# Express-PTL

COM Express COM R3.1 Type 6 Module based on Intel® Panther Lake-H Platform

![Preliminary\nCOW\nADLINK](.express-ptl-prelim-datasheet-20251231/5b4880e2bc089b62b99cc9f363467c94f453736a24439a62ea508ce01e248db4.jpg)

# Features

• New NPU provide 50 TOPS AI performance
• Xe3 Intel GPU up to 1.5x improvement over the last generation
• Up to 128GB DDR5 SO-DIMM, IBECC

• Up to 4x SATA gen3 ports
• Built-in one MIPI-CSI connector
• Extreme rugged operating temperature (selected SKUs)

Specifications

<table><tr><td rowspan="11">Core System</td><td rowspan="7">SoC</td><td colspan="5">Intel® CoreTM Ultra Series 3 processors (Panther Lake-H)</td></tr><tr><td>Processor</td><td>Cores/Threads</td><td>Cache</td><td>TDP</td><td>Graphics</td></tr><tr><td>CoreTM Ultra 7 368H</td><td>4P+8E+4LPE</td><td>18MB</td><td>25W(15-65W cTDP)</td><td>12 Xe3</td></tr><tr><td>CoreTM Ultra 7 356H</td><td>4P+8E+4LPE</td><td>18MB</td><td>25W(15-65W cTDP)</td><td>4 Xe3</td></tr><tr><td>CoreTM Ultra 5 336H</td><td>4P+4E+4LPE</td><td>18MB</td><td>25W(15-65W cTDP)</td><td>4 Xe3</td></tr><tr><td colspan="5">1. Panther Lake supports Embedded and Industrial SKUs.2. Some processor SKUs are supported by project basis only. Please see the user&#x27;s manual for details.</td></tr><tr><td colspan="5">Supports: Intel® VT (including VT-x, VT-d, VT-x with Extended Page Tables), Intel® HT Technology, Intel® SSE4.2, Intel® 64 Architecture, Intel® Turbo Boost Technology 3.0, Intel® AVX512-VNNI, Intel® TXT, Execute Disable Bit, Intel® Data Protection Technology with Intel® Secure Key, Intel® AES-NINote: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td colspan="5">Up to 128GB (2x 64GB) DDR5, IBECC (selected SKUs), SO-DIMM memory, max. 7200MHz2 memory channels with 1DPC design</td></tr><tr><td>Embedded BIOS</td><td colspan="5">AMI UEFI with CMOS backup in 32 SPI BIOS (dual BIOS opt.)</td></tr><tr><td>Cache</td><td colspan="5">Ultra 7 368H/ 7 356H/ 5 336H 18MB(Other SKUs will be updated after Intel releases information.)</td></tr><tr><td>Expansion Busses</td><td colspan="5">PCIe x8 Gen4, lanes 16-23, available for H484 and H404 ET</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="3"></td><td>Expansion Busses</td><td>8 PCIe x1 Gen4: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5/6/7 (Configurable to x1, x2, x4. Port 7 and GbE function can be selected via BIOS settings)LPC bus (via ESPI-to-LPC bridge IC), SMBus (system),  $I^{2}C$  (user), GP_SPI(TBC)</td></tr><tr><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose  $I^{2}C$ , UART, GPIO, watchdog timer, fan control</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing,power testpoints, debug LEDs</td></tr><tr><td rowspan="6">Video</td><td>GPU Feature Support</td><td>Intel® Xe3 Graphics Core Architecture, max. 196EUs, supporting 4 concurrent display. Supports display resolutions of up to 8K60 for a single output and 6K60 for four simultaneous displays.Hardware Codecs decode VVC 8K60 8/10-bit 420 and AVC 4K60 8/10-bit 420/422Encode AVI/VP8 8K30 10-bit 420/422/444DirectX 12, OpenGL 4.6Graphics Hardware Virtualization (SRIOV)</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP 2.1, HDMI 2.1, DVI</td></tr><tr><td>VGA</td><td>Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.4b</td></tr><tr><td>USB4</td><td>Max. 2x USB4 in place of DDI 1/2, supports DP 2.1 by DP alternative mode, Thunderbolt 4 capable (TBC)Requires BIOS code modification by project basis, re-timer with PD on carrier</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On the carrier Express-BASE6 R3.1 (ALC888 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (I226-IT supports TSN by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connectionGbE0_SDP if TSN support enabled (TBC)</td></tr><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)4x SATA 6Gb/s (SATA 0-3)Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC)</td></tr><tr><td>On-board Storage</td><td>NVMe SSD in place of SATA 0-3 (build option, project basis)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>8x GPIO (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 125 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C)(Build option, selected SKUs, TBC)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 11 IoT Enterprise LTSC 2024, Ubuntu 2024 64-bit, Yocto project-based Linux 64-bit (TBC)</td></tr></table>

