: SKUs not listed above and D1577/D1559 may be supported on a project basis. please contact your ADLINK representative. Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® TSX-NI, Intel® Platform Protection Technology with Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI Note: Availability of features may vary between processor SKUs. # Dual channel 1867/2133/2400 MHz DDR4 ECC memory up to 32GB in dual SODIMM sockets (dependent on SoC SKU) Note: Only D1548 support up to 2400 MHz Only D1548 support up to 1866 MHz # Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS # Cache 24MB for D1577 18MB for D1559 12MB for D1548/D1539 6MB for D1527/D1519 3MB for D1508 # Expansion Busses PCIe x16 or 2 PCIe x8 or 4 PCIe x4 (Gen3) 8 PCIe lanes (Gen3): AB connector, Lanes 8-15 6 PCIe lanes (Gen2): AB connector, Lanes 0/1/2/3/4/5 Up 2 PCIe lanes (Gen2): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2 C (user) Note: PCI Express lane 7 support in place of GbE # SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. ![Close-up of a green printed circuit board with an Intel XR/MOS D-1539 chip and visible connectors (no readable text or symbols beyond branding)](.express-bd7-20210923-客戶版/51d9be4fb08f2c07d0010924b51f36764910b8e3ee5d50e441d92f0fee39dc7f.jpg) # ● 10G Ethernet # Intel® MAC/Controller Intel® 10G Ethernet Controller integrated in SoC # 10G Interface 2x 10GBASE-KR # 10G Sideband Signals 10G\_INT 10G\_PHY\_MDIO/MDC & SDA/SCL 10G\_PHY\_CAP 10G\_PHY\_RST 10G\_LED\_I2C 10G\_SFP\_I2C 10G\_SDP # NC-SI NC-SI supported on AB connector, connect to GbE controller # ● Ethernet . Intel® MAC/PHY: Intel® Ethernet Connection i210-LM Interface: 10/100/1000 GbE connection # ● Multi I/O and Storage USB: 4x USB 3.0/2.0 (USB 0, 1, 2, 3) SATA: 2x SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # Specifications # ● TPM Chipset: Infineon Type: TPM 2.0 # ● Power Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Operating Systems # Standard Support Windows 10 (64-bit) Windows Server 2012 (64-bit) Windows 7 (64-bit) Linux (64-bit) # Extended Support (BSP) Linux (64-bit) # ● Mechanical and Environmental Form Factor: PICMG COM.0 Rev 3.0 , Type 7 Dimension: Basic size: 125 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (build option, standard voltage only) Note: Extreme Rugged availability dependent on SoC SKU # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. # Customized information # Product information Product name: t2Express-BD7-D1539-cc/YT Part number: 91-72129-442D # . Change History Remove debug connector (PCN 20210818 Rev 1.0) # Functional Diagram ![**Labeled Blocks:**\n* AB\n* CD\n* SODIMM 1 Up to 2400 MHz 4-16 GB ECC/non-ECC DDR4\n* SODIMM 2 Up to 2400 MHz 4-16 GB ECC/non-ECC DDR4\n* Note: Memory frequency dependent on SoC SKU\n* Intel® Xeon® D Pentium® D “Broadwell-DE”\n* XDP 60\n* 6 PCIe lanes (Gen2) (port 0-5)\n* 8 PCIe lanes (Gen3) (port 8-15)\n* 2x SATA 6Gb/s (port 0/1)\n* NC-SI\n* GbE Controller\n* 4 x USB 2.0 (port 0/1/2/3)\n* UART0/1\n* LPC to UART NCT5014D\n* TPM 2.0\n* LPC bus\n* SMBus\n* 4x GPO, 4x GPI\n* GPIO PCA9535\n* GP I2C\n* 1x 10G KR\n* 10G Sideband Signals\n* 16 PCIe lanes (Gen3) (port 16-31)\n* 1 PCIe lane (Gen2) (port 6)\n* 1 PCIe lane (Gen2) (port 7)\n* 4x USB 3.0 upgrade (port 0/1/2/3)\n* New SEMA BMC\n* SPI 0 BIOS\n* SPI 1 BIOS\n* LM73 Sensor\n* SPI_CS#\n* SPI\n\n**Connections:**\n* **SODIMM 1** and **SODIMM 2** connect via arrows to the central block.\n* **XDP 60** connects via a double-headed arrow to the central block.