# Express-BD7

# COM Express Basic Size Type 7 Module with Intel® Xeon® D and Pentium® D SoC

# Features

● Intel® Xeon® D and Pentium® D SoC (up to 16 cores)
● Up to 32GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)
Two 10G Ethernet and NC-SI support
Up to 32 PCIe lanes (24x Gen3, 8x Gen2)
GbE, two SATA 6 Gb/s, four USB 3.0/2.0
● Supports Smart Embedded Management Agent (SEMA® ) functions
● Extreme Rugged operating temperature: -40°C to +85°C (build option with selected SoC SKU)

# Specifications

# ● Core System

# CPU

Intel® Xeon® D and Pentium® D SoC, 14nm process (formerly”Broadwell-DE”)

Xeon® D1559 1.6/2.1GHz 18MB, 45W (12C) (eTEMP)

Xeon® D1539 1.6/2.2GHz 12MB, 35W (8C) (eTEMP)

Xeon® D1577 1.3/2.1GHz 24MB, 45W (16C)

Xeon® D1548 2.0/2.6GHz 12MB, 45W (8C)

Xeon® D1527 2.2/2.7GHz 6MB, 35W (4C)

Pentium® D1508 2.2/2.6GHz 3MB, 25W (2C)

Pentium® D1519 1.5/2.1GHz 6MB, 25W (4C) (eTEMP)

Note: SKUs not listed above and D1577/D1559 may be supported on a project basis. please contact your ADLINK representative.

Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® TSX-NI, Intel® Platform Protection Technology with Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI

Note: Availability of features may vary between processor SKUs.

#

Dual channel 1867/2133/2400 MHz DDR4 ECC memory up to 32GB in dual SODIMM sockets (dependent on SoC SKU)

Note: Only D1548 support up to 2400 MHz Only D1548 support up to 1866 MHz

# Embedded BIOS

AMI EFI with CMOS backup in 16MB SPI BIOS

# Cache

24MB for D1577

18MB for D1559

12MB for D1548/D1539

6MB for D1527/D1519

3MB for D1508

# Expansion Busses

PCIe x16 or 2 PCIe x8 or 4 PCIe x4 (Gen3)

8 PCIe lanes (Gen3): AB connector, Lanes 8-15

6 PCIe lanes (Gen2): AB connector, Lanes 0/1/2/3/4/5

Up 2 PCIe lanes (Gen2): CD connector, Lanes 6/7

LPC bus, SMBus (system) , I2 C (user)

Note: PCI Express lane 7 support in place of GbE

# SEMA Board Controller

Supports: Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

![Green printed circuit board with integrated circuits and memory chips (no readable text or symbols)](.express-bd7-20230922/6efb9ab28cb45acf34a29d8cd0c664c4602a02e8174ce2cc1bd5a992eb202ee5.jpg)

# Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs

60-pin XDP header for ICE debug of CPU/chipset

# ● 10G Ethernet

# Intel® MAC/Controller

Intel® 10G Ethernet Controller integrated in SoC

# 10G Interface

2x 10GBASE-KR

# 10G Sideband Signals

10G\_INT

10G\_PHY\_MDIO/MDC & SDA/SCL

10G\_PHY\_CAP

10G\_PHY\_RST

10G\_LED\_I2C

10G\_SFP\_I2C

10G\_SDP

# NC-SI

NC-SI supported on AB connector,

connect to GbE controller

# ● Ethernet

Intel® MAC/PHY: Intel® Ethernet Connection i210-LM

Interface: 10/100/1000 GbE connection

# ● Multi I/O and Storage

USB: 4x USB 3.0/2.0 (USB 0, 1, 2, 3)

SATA: 2x SATA 6Gb/s (SATA0,1,2,3)

Serial: 2 UART ports with console redirection

GPIO: 4 GPO and 4 GPI

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

# Specifications

# ● TPM (option)

Chipset: Infineon

Type: TPM 2.0

# ● Power

Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5%

Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/ S4, WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

# ● Operating Systems

# Standard Support

Windows 10 (64-bit)

Windows Server 2012 (64-bit)

Windows 7 (64-bit)

Linux (64-bit)

# Extended Support (BSP)

Linux (64-bit)

# ● Mechanical and Environmental

Form Factor: PICMG COM.0 Rev 3.0 , Type 7

Dimension: Basic size: 125 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -45°C to +85°C (build option, standard voltage only)

