# Express-CFR COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon® , Core™, Pentium® and Celeron® Processors # Features ● PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors ● Up to 96GB Dual Channel DDR4 at 2133/2400/2666 in up to three SO-DIMM sockets ● Three DDI channels, one LVDS, supports up to 3 independent displays (VGA, eDP by build option) ● One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD & Intel® Optane™ Memory Technology support) ● GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0 ● Supports Smart Embedded Management Agent (SEMA) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs) ![Close-up of a green printed circuit board with visible components and connectors (no readable text or symbols)](.express-cfr-datasheet-20230216/a10383a6c80d7a04d305b22a7a91c308f79e1b8802f69d6bde8aca8ca5e34333.jpg) # Specifications # ● Core System # CPU Mobile 9th Gen Intel® Core™, Intel® Xeon®, Pentium® and Celeron® Processors - 14nm process • Xeon® E-2276ME 45W (35W cTDP), 6C/GT2 • Xeon® E-2276ML 25W, 6C/GT2 • Xeon® E-2254ME 45W (35W cTDP), 4C/GT2 • Xeon® E-2254ML 25W, 4C/GT2 • Core™ i7-9850HE 45W (35W cTDP), 6C/GT2 • Core™ i7-9850HL 25W, 6C/GT2 • Core™ i3-9100HL 25W, 4C/GT2 • Pentium® G5600E 35W, 2C/GT1 • Celeron® G4930E 35W, 2C/GT1 • Celeron® G4932E 25W, 2C/GT1 Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs. # Memory Up to 96GB 2133/2400 MHz DDR4 in three (superscript) SODIMM sockets (Xeon®, Core™ i3, Pentium®, Celeron® paired with CM246 support both ECC and non-ECC memory) \* Three sockets by build option # Embedded BIOS AMI EFI with CMOS backup in 32/16MB SPI BIOS with Intel® AMT 12.0 support # Cache 12MB for Xeon® 6C, 8MB for Xeon® 4C, 9MB for Core™ i7, 6MB for Core™ i3, 4MB for Pentium®, 2MB for Celeron® # Chipset • Mobile Intel® CM246 (supports ECC memory and Intel® AMT) • Mobile Intel® QM370 (supports Intel® AMT ) • Mobile Intel® HM370 (no support for Intel® AMT ) Note: Chipset is formerly Coffee Lake. # Expansion Busses • PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) • 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 • 2 PCI Express x1 (Gen3); CD connector, Lane 6/7 • LPC bus, SMBus (system), I2 C (user) # SEMA Board Controller Supports: voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2 C, failsafe BIOS (dual BIOS ), watchdog timer and fan control # Debug Headers • 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs • 60-pin XDP header for ICE debug of CPU/chipset (optional) # Specifications # ● Video # GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS or eDP outputs • Hardware encode/transcode HD content (including HEVC 10-bit) • DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10,DirectX 9 support • OpenGL 4.5 support • OpenCL 2.1, 2.0/1.2 support # Digital Display Interface DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp # VGA VGA support, in place of DDI3 channel (build option, max. resolution 1920x1200@60Hz) # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) # eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) # ● Audio Chipset: Intel® HD Audio integrated in chipset Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported) # ● Ethernet Intel® I219LM/V with AMT 12.0 support (only LM version support AMT) Interface: 10/100/1000 GbE connection # Multi I/O and Storage USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7) SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt) SD/GPIO muxed design, switched by BIOS setting SD functions as storage device only Note: USB 3.1 Gen2 support dependent on carrier design Notes: \* All specifications are subject to change without further notice. \* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability. # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # ● TPM (option) Chipset: Infineon Type: TPM 2.0 # ● Power Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/ S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Operating Systems # Standard Support Windows® 10 64-bit, Linux 64-bit # Extended Support (BSP) Linux 64-bit # ● Mechanical and Environmental Form Factor: PICMG COM.0, Rev 3.0 Type 6 Dimension: Basic size: 125 mm x 95 mm # Operating Temperature Standard:0°C to 60°C (storage: -20°C to 80°C) Extreme Rugged: -40°C to +85°C (build option for selected SKUs; storage: -40°C to +85°C) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Functional Diagram ![The flowchart depicts a system architecture centered around a processor and a chipset, with connections to memory, peripherals, and management components.\n\n**Central Components:**\n* **Top Block:** 'Mobile 9th Gen Intel® Core™ Intel® Xeon® Intel® Pentium® Intel® Celeron® Processor'\n* **Bottom Block:** 'Mobile Intel® QM370/HM370/ CM246 Chipset'\n* **Interconnection:** A double-headed arrow labeled 'DMI' connects the Processor to the Chipset.\n\n**Processor Connections:**\n* **Memory:** Connected to 'SODIMM 1' ('2133/2400 MHz DDR4'), 'SODIMM 2' ('2133/2400 MHz DDR4'), and 'SODIMM 3' ('2133/2400 MHz DDR4' via a dashed line).\n* **Video/Display Interfaces:**\n * 'eDP - LVDS' (labeled 'single/dual 18/24 bit LVDS').\n * 'eDP - VGA' (labeled 'eDP x2').\n * 'XDP 60' (Double arrow connection).\n * 'DDI 1' (labeled 'DP/HDMI/DVI').\n * 'DDI 2' (labeled 'DP/HDMI/DVI').\n * 'DDI 3' (labeled 'DP/HDMI/DVI').\n * 'PCIe x16 (Gen3)' (labeled '1 x16, 2 x8, or 1 x8 + 2 x4').\n* **Other:** Dashed lines labeled 'eDP x2' and 'AUX' (connecting to eDP - VGA).\n\n**Chipset Connections:**\n* **Left Side (Inputs/Peripherals):**\n * '6x PClex1 (Gen3) (port 0-5)'.\n * 'LAN I219 LM/V No GbE_SDP' (via 'PCIe x1').\n * '4x SATA 6Gb/s (port 0/1/2/3)'.\n * '8x USB 2.0'.\n * 'HD Audio'.\n * 'UART0/1' (via 'LPC to UART').\n * 'TPM 2.0 option' (via 'LPC bus').\n * 'SMBus'.\n * 'GPIO' (via 'SDIO (for SD card)').\n * 'MUX' (labeled '4x GPO, 4x GPI') connected via 'GPIO SD'.\n* **Right Side (Outputs):**\n * 'Supports Intel® Optane™ Technology & RST on PCIe ports 0-7' (labeled '2x PCIe x1 (Gen3) (port 6/7)').\n * '4x USB 3.0 (port 0/1/2/3)'.\n\n**Bottom/Management Subsystem:**\n* **BMC:** 'New SEMA BMC' connected via 'SMBus'.\n* **BIOS/Sensors:** 'SPI 0 BIOS', 'SPI 1 BIOS', and 'Thermal Sensor' are connected via 'SPI'.\n* **Bus Lines:** Lines extending to the left edge labeled 'GP I2C', 'DDC I2C', 'SPI_CS#', and 'SPI'.](.express-cfr-datasheet-20230216/511238e1525e96e9a1d965b0450d16e416f3723a2e8530f5373b25e3acefdb08.jpg) # Ordering Information # ● Express-CFR-i7-9850HE Basic size COM Express Type 6 module with 9th Gen Intel® Core™ i7-9850HE hexa-core processor at 2.7/4.4GHz with QM370 Chipset, 3 SO-DIMM # ● Express-CFR-i7-9850HL Basic size COM Express Type 6 module with 9th Gen Intel® Core™ i7-9850HL hexa-core processor at 1.9/4.1GHz with QM370 Chipset, 3 SO-DIMM # ● Express-CFR-i3-9100HL Basic size COM Express Type 6 module with 9th Gen Intel® Core™ i3-9100HL quad-core processor at 1.6/2.9GHz with HM370 Chipset, 2 SO-DIMM # ● Express-CFR-E-2276ME Basic size COM Express Type 6 module with Intel® Xeon® E-2276ME hexa-core processor at 2.8/4.5GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support # ● Express-CFR-E-2254ME Basic size COM Express Type 6 module with Intel® Xeon® E-2254ME quad core processor at 2.6/3.8GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support # ● Express-CFR-E-2276ML Basic size COM Express Type 6 module with Intel® Xeon® E-2276ML hexa-core processor at 2.0/4.2GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support # Express-CFR-E-2254ML Basic size COM Express Type 6 module with Intel® Xeon® E-2254ML quad-core processor at 1.7/3.5GHz with CM246 Chipset, 3 SO-DIMM with ECC/non-ECC support # Express-CFR-G5600E Basic size COM Express Type 6 module with Intel® Pentium® G5600E dual-core processor at 2.6/3.1GHz with HM370 Chipset, 2 SO-DIMM # Express-CFR-G4930E Basic size COM Express Type 6 module with Intel® Celeron® G4930E dual-core processor at 2.4GHz with HM370 Chipset, 2 SO-DIMM SKUs not listed above can be supported by project basis. Please contact your local ADLINK representative. # Accessories \* Express-CF and Express-CFR share the same thermal solution # Heat Spreaders # ● HTS-CF-B Heatspreader for Express-CF/CFE with threaded standoffs for bottom mounting # ● HTS-CF-BT Heatspreader for Express-CF/CFE with through hole standoffs for top mounting # Passive Heatsinks # ● THS-CF-BL Low profile heatsink for Express-CF/CFE with threaded standoffs for bottom mounting # ● THS-CF-BT Low profile heatsink for Express-CF/CFE with through hole standoffs for top mounting # ● THSH-CF-BL High profile heatsink for Express-CF/CFE with threaded standoffs for top mounting # Active Heatsink # ● THSF-CF-BL High profile heatsink with Fan for Express-CF/CFE with threaded standoffs for bottom mounting # Starter Kit ● COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6 [🔗 Link to the original document](.express-cfr-datasheet-20230216/express-cfr-datasheet-20230216.pdf)