# Express-RLP

COM Express COM.0 R3.1 Type 6 Module based on Intel® Raptor Lake-P platform

![The image displays a blue oval shape tilted slightly upwards to the right, centered on a white background. Inside the oval, the word 'Preliminary' is written in white, sans-serif text. In the bottom right corner, a small fragment of another image is visible, showing part of an eye and hair.](.express-rlp-preliminary-datasheet-20231109/a3c46e6968b232a23251e3f73994241ae00d3af5fb39ec7aca81bd07d32657ae.jpg)

![Close-up of a green printed circuit board with visible components and gold contacts (no readable text or symbols)](.express-rlp-preliminary-datasheet-20231109/9c458c4a73c852f7be9f690101e8b673ef880730590793e6538101025b52fa10.jpg)

# Features

• Performance hybrid architecture (P-core, E-core)
• Up to 14 cores, 20 threads at 15W/28W/45W TDP
• Up to 64GB DDR5 SO-DIMM at max. 4800MT/s, IBECC (selected SKUs)
• AI inference (AVX-512 VNNI, Iris Xe GPU 96EUs)

• 4 displays via DDI/LVDS (opt. eDP, VGA) and USB4/Thunderbolt 4 (TBC)
• 1 PCIe x8 Gen4, 2 PCIe x4 Gen4, 2.5GbE (selected SKUs)
• Extreme Rugged operating temperature (selected SKUs)

Specifications

<table><tr><td rowspan="13">Core System</td><td rowspan="9">SoC</td><td colspan="5">13th Gen Intel $^{\textregistered}$  Core $^{\text{TM}}$  mobile processors (formerly Raptor Lake-P)</td></tr><tr><td>Processor</td><td>Cores/Threads</td><td>Cache</td><td>TDP</td><td>Graphics</td></tr><tr><td>Core $^{\text{TM}}$  i7-13800HE</td><td>6P+8E/20T</td><td>24MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i5-13600HE</td><td>4P+8E/16T</td><td>18MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i3-13300HE</td><td>4P+4E/12T</td><td>12MB</td><td>45W(35W cTDP)</td><td>UHD GPU</td></tr><tr><td>Core $^{\text{TM}}$  i7-13800HRE</td><td>6P+8E/20T</td><td>24MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i5-13600HRE</td><td>4P+8E/16T</td><td>18MB</td><td>45W(35W cTDP)</td><td>Iris Xe GPU</td></tr><tr><td>Core $^{\text{TM}}$  i3-13300HRE</td><td>4P+4E/12T</td><td>12MB</td><td>45W(35W cTDP)</td><td>UHD GPU</td></tr><tr><td colspan="5">Note:1. Raptor Lake-P supports Embedded and Industrial SKUs.2. Some processor SKUs are supported by project basis only. Please see the user&#x27;s manual for details.Supports: Intel $^{\textregistered}$  VT (including VT-x, VT-d, VT-x with Extended Page Tables),Intel $^{\textregistered}$  HT Technology, Intel $^{\textregistered}$  SSE4.2, Intel $^{\textregistered}$  64 Architecture, Intel $^{\textregistered}$  Turbo BoostTechnology 2.0, Intel $^{\textregistered}$  AVX512-VNNI, Intel $^{\textregistered}$  TXT, Execute Disable Bit, Intel $^{\textregistered}$  DataProtection Technology with Intel $^{\textregistered}$  Secure Key, Intel $^{\textregistered}$  AES-NINote: Availability of features may vary between processor SKUs.</td></tr><tr><td>Memory</td><td colspan="5">Up to 64GB (2x 32GB) DDR5, IBECC (selected SKUs), SO-DIMM memory, max.4800MT/s2 memory channels with 1DPC design</td></tr><tr><td>Embedded BIOS</td><td colspan="5">AMI UEFI with CMOS backup in 32 SPI BIOS (dual BIOS opt.)</td></tr><tr><td>Cache</td><td colspan="4">Core $^{\text{TM}}$  i7-13800H(R)E / i7-1370P(R)E :Core $^{\text{TM}}$  i5-13600H(R)E / i5-1250PRE :Core $^{\text{TM}}$  i7-1365PE / i7-1365URE / i5-1350PE / i5-1340PE /i5-1345U(R)E / i5-1335UE /i3-13300H(R)E / i3-1320P(R)E:Core $^{\text{TM}}$  i3-1315URE :</td><td>24MB18MB12MB10MB</td></tr><tr><td>Expansion Busses</td><td colspan="5">PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)PCIe x4 Gen4, lanes 24-27PCIe x4 Gen4, lanes 28-31Note: PCIe 16-23, 24-27, and 28-31 are recommended to be used for discrete graphics and storagepurposes only.</td></tr></table>

Specifications

<table><tr><td rowspan="3"></td><td>Expansion Busses</td><td>8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1Gen3: Lanes 4/5/6/7LPC bus (via ESPI-to-LPC bridge IC), SMBus (system),  $I^{2}C$  (user), GP_SPI(TBC)</td></tr><tr><td>SEMA Board Controller</td><td>Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, genral purpose  $I^{2}C$ , UART, GPIO, watchdog timer, fan control</td></tr><tr><td>Debug Headers</td><td>30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr><tr><td rowspan="6">Video</td><td>GPU Feature Support</td><td>Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60Hardware video encode/decode, up to 8K60 HEVC DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D supportOneVPLHDCP 2.3Graphics Hardware Virtualization (SRIOV)</td></tr><tr><td>Digital Display Interface</td><td>DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI</td></tr><tr><td>VGA</td><td>Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920x1200@60Hz</td></tr><tr><td>LVDS</td><td>Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode</td></tr><tr><td>eDP</td><td>Build option in place of LVDS, 4 lanes, eDP 1.4b</td></tr><tr><td>USB4</td><td>Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)Requires BIOS code modification by project basis, re-timer with PD on carrier</td></tr><tr><td rowspan="2">Audio</td><td>Chipset</td><td>Integrated on SoC</td></tr><tr><td>Codec</td><td>On carrier Express-BASE6 R3.1 (ALC888 standard support)</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/PHY</td><td>Intel® Ethernet Connection I226 series (I226-IT supports TSN by build option)</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC)</td></tr><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)2x SATA 6Gb/s (SATA 0-1)Max. two USB4 (in place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC)</td></tr><tr><td>On-board Storage</td><td>NVMe SSD in place of PCIe lanes 28-31 (build option, project basis)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO</td><td>8x GPIO (GPI with interrupt)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="5">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Wide Input</td><td>ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant, Smart Battery support (TBC)</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)</td></tr><tr><td>ECO Mode</td><td>Supports deep S5 mode for power saving</td></tr></table>

Specifications

<table><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 6</td></tr><tr><td>Dimension</td><td>Basic size: 125 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (storage: -20°C to 80°C)Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Windows 10 IoT Enterprise LTSC, Ubuntu 64-bit, Yocto project-based Linux 64-bit (TBC), VxWorks (TBC)</td></tr></table>

Ordering Information

<table><tr><td colspan="2">Starter Kit</td></tr><tr><td colspan="2">COM Express Type 6 Starter Kit Plus Starter kit for COM Express Type 6</td></tr><tr><td colspan="2">Module</td></tr><tr><td>Express-RLP-i7-13800HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HE 2.5GHz/14C 45W</td></tr><tr><td>Express-RLP-i5-13600HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HE 2.7GHz/12C 45W</td></tr><tr><td>Express-RLP-i3-13300HE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HE 2.1GHz/8C 45W</td></tr><tr><td>Express-RLP-i7-1370PE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-1370PE 1.9GHz/14C 28W</td></tr><tr><td>Express-RLP-i7-13800HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i7-13800HRE 2.5GHz/14C 45W, -40 to 85°C</td></tr><tr><td>Express-RLP-i5-13600HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i5-13600HRE 2.7GHz/12C 45W, -40 to 85°C</td></tr><tr><td>Express-RLP-i3-13300HRE</td><td>Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-13300HRE 2.1GHz/8C 45W, -40 to 85°C</td></tr></table>

Note:
1. Raptor Lake-P supports Embedded and Industrial SKUs.
2. Some processor SKUs are supported by project basis only. Please see the user's manual for details or consult an ADLINK representative.

