# Express-VR7

COM Express Basic Size Type 7 Module with AMD Embedded Ryzen V3000

![Close-up of a green printed circuit board with integrated chip and surrounding components (no readable text or symbols)](.express-vr7-datasheet-20250416/9bee6ae5f59b69541bc300f71cbaa4fb03fd519394f1eb2f019be6475f5e81e9.jpg)

# Features

• 8 Cores at 15W, 45W — Best Performance per Watt in its class
• Up to 64GB DDR5 SO-DIMM, 4800 MT/s ECC
• 2x 10G Ethernet and 1x 2.5G Ethernet
• 14x PCIe Gen4 lanes
• Extreme Rugged operating temperature: -40°C to 85°C (build option, selected SKU)

Specifications

<table><tr><td rowspan="13">Core System</td><td rowspan="7">CPU</td><td colspan="3">AMD Embedded Ryzen V3000 Processor</td></tr><tr><td>V3C48 3.3/3.8GHz</td><td>8 Cores / 16 Threads</td><td>45W</td></tr><tr><td>V3C44 3.5/3.8GHz</td><td>4 Cores / 8 Threads</td><td>45W</td></tr><tr><td>V3C18I 1.9/3.8GHz</td><td>8 Cores / 16 Threads</td><td>15W</td></tr><tr><td>V3C16 2.0/3.8GHz</td><td>6 Cores /12Threads</td><td>15W</td></tr><tr><td>V3C14 2.3/3.8GHz</td><td>4 Cores / 8 Threads</td><td>15W</td></tr><tr><td colspan="3">Note: Availability of features may vary between processor SKUs. Note: V3C18I could be used for extreme temperature (TBC)</td></tr><tr><td>Memory</td><td colspan="3">Dual channel up to 4800 MT/s ECC/non-ECC DDR5 memory up to 64GB (2x 32GB) in two SODIMM socketsTwo SO-DIMM on top side</td></tr><tr><td>Embedded BIOS</td><td colspan="3">AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS (dual BIOS by build option)</td></tr><tr><td>Cache</td><td colspan="3">TBC</td></tr><tr><td>Expansion Busses</td><td colspan="3">All Gen4 speed• 8 PCI Express Gen4: Lanes 16-23 (configurable to one x8, two x4, two controller)• 4 PCI Express Gen4: Lanes 0-3 (configurable to four x1, two x2, one x4, four controller)• 2 PCI Express Gen4: Lanes 4-5 (configurable to one x1, one x2, one controller)• LPC bus (through an ESPI to LPC bridge IC), SMBus (system),  $I^{2}C$  (user), GP_SPU (user, project basis)</td></tr><tr><td>SEMA Board Controller</td><td colspan="3">Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose  $I^{2}C$ , watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)</td></tr><tr><td>Debug Headers</td><td colspan="3">40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs</td></tr></table>

Specifications

<table><tr><td rowspan="2">10G Ethernet</td><td>Intel® MAC/Controller</td><td>AMD 10G Ethernet controller integrated in CPU</td></tr><tr><td>Interface</td><td>2x 10GBASE-KR and its sideband signalsNote: SGMII and additional 1x MDIO/MDC supported by project basis</td></tr><tr><td rowspan="2">Ethernet</td><td>Intel® MAC/Controller</td><td>Intel Ethernet controller i226 series</td></tr><tr><td>Interface</td><td>2.5GbE and 1000/100/10 Mbit/s Ethernet connection</td></tr><tr><td rowspan="4">Multi I/O and Storage</td><td>USB</td><td>4x USB 3.x/2.0/1.1 (USB 0,1,2,3)</td></tr><tr><td>SATA</td><td>2x SATA 6Gb/s (SATA 0,1)</td></tr><tr><td>Serial</td><td>2x UART ports with console redirection</td></tr><tr><td>GPIO/SD</td><td>4x GPO and 4x GPI (GPI with interrupt TBC)</td></tr><tr><td>Module Management Controller</td><td colspan="2">Supports: IPMB (in conjunction with carrier BMC for remote management Controller applications) by build option (TBC)</td></tr><tr><td>Super I/O</td><td colspan="2">Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported by project basis)</td></tr><tr><td rowspan="2">TPM</td><td>Chipset</td><td>Infineon</td></tr><tr><td>Type</td><td>TPM 2.0 (SPI based)</td></tr><tr><td rowspan="3">Power</td><td>Standard Input</td><td>ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%</td></tr><tr><td>Management</td><td>ACPI 5.0 compliant</td></tr><tr><td>Power States</td><td>C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)</td></tr><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>PICMG COM.0: Rev 3.1 Type 7</td></tr><tr><td>Dimension</td><td>Basic size: 125 mm x 95 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C (Storage: -20°C to 80°C)Extreme Rugged: -45°C to 85°C (build option, selected SKUs)(Storage: -40°C to 85°C) (TBC)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td rowspan="2">Operating Systems</td><td>Standard Support</td><td>Yocto Linux, Ubuntu 20.04.3 LTS (TBC)</td></tr><tr><td>Extended Support (BSP)</td><td>Yocto project based Linux</td></tr></table>

