# HPERC-IBR-MC

Extreme Rugged™ Coldplate Mount System with 3rd Gen Intel® Core™ i7 Processor and MIL-DTL-38999 Connectors

# Features

● SWaP efficient sealed SFF system
● VITA 75 coldplate mounting
Intel® Core™ i7 dual or quad-core processor
● Soldered DDR3L 8GB, up to 16GB RAM
● Quad Gigabit Ethernet
● Available GPGPU on 16-lane 3rd Generation PCI Express
Simple user expansion and configuration
● Extreme Rugged temperature: -40°C to +85°C
● Dual independent displays (DVI/VGA)
● Tested to MIL-STD-810G and MIL-STD-461F standards; IP67 rating
● OS support: VxWorks 6.9, Ubuntu, Windows® 7 and WES7

![Exterior view of a silver industrial electronic device with two circular connectors and mounting flanges (no visible text or symbols)](.hperc-ibr-mc-datasheet-en-20180207-v1/6581d5d2e8c4537a8786258266788d8c34701e8e47d48505f496629d9e08104d.jpg)

![The image shows a rectangular graphic containing the text 'EXTREME RUGGED' in bold, white, capital letters set against a dark gray background. The rectangle has small screw or bolt holes in each of its four corners. Below the main graphic, a reflection of the text is visible on a shiny surface.](.hperc-ibr-mc-datasheet-en-20180207-v1/21b56731e73759bd8ca2943e388ce56278c824e906d3b8c00546c3e17c8104c9.jpg)

# Specifications

# ● Core System

CPU

Intel® Core™ i7-3517UE 1.7GHz, dual-core

Intel® Core™ i7-3612QE 2.1GHz, quad-core

Chipset

Intel® QM77 Express Chipset

GPGPU

MXM NVIDIA GeForce GT 745M / GTX 950M with 2GB 128-bit GDDR5 (optional)

16GB DDR3L-1333 ECC

8GB soldered down, 8GB SODIMM

BIOS

AMI EFI

Expansion Busses

MXM (3rd Generation PCIe x16)

PCI/104 Express® Type 2 (PCIe Gen2)

PCI Express Mini Card (PCIe Gen2)

# ● Standard I/O

1x VGA, 2x DVI (only 2 display outputs supported concurrently)

Audio

1x amplified stereo output

1x stereo input

LAN Chipset

4x Intel® I210 Ethernet controller

LAN Speed

10/100/1000 Mbps

USB

6x USB 2.0

Serial

7x RS-232/422

GPIO

8x digital IO

# Specifications

# ● Internal Storage

Removable SATA: 2x 2.5” SLC/MLC SSD on SATA 6 Gb/s (up to 1 TB)

RAID: Supports RAID 0/1

Removable: 1x SDHC - SLC (up to 64 GB)

# . ● Security

TPM: Atmel AT97SC3204-U1A190

Secure Erase: Software triggered

# ● Power

Input: 10-36VDC

Performance: P-States 0-16 (Speedstep & Turbo)

S-States S3, S4

# ● Thermal

Internal Transfer: Passive conduction to body

# Storage Temperature

-55°C to +85°C

# Baseplate Point

Extreme Rugged: -40°C to +85°C (i7-3517UE);

# Temperature

-40°C to +80°C (i7-3612QE)

Coldplate conduction

VITA 75.22 mount

# ● Environmental

# Immersion

IEC 529 - IP-67

# Salt Spray

RTCA/DO-160G, Section 14, Category S

# Altitude

0 to 50K ft.

# Humidity

95% at 60°C non-condensing

# Shock

MIL-STD-810G - 516.6 Procedures I and V

# Vibration

MIL-STD-810G - 514.6 Procedure I

Categories 4, 9, 11, 21

# EMI/EMC

MIL-STD-461F

# Temperature

MIL-STD-810G - 501.5 Procedure II

MIL-STD-810G - 502.5 Procedure II

Altitude: 50,000Ft

# ● Mechanical

# Form Factor

VITA-75.22 Conductive Coldplate

# Dimension

223.65(L) x 177.8(W) x 68.7(H) mm (with mounting brackets)

# Weight

# IO Connectors

MIL-DTL-38999 (uniquely-keyed)

# ● Operating Systeml

# OS

Ubuntu 16.04

VxWorks 6.9.3.1 (Please contact ADLINK for other OS support)

Windows® 7 (64-bit)

WES 7 (64-bit/32-bit)

# Functional Diagram

![This block diagram illustrates a computer architecture with a central processing unit (CPU) and platform controller hub (PCH) connecting various components.\n\n**Central Components:**\n*   **8/16GB ECC DDR3 RAM**: Located at the top, connected downwards.\n*   **Intel® 3rd Generation i7 CPU**: Connected to the RAM above and the PCH below.\n*   **Intel® PCH QM77**: Located centrally at the bottom, connected to the CPU above.\n\n**Connections and Peripherals:**\n*   **GPGPU (NVIDIA®)**: Enclosed in a dashed box to the right, connected directly to the **Intel® 3rd Generation i7 CPU**.\n*   **Removable Media**: A dashed box on the left containing three blocks labeled **SDHC**, **SSD**, and **SSD**. The **Intel® PCH QM77** connects to the **SDHC** block and splits to connect to both **SSD** blocks.\n*   **User Expansion slots**: A dashed box on the bottom right containing two slots. The **Intel® PCH QM77** connects to the upper block labeled **PC-104 Express** and the lower block labeled **Mini PCI Express**.](.hperc-ibr-mc-datasheet-en-20180207-v1/01a5f9658506ac8ff05815c68e38a559bb2e00fcf49570e5ad31a87eccd026ab.jpg)

# Ordering Information

● HPERC-IBRMC-100XN Coldplate, Intel® Core™ i7 3517UE, 16GB RAM
● HPERC-IBRMC-B00XN Coldplate, Intel® Core™ i7 3517UE, 8GB RAM
● HPERC-IBRMC-300XN Coldplate, Intel® Core™ i7 3612QE, 16GB RAM
● HPERC-IBRMC-D00XN Coldplate, Intel® Core™ i7 3612QE, 8GB RAM

# HPERC Accessories

● HPERC-X-03
HPERC™ breakout cable kit including Amphenol MIL-STD Nkey & Akey I/O cables, and AC adapter
M3N745M-JN-A
MXM NVIDIA GeForce GT 745M GPU card, with 2GB 128-bit GDDR5 memory (must be pre-assembled at ADLINK factory)
● M3N950M-JN1A-A
MXM NVIDIA GeForce GTX 950M GPU card, with 2GB 128-bit GDDR5 memory (must be pre-assembled at ADLINK factory)
[🔗 Link to the original document](.hperc-ibr-mc-datasheet-en-20180207-v1/hperc-ibr-mc-datasheet-en-20180207-v1.pdf)