# LEC-BTS

# SMARC ® Short Size Module with Intel ® Atom™

# Processor E3800 Series System-on-Chip

# Features

● Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip
● Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
● HDMI and LVDS
● GbE, camera interface
● 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
● Extreme Rugged™ operating temperature: -40°C to 85°C

![Green printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-bts-datasheet-en-1/e6b7ff6c2f7492124a15a2d4ffba6d3d1c5319a97f7ba019e7e357bbac9f3e85.jpg)

# Specifications

# ● Core System

# CPU

Intel® Atom ™ E3800 Series, single, dual or quad-core SoC with integrated graphics Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP

Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP

Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz, 5 W TDP

# Memory

Up to 4 GB DDR3L at 1066/1333 MHz, memory down non-ECC

# Embedded BIOS

AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support

# Cache

512 kB to 2 MB L2 cache

# SEMA Board Controller

Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control

# ● Audio

# Chipset

Intel® HD Audio integrated in SoC

# Ports

1x I²S and 1x HDA for audio codec on carrier

# . Ethernet

# Intel® MAC/PHY

1x Intel® i210-IT Ethernet controller

# Interface

10/100/1000 GbE

# ● I/O Interfaces

# PCIe

3x PCIe x1 Gen2

# USB

1x USB 3.0 + 3x USB 2.0

# SATA

1x SATA 3 Gb/s

# SDIO

1x SