# I-Pi SMARC Elkhart Lake

Industrial Prototyping Kit for IoT with Off-the-Shelf SMARC Computer-on-Module

![USB 2.0\n2x\nUSB 3.0\n2x\nRJ45\n2x\nHDMI\n3.5mm\nAudio\nJack\nmicroSD\nSIM Card\n40-pin RPI Compatible\nExpansion Header\nGPIO/I2C/PWM/SPI/UART\nLVDS\n2x\n40-pin Expansion Header\nI2C/CAN/UART/SPI\nMicro USB\nPower\nButton\nReset\nButton\nPower\nJack\nM.2 B-key PCIe\nM.2 E-key PCIe\nintel\nATOM](.i-pi-smarc-elkhart-lake-datasheet-20210827/dc72ed705043e33f8ff68551f312b73583ed78decb33bd5e587589232f7692d0.jpg)

# Features

Based on Intel® 6th Gen. Atom® x6425E quad-core SoC with integrated GPU
1 Equipped with SMARC 2.1 compliant module specially designed for industrial embedded applications requiring long life, high MTBF and strict revision control
1 Includes everything needed to go live in minutes
Industrial grade quality and minimum 10 year product availability
1 Supports Windows 10, Linux and Android OS

Specifications

<table><tr><td rowspan="5">CORE SYSTEM</td><td>SoC</td><td>Intel 6th Gen. Atom® x6425E Quad Core SoC</td></tr><tr><td>Architecture</td><td>x86</td></tr><tr><td>Memory</td><td>4GB LPDDR4</td></tr><tr><td>Storage</td><td>64GB eMMC 5.0</td></tr><tr><td>IoT Security</td><td>TPM 2.0 (optional), Intel® AES-NI, Secure Key, Execute Disable Bit, Intel® OS Guard, Intel® Boot Guard</td></tr><tr><td>ETHERNET</td><td>LAN</td><td>2x 2.5GbE</td></tr><tr><td>AUDIO</td><td>Codec</td><td>Realtek ALC262-VC2-GR</td></tr><tr><td rowspan="3">VIDEO</td><td>GPU Core</td><td>Intel® UHD Graphics for 10th Gen Intel® Processors</td></tr><tr><td>Video Decoding</td><td>4Kp60 HEVC, H.265 for decode H.264, VP9, VP8</td></tr><tr><td>Video Encoding</td><td>4Kp60 H.265, H.264</td></tr></table>

<table><tr><td rowspan="2">I/O INTERFACES</td><td>40-pin RPI Expansion Header</td><td>GPIO / I2C / PWM / SPI / UART</td></tr><tr><td>40-pin Expansion Header</td><td>I2C / CAN / SPI / UART</td></tr><tr><td rowspan="8">CONNECTORS</td><td>Display</td><td>1x HDMI2x LVDS</td></tr><tr><td>Audio</td><td>1x 3.5mm Audio Jack</td></tr><tr><td>Network</td><td>2x RJ45</td></tr><tr><td>USB</td><td>2x USB 3.02x USB 2.01x Micro USB</td></tr><tr><td>Buttons</td><td>1x Reset1x Power</td></tr><tr><td>SD Card Slot</td><td>1x microSD</td></tr><tr><td>SIM Card Slot</td><td>1x SIM</td></tr><tr><td>M.2 Card Slots</td><td>1x M.2 B-key PCIe1x M.2 E-key PCIe</td></tr><tr><td rowspan="2">POWER</td><td>Input</td><td>19V+/-5% DC</td></tr><tr><td>Connector</td><td>DC Jack</td></tr><tr><td>OPERATING SYSTEMS</td><td>Standard Support</td><td>Windows 10 / Yocto / Android [TBC]</td></tr><tr><td rowspan="6">MECHANICAL AND ENVIRONMENTAL</td><td>Form Factor</td><td>SGET SMARC Specifications v2.1</td></tr><tr><td>Dimensions</td><td>SMARC short size module (82mm x 50mm)</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to +60°CRugged: -40°C to +85°C (optional)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing5-95% RH storage</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202 F Method 213B, Table 213-I,Condition AMethod 214A, Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress,Thermal Shock and Combined Test</td></tr></table>