\n* **6 PCIe lanes (Gen2) (port 0-5)**, **8 PCIe lanes (Gen3) (port 8-15)**, and **2x SATA 6Gb/s (port 0/1)** connect via double-headed arrows to the central block.\n* **NC-SI** is a label on a dashed line connecting the central block to the left side (AB).\n* **GbE Controller** connects via a dashed line to the central block and to the left side (AB).\n* **4 x USB 2.0 (port 0/1/2/3)** connects via a double-headed arrow to the central block.\n* **LPC bus** connects via a double-headed arrow to the central block and to the left side (AB).\n* **SMBus** connects via a double-headed arrow to the central block and to the left side (AB).\n* **UART0/1** connects from **LPC to UART NCT5014D** to the left side (AB).\n* **TPM 2.0** connects via an arrow from **LPC bus**.\n* **4x GPO, 4x GPI** connects from **GPIO PCA9535** to the left side (AB).\n* **GPIO PCA9535** connects to **SMBus**.\n* **GP I2C** connects to the left side (AB) and to **New SEMA BMC**.\n* **1x 10G KR** (two instances) connect via double-headed arrows to the right side (CD).\n* **10G Sideband Signals** connects via a double-headed arrow to the right side (CD).\n* **16 PCIe lanes (Gen3) (port 16-31)** connects via a double-headed arrow to the right side (CD).\n* **1 PCIe lane (Gen2) (port 6)** connects via a double-headed arrow to the right side (CD).\n* **1 PCIe lane (Gen2) (port 7)** connects via a dashed arrow to the right side (CD).\n* **4x USB 3.0 upgrade (port 0/1/2/3)** connects via a double-headed arrow to the right side (CD).\n* **New SEMA BMC** connects to **SPI 0 BIOS**, **SPI 1 BIOS**, and **LM73 Sensor**.\n* **SPI 0 BIOS** and **SPI 1 BIOS** connect via double-headed arrows to the right side (CD).\n* **SPI_CS#** and **SPI** connect to the left side (AB).](.express-bd7-20210923-客戶版/fe4545c6bb3e22ac8de8cc915850f3150ef409753b3920837b04967f03bd5dec.jpg) # Ordering Information ● Express-BD7-D1559 Basic COM Express Type7 module with Intel Broadwell-DE D1559, 12C (eTEMP) ● Express-BD7-D1539 Basic COM Express Type7 module with Intel Broadwell-DE D1539, 8C (eTEMP) Express-BD7-D1519 Basic COM Express Type7 module with Intel Broadwell-DE D1519, 4C (eTEMP) ● Express-BD7-D1577 Basic COM Express Type7 module with Intel Broadwell-DE D1577, 16C ● Express-BD7-D1548 Basic COM Express Type7 module with Intel Broadwell-DE D1548, 8C ● Express-BD7-D1527 Basic COM Express Type7 module with Intel Broadwell-DE D1527, 4C Express-BD7-D1508 Basic COM Express Type7 module with Intel Broadwell-DE D1508, 2C Note: All modules above support SFP+ 10GbE. Supports for 10GBASE-T (Copper) is by project basis. # Starter Kit . COM Express Type 7 Starter Kit Plus Starter kit for COM Express Type 7 Note: Two starter kits are available: one supporting SFP+ and one supporting 10GBASE-T. # Customized information Product information Product name: t2Express-BD7-D1539-cc/YT Part number: 91-72129-442D ● Change History Remove debug connector (PCN 20210818 Rev 1.0) # Accessories # Heat Spreaders ● HTS-BD7-BL Heatspreader for Express-BD7 with threaded standoffs for bottom mounting ● HTS-BD7-BTL Heatspreader for Express-BD7 with through hole standoffs for top mounting # Passive Heatsinks ● THS-BD7-BL Low profile heatsink for Express-BD7 with threaded standoffs for bottom mounting ● THS-BD7-BTL Low profile heatsink for Express-BD7 with through hole standoffs for top mounting THSH-BD7-BL High profile heatsink for Express-BD7 with threaded standoffs for bottom mounting # Active Heatsink ● THSF-BD7-BL High profile heatsink with fan for Express-BD7 with threaded standoffs for bottom mounting [🔗 Link to the original document](.express-bd7-20210923-客戶版/express-bd7-20210923-客戶版.pdf)