# Express-SL/SLE COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor # Features ● 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor ● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz (supports both ECC and non-ECC memory) ● 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays ● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3) ● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 ● Supports Smart Embedded Management Agent (SEMA® ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option) New ![Close-up of a green printed circuit board with visible components and connectors (no readable text or symbols)](.express-sl-sle-20230922/dfba03e79b9566240bf12eb2f128cdba7398965c8d61eba58480bb6815f57911.jpg) # Specifications # ● Core System # CPU Mobile Intel® Xeon®, Core™ and Celeron® Processors - 14nm Xeon® E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e) Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2) Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2) Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2) Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2) Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2) Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2) Core™ i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2) Core™ i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2) Celeron® G3900E 2.4GHz (no Turbo), 35W (2C/GT1) Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. Note: Availability of the features may vary between processor SKUs. # Memory Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH) # Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support # Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron® # PCH CM236 (supports ECC memory, Intel® AMT) QM170 (supports non-ECC, Intel® AMT) HM170 (supports non-ECC, no Intel® AMT support) # Expansion Busses PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2 C (user) # Debug Headers 40-pin flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset # ● Video # GPU Feature Support Intel® Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs # Hardware encode/transcode HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support # Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI # LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC # eDP 4 lane support optional, in place of LVDS # ● Audio # Chipset Intel® HD Audio integrated in chipset # Audio Codec located on carrier Express-BASE6 (ALC886 standard supported) # ● Ethernet Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support) Interface: 10/100/1000 GbE connection # Specifications # I/O Interfaces USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7) SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI # ● Super I/O Supported on carrier if needed (standard support for W83627DHG-P) # ● TPM (option) Chipset: Atmel AT97SC3204 Type: TPM1.2/2.0 (TPM 2.0 support with project basis) # ● Power Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 \~20V (Standard temp. only) Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving # ● Operating Systems # Standard Support Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks # Extended Support (BSP) WES 7 32/64-bit, Linux 64-bit, VxWorks # Mechanical and Environmental Form Factor: PICMG COM.0, Rev 2.1 Type 6 Dimension: Basic size, 125 mm x 95 mm # Operating Temperature Standard: 0°C to 60°C Extreme Ruggeed: -40°C to +85°C (build option for Core™ & Celeron® 25W TDP SKUs) # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Intelligent Middleware # SEMA® ![The image features the text 'SEMA' in white, stylized capital letters set against a solid orange rectangular background with rounded corners.](.express-sl-sle-20230922/19005aaf4f959e7133b9622ffbb556140029cede91bac7718f35ed3288c9aa3a.jpg) Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times. Functional Diagram ![**Labeled Blocks:**\n* **AB** (Vertical bar on the left)\n* **CD** (Vertical bar on the right)\n* **SODIMM 1** (1867/2133 MHz 4-16 GB DDR4)\n* **SODIMM 2** (1867/2133 MHz 4-16 GB DDR4)\n* **Mobile Intel® Xeon® 6th Gen Intel® Core™ i7/i5/i3 Processor Intel® Celeron® Processor (formerly “Skylake-H”)**\n* **XDP 60**\n* **DDI 1 DP/HDMI/DVI**\n* **DDI 2 DP/HDMI/DVI**\n* **DDI 3 DP/HDMI/DVI**\n* **PCIe x16 (Gen3) 2 x8 or 1 x8 + 2 x4**\n* **eDP - LVDS**\n* **single/dual 18/24 bit LVDS**\n* **eDP x4 lanes (optional)**\n* **UMI**\n* **Mobile Intel® QM170/HM170/ CM236 Chipset**\n* **6x PClex1 (Gen3) (port 0-5)**\n* **2x PCle x1 (Gen3) (port 6/7)**\n* **LAN I219**\n* **PCIe x1**\n* **4x SATA 6Gb/s (port 0/1/2/3)**\n* **8x USB 2.0**\n* **HD Audio**\n* **UART0/1**\n* **LPC to UART**\n* **LPC bus**\n* **Debug header**\n* **TPM**\n* **SMBus**\n* **GPIO**\n* **4x GPO, 4x GPI**\n* **GP I2C**\n* **DDC I2C**\n* **4x USB 3.0 (port 0/1/2/3)**\n* **New SEMA BMC**\n* **SPI 0 BIOS**\n* **SPI 1 BIOS**\n* **LM73 Sensor**\n* **SPI_ CS#**\n* **SPI**\n\n**Connections:**\n* **SODIMM 1** and **SODIMM 2** connect to the **Processor**.