# Express-TL

COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors

# Features

● Intel® Tiger Lake-H Processors (up to 8 cores) integrated with Intel® UHD Graphics (Xe architecture)
● AI inference (AVX512 VNNI + Intel® UHD GFX)
Up to 128GB DDR4 SO-DIMM, non-ECC, ECC
3x DDI channels, 1x LVDS (opt. 4 lane eDP), opt. VGA, up to 4 independent displays
PCIe x16 Gen4, 2.5GbE (TSN, build option)
● Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs, up to 2933MT/s memory frequency)

# Specifications

# ● Core System

# CPU

Intel® Xeon®, 11th Gen Intel® Core™, Intel® Celeron® Processors (Tiger Lake-H)
• Intel® Xeon® W-11865MRE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T
• Intel® Xeon® W-11865MLE, 1.5(4.5) GHz, 24MB, 25W, 8C/16T
• Intel® Core™ i7-11850HE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T
• Intel® Xeon® W-11555MRE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T
• Intel® Xeon® W-11555MLE, 1.9(4.4) GHz, 12MB, 25W, 6C/12T
• Intel® Core™ i5-11500HE, 2.6(4.5) GHz, 12MB, 45W(35W cTDP), 6C/12T
• Intel® Xeon® W-11155MRE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T
• Intel® Xeon® W-11155MLE, 1.8(3.1) GHz, 8MB, 25W, 4C/8T
• Intel® Core™ i3-11100HE, 2.4(4.4) GHz, 8MB, 45W(35W cTDP), 4C/8T
• Intel® Celeron® 6600HE, 2.6GHz, 8MB, 35W, 2C/2T

Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® AVX-512, Intel® AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX-NI.

Notes:

Availability of features may vary between processor SKUs.

Some SKUs listed above are supported by project basis only. Please contact your ADLINK representative for availability.

# Memory

Dual channel up to 3200 MT/s DDR4 memory up to 128GB in four SODIMM sockets

Two SO-DIMM on top side, two SO-DIMM on bottom side (3 or 4 socket build option dependent on carrier design)

ECC support by Xeon CPU paired with RM590E PCH

# Embedded BIOS

AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS by build option)

# Cache

Xeon® W-11865MRE / Core™ i7-11850HE: 24MB

Xeon® W-11555MRE / Core™ i5-11500HE: 12MB

Xeon® W-11155MRE / Core™ i3-11100HE / Celeron® 6600HE: 8MB

# Chipset

Intel® RM590E (support ECC, with Xeon® CPU)

Intel® QM580E

Intel® HM570E

![Green printed circuit board with multiple microchips and connectors (no visible text or symbols)](.express-tl-datasheet-20250528/d3c951fc84c0bdd14a90e515f22f9a115134f8558f3db56e63ccb6db53c292df.jpg)

# Expansion Busses

PCIe x16 Gen4: Lanes 15-31 (configurable to one x16, two x8, one x8 + two x4) 8 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5/6/7 (configurable to x1, x2, x4)

LPC bus (through an ESPI to LPC bridge IC), SMBus (system) , I2C (user)

# SEMA Board Controller

Supports: Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)

# Debug Headers

30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs

# ● Video

# GPU Feature Support

Intel® Gen 12 Graphics Core Architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4x 4K60)

Hardware encode/transcode of HD content (including HEVC)

DirectX 12 support

OpenGL 4.5, 4.4/4.3 and ES 2.0 support

OpenCL 2.1, 2.0/1.2 support

# Digital Display Interface

DDI1/2/3 supporting DisplayPort/HDMI/DVI

USB4

Maximum 2x USB4 by using DDI 1 and DDI2

Notes: USB4 is a build option (HW and BIOS) supported by project basis in place of DDI channels.

USB4 support also requires re-timer and PD on carrier.