Accessories

<table><tr><td colspan="2">Heat Spreaders</td></tr><tr><td>HTS-ADP-B</td><td>Heatspreader for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-ADP-BT</td><td>Heatspreader for Express-ADP/RLP with through-hole standoffs for top mounting</td></tr><tr><td colspan="2">Passive Heatsinks</td></tr><tr><td>THS-ADP-B</td><td>Low-profile Heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td>THS-ADP-BT</td><td>Low-profile Heatsink for Express-ADP/RLP with through-hole standoffs for top mounting</td></tr><tr><td>THSH-ADP-B</td><td>High-profile Heatsink for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr><tr><td colspan="2">Active Heatsinks</td></tr><tr><td>THSF-ADP-B</td><td>High-profile Heatsink with Fan for Express-ADP/RLP with threaded standoffs for bottom mounting</td></tr></table>

![| Component             | Value |\n|-----------------------|-------|\n| eDP / LVDS            | eDP x 4 |\n| eDP / LVDS            | eDP to LVDS |\n| VGA                   | DP to VGA |\n| USB 2.0 Lane 0-7      | LAN controller I225 |\n| Max. 2.5GbE           | 1 PCIe Gen 3 (HSIO) |\n| PCIe Lane 0-3         | 4 PCIe Gen 3 (HSIO) |\n| PCIe Lane 4          | 1 PCIe Gen 3 (HSIO) |\n| PCIe Lane 5          | PCIe switch |\n| SATA 0-1              | 2 PCIe x1 |\n| SATA 2-3              | 4x USB 10Gbps |\n| HDA                   | 2x PCIe |\n| SPI                   | TPM 2.0 |\n| SMBus                 | 2x HsuART |\n| I²C                   | 2x PCIe |\n| 8xGPIO / SDIO-        | eSPI to LPC |\n| 2xUART / GAN-        | Embedded Controller |\n| LPC / eSPI            | LM73 (board) |\n| eSPI build option (TBC) | eSPI to LPC |\n| Embedded Controller   | Fan connector |\n| Embedded Controller   | LM73 (board) |\n| PCle Gen4 x8 (CPU)    | available for 45W(35W CTDP) SKUs |\n| PCle Gen4 x4 (CPU)    | available for 45W(35W CTDP) SKUs |\n| PCle Gen4 x4 (CPU)    | available for 45W(35W CTDP) SKUs |\n| PCle Lane 6-7         | available for 45W(35W CTDP) SKUs |\n| PCle Lane 3-7         | available for 45W(35W CTDP) SKUs |\n| PCle Lane 2-7         | available for 45W(35W CTDP) SKUs |\n| PCle Lane 1-7         | available for 45W(35W CTDP) SKUs |\n| PCle Lane 0-7         | available for 45W(35W CTDP) SKUs |\n| DDI /USB 4/TBT4       | available for 45W(35W CTDP) SKUs |\n| DDI /USB 4/TBT4       | available for 45W(35W CTDP) SKUs |\n| DDI only Port 3       | available for 45W(35W CTDP) SKUs |\n| DDI /USB 4/TBT4 Port 1 | available for 45W(35W CTDP) SKUs |\n| DDI /USB 4/TBT4 Port 2 | available for 45W(35W CTDP) SKUs |\n| DDI only Port 3       | available for 45W(35W CTDP) SKUs |\n| PEG Port              | available for 45W(35W CTDP) SKUs |\n| PCIe 16-23            | available for 45W(35W CTDP) SKUs |\n| PCIe 24-27            | available for 45W(35W CTDP) SKUs |\n| PCIe 28-31            | available for 45W(35W CTDP) SKUs |\nNVMe BGA SSD build option](.express-rlp-preliminary-datasheet-20231109/da48ab7a729aedf885f1d6139de5760a7ac57e81e1429bae43a37d5e67ac7100.jpg)
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