# Express-BD74 # COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs # Features ● 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU) Intel® Xeon® D SoC (up to 16 cores) Two 10G Ethernet and NC-SI support Up to 32 PCIe lanes (24x Gen3, 8x Gen2) GbE, two SATA 6 Gb/s, four USB 3.0/2.0 ● Supports Smart Embedded Management Agent (SEMA® ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option with selected SoC SKU) # Specifications # ● Core System # CPU Intel® Xeon® D and Pentium® D SoC, 14nm process (formerly”Broadwell-DE”) Xeon® D1559 1.6/2.1GHz 18MB, 45W (12C) (eTEMP) Xeon® D1539 1.6/2.2GHz 12MB, 35W (8C) (eTEMP) Xeon® D1577 1.3/2.1GHz 24MB, 45W (16C) Xeon® D1548 2.0/2.6GHz 12MB, 45W (8C) Note: SKUs not listed above and D1577/D1559 may be supported on a project basis. please contact your ADLINK representative. Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® TSX-NI, Intel® Platform Protection Technology with Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NI Note: Availability of features may vary between processor SKUs. # Memory Dual channel 1867/2133/2400 MHz DDR4 ECC memory in four SODIMM sockets (two on top, two on bottom), up to 128GB (dependent on SoC SKU) Note: Only D1548 supports up to 2400 MHz # Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS # Cache 24MB for D1577 18MB for D1559 12MB for D1548/D1539 # Expansion Busses PCIe x16 or 2 PCIe x8 or 4 PCIe x4 (Gen3) 8 PCIe lanes (Gen3): AB connector, Lanes 8-15 6 PCIe lanes (Gen2): AB connector, Lanes 0/1/2/3/4/5 Up 2 PCIe lanes (Gen2): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2 C (user) Note: PCI Express lane 7 support in place of GbE # SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS, opt. support), watchdog timer and fan control ![Close-up of a green printed circuit board with visible components and gold contacts (no readable text or symbols)](.express-bd74-20220511-special/dc711b61f8a5a167ed06e8d144753f53802066d46d768487014598a27f70acc7.jpg) # Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs # ● 10G Ethernet # Intel® MAC/Controller Intel® 10G Ethernet Controller integrated in SoC # 10G Interface 2x 10GBASE-KR # 10G Sideband Signals 10G\_INT 10G\_PHY\_MDIO/MDC & SDA/SCL 10G\_PHY\_CAP 10G\_PHY\_RST 10G\_LED\_I2C 10G\_SFP\_I2C 10G\_SDP # NC-SI NC-SI supported on AB connector, connect to GbE controller # ● Ethernet Intel® MAC/PHY: Intel® Ethernet Connection i210 Interface: 10/100/1000 GbE connection # ● Multi I/O and Storage USB: 4x USB 3.0/2.0 (USB 0, 1, 2, 3) SATA: 2x SATA 6Gb/s (SATA0,1) Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # Specifications # ● TPM Chipset: Infineon Type: TPM 2.0 # ● Power Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Operating Systems # Standard Support Windows 10 (64-bit) Windows Server 2012 (64-bit) Windows 7 (64-bit) Linux (64-bit) # Extended Support (BSP) Linux (64-bit) # ● Mechanical and Environmental Form Factor: PICMG COM.0 Rev 3.0 , Type 7 Dimension: Basic size: 125 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (build option, standard voltage only) Note: Extreme Rugged availability dependent on SoC SKU # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. # Functional Diagram ![The diagram is a block diagram centered around a processor, showing connections to two vertical bus columns labeled **AB** and **CD**, as well as peripheral blocks.\n\n**Central Component:**\n* **Intel® Xeon® D** (labeled **'Broadwell-DE'**)\n\n**Left Column Connections (to AB):**\n* **Memory:**\n * **SODIMM 1/3** (Up to 2400 MHz, 4-32 GB ECC/non-ECC DDR4, 4-32 GB ECC/non-ECC DDR4) connects to the central processor.