Note: Extreme Rugged availability dependent on SoC SKU

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

# Functional Diagram

![**Blocks:**\n*   Intel® Xeon® D Pentium® D 'Broadwell-DE' (Central Block)\n*   SODIMM 1: Up to 2400 MHz 4-16 GB ECC/non-ECC DDR4\n*   SODIMM 2: Up to 2400 MHz 4-16 GB ECC/non-ECC DDR4\n*   Note: Memory frequency dependent on SoC SKU\n*   XDP 60\n*   6 PCIe lanes (Gen2) (port 0-5)\n*   8 PCIe lanes (Gen3) (port 8-15)\n*   2x SATA 6Gb/s (port 0/1)\n*   NC-SI\n*   GbE Controller\n*   4 x USB 2.0 (port 0/1/2/3)\n*   UART0/1\n*   LPC to UART NCT5014D\n*   Debug header\n*   TPM 2.0\n*   LPC bus\n*   SMBus\n*   4x GPO, 4x GPI\n*   GPIO PCA9535\n*   GP I2C\n*   SPI_CS#\n*   SPI\n*   1x 10G KR\n*   10G Sideband Signals\n*   16 PCIe lanes (Gen3) (port 16-31)\n*   1 PCIe lane (Gen2) (port 6)\n*   1 PCIe lane (Gen2) (port 7)\n*   4x USB 3.0 upgrade (port 0/1/2/3)\n*   New SEMA BMC\n*   SPI 0 BIOS\n*   SPI 1 BIOS\n*   LM73 Sensor\n\n**Connections:**\n*   **Memory:** SODIMM 1 and SODIMM 2 connect bidirectionally to the central Intel processor.\n*   **Central Processor to Right Side (CD):**\n    *   Bidirectional connection to XDP 60.\n    *   Unidirectional connections for two instances of '1x 10G KR' and '10G Sideband Signals'.\n    *   Unidirectional connections for '16 PCIe lanes (Gen3) (port 16-31)', '1 PCIe lane (Gen2) (port 6)', and '1 PCIe lane (Gen2) (port 7)' (dashed line).\n    *   Unidirectional connection for '4x USB 3.0 upgrade (port 0/1/2/3)'.\n*   **Central Processor to Left Side (AB):**\n    *   Unidirectional connections for '6 PCIe lanes (Gen2) (port 0-5)' and '8 PCIe lanes (Gen3) (port 8-15)'.\n    *   Bidirectional connection for '2x SATA 6Gb/s (port 0/1)'.\n    *   Unidirectional connection for '4 x USB 2.0 (port 0/1/2/3)'.\n    *   Dashed line labeled 'NC-SI' connects to the 'GbE Controller', which then connects to the AB side.\n    *   Dashed line connects to 'LPC to UART NCT5014D'.\n    *   Labeled 'SMBus' connects to 'GPIO PCA9535' and 'New SEMA BMC'.\n*   **Peripheral Connections:**\n    *   'LPC to UART NCT5014D' connects to 'UART0/1' on the AB side.\n    *   'Debug header' connects via 'LPC bus' to 'LPC to UART NCT5014D' and 'TPM 2.0'.\n    *   'GPIO PCA9535' connects to '4x GPO, 4x GPI' on the AB side.\n    *   'New SEMA BMC' connects to 'SPI 0 BIOS', 'SPI 1 BIOS', and 'LM73 Sensor'.\n    *   'New SEMA BMC' connects via 'GP I2C', 'SPI_CS#', and 'SPI' lines to the AB side.\n    *   'SPI 0 BIOS' and 'SPI 1 BIOS' connect to the CD side.](.express-bd7-20230922/db9f90809ef34988259001465adcbe250f275041c5e9bb6aafee6c15accbd4d8.jpg)

# Ordering Information

● Express-BD7-D1559
Basic COM Express Type7 module with Intel Broadwell-DE D1559, 12C (eTEMP)
● Express-BD7-D1539
Basic COM Express Type7 module with Intel Broadwell-DE D1539, 8C (eTEMP)
Express-BD7-D1519
Basic COM Express Type7 module with Intel Broadwell-DE D1519, 4C (eTEMP)
● Express-BD7-D1577
Basic COM Express Type7 module with Intel Broadwell-DE D1577, 16C
● Express-BD7-D1548
Basic COM Express Type7 module with Intel Broadwell-DE D1548, 8C
● Express-BD7-D1527
Basic COM Express Type7 module with Intel Broadwell-DE D1527, 4C
Express-BD7-D1508
Basic COM Express Type7 module with Intel Broadwell-DE D1508, 2C

Note: All modules above support SFP+ 10GbE. Supports for 10GBASE-T (Copper) is by project basis.

# Starter Kit

. COM Express Type 7 Starter Kit Plus

Starter kit for COM Express Type 7

Note: Two starter kits are available: one supporting SFP+ and one supporting 10GBASE-T.

# Accessories

# Heat Spreaders

● HTS-BD7-BL
Heatspreader for Express-BD7 with threaded standoffs for bottom mounting
● HTS-BD7-BTL
Heatspreader for Express-BD7 with through hole standoffs for top mounting

# Passive Heatsinks

● THS-BD7-BL
Low profile heatsink for Express-BD7 with threaded standoffs for bottom mounting
● THS-BD7-BTL
Low profile heatsink for Express-BD7 with through hole standoffs for top mounting
THSH-BD7-BL
High profile heatsink for Express-BD7 with threaded standoffs for bottom mounting

# Active Heatsink

● THSF-BD7-BL

High profile heatsink with fan for Express-BD7 with threaded standoffs for bottom mounting
[🔗 Link to the original document](.express-bd7-20230922/express-bd7-20230922.pdf)