# LEC-BT

# SMARC ® Full Size Module with Intel ® Atom™

# Processor E3800 Series System-on-Chip

# Features

● Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
● Up to 8 GB DDR3L at 1066/1333 MHz (ECC)
● HDMI and LVDS, onboard eMMC
● GbE, camera interface
● 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0,
● max. 12x GPIO
● Extreme Rugged™ operating temperatur e: -40°C to 85°C

![Green printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-bt-2016-en/3544e9bba5131687d3b2c645f257f238d1e68d9828298ecdca1c87d9a6f467fa.jpg)

# Specifications

# ● Core System

# CPU

Intel® Atom ™ E3800 Series, single, dual or quad-core SoC with integrated graphics Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz (No Turbo), 5 W TDP Atom™ E3805 (2C/1066), 1.33 GHz (No GFX) 3W TDP

# Memory

Up to 8 GB DDR3L at 1066/1333 MHz, memory down with ECC

# Embedded BIOS

AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support

# Cache

512 kB to 2 MB L2 cache

# SEMA Board Controller

Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control

# ● Audio

# Chipset

Intel® HD Audio integrated in SoC

# Ports

1x I²S and 1x HDA for audio codec on carrier

# . Ethernet

# Intel® MAC/PHY

1x Intel® i210-IT Ethernet controller

# Interface

10/100/1000 GbE

# ● I/O Interfaces

# PCIe

3x PCIe x1 Gen2

# USB

1x USB 3.0 + 3x USB 2.0

# SATA

1x SATA 3 Gb/s

# SDIO

1x SDIO (4-bit)

# Camera

CSI 4L/1L

# Serial

2x SPI, 2x I2C, 1x I2S, Power Management, 2x UART

# eMMC

Soldered, bootable eMMC flash storage from 4 to 64 GB (optional)

# GPIO

12x GPIO, 5x used for camera, 7x available

# ● Video

# GPU Feature Support

7th generation Intel® graphics core architecture with four execution units, supports two independent displays 2D and 3D graphics hardware acceleration Support for DirectX 11.1, OGLES 2.0, OGL 3.2 Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats Video encode HW acceleration for H.264, MPEG2 formats

# LVDS

Single channel 18/24-bit LVDS from DDI0

# HDMI/DP++

HDMI 1.4a from DDI1

# ● Power

# Standard Input

3.0 V\~5.25 V DC ±5%

# Power States

C0-C6, S0, S3, S4, S5

# ● Mechanical and Environmental

# Form Factor

SMARC Specifications v1.1

# Dimension

SMARC full size module, 82 mm x 80 mm

# Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged: -40ºC to +85ºC

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operation System

# Standard Support

Linux, VxWorks, Windows 7/8, Windows Embedded, Compact 7

# Extended Support (BSP)

QNX, Android

# Intelligent Middleware

# SEMA®

Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)

![The image features a logo displaying the word 'SEMA' in white, stylized capital letters with an orange outline, set against a horizontal gradient background that transitions from yellow on the left to deep orange on the right.](.lec-bt-2016-en/d0b1503fca345e3cb12d61c2d386168b948af31078fe751876ae771450516472.jpg)

![The diagram illustrates the connections between a central processor and various peripherals and interfaces.\n\n**Central Component:**\n*   **Intel® Bay Trail SoC**\n\n**Left-Side Connections:**\nA large block labeled **314-pin Golden finger** connects to the SoC through several direct lines and intermediate components:\n\n*   **Direct Connections (Golden finger ↔ SoC):**\n    *   **DDI1 (HDMI)**\n    *   **Audio (HDA and I²S)**\n    *   **2x I²C(LCD/GP)**\n    *   **PCIe x1, PCIe port 1, 2, 3**\n    *   **MMC** (This line connects to an intermediate block labeled **eMMC (Option)**)\n    *   **Camera Support (CSI 4L/1L)**\n    *   **2x Serial (incl. RTS/CTS)+PCU-UART**\n    *   **USB 2.0, ports 0,1,2**\n    *   **USB 3.0 on AFB**\n    *   **SATA0**\n    *   **SDIO x4**\n    *   **Power Management**\n\n*   **Intermediate Components:**\n    *   **LVDS RTD2136**: Connected to the Golden finger via 'LVDS 18/24-bit single' and to the SoC via 'DDIO'.\n    *   **GPIO PCA9535A**: Connected to the Golden finger via '12x GPIO (5x reserved for CSI)' and to the SoC via 'SM Bus' and 'INT'.\n    *   **LAN i210IT**: Connected to the Golden finger via 'GbE' and to the SoC via 'PCIe x1'.\n    *   **BMC HWM**: Connected to the Golden finger via 'Boot Select' and '2x I²C'. Connected to the SoC via 'SMB'. Connected vertically to **SPI BIOS**.\n    *   **SPI BIOS**: Connected to the BMC HWM and to the SoC via '2x SPI'.\n\n**Right-Side Connections:**\n*   **DDR3L Memory down 2/4 GB ECC**: Connected to the SoC via 'DDR3L 1066/1333MHz'.\n*   **PMIC IDTP9145**: Connected directly to the SoC.\n*   **Debug Connector for DB40**: Connected to the SoC via 'LPC'.](.lec-bt-2016-en/12a67000122693b4a3c499bf7409e283257d06bc1ceabbc024c640bc4f124267.jpg)

# Ordering Information

● LEC-BT4-4G-8G-ER
SMARC Full Size Module with Intel® Atom™ E3845, quad core, 4 GB DDR3L, 8 GB eMMC, Extreme Rugged™ operating temperature: -40°C to +85°C
● LEC-BT2-2G-8G-ER
SMARC Full Size Module with Intel® Atom™ E3826, dual core, 2 GB DDR3L, 8 GB eMMC, Extreme Rugged™ operating temperature: -40°C to +85°C
. LEC-BT1-2G-8G-ER
SMARC Full Size Module with Intel® Atom™ E3815, single core, 2 GB DDR3L, 8 GB eMMC, Extreme Rugged™ operating temperature: -40°C to +85°C
● LEC-BT-HS
Heatspreader for LEC-BTS

\*other configurations by request
[🔗 Link to the original document](.lec-bt-2016-en/lec-bt-2016-en.pdf)