# I-Pi SMARC iMX95

I-Pi SMARC Development Kit Based on NXP iMX95 NXP i.MX 95 with hexa-core Arm Cortex-A55 & ARM Cortex M33 and M7

![Product packaging and hardware components including a I-PI SMARC IMX95 processor, circuit board, and charging cable (no visible text or symbols on main components)](.i-pi-smarc-imx95-datasheet-20260306-2/a95736251e77a47b4f6cdea76ba0bc439c233cbd915ed984b05083a8c61d2ec0.jpg)

# Features

i.MX95 series 6-core Arm Cortex-A55
1x Arm Cortex-M7 core + 1x Arm Cortex-M33 core
In-SoC eIQ® Neutron NPU, up to 2.0 TOPS
LVDS, DSI, HDMI graphics output (BOM option)
Rugged operating temperature option: -40°C to 85°C

• Dual CAN bus FD
• 2x GbE (TSN) ports
I2S audio codec interface
• 15-year product availability
• SMARC Revision 2.2 compliant

Specifications

<table><tr><td rowspan="5">Core System</td><td>SoC</td><td>NXP i.MX 95 series with 2/4/6-core Arm Cortex-A55, 1× Cortex-M7 (Flex domain), 1× Cortex-M33 (low-power real-time domain), TrustZone support, Armv8 cryptography extensions, and an NPU up to 2 TOPS</td></tr><tr><td>Memory</td><td>4GB LPDDR5</td></tr><tr><td>Storage</td><td>32GB eMMC</td></tr><tr><td>L2 Cache</td><td>Per core: 32KB I-Cache, 32KB D-Cache, 64KB L2 Cache Unified: 512KB L3 Cache</td></tr><tr><td>Security</td><td>Cryptography ServicesMultiple key storage and user supportKey Type: AES-128/192/256, ECC 256/384Key Import/Creation/Derivation/Update/DeletionSCA-hardened Asymmetric Public Key Cryptography:- RSA up to 4096; Elliptic Curve up to P-512 w/NIST curves; Brainpool P-512, P-384SCA-hardened Symmetric Cryptography:- AES-128/192/256 Modes: GCM, ECB, CBC, CTR, CCM, XCBC-MAC, KTS (256)</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications

<table><tr><td rowspan="7">Video</td><td>GPU Core</td><td>Arm® MaliTM G310</td></tr><tr><td>GPU Feature Support</td><td>Arm Mali-G310 GPU3D GPU supporting 50 GFLOPs, OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0</td></tr><tr><td>VPU Feature Support</td><td>4Kp30 H.265 and H.264 encode and decode1x JPEG Encoder, 1x JPEG Decoder</td></tr><tr><td>HDMI</td><td>HDMI 2.0a (BOM option)</td></tr><tr><td>MIPI DSI</td><td>1x MIPI DSI 4 lanes</td></tr><tr><td>LVDS</td><td>Dual-channel LVDS port 18/24 bit</td></tr><tr><td>Camera</td><td>MIPI CSI RX interfaceCompatible with MIPI Alliance Interface specification v1.0Up to 4 data lanes, 1.0Gbps maximum data rate per laneSupports MIPI-HS, MIPI-LP mode</td></tr><tr><td>Audio</td><td>Codec</td><td>TI TLV320</td></tr><tr><td>Ethernet</td><td>LAN</td><td>2x GbE (TSN capable)</td></tr><tr><td rowspan="10">Connectors/Headers</td><td>Display</td><td>1x HDMI2x LVDS</td></tr><tr><td>Audio</td><td>1x 3.5mm Audio jack</td></tr><tr><td>Network</td><td>2x RJ45</td></tr><tr><td>USB</td><td>2x USB 3.0, 2x USB2.0, 1x micro USB</td></tr><tr><td>Buttons</td><td>1x Reset1x Power</td></tr><tr><td>SD Card Slot</td><td>1x microSD</td></tr><tr><td>SIM Card Slot</td><td>1x SIM</td></tr><tr><td>M.2 Card Slots</td><td>1x M.2 B-key PCIe1x M.2 E-key PCIe</td></tr><tr><td>40-pin RPI Expansion Header</td><td>GPIO / I2C / PWM / SPI / UART</td></tr><tr><td>40-pin Expansion Header</td><td>I2C / CAN / SPI / UART</td></tr><tr><td rowspan="2">Power</td><td>Input</td><td>19V+/-5% DC (Adapter: 19VDC)</td></tr><tr><td>Connector</td><td>DC jack</td></tr><tr><td>Operating Systems</td><td>Standard Support</td><td>Yocto Linux BSP, Android (by project), Ubuntu (by project)</td></tr><tr><td rowspan="5">Mechanical and Environmental</td><td>Form Factor</td><td>SGET SMARC Specification v2.2</td></tr><tr><td>Dimensions</td><td>SMARC short size module (82mm x 50mm)</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°CRugged: -40°C to 85°C*</td></tr><tr><td>Humidity</td><td>Operating: 5-90% RH, non-condensingStorage: 5-95% RH</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27MIL-STD-202 F Method 213B, Table 213-I, Condition AMethod 214A, Table 214-I, Condition D</td></tr></table>

Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Ordering Information

<table><tr><td>Part Name</td><td>Description/Configuration</td></tr><tr><td>LEC-iMX95-H-4G-32G-CT</td><td>SMARC 2.1 Short Size Module with Hexa Core NXP i.MX95, 4 GB LPDDR5, 32 GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-iMX95-H-4G-32G-ER</td><td>SMARC 2.1 Short Size Module with Hexa Core NXP i.MX95, 4 GB LPDDR5, 32 GB eMMC, -40°C to 85°C</td></tr><tr><td>I-Pi LEC-iMX95-H-4G-32G</td><td>I-Pi SMARC Plus Prototype Kit for AIOT with LEC-iMX95-H-4G-32G, low profile heatsink and TLV320 Audio (US &amp; EU power cable, 110/220V to 19V Adapter, USB debug cable)</td></tr></table>

Note: Non-listed configurations are available upon request.

![USB 2.0\n2x\nUSB 3.0\n2x\nRJ45\n2x\nHDMI\n3.5mm\nAudio jack\n40-pin RPI Compatible\nExpansion Header GPIO/\nI2C/PWM/SPI/UART\nLVDS\n2x\n40-pin Expansion Header\nI2C/CAN/UART/SPI\nMicro USB\nPower button\nReset button\nPower jack\nMIPI-CSI 0\n2 lanes\nMIPI-CSI 1\n4 lanes\nmicroSD\nSIM Card\nS/N\nIPi-SMARC Plus\n51-77A07-0A10\nM.2 B-key PCIe\nM.2 E-key PCIe](.i-pi-smarc-imx95-datasheet-20260306-2/92c35adcc2e2d5dc52900f436ea77194ae585a112ff51fadd23a4ed8dca2b3a0.jpg)

Note: “Build option””indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
[🔗 Link to the original document](.i-pi-smarc-imx95-datasheet-20260306-2/i-pi-smarc-imx95-datasheet-20260306.pdf)