# Express-RLP

COM Express COM.0 R3.1 Type 6 Module based on Intel® Raptor Lake-P Platform

![Close-up of a green printed circuit board with visible components and gold contacts (no readable text or symbols)](.express-rlp-datasheet-20250514/6a74c721a394f6d606eaebfe7f27522fcea2b32fcbf8d59da9797d7cb07ee1e9.jpg)

# Features

• Performance hybrid architecture (P-core, E-core)
• Up to 14 cores, 20 threads at 15W/28W/45W TDP
• Up to 96GB DDR5 SO-DIMM at max. 5200MHz, IBECC (selected SKUs)

• 4 displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4 (TBC)
• 1 PCIe x8 Gen4, 2 PCIe x4 Gen4, 2.5GbE (selected SKUs)
• Extreme Rugged operating temperature (selected SKUs)

Specifications

<table><tr><td rowspan="13">Core System</td><td rowspan="9">SoC</td><td colspan="5">13th Gen Intel $^{\textregistered}$  Core $^{\text{TM}}$  mobile processors (formerly Raptor Lake-P)</td></tr><tr><td>Processor</td><td>Cores/Threads</td><td>Cache</td><td>TDP</td><td>Graphics</td></tr><tr><td>Core $^{\text{TM}}$  i7-13800HE</td><td>6P+8E/20T</td><td>24MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i5-13600HE</td><td>4P+8E/16T</td><td>18MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i3-13300HE</td><td>4P+4E/12T</td><td>12MB</td><td>45W(35W cTDP)</td><td>UHD GPU</td></tr><tr><td>Core $^{\text{TM}}$  i7-13800HRE</td><td>6P+8E/20T</td><td>24MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i5-13600HRE</td><td>4P+8E/16T</td><td>18MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i3-13300HRE</td><td>4P+4E/12T</td><td>12MB</td><td>45W(35W cTDP)</td><td>UHD GPU</td></tr><tr><td colspan="5">Note:1. Raptor Lake-P supports Embedded and Industrial SKUs.2. Some processor SKUs are supported by project basis only. Please see the user&#x27;s manual for details.Supports: Intel $^{\textregistered}$  VT (including VT-x, VT-d, VT-x with Extended Page Tables),Intel $^{\textregistered}$  HT Technology, Intel $^{\textregistered}$  SSE4.2, Intel $^{\textregistered}$  64 Architecture, Intel $^{\textregistered}$  Turbo BoostTechnology 2.0, Intel $^{\textregistered}$  TXT, Execute Disable Bit, Intel $^{\textregistered}$  Data ProtectionTechnology with Intel $^{\textregistered}$  Secure Key, Intel $^{\textregistered}$  AES-NINote: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td colspan="5">Up to 96GB (2x 48GB) DDR5, IBECC (selected SKUs), SO-DIMM memory, max.5200MHz2 memory channels with 1DPC design</td></tr><tr><td>Embedded BIOS</td><td colspan="5">AMI UEFI with CMOS backup in 32 SPI BIOS (dual BIOS opt.)</td></tr><tr><td>Cache</td><td colspan="4">Core $^{\text{TM}}$  i7-13800H(R)E / i7-1370P(R)E :Core $^{\text{TM}}$  i5-13600H(R)E / i5-1250PRE :Core $^{\text{TM}}$  i7-1365PE / i7-1365URE / i5-1350PE / i5-1340PE /i5-1345U(R)E / i5-1335UE /i3-13300H(R)E / i3-1320P(R)E:Core $^{\text{TM}}$  i3-1315URE :</td><td>24MB18MB12MB10MB</td></tr><tr><td>Expansion Busses</td><td colspan="5">PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)PCIe x4 Gen4, lanes 24-27PCIe x4 Gen4, lanes 28-31</td></tr></table>

Specifications

<table><tr><td rowspan="3"></td><td>Expansion Busses</td><td>8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1Gen3: Lanes 4/5/6/7LPC bus (via ESPI-to-LPC bridge IC), SMBus (system),  $I^{2}C$  (user), GP_SPI(TBC)</td></tr><tr><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, genral purpose  $I^{2}C$ , UART, GPIO, watchdog timer, fan control</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr><tr><td rowspan="6">Video</td><td>GPU Feature Support</td><td>Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D supportOneVPLHDCP 2.3Graphics Hardware Virtualization (SRIOV)</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI</td></tr><tr><td>VGA</td><td>Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.4b</td></tr><tr><td>USB4</td><td>Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)Requires BIOS code modification by project basis, re-timer with PD on carrier</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On carrier Express-BASE6 R3.1 (ALC888 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (I226-IT supports TSN by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC)</td></tr><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)2x SATA 6Gb/s (SATA 0-1)Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC)</td></tr><tr><td>On-board Storage</td><td>NVMe SSD in place of PCIe lanes 28-31 (build option, project basis)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>8x GPIO (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 125 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 10 IoT Enterprise LTSC, Windows 11 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit (TBC), VxWorks (TBC)</td></tr></table>

