# Express-SL2

COM Express Basic Size Type 2 Module with Mobile 6th Gen Intel® Xeon® , Core™ and Celeron® Processors

# Features

● PICMG COM.0 Type 2 compliant module with mainstream processor
● Dual channel DDR4 ECC/non-ECC memory in dual stacked SODIMM sockets
● Single/dual channel 18/24-bit LVDS and VGA
● Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel)
● Three SATA, one PATA, eight USB 2.0 and GbE
● Extreme Rugged operating temperature: -40°C to +85°C (selected SKUs)

# Specifications

# ● Core System

# CPU

Mobile 6th Generation Intel® Xeon®, Core™ and Celeron® Processors - 14nm (formerly”Sky Lake-H”)

• Intel® Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 45W/35W (cTDP), 4C/GT2
• Intel® Xeon® E3-1505L v5 2/2.8GHz (Turbo), 25W, 4C/GT2
• Intel® Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W/35W (cTDP), 4C/GT2
• Intel® Core™ i7-6822EQ 2/2.8GHz (Turbo), 25W, 4C/GT2
• Intel® Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W/35W (cTDP), 4C/GT2
• Intel® Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W, 4C/GT2
• Intel® Core™ i3-6100E 2.7GHz, 35W, 4C/GT2
• Intel® Core™ i3-6102E 1.9GHz, 25W, 4C/GT2
• Intel® Celeron® G3900E 2.4GHz, 35W, 2C/GT1
• Intel® Celeron® G3902E 1.6GHz, 25W, 2C/GT1

Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Device Protection Technology with Intel® Secure Key, Intel® TSXNI

Note: Availability of features may vary between processor SKUs.

#

1866/2133 MHz DDR4 memory in dual stacked SODIMM sockets

Note: Xeon® with CM236 supports both ECC and non-ECC memory

(Core™ i3/Celeron® available with MOQ)

# Embedded BIOS

AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11 support (depends on CPU/PCH)

# Cache

8MB for Xeon®/Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3 and 2MB for Celeron®

# PCH

CM236 (supports ECC and non-ECC memory and Intel® AMT)

QM170 (supports Intel® AMT )

HM170 (no Intel® AMT support)

# Expansion Busses

PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3, muxed with DDI channel, build option)

6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5, supports x4, x2, x1 configurations

1 PCI bus

LPC bus, SMBus (system) , I2 C (user)

# SEMA Board Controller

Supports: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control

![Close-up of a green printed circuit board with visible traces, chips, and connectors (no readable text or symbols)](.express-sl2-20230922/3de3db7bfaee8cc0a802ea4e0dbdcef4fa296fb7257513a947b66ecf99a99112.jpg)

# Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs

# . ● Video

# GPU Feature Support

Intel® Generation 9 Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of VGA, LVDS (or optional eDP), optional DisplayPort/HDMI outputs (DisplayPort/HDMI from DDI channel muxed with PEG port)

• Encode/transcode HD content
• Playback of high definition content including Blu-ray Disc
• Playback of Blu-ray Disc 3D content using HDMI (1.4a spec compliant with 3D)
• DirectX Video Acceleration (DXVA) support for accelerated video processing
• HEVC/H.265, H.264, M/JPEG, MPEG2, VC1, WMV9, VP8/VP9 HW decode
• HEVC/H.265, M/JPEG, MPEG2 HW encode
• Advanced Scheduler 2.0, 1.0, XPDM support
• DirectX 12, DirectX 11.3, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
• OpenGL up to 4.4, OpenCL up to 2.1 support

# Digital Display Interface

DDI1/2 are muxed with PEG port, build option feature, supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:

DP1.2: max. resolution 4096x2304 @ 60Hz, 24bpp

HDMI 1.4: max. resolution 4096x2160 @ 24Hz, 24bpp

# VGA

VGA support from DP-to-VGA IC

# LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution 1920x1200@60Hz in dual mode)

# eDP

4 lane support optional, in place of LVDS (build option, max. resolution 4096x2304 @60Hz, 24bpp)

# Specifications

# ● Audio

# Chipset

Intel® HD Audio integrated in chipset

# Audio Codec

Located on carrier Express-BASE

# ● Ethernet

# Integrated MAC

MAC integrated in QM170/HM170/CM236 Chipset

# Intel® PHY

Intel® I219LM/V with AMT 11.0 support (only LM version supports AMT)

# Interface

10/100/1000 GbE connection

# ● Multi I/O and Storage

USB: 8x USB 2.0 (USB 0-7)

SATA: 3x SATA 6Gb/s (SATA 0,1,2) Max. 4x SATA without PATA feature, build option

IDE (PATA): SATA-to-PATA IC on SATA port 3, Master only

GPIO/SD: 4x GPO and 4x GPI (GPI with interrupt)