\n * **SODIMM 2/4** (Up to 2400 MHz, 4-32 GB ECC/non-ECC DDR4, 4-32 GB ECC/non-ECC DDR4) connects to the central processor.\n * **Note:** **Memory frequency dependent on SoC SKU**.\n* **High-Speed I/O (Bidirectional):**\n * **6 PCIe lanes (Gen2) (port 0-5)**\n * **8 PCIe lanes (Gen3) (port 8-15)**\n * **2x SATA 6Gb/s (port 0/1)**\n * **4 x USB 2.0 (port 0/1/2/3)**\n * **16 PCIe lanes (Gen3) (port 16-31)** (Connects to **CD**)\n * **4x USB 3.0 upgrade (port 0/1/2/3)** (Connects to **CD**)\n* **Network & Management:**\n * **NC-SI** connects to **AB**.\n * **GbE Controller** connects the central processor to **AB**.\n * **1x 10G KR** connects to **CD**.\n * **1x 10G KR** connects to **CD**.\n * **10G Sideband Signals** connects to **CD**.\n* **Low-Speed & Debug:**\n * **UART0/1** connects to **AB**.\n * **LPC to UART NCT5014D** connects the central processor area to the **LPC bus**.\n * **Debug header** connects to the **LPC bus**.\n * **TPM 2.0** connects to the **LPC bus**.\n * **LPC bus** connects **Debug header**, **TPM 2.0**, and **LPC to UART NCT5014D**.\n * **SMBus** connects the central processor to **AB**.\n * **GPIO PCA9535** connects to the **SMBus**.\n * **4x GPO, 4x GPI** connects **GPIO PCA9535** to **AB**.\n * **GP I2C** connects the central processor to **AB**.\n * **SPI_CS#** connects the central processor to **AB**.\n * **SPI** connects the central processor to **AB**.\n* **PCIe Lanes (Unidirectional to CD):**\n * **1 PCIe lane (Gen2) (port 6)**\n * **1 PCIe lane (Gen2) (port 7)** (Dashed line)\n\n**Bottom Right Peripherals:**\n* **New SEMA BMC** connects via a dashed line to the central processor area.\n* **New SEMA BMC** connects to **SPI 0 BIOS**.\n* **New SEMA BMC** connects to **SPI 1 BIOS** (Dashed line).\n* **New SEMA BMC** connects to **LM73 Sensor**.\n* **SPI 0 BIOS** connects to the **SPI** line.\n* **SPI 1 BIOS** connects to the **SPI** line (Dashed connection) and has a dashed output arrow to **CD**.\n* **LM73 Sensor** connects to **New SEMA BMC**.](.express-bd74-20220511-special/7d4e8c3eebc650521d55194599bbaf242ecac1c6024d5bac628bf2d3af7662ee.jpg) # Ordering Information ● Express-BD74-D1559 Basic COM Express Type 7 module with Intel Broadwell-DE D1559, 12 core, at 1.5/2.1GHz, 4 SODIMMs ● Express-BD74-D1539 Basic COM Express Type 7 module with Intel Broadwell-DE D1539, 8 core, at 1.6/2.2GHz, 4 SODIMMs ● Express-BD74-D1577 Basic COM Express Type 7 module with Intel Broadwell-DE D1577, 16 core, at 1.3/2.1GHz, 4 SO-DIMMs Note: All modules above support SFP+ 10GbE. Supports for 10GBASE-T (Copper) is by project basis. # Starter Kit COM Express Type 7 Starter Kit Plus Starter kit for COM Express Type 7 Note: Two starter kits are available: one supporting SFP+ and one supporting 10GBASE-T. # Accessories Heat Spreaders ● HTS-BD7-BL Heatspreader for Express-BD7 with threaded standoffs for bottom mounting ● HTS-BD7-BTL Heatspreader for Express-BD7 with through hole standoffs for top mounting Passive Heatsinks ● THS-BD7-BL Low profile heatsink for Express-BD7 with threaded standoffs for bottom mounting ● THS-BD7-BTL Low profile heatsink for Express-BD7 with through hole standoffs for top mounting THSH-BD7-BL High profile heatsink for Express-BD7 with threaded standoffs for bottom mounting Active Heatsink ● THSF-BD7-BL High profile heatsink with fan for Express-BD7 with threaded standoffs for bottom mounting Note: Express-BD7 and Express-BD74 use the same thermal solutions. 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