Ordering Information

<table><tr><td colspan="2">Starter Kit</td></tr><tr><td colspan="2">COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6</td></tr><tr><td colspan="2">Module</td></tr><tr><td>Express-RLP-i7-13800HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HE 2.5GHz/14C 45W</td></tr><tr><td>Express-RLP-i5-13600HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HE 2.7GHz/12C 45W</td></tr><tr><td>Express-RLP-i3-13300HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HE 2.1GHz/8C 45W</td></tr><tr><td>Express-RLP-i7-1370PE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-1370PE 1.9GHz/14C 28W</td></tr><tr><td>Express-RLP-i7-13800HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HRE 2.5GHz/14C 45W, -40 to 85°C</td></tr><tr><td>Express-RLP-i5-13600HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HRE 2.7GHz/12C 45W, -40 to 85°C</td></tr><tr><td>Express-RLP-i3-13300HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HRE 2.1GHz/8C 45W, -40 to 85°C</td></tr></table>

Note:
1. Raptor Lake-P supports Embedded and Industrial SKUs.
2. Some processor SKUs are supported by project basis only. Please see the user's manual for details or consult an ADLINK representative.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-ADP-B</td><td>Heatspreader for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-ADP-BT</td><td>Heatspreader for Express-ADP/RLP with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-ADP-B</td><td>Low-profile Heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td>THS-ADP-BT</td><td>Low-profile Heatsink for Express-ADP/RLP with through-hole standoffs for top mounting</td></tr><tr><td>THSH-ADP-B</td><td>High-profile Heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-ADP-B</td><td>High-profile Heatsink with Fan for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr></table>

![| Component             | Value |\n|-----------------------|-------|\n| eDP / LVDS            | eDP x 4 |\n| eDP / LVDS            | eDP to LVDS |\n| VGA                   | DP to VGA |\n| USB 2.0 Lane 0-7      | LAN controller I225 |\n| Max. 2.5GbE           | 1 PCIe Gen 3 (HSIO) |\n| PCIe Lane 0-3         | 4 PCIe Gen 3 (HSIO) |\n| PCIe Lane 4          | 1 PCIe Gen 3 (HSIO) |\n| PCIe Lane 5          | PCIe switch |\n| SATA 0-1              | 2 PCIe x1 |\n| SATA 2-3              | 4x USB 10Gbps |\n| HDA                   | 2x PCIe |\n| SPI                   | TPM 2.0 |\n| SMBus                 | 2x HSUART |\n| I²C                   | 2x PCIe |\n| 8xGPIO /SDIO-         | eSPI to LPC |\n| 2xUART /GAN-         | Embedded Controller |\n| LPC/eSPI              | eSPI build option (TBC) |\n| DDR 5 SODIMM max. 5200MHz 8-48GB, non-ECC | TCP   |\n| DDR 5 SODIMM max. 5200MHz 8-48GB, non-ECC | TCP   |\n| PCIe Gen 3 (HSIO)     | 1 PCIe Gen 3 (HSIO) |\n| PCIe Gen 3 (HSIO)     | 4 PCIe Gen 3 (HSIO) |\n| PCIe Gen 4 x8 (CPU)    | available for 45W(35W CTDP) SKUs |\n| PCIe Gen 4 x4 (CPU)    | available for 45W(35W CTDP) SKUs |\n| PCIe Gen 4 x4 (CPU)    | available for 45W(35W CTDP) SKUs |\n| NVMe BGA SSD          | build option |\n| Fan connector        | LM73 (board) |\n| Embedded Controller   | LM73 (board) |](.express-rlp-datasheet-20250514/698b65e1abd09b51b42cb751c61fae7815c070f603c44e5a331eb8e8d7475039.jpg)

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.express-rlp-datasheet-20250514/express-rlp-datasheet-20250514.pdf)