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

# ● TPM (option)

Chipset: In ineon

Type: TPM 2.0

# ● Power

Standard Input: ATX 12V±5% / 5Vsb ±5% or AT 12V±5%

Wide Input: ATX 8.5-20 V / 5Vsb ±5% or AT 8.5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

# ● Mechanical and Environmental

Form Factor: PICMG COM.0, Rev 2.1 Type 2

Dimension: Basic size: 125 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -40°C to 85°C (selected SKUs, by project basis)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operating Systems

# Standard Support

Windows 10/8.1 (64-bit), Windows 7 (32/64-bit), Linux (64-bit), VxWorks

# Extended Support (BSP)

WES 7 (32/64-bit), Linux 64-bit, VxWorks

Functional Diagram
![**Top Processor Block**\n*   **Mobile 6th Gen Intel® Xeon® Intel® Core™ Intel® Celeron® Processor** connects to:\n    *   **SODIMM 1 1866/2133 MHz DDR4**\n    *   **SODIMM 2 1866/2133 MHz DDR4**\n    *   **eDP - LVDS** (labeled **eDP x2**) which connects to **single/dual 18/24 bit LVDS** (surrounded by a dashed box labeled **eDP x4**) and the left bar **AB**.\n    *   **DP-to-VGA** (labeled **VGA**) which connects to the left bar **AB**.\n    *   **Switch PEG or DDI** (via **PCIe x16 (Gen3) 1 x16, 2 x8, or 1 x8 + 2 x4**, **DDI 1 DP/HDMI/DVI**, and **DDI 2 DP/HDMI/DVI**). The Switch connects to the right bar **CD** (via **PEG or DDI 1 DDI 2**).\n    *   **Mobile Intel® Sky Lake Chipset QM170/HM170/ CM236** via a double arrow labeled **DMI**.\n\n**Bottom Chipset Block**\n*   **Mobile Intel® Sky Lake Chipset QM170/HM170/ CM236** connects to:\n    *   Left bar **AB** via: **6x PCIe x1 (Gen3) (port 0-5)**, **3x SATA 6Gb/s (port 0/1/2)**, **1x SATA 6Gb/s (port 3)** (dashed line), **8x USB 2.0**, **HD Audio**, **LPC bus**, **SMBus**, **GP I2C**, and **DDC I2C**.\n    *   **LAN i219 LM/V** (via **PCIe x1**).\n    *   **TPM 2.0** (via **LPC bus**).\n    *   **GPIO** (via **SMBus**). **GPIO** connects to **4GPI, 4GPO** on the left bar **AB**.\n    *   Right bar **CD** via **PCIe** → **PCIe-to-PCI** → **PCI**.\n    *   Right bar **CD** via **SATA** → **SATA-to-PATA** → **PATA**.\n    *   **New SEMA BMC** (via **SMBus**).\n\n**Bottom Right Management Block**\n*   **New SEMA BMC** connects to:\n    *   Left bar **AB** via lines labeled **GP I2C**, **DDC I2C**, **SPI_CS#**, and **SPI**.\n    *   **SPI 0 BIOS** and **SPI 1 BIOS** (which connect to the right bar **CD**).\n    *   **Thermal Sensor**.](.express-sl2-20230922/f43611c4b633c35c45b8df345e46b37654c06030e58654b69b65eb7e275de215.jpg)

# Ordering Information

Express-SL2-i7-6820EQ
Basic COM Express Type 2 module with Intel® Core™ i7-6820EQ (4C/GT2), QM170 chipset
● Express-SL2-i5-6440EQ
Basic COM Express Type 2 module with Intel® Core™ i5-6440EQ (4C/GT2), QM170 chipset
Express-SL2-i3-6100E
Basic COM Express Type 2 module with Intel® Core™ i3-6100E (4C/GT2), HM170 chipset
Express-SL2-i5-6442EQ
Basic COM Express Type 2 module with Intel® Core™ i5-6442EQ (4C/GT2), QM170 chipset
● Express-SL2-G3902E
Basic COM Express Type 2 module with Intel® Celeron® G3902E (2C/GT1), HM170 chipset

# Accessories

# Heat Spreaders

● HTS-SL2-B

Heatspreader for Express-SL2 with threaded standoffs for bottom mounting

# Passive Heatsinks

● THS-SL2-B
Low profile heatsink for Express-SL2 with threaded standoffs for bottom mounting
● THSH-SL2-B
High profile heatsink for Express-SL2 with threaded standoffs for bottom mounting

# Active Heatsink

● THSF-SL2-B

High profile heatsink for Express-SL2 with threaded standoffs for top mounting

Notes: Express-SL2, Express-KL2 share the same thermal solutions

# Starter Kit

# COM Express Type 2

● Starter Kit Plus

Starter kit for COM Express Type 2

Notes:

\* All specifications are subject to change without further notice.
\* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability.
[🔗 Link to the original document](.express-sl2-20230922/express-sl2-20230922.pdf)