# Ordering Information

Module

<table><tr><td>Express-VR7-V3C18I</td><td>Basic COM Express Type 7 module with AMD Embedded Ryzen V3C18I, 8-core at 15W</td></tr></table>

\*For processor SKUs not listed, please contact your ADLINK representative for availability.

# Accessories

Heat Spreaders

<table><tr><td>HTS-VR7-B</td><td>Heatspreader for Express-VR7 with threaded standoffs for bottom mounting</td></tr><tr><td>HTS-VR7-BT</td><td>Heatspreader for Express-VR7 with through hole standoffs for top mounting</td></tr></table>

Passive Heatsinks

<table><tr><td>THS-VR7-B</td><td>Low profile heatsink for Express-VR7 with threaded standoffs for bottom mounting</td></tr><tr><td>THS-VR7-BT</td><td>Low profile heatsink for Express-VR7 with through hole standoffs for top mounting</td></tr><tr><td>THSH-VR7-B</td><td>High profile heatsink for Express-VR7 with threaded standoffs for bottom mounting</td></tr></table>

Active Heatsinks

<table><tr><td>THSF-VR7-B</td><td>High profile heatsink with Fan for Express-VR7 with threaded standoffs for bottom mounting</td></tr></table>

# Starter Kit

<table><tr><td>VR7 COM Express Type 7</td><td>TBC</td></tr><tr><td>Starter Kit</td><td></td></tr></table>

# Block diagram

![The diagram centers on a large red block labeled **'AMD Embedded Ryzen V3000'**, which has three **'GEN4'** labels across its top edge.\n\n**Left-side connections:**\n*   **'PCIe Lane 0-3'** connects via a line labeled **'x1, x2, x4 (four controllers)'**.\n*   **'PCIe Lane 4-5'** connects via **'x2 (one controller)'**.\n*   **'USB 2.0 Lane 0-3'** connects directly to the central block.\n*   **'SATA Port 0-1'** connects directly to the central block.\n*   **'2.5GbE NCSI'** connects to a blue block labeled **'i226'**.\n*   **'SPI'** connects to a block labeled **'TPM'** and an adjacent dashed box.\n*   **'GP_SPI (OEM)'** connects to a pin labeled **'eSPI'** on the central block.\n*   **'SMBus'** connects to a pin labeled **'SMBus/I2C (mUlti-function)'**.\n*   **'I2C'** connects to a pin labeled **'I2C'**.\n*   **'UART 0-1'** connects to a pin labeled **'2x UART'**.\n*   **'4x GPI Interrupt'** connects to a pin labeled **'4x GPI'**.\n*   **'4x GPO'** connects to a pin labeled **'4x GPO'**.\n*   **'IPMB'** connects to a block labeled **'MMC'**.\n\n**Right-side connections:**\n*   **'PCIe Lane 16-23'** connects via a line labeled **'x8, x4 (two controllers)'**.\n*   **'USB 3.x Lane 0-3 (high speed lanes)'** connects directly.\n*   **'10G_SDP 0-1'** connects via a line labeled **'2x PPS input'**.\n*   **'10G_SDP 2-3'** connects via a line labeled **'2x PPS output'**.\n*   **'10G_KR 0-1 & sideband signals (additional 1x MDIO/MDC, OEM)'** connects directly.\n\n**Bottom section:**\n*   **'LPC/eSPI'** connects to a large blue block labeled **'Embedded controller'**.\n*   An **'eSPI to LPC bridge IC'** block connects the central block (via the eSPI line) to the **'Embedded controller'**.\n*   The **'Embedded controller'** connects to **'Thermal sensor (TBC)'** and **'Thermal sensor (board)'**.\n*   Two blocks labeled **'DDR5 SODIMM'** (both marked **'ECC/non-ECC'**) are shown. One connects to the central block. The text **'Two SO-DIMM sockets on top side'** is positioned next to the second block.](.express-vr7-datasheet-20250416/3c26d3f94a80a7212404a7d3ebd3b25f8a4a75cd9aff6d875c7f4e0816cd3de3.jpg)

I2C, SMBus, UART, GPIO source from EC or CPU. It can be configured based on project basis
[🔗 Link to the original document](.express-vr7-datasheet-20250416/express-vr7-datasheet-20250416.pdf)