# Express-KL2 COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® , and Core™ Processors # Features ● PICMG COM.0 Type 2 compliant module with mainstream processor ● Dual channel DDR4 ECC/non-ECC memory in dual stacked SODIMM sockets ● Single/dual channel 18/24-bit LVDS and VGA ● Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel) ● Three SATA, one PATA, eight USB 2.0 and GbE ● Extreme Rugged operating temperature: -40°C to +85°C (selected SKUs) # Specifications # ● Core System # CPU Mobile 7th Generation Intel® Xeon®, and Core™ Processors - 14nm (formerly”Kaby Lake-H”) • Xeon® E3-1505M v6 3.0/4.0GHz (Turbo), 45W(35W cTDP) (4C/GT2) • Xeon® E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2) • Core™ i7-7820EQ 3.0/3.7GHz (Turbo), 45W(35W cTDP) (4C/GT2) • Core™ i5-7440EQ 2.9/3.6GHz (Turbo), 45W(35W cTDP) (4C/GT2) • Core™ i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2) • Core™ i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2) • Core™ i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key, Intel® TSXNI Note: Availability of features may vary between processor SKUs. # Memory 2400 MHz DDR4 memory in dual stacked SODIMM sockets Note: Xeon® with CM236 supports both ECC and non-ECC memory (Core™ i3 available with MOQ) # Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11 support (depends on CPU/PCH) # Cache 8MB for Xeon®/Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3 and 2MB for Celeron® # PCH CM238 (supports ECC and non-ECC memory and Intel® AMT) QM175 (supports Intel® AMT ) HM175 (no Intel® AMT support) # Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3, muxed with DDI channel, build option) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5, supports x4, x2, x1 configurations 1 PCI bus LPC bus, SMBus (system) , I2 C (user) # SEMA Board Controller Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control ![Close-up of a green printed circuit board with multiple integrated circuits and connectors (no readable text or symbols)](.express-kl2-20230922/b01b299334b9a17c29fcd69afdda83d8eb9117ff500822de0878c807c86db2dc.jpg) # Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs # ● Video # GPU Feature Support Intel® Generation 9 Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of VGA, LVDS (or optional eDP), optional DisplayPort/HDMI outputs (DisplayPort/HDMI from DDI channel muxed with PEG port) • Encode/transcode HD content • Playback of high definition content including Blu-ray Disc • Playback of Blu-ray Disc 3D content using HDMI (1.4a spec compliant with 3D) • DirectX Video Acceleration (DXVA) support for accelerated video processing • HEVC/H.265, H.264, M/JPEG, MPEG2, VC1, WMV9, VP8/VP9 HW decode • HEVC/H.265, M/JPEG, MPEG2 HW encode • Advanced Scheduler 2.0, 1.0, XPDM support • DirectX 12, DirectX 11.3, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support • OpenGL up to 4.4, OpenCL up to 2.1 support # Digital Display Interface DDI1/2 are muxed with PEG port, build option feature, supporting DisplayPort 1.2, HDMI 1.4, DVI Notes: DP1.2: max. resolution 4096x2304 @ 60Hz, 24bpp HDMI 1.4: max. resolution 4096x2160 @ 24Hz, 24bpp # VGA VGA support from DP-to-VGA IC # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode) # eDP 4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp) # Specifications # ● Audio Chipset Intel® HD Audio integrated in chipset Audio Codec Located on carrier Express-BASE # ● Ethernet Integrated MAC MAC integrated in QM170/HM170/CM236 Chipset Intel® PHY Intel® I219LM/V with AMT 11.0 support (only LM version supports AMT) Interface 10/100/1000 GbE connection # ● Multi I/O and Storage USB: 8x USB 2.0 (USB 0-7) SATA: 3x SATA 6Gb/s (SATA 0,1,2) Max. 4x SATA without PATA feature, build option IDE (PATA): SATA-to-PATA IC on SATA port 3, Master only GPIO/SD: 4x GPO and 4x GPI (GPI with interrupt) # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # ● TPM (option) Chipset: Infineon Type: TPM 