\n* The **Processor** connects to **XDP 60**.\n* The **Processor** connects to **DDI 1**, **DDI 2**, and **DDI 3**, which connect to **CD**.\n* The **Processor** connects to **PCIe x16 (Gen3)**, which connects to **CD**.\n* The **Processor** connects to **eDP - LVDS**.\n* **eDP - LVDS** connects to **single/dual 18/24 bit LVDS**, which connects to **AB**. (Note: **eDP x4 lanes (optional)** is a dashed line connected to **eDP - LVDS**).\n* The **Processor** connects to the **Chipset** via **UMI**.\n* The **Chipset** connects to **AB** via **6x PClex1 (Gen3) (port 0-5)**.\n* The **Chipset** connects to **LAN I219** via **PCIe x1**, which connects to **AB**.\n* The **Chipset** connects to **AB** via **4x SATA 6Gb/s (port 0/1/2/3)**, **8x USB 2.0**, and **HD Audio**.\n* The **Chipset** connects to the **LPC bus**, which connects to **UART0/1** (via **LPC to UART**) -) **AB**, **Debug header**, and **TPM**.\n* The **Chipset** connects to **SMBus**, which connects to **GPIO**.\n* **GPIO** connects to **AB** via **4x GPO, 4x GPI**, **GP I2C**, and **DDC I2C**.\n* The **Chipset** connects to **CD** via **2x PCle x1 (Gen3) (port 6/7)** and **4x USB 3.0 (port 0/1/2/3)**.\n* The **Chipset** connects to **New SEMA BMC** via **SMBus**.\n* **New SEMA BMC** connects to **SPI 0 BIOS** and **SPI 1 BIOS**, which connect to **CD**.\n* **New SEMA BMC** connects to **LM73 Sensor**.\n* **AB** connects to **New SEMA BMC** via **SPI_ CS#** and **SPI**.](.express-sl-sle-20230922/1cd42260ff5ab3279b4331f31032e2f318b095ffd996ddc270b91366e559aaca.jpg) # Ordering Information ● Express-SLE-E3-1515M v5 Basic COM Express Type 6 module with Intel® Xeon® E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC ● Express-SLE-E3-1505M v5 Basic COM Express Type 6 module with Intel® Xeon® E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC Express-SLE-E3-1505L v5 Basic COM Express Type 6 module with Intel® Xeon® E3-1505L v5 and GT2 level graphics, CM236 chipset, support ECC Express-SL-i7-6820EQ Basic COM Express Type 6 module with Intel® Core™ i7-6820EQ and GT2 level graphics, QM170 chipset ● Express-SL-i7-6822EQ Basic COM Express Type 6 module with Intel® Core™ i7-6822EQ, and GT2 level graphics, QM170 chipset ● Express-SL-i5-6440EQ Basic COM Express Type 6 module with Intel® Core™ i5-6440EQ and GT2 level graphics, QM170 chipset ● Express-SL-i5-6442EQ Basic COM Express Type 6 module with Intel® Core™ i5-6442EQ and GT2 level graphics, QM170 chipset Express-SL-i3-6100E Basic COM Express Type 6 module with Intel® Core™ i3-6100E and GT2 level graphics, HM170 chipset Express-SL-i3-6102E Basic COM Express Type 6 module with Intel® Core™ i3-6102E and GT2 level graphics, HM170 chipset ● Express-SL-G3900E Basic COM Express Type 6 module with Intel® Celeron® G3900E and GT1 level graphics, HM170 chipset # Accessories # Heat Spreaders ● HTS-SL-B Heatspreader for Express-SL with threaded standoffs for bottom mounting ● HTS-SL-BT Heatspreader for Express-SL with through hole standoffs for top mounting # Passive Heatsinks ● THS-SL-BL Low profile heatsink for Express-SL with threaded standoffs for bottom mounting ● THS-SL-BT Low profile heatsink for Express-SL with through hole standoffs for top mounting THSH-SL-BL High profile heatsink for Express-SL with threaded standoffs for bottom mounting # Active Heatsink ● THSF-SL-BL High profile heatsink with fan for Express-SL with threaded standoffs for bottom mounting ● THSF-SLE-GT4e-BL High profile heatsink with fan for Express-SL-E3-1515M v5 with threaded standoffs for bottom mounting # Starter Kit Starterkit-COM Express 6 PLUS COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit [🔗 Link to the original document](.express-sl-sle-20230922/express-sl-sle-20230922.pdf)