Functional diagram
![The diagram centers on a vertical block labeled **'314-Pin Connector SMARC2.1'**.\n\n**Labeled Blocks:**\n*   **314-Pin Connector SMARC2.1**\n*   **LVDS 0 / eDP0 / DSI0**\n*   **LVDS1 / eDP1 / DSI1**\n*   **HDMI**\n*   **Audio jack**\n*   **Codec board Able to switch Codec Header**\n*   **I2S**\n*   **HDA**\n*   **OTG**\n*   **USB 2.0 / 3.0 Host** (appears twice)\n*   **USB 2.0 Host** (appears twice)\n*   **GbE 1**\n*   **GbE 0**\n*   **SDIO / Micro SD**\n*   **U-sim**\n*   **M.2 B key**\n*   **M.2 E key**\n*   **I2C** (appears twice)\n*   **UART** (appears twice)\n*   **GPIO**\n*   **SPI** (appears twice)\n*   **40 pin header** (appears twice)\n*   **CAN 0/1**\n*   **Power**\n*   **RESET**\n\n**Connections:**\n*   **Bidirectional connections** (double-headed arrows) link the central connector to: **LVDS 0 / eDP0 / DSI0**, **LVDS1 / eDP1 / DSI1**, **HDMI**, **OTG**, two instances of **USB 2.0 / 3.0 Host**, two instances of **USB 2.0 Host**, **GbE 1**, **GbE 0**, **SDIO / Micro SD**, and **M.2 E key**.\n*   **Audio path:** **Audio jack** connects to **Codec board Able to switch Codec Header**, which connects to the central connector. **I2S** and **HDA** also connect directly to the central connector.\n*   **M.2 path:** A line connects the central connector to **U-sim**, which points via a single arrow to **M.2 B key**.\n*   **40 pin header paths:**\n    *   The central connector connects to four blocks (**I2C**, **UART**, **GPIO**, **SPI**), which point to the top **40 pin header**.\n    *   The central connector connects to four blocks (**UART**, **CAN 0/1**, **I2C**, **SPI**), which point to the bottom **40 pin header**.\n*   **Power/Reset:** The central connector points via single arrows to **Power** and **RESET**.](.i-pi-smarc-elkhart-lake-datasheet-20210827/692d606d729495f404cb9b4ff360b961c132c877708aae5aff3dfcb8ae6821de.jpg)

Dimensional drawing
![110(4330.7)\n108.5(4192.9)\n88.13(3469.7)\n30.13(1106.2)\n0(0)\n3.5(127.8)\n106.5(4192.9)\n42.5(3606.9)\n000000\n0\n0\n0\n0\n0\n0\n3.8(137.8)\n106.5(4192.9)](.i-pi-smarc-elkhart-lake-datasheet-20210827/d4412315a97b52852a69777ba6b82f29ea26fb96c49ab84ca9979f3e83575832.jpg)

![φ6(236.2)\nφ2.7(106.3)](.i-pi-smarc-elkhart-lake-datasheet-20210827/3bbb31b0efbe08dcd279a270125ef5bc7d3d606b684eaa7fd0f00a38685d949f.jpg)

# Ordering information

I-Pi SMARC Elkhart Lake (EU)

I-Pi SMARC development kit based on LEC-EL module including 4GB LPDDR4 memory, 64GB eMMC, EU AC power adapter

-Pi SMARC Elkhart Lake (US)

I-Pi SMARC development kit based on LEC-EL module including 4GB LPDDR4 memory, 64GB eMMC, US AC power adapter
[🔗 Link to the original document](.i-pi-smarc-elkhart-lake-datasheet-20210827/i-pi-smarc-elkhart-lake-datasheet-20210827.pdf)