Ordering Information

<table><tr><td colspan="2">Starter Kit</td></tr><tr><td colspan="2">COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6</td></tr><tr><td colspan="2">Module</td></tr><tr><td>Express-PTL-368H</td><td>Basic COM Express Type 6 module with Panther Lake Ultra 7 368H 16 core, Intel 12 core Xe graphics</td></tr><tr><td>Express-PTL-358H</td><td>Basic COM Express Type 6 module with Panther Lake Ultra 7 358H 16 core, Intel 4 core Xe graphics</td></tr><tr><td>Express-PTL-336H</td><td>Basic COM Express Type 6 module with Panther Lake Ultra 5 336H 12 core, Intel 4 core Xe graphics</td></tr></table>

Note:
1. Special SKUs support Embedded and Industrial SKUs.
2. Some processor SKUs are supported by project basis only. Please see the user's manual for details or consult an ADLINK representative.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-PTL-B</td><td>Heatspreader for Express-PTL with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-PTL-BT</td><td>Heatspreader for Express-PTL with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-PTL-B</td><td>Low-profile Heatsink for Express-PTL with threaded standoffs for bottom mounting</td></tr><tr><td>THS-PTL-BT</td><td>Low-profile Heatsink for Express-PTL with through-hole standoffs for top mounting</td></tr><tr><td>THSH-PTL-B</td><td>High-profile Heatsink for Express-PTL with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-PTL-B</td><td>High-profile Heatsink with Fan for Express-PTL with threaded standoffs for bottom mounting</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

![The diagram illustrates the block diagram for the **Intel® Core™ Ultra Processor Series 3 (Panther Lake H)**.\n\n**Central Processor Block**\n*   The central red block is labeled **Intel® Core™ Ultra Processor Series 3** with **(Panther Lake H)** below it.\n\n**Left Side Connections (Inputs & Components)**\n*   **Memory:** Two blocks labeled **DDR5 SODIMM max. 7200MT/s 8-64GB, non-ECC/IB ECC** connect directly to the processor.\n*   **Display:**\n    *   **eDP/LVDS** connects to a block labeled **eDP to LVDS**, which connects to **DDI A** on the processor. A dashed box labeled **eDP x4** is nearby.\n    *   **VGA** connects to a dashed box labeled **DP to VGA**, which connects to **DDI A**. A dashed line extends from this area across to **TCP 2** on the processor's right side.\n*   **LAN/USB:**\n    *   **USB 2.0 Lane 0-7** connects to **HSIO 10**.\n    *   **Max. 2.5GbE** connects to a block labeled **LAN chip i226**, which connects to **HSIO 10**. A dashed line connects the LAN chip to **PCIe Lane 0-3**.\n*   **PCIe/SATA:**\n    *   **PCIe Lane 0-3** connects to **HSIO 3-6**.\n    *   **PCIe Lane 4-5** connects to **HSIO 7-8**.\n    *   **SATA 0-3** connects to a block labeled **PCIE-to-SATA**, which connects to **HSIO 11-12**. A dashed line connects this block to a dashed box labeled **NVMe BGA SSD**.\n    *   The **NVMe BGA SSD** connects via **x4** to **HSIO 13-14**.\n*   **Embedded/Bus Interfaces:**\n    *   **HDA** and **GP_SPI** have lines extending downward toward the Embedded Controller.\n    *   **SPI** connects to two blocks labeled **BIOS Flash** (one solid, one dashed).\n    *   **SMBus** connects to **TPM 2.0**.\n    *   **I2C** connects to the processor (labeled **I2C** and **2x HSUART**) and the Embedded Controller below.\n    *   **8xGPIO**, **2xUART**, and **LPC** connect to the Embedded Controller below.\n\n**Right Side Connections (Outputs & Ports)**\n*   **TCP 0** connects to **DDI/USB4 Port 1**.\n*   **TCP 1** connects to **DDI/USB4 Port 2**.\n*   **TCP 2** connects to **DDI only Port 3**.\n*   **HSIO 1** connects to **USB 3.x Lane 0**.\n*   **HSIO 2** connects to **USB 3.x Lane 1**.\n*   **TCP 3** connects to a block labeled **USB hub**, which connects to **USB 3.x Lane 2** and **USB 3.x Lane 3**.\n*   **HSIO 9** connects to **PCIe Lane 6** and **PCIe Lane 7**.\n*   **HSIO 15-22** connects via **Only for H484 SKUs** to **PEG Port PCIe 16-23**.\n\n**Bottom Section (Embedded Controller)**\n*   A block labeled **Embedded Controller** sits at the bottom.\n*   It connects to the processor via a dashed line/label **eSPI to LPC**.\n*   It receives connections from **HDA**, **GP_SPI**, **I2C**, **8xGPIO**, **2xUART**, and **LPC**.\n*   It outputs to **FAN connector** and **LM73 (board)**.](.express-ptl-prelim-datasheet-20251231/98ae3519a6119944d00ab620e25bf74b1ede6e1dcc8a9d2168f253f57efae24c.jpg)

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.express-ptl-prelim-datasheet-20251231/express-ptl-prelim-datasheet-20251231.pdf)