# Express-ID7/R

# COM Express Basic Size Type 7 Module with New Gen Intel® Xeon® D SoC

# Features

● AVX-512 VNNI for AI inference, data analysis
● Up to 128GB DDR4 SO-DIMM 2933MT/s
● 4x 10G Ethernet and NC-SI support
● 16 PCIe Gen4 lanes and 16 PCIe Gen3 lanes
● 10+ year product availibility
● Extreme Rugged operating temperature: -40°C to 85° C (build option, selected SKUs)

# Specifications

# . Core System

# CPU

New Gen Intel® Xeon® D-1700 processor (formerly “Ice Lake-D LCC”)

Xeon(R) D-1848TER 2.0/3.1GHz 15MB, 57W (10C, eTEMP)

Xeon(R) D-1813NT 2.2/2.4GHz 10MB, 42W (4C)

Xeon® D-1746TER 2.0/3.1GHz 15MB, 67W (10C, eTEMP)

Xeon® D-1735TR 2.2/3.4GHz 15MB, 59W (8C)

Xeon® D-1732TE 1.9/3.0GHz 15MB, 52W (8C, eTEMP)

Xeon® D-1715TER 2.4/3.5GHz 10MB, 45W (4C, eTEMP)

Xeon® D-1712TR 2.0/3.1GHz 18MB, 40W (4C)

Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT

Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost

Technology 2.0, Intel® AVX-512, Intel® AVX2, Intel® AES-NI, PCLMULQDQ

Instruction, Intel® Secure Key and Intel TSX-NI.

Note: Availability of features may vary between processor SKUs.

Note: Additional 7 year availibility SKUs with QAT feature are supported by project basis.

Please contact your ADLINK representative

# Memory

3-channel up to 2933 MT/s ECC/non-ECC DDR4 memory, up to 128GB in

four SODIMM sockets (Xeon® D-1800)

2-channel up to 2933 MT/s ECC/non-ECC DDR4 memory, up to 96GB in three SO-DIMM sockets (Xeon® D-1800)

Xeon® D-1848TER/D-1746TER/D-1732TE/D-1715TER: max. 2667MT/s Xeon®

D-1735TE: max. 2933MT/s

Xeon® D-1813NT/D-1712TR: max. 2400MT/s

Note: It is recommended to check that the bottom side specifications are suitable for your application purposes.

# Embedded BIOS

AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS by build option)

# Cache

Xeon® D-1848TER/D-1746TER/D-1735TR/D-1732TE: 15MB

Xeon® D-1813NT/D-1715TER/D-1712TR: 10MB

# Expansion Busses

• 16 PCI Express Gen4: Lanes 16-31 (configurable to one x16, two x8, four x4)
• 8 PCI Express Gen3: Lanes 0-7 (configurable to one x8, two x4, four x2)
• 8 PCI Express Gen3: Lanes 8-15 (configurable to one x8, two x4, four x2)
• LPC bus (through an ESPI to LPC bridge IC), SMBus (system) , I2 C (user)

# SEMA Board Controller

Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)

![Close-up of a green computer motherboard with visible CPU socket and connectors (no text or symbols)](.express-id7-r-datasheet-260114/76548c8229a8e69e40027d082d746e79c318ba825a203ab697f479185c22dba9.jpg)

● Debug Headers
30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs

● 10G Ethernet

Intel® MAC/Controller

Intel®10G Ethernet controller integrated in SoC

# Interface

4x 10GBASE-KR and its sideband signals

● Ethernet

Intel® MAC/Controller

Intel Ethernet controller I210 series

# Interface

1000/100/10 GbE connection

# NC-SI

connect to GbE controller

● Multi I/O and Storage

# USB

4x USB 3.x/2.0/1.1 (USB 0,1,2,3)

# SATA

2x SATA 6Gb/s (SATA 0,1)

# Serial

2x UART ports with console redirection

# GPIO/SD

4x GPO and 4x GPI from EC (GPI with interrupt TBC)

● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis)

● TPM (2.0)

# Chipset

Infineon

SPI based

# Specifications

# ● Power

# Standard Input

ATX: 12V+/-5% / 5Vsb +/-5% (TBC); or AT: 12V±5%

# Management

ACPI 5.0 compliant

# Power States

C1-C6, S0, S5 , S5 ECO mode

# ECO mode

support deep S5 mode for power saving

# ● Mechanical and Environmental

# Form Factor

PICMG COM.0: Rev 3.0 Type 7

# Dimension

Basic size: 125 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C (Storage: -20°C to 80°C)

Extreme Rugged: -40°C to 85°C (build option, selected SKUs) (Storage: -40°C

to 85°C) (TBC)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are supported by project bassis. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times

# ● Operating Systems

# Standard Support

Windows Server, Windows® 10 IoT Enterprise LTSC, Yocto Linux, VxWorks (TBC)

# Extended Support (BSP)

Yocto project based Linux

Functional Diagram
![This block diagram illustrates the connectivity of the **New Generation Intel® Xeon® D SoC (formerly “Ice Lake-D”) LCC Family**.\n\n**Central Block:**\nThe core component is the large central block labeled **New Generation Intel® Xeon® D SoC (formerly “Ice Lake-D”) LCC Family**.\n\n**Peripheral Connections:**\n\n*   **PCIe Interfaces:**\n    *   **PCIe Lane 4-5** connects to **x8, x4, x2 Gen3**.\n    *   **PCIe Lane 0-3** connects to **PCIe x16 Gen4**.\n    *   **PCIe Lane 8-15** connects to **PCIe Gen3**.\n    *   **PCIe Lane 6-7** connects to **Gen4 1 x16, 2 x8, 4 x4**.\n    *   **PCIe Lane 16-31** connects to **PCIe x16 Gen4**.\n\n*   **Network and Storage:**\n    *   **SATA Port 0-1** and **USB 2.0 Lane 0-3** connect to **GbE NC-SI***.\n    *   **GbE NC-SI*** connects to **I210 (I211 opt.)**. A note specifies **(I211 has no NC-SI)**.\n    *   **NC-SI** is also labeled on the SoC itself.\n\n*   **Control and Bus Interfaces (Left Side):**\n    *   **SPI** connects to **TPM** and **BIOS**.\n    *   **SMBus** connects to a block labeled **Mux**.\n    *   **I2C** connects to **Mux**.\n    *   **8x GPIO**, **UART**, and **LPC/eSPI** connect to the **Embedded Controller**.\n\n*   **Memory and Thermal (Bottom/Right Side):**\n    *   **CHA** connects to **SODIMM (top side, 9.2mm)** and **SODIMM (bottom side, 8mm)**.\n    *   **CHB** connects to **SODIMM (bottom side, 4mm)**.\n    *   **CHC** connects to **SODIMM (top side, 5.2mm)**.\n    *   **Thermal Sensor (SoC)** and **Thermal Sensor (board)** connect to the **Embedded Controller**.\n\n*   **10GbE and USB (Right Side):**\n    *   **USB 3.0 Lane 0-3** connects to **Max. 5Gbit/s per lane**.\n    *   A vertical block labeled **CEI** is situated on the right edge.\n    *   The following 10G interfaces connect to the right side of the SoC/CEI area: **10G_KR 0-1**, **10G_KR 2-3**, **10G_PHY_MDIO/I2C 0**, **10G_SDP 0-3**, **10G_INT 0**, **10G_SFP_I2C 0**, **10G_LED_I2C**, **10G_PHY_RST_01**, and **10G_PHY_CAP_01 (ETH0-3_PRSNT#)**.\n\n*   **Embedded Controller (Bottom Center):**\n    *   **LPC/eSPI** (from the SoC bottom) and **HSUART** (from the SoC bottom) connect to the **Embedded Controller**.\n    *   **SMBus** (from the SoC bottom) connects to the **Mux**.](.express-id7-r-datasheet-260114/f6cb582649a86522ef21fc62ad9056ef93dfc783c93b7b29cd333337694cc6e4.jpg)

Additional PCIe x1 at Lane 1, Lane 5 is supported by project basis
Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are supported by project bassis. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times

# Ordering Information

● Express-ID7-D-1848TER
Basic size COM Express Type7 module with Intel® Xeon® D-1848TER, 10C, 3 SO-DIMMs
Express-ID7-D-1746TER
Basic size COM Express Type7 module with Intel® Xeon® D-1746TER, 10C, 3 SO-DIMMs
● Express-ID7-D-1735TR
Basic size COM Express Type7 module with Intel® Xeon® D-1735TR, 8C, 3 SO-DIMMs
Express-ID7-D-1732TE
Basic size COM Express Type7 module with Intel® Xeon® D-1732TE, 8C, 3 SO-DIMMs
● Express-ID7-D-1715TER
Basic size COM Express Type7 module with Intel® Xeon® D-1715TER, 4C, 3 SO-DIMMs
● Express-ID7-D-1712TR
Basic size COM Express Type7 module with Intel® Xeon® D-1712TR, 4C, 3 SO-DIMMs

For processor SKUs not listed, please contact your ADLINK representative for availability.

# Starter Kit

COM Express Type 7 Starter Kit Plus Specific

Starter kit for COM Express Type 7

For PCIe Gen4 specific version, please contact your local ADLINK representative.

Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are supported by project bassis. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times

# Accessories

# Heat Spreaders

● HTS-ID7-B
Heatspreader for Express-ID7 with threaded standoffs for bottom mounting
● HTS-ID7-BT
Heatspreader for Express-ID7 with through hole standoffs for top mounting

# Passive Heatsinks

● THS-ID7-B
Low profile heatsink for Express-ID7 with threaded standoffs for bottom mounting
● THS-ID7-BT
Low profile heatsink for Express-ID7 with through hole standoffs for top mounting
THSH-ID7-B
High profile heatsink for Express-ID7 with threaded standoffs for bottom mounting

# Active Heatsink

● THSF-ID7-B

High profile heatsink with Fan for Express-ID7 with threaded standoffs for bottom mounting
[🔗 Link to the original document](.express-id7-r-datasheet-260114/express-id7-r-datasheet-260114.pdf)