# VGA

Supported by build option through DP-to-VGA IC (in place of DDI3), max. resolution 1920x1200@60Hz

# LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920x1200@60Hz in dual mode

# eDP

Build option: 4 lane support, in place of LVDS

# Specifications

# ● Audio

# Chipset

Intel® HD Audio integrated on CPU

# Audio Codec

On carrier Express-BASE6 (ALC886 standard support)

# ● Ethernet

# Intel® MAC/PHY

LAN controller i225 series (i225-IT feature TSN by build option)

# Interface

2.5GbE and 1000/100/10 Mbit/s Ethernet connection

GbE0\_SDP available if TSN support enabled

# ● I/O Interfaces

USB: 4x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4x USB 2.0/1.1 (USB 4,5,6,7)

SATA: 4x SATA 6Gb/s (SATA 0,1,2,3)

On-board Storage: Soldered type PCIe based SSD (build option)

Serial: 2x UART ports with console redirection

GPIO/SD: 4x GPO and 4x GPI from EC (GPI with interrupt)

Note: USB 3.1 Gen2 support dependent on carrier design

# ● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis)

# ● TPM

Chipset: Infineon

Type: TPM 2.0 (SPI based)

# ● Power

Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

Wide Input: ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO mode: supports deep S5 mode for power saving

# ● Mechanical and Environmental

Form Factor: PICMG COM.0: Rev 3.0 Type 6

Dimension: Basic size: 125 mm x 95 mm

# Operating Temperature

Standard: 0°C to 60°C (storage: -20°C to 80°C)

Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected

SKUs, up to 2933MT/s memory frequency)

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operating Systems

# Standard Support

Windows 10 64-bit, Windows 10 Enterprise 64-bit, Ubuntu 20.04.3 LTS,

Ubuntu Desktop 20.10/20.04 LTS

# Extended Support (BSP)

Yocto project based Linux 64-bit

# Functional Diagram

![The block diagram illustrates the architecture of a system based on the Intel® Tiger Lake-H processor and a Mobile Intel® Next Series Chipset.\n\n**Labeled Blocks:**\n\n*   **Processor:** Intel® Xeon® 11th Gen Intel® Core™ / Celeron® Processor (Tiger Lake-H)\n*   **Chipset:** Mobile Intel Next Series Chipset RM590E/QM580E/HM570E\n*   **Controller:** Embedded Controller\n*   **Memory:** DDR4 SODIMM up to 3200 MT/s\n*   **Display:** eDP to LVDS, DP to VGA, eDP x4\n*   **Storage/Network:** LAN Controller Intel I225, BGA SSD, SATA (implied by port count)\n*   **Boot/Security:** BIOS Flash, TPM 2.0\n*   **Interfaces/Connectors:** eSPI to LPC, DB30 x86 Connector, Fan Connector, LM73 (board)\n*   **External Ports:** DDI 1 / USB4, DDI 2 / USB4, DDI 3, PEG Port PCIe 16-31, USB 3.0 Lane 0-3, PCIe Lane 6-7, USB 2.0 Lane 0-7, SATA Port 0-3, Max. 2.5GbE, PCIe Lane 0-3, PCIe Lane 4-5, HDA, SPI, SMBus, I2C, 8xGPIO/SDIO, 2xUART/CAN, LPC/eSPI\n\n**Connections:**\n\n*   **Processor to Chipset:** Connected via 'DMI (x8, Gen3)'.\n*   **Processor to Memory:** Two blocks of 'DDR4 SODIMM up to 3200 MT/s'.\n    *   One is labeled 'ECC, non-ECC dependent on CPU/chipset config.'\n    *   The other is labeled '3rd, 4th socket dependent on SKU'.\n*   **Processor to Display:**\n    *   'eDP/LVDS' connects to 'eDP to LVDS'.\n    *   'VGA' connects via a dashed line to 'DP to VGA'.\n    *   'DDI 8 (eDP 4lanes)' connects via a dashed line to 'eDP x4'.\n    *   '16 PCIe Gen4' connects via a dashed line to 'DP to VGA'.\n*   **Processor to Right-Side Interfaces:**\n    *   'TCP 0' connects to 'DDI 1 / USB4'.\n    *   'TCP 1' connects to 'DDI 2 / USB4'.\n    *   'TCP 2' connects to 'DDI 3'.\n    *   '16 PCIe Gen4' connects to 'PEG Port PCIe 16-31' (labeled '1 x16 or 2 x8 or 1 x8 + 2 x4').\n*   **Chipset to Left-Side Interfaces:**\n    *   'USB 2.0 Lane 0-7' connects directly.\n    *   'SATA Port 0-3' connects via a line labeled 'SATA 6Gb/s'.\n    *   'LAN Controller Intel I225' connects via a line labeled 'Max. 2.5GbE' and 'TSN dependent on controller SKU' (also labeled '1 PCIe Gen3').\n    *   'PCIe Lane 0-3' connects via lines labeled '1 x4, 2 x2, 4 x1' and '4 PCIe Gen3'.\n    *   'PCIe Lane 4-5' connects via lines labeled '2 x1, 1 x2', '1 x4 (Lane 4-7)', and '2 PCIe Gen3'.\n    *   'HDA', 'SPI', 'SMBus', and 'I2C' connect directly.\n        *   'SPI' connects to 'BIOS Flash' and 'TPM 2.0'.\n        *   'SMBus' and 'I2C' have dashed lines connecting to the 'Embedded Controller'.\n*   **Chipset to Right-Side Interfaces:**\n    *   Four lines labeled 'USB 3.2 Gen2 x1' connect to 'USB 3.0 Lane 3', 'USB 3.0 Lane 2', 'USB 3.0 Lane 1', and 'USB 3.0 Lane 0'.\n    *   '2 PCIe Gen3' connects to 'PCIe Lane 6-7' (labeled '2 x1, 1 x2' and '1 x4 (Lane 4-7)').\n    *   '2 PCIe Gen3' connects to 'BGA SSD' (labeled 'build option' and 'x2').\n    *   'HSUART' connects to 'DB30 x86 Connector'.\n*   **Chipset to Embedded Controller:**\n    *   'HSUART' connects to 'eSPI to LPC', which connects to the 'Embedded Controller'.\n*   **Embedded Controller Connections:**\n    *   Connects to 'Fan Connector' and 'LM73 (board)'.\n    *   Connects to external lines: '8xGPIO/SDIO', '2xUART/CAN', and 'LPC/eSPI'.](.express-tl-datasheet-20250528/9c31c8a2a2c393d493c5e6b156b8f661a885a5b389e02218d54235e58f2ce132.jpg)

# Ordering Information

● Express-TL-i7-11850HE

Basic size type 6 COM Express module with 11th Gen Intel® Core™ i7-11850HE octa core processor with QM580E chipset, 3 SO-DIMM

● Express-TL-i5-11500HE

Basic size type 6 COM Express module with 11th Gen Intel® Core™ i5-11500HE hexa core processor with QM580E chipset, 2 SO-DIMM

● Express-TL-i3-11100HE

Basic size type 6 COM Express module with 11th Gen Intel® Core™ Core i3-11100HE quad core processor with HM570E chipset, 2 SO-DIMM

● Express-TL-W-11865MRE

Basic size type 6 COM Express module with Intel® Xeon® W-11865MRE octa core processor with RM590E chipset, 3 SO-DIMM

Express-TL-W-11865MLE

Basic size type 6 COM Express module with Intel® Xeon® W-11865MLE octa core processor with RM590E chipset, 3 SO-DIMM

t1Express-TL-W-11865MRE

Basic size type 6 COM Express module with 11th Intel Xeon W-11865MRE octa core processor with RM590E chipset, 3 SO-DIMM, -40° to 85°

t1Express-TL-W-11555MRE

Basic size type 6 COM Express module with 11th Intel Xeon W-11555MRE hexa core processor with RM590E chipset, 2 SO-DIMM, -40° to 85°

t2Express-TL-W-11555MRE

Basic size type 6 COM Express module with 11th Intel Xeon W-11555MRE hexa core processor with RM590E chipset, 2 SO-DIMM, -40° to 85°, ETT

t2Express-TL-W-11865MRE

Basic size type 6 COM Express module with 11th Intel Xeon W-11865MRE octa core processor with RM590E chipset, 3 SO-DIMM, -40° to 85°, ETT

\*For processor SKUs not listed, please contact your ADLINK representative for availability.

# Starter Kit

COM Express Type 6 Starter Kit Plus

Starter kit for COM Express Type 6

For PCIe Gen4 specific version, please contact your local

ADLINK representative.

# Accessories

# Heat Spreaders

● HTS-TL-B Heatspreader for Express-TL with threaded standoffs for bottom mounting

● HTS-TL-BT Heatspreader for Express-TL with through hole standoffs for top mounting

# Passive Heatsinks

● THS-TL-BL Low profile heatsink for Express-TL with threaded standoffs for bottom mounting

● THS-TL-BTL Low profile heatsink for Express-TL with through hole standoffs for top mounting

● THSH-TL-BL High profile heatsink for Express-TL with threaded standoffs for bottom mounting

# Active Heatsinks

● THSF-TL-BL High profile heatsink with Fan for Express-TL with threaded standoffs for bottom mounting
[🔗 Link to the original document](.express-tl-datasheet-20250528/express-tl-datasheet-20250528.pdf)