2.0 # ● Power Standard Input: ATX 12V±5% / 5Vsb ±5% or AT 12V±5% Wide Input: ATX 8.5-20 V / 5Vsb ±5% or AT 8.5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Mechanical and Environmental Form Factor: PICMG COM.0, Rev 2.1 Type 2 Dimension: Basic size: 125 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Extreme Rugged: -40°C to 85°C (selected SKUs, by project basis) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating Systems # Standard Support Windows 10 (64-bit), Linux (64-bit), VxWorks # Extended Support (BSP) Linux 64-bit, VxWorks Functional Diagram ![The diagram illustrates a system architecture with two main processing blocks (Processor and Chipset) and various peripheral connections, organized into columns labeled **AB** and **CD**.\n\n**Labeled Blocks:**\n* **SODIMM 1 1866/2133 MHz DDR4**\n* **SODIMM 2 1866/2133 MHz DDR4**\n* **Mobile 7th Gen Intel® Xeon® Intel® Core™ Intel® Celeron® Processor**\n* **eDP - LVDS**\n* **DP-to-VGA**\n* **Switch PEG or DDI**\n* **Mobile Intel® Kaby Lake Chipset QM175/HM175/ CM238**\n* **LAN i219 LM/V**\n* **TPM 2.0**\n* **GPIO**\n* **PCIe-to-PCI**\n* **SATA-to-PATA**\n* **New SEMA BMC**\n* **SPI 0 BIOS**\n* **SPI 1 BIOS**\n* **Thermal Sensor**\n\n**Connections:**\n* The **Processor** connects to **SODIMM 1** and **SODIMM 2**.\n* The **Processor** connects to **eDP - LVDS** (via lines labeled 'eDP x4', 'single/dual 18/24 bit LVDS', and 'eDP x2').\n* The **Processor** connects to **DP-to-VGA** (via a line labeled 'VGA').\n* The **Processor** connects to the **Switch** via lines labeled 'PCIe x16 (Gen3) 1 x16, 2 x8, or 1 x8 + 2 x4', 'DDI 1 DP/HDMI/DVI', and 'DDI 2 DP/HDMI/DVI'.\n* The **Processor** connects to the **Chipset** via a double-headed arrow labeled 'DMI'.\n* The **Switch** connects to the **CD** column via a line labeled 'PEG or DDI 1 DDI 2'.\n* The **Chipset** connects to the **AB** column via lines labeled '6x PCIe x1 (Gen3) (port 0-5)', 'LAN' (via 'PCIe x1'), '3x SATA 6Gb/s (port 0/1/2)', '1x SATA 6Gb/s (port 3)' (dashed line), '8x USB 2.0', 'HD Audio', 'LPC bus' (to TPM), 'SMBus', 'GPIO', '4GPI, 4GPO', 'GP I2C', 'DDC I2C', 'SPI_CS#', and 'SPI'.\n* The **Chipset** connects to **PCIe-to-PCI** via 'PCIe', which then connects to the **CD** column via 'PCI'.\n* The **Chipset** connects to **SATA-to-PATA** via 'SATA', which then connects to the **CD** column via 'PATA'.\n* The **New SEMA BMC** connects to the **Chipset** via 'SMBus'.\n* The **New SEMA BMC** connects to **SPI 0 BIOS** and **SPI 1 BIOS**.\n* The **New SEMA BMC** connects to the **Thermal Sensor**.\n* **SPI 0 BIOS** and **SPI 1 BIOS** connect to the **CD** column.](.express-kl2-20230922/3a45db332f69ae332cd06cdc68a5285afa1d587f1ba84dbf36813a7e34e8bcd8.jpg) # Ordering Information ● Express-KL2-i7-7820EQ Basic Size COM Express® Type 2 module with Intel® Core™ i7- 7820EQ and GT2 level graphics, QM175 chipset ● Express-KL2-i5-7440EQ Basic Size COM Express® Type 2 module with Intel® Core™ i5- 7440EQ and GT2 level graphics, QM175 chipset ● Express-KL2-i3-7100E Basic Size COM Express® Type 2 module with Intel® Core™ i3- 7100E and GT2 level graphics, HM175 chipset # Accessories # Heat Spreaders ● HTS-SL2-B Heatspreader for Express-SL2 with threaded standoffs for bottom mounting # Passive Heatsinks ● THS-SL2-B Low profile heatsink for Express-SL2 with threaded standoffs for bottom mounting ● THSH-SL2-B High profile heatsink for Express-SL2 with threaded standoffs for bottom mounting # Active Heatsink ● THSF-SL2-B High profile heatsink for Express-SL2 with threaded standoffs for top mounting Notes: Express-SL2, Express-KL2 share the same thermal solutions # Starter Kit # COM Express Type 2 ● Starter Kit Plus Starter kit for COM Express Type 2 Notes: \* All specifications are subject to change without further notice. \* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability. [🔗 Link to the original document](.express-kl2-20230922/express-kl2-20230922.pdf)