# Express-CF/CFE COM Express® Basic Size Type 6 Module with Hexacore Mobile ${ \pmb 8 } ^ { t h }$ Gen Intel® Xeon® and Core™ Processors # Features ● PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core Intel® processors ● Up to 48GB Dual Channel DDR4 at 2133/2400MHz ● Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays ● One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support) ● GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0 ● Supports Smart Embedded Management Agent (SEMA) functions ![Close-up of a green printed circuit board with various electronic components and connectors (no readable text or symbols)](.express-cf-cfe-20230922/b2bddb1baf848b117602ab4ccfaf088e53b8dbee325609cfb8825c7452c940cf.jpg) # Specifications # ● Core System # CPU Mobile 8th Generation Intel Xeon® and Core™ Processors - 14nm process • Xeon® E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2 • Core™ i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2 • Core™ i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2 • Core™ i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2 Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs. # Memory 2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets (Xeon® paired with CM246 supports both ECC and non-ECC memory) (48GB is build support) # Embedded BIOS AMI EFI with CMOS backup in 32MB SPI BIOS with Intel® AMT 12.0 support # Cache 12MB for Xeon®, 9MB for Core™ i7, 8MB for Core™ i5 6MB for Core™ i3 # Chipset • CM246 (supports ECC memory and Intel® AMT) • QM370 (supports Intel® AMT ) • HM370 (no support for Intel® AMT ) # Expansion Busses • PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3) • 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 • 2 PCI Express x1 (Gen3); CD connector, Lane 6/7 • LPC bus, SMBus (system), I2 C (user) # SEMA Board Controller Supports: voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control # Debug Headers • 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs • 60-pin XDP header for ICE debug of CPU/chipset # ● Video # GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs • Hardware encode/transcode HD content (including HEVC 10-bit) • DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support • OpenGL 4.5 support • OpenCL 2.1, 2.0/1.2 support # Digital Display Interface DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp # VGA VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz) # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) # eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) # ● Audio Chipset: Intel® HD Audio integrated in chipset Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported) # ● Ethernet Intel® I219LM/V with AMT 12.0 support (only LM version support AMT) Interface: 10/100/1000 GbE connection # Specifications # Multi I/O and Storage USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design # . ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # ● TPM (option) Chipset: Infineon Type: TPM 2.0 # ● Power Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/ S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Operating Systems # Standard Support Windows® 10 64-bit, Linux 64-bit # Extended Support (BSP) Linux 64-bit # Mechanical and Environmental Form Factor: PICMG COM.0, Rev 3.0 Type 6 Dimension: Basic size: 125 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Storage Temperature: -20°C to 80°C # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Notes: \* All specifications are subject to change without further notice. \* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability. Functional Diagram ![This block diagram illustrates the architecture of a mobile computing system featuring a central processor and chipset.\n\n**Central Blocks**\n* **Mobile New Gen Intel® Xeon® Intel® Core™ Processor** (Top)\n* **Mobile Intel® QM370/HM370/ CM246 Chipset** (Bottom)\n\n**Processor Interconnections**\n* **DMI** (bidirectional arrow) connects the Processor to the Chipset.\n* **SODIMM 1** (2133/2400 MHz 4-16 GB DDR4), **SODIMM 2** (2133/2400 MHz 4-16 GB DDR4), and **SODIMM 3** (2133/2400 MHz 4-16 GB DDR4) connect to the Processor.\n* **XDP 60** connects bidirectionally to the Processor.\n* **DDI 1** (DP/HDMI/DVI), **DDI 2** (DP/HDMI/DVI), and **DDI 3** (DP/HDMI/DVI) connect to the right vertical bar (CD).\n* **PCIe x16 (Gen3)** (1 x16, 2 x8, or 1 x8 + 2 x4) connects to the right vertical bar (CD).\n* **eDP - LVDS** connects via **eDP x2**. It connects to the left vertical bar (AB) via **single/dual 18/24 bit LVDS**.\n* **eDP - VGA** connects via **eDP x2**. A dashed line labeled **AUX** connects towards the left vertical bar (AB).\n\n**Chipset Interconnections**\n* **6x PClex1 (Gen3)** (port 0-5) connects to the left vertical bar (AB).\n* **LAN** (I219 LM/V No GbE_SDP) connects via **PCIe x1**.\n* **4x SATA 6Gb/s** (port 0/1/2/3) connects to the left vertical bar (AB).\n* **8x USB 2.0** connects to the left vertical bar (AB).\n* **HD Audio** connects to the left vertical bar (AB).\n* **Supports Intel® Optane™ Technology & RST on PCIe ports 0-7** connects to the right vertical bar (CD).\n* **2x PCIe x1 (Gen3)** (port 6/7) connects to the right vertical bar (CD).\n* **4x USB 3.1 (port 0/1/2/3)** connects to the right vertical bar (CD).\n* **UART0/1** connects via a block labeled **LPC to UART**.\n* **TPM 2.0** connects via a line labeled **LPC bus**.\n* **SMBus** connects downwards.\n* **GPIO** connects downwards.\n* **SDIO (for SD card)** connects downwards.\n* **SPI 0 BIOS** and **SPI 1 BIOS** connect directly to the Chipset.\n\n**Peripheral & Management Interconnections**\n* **GPIO** connects to **MUX** (4x GPO, 4x GPI). **GPIO SD** connects to the MUX and points to the left vertical bar (AB).\n* **New SEMA BMC** connects via **SMBus** to the Chipset.\n* **New SEMA BMC** connects to **SPI 0 BIOS**, **SPI 1 BIOS**, and **Thermal Sensor**.\n* **GP I2C** and **DDC I2C** connect to the left vertical bar (AB).\n* **SPI_CS#** and **SPI** connect towards the bottom area.](.express-cf-cfe-20230922/a8db6583a2ae38032e715d186d3cd3b0141be92b27e045b0f2bee2e744a0c497.jpg) # Ordering Information ● Express-CFE-E-2176M Basic COM Express Type 6 module with Intel® Xeon® E-2176M (6C/GT2), CM246 chipset, supports ECC/non-ECC ● Express-CF-i7-8850H Basic COM Express Type 6 module with Intel® Core™ i7-8850H (6C/GT2), QM370 chipset ● Express-CF-i5-8400H Basic COM Express Type 6 module with Intel® Core™ i5-8400H (4C/GT2), QM370 chipset ● Express-CF-i3-8100H Basic COM Express Type 6 module with Intel® Core™ i3-8100H (4C/GT2), HM370 chipset # Accessories # Heat Spreaders ● HTS-CF-B Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting ● HTS-CF-BT Heatspreader for Express-CF/CFE with through hole standoffs for top mounting # Passive Heatsinks ● THS-CF-BL Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting ● THS-CF-BTL Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting THSH-CF-BL High profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting # Active Heatsink ● THSF-CF-BL High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting # Starter Kit ● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 [🔗 Link to the original document](.express-cf-cfe-20230922/express-cf-cfe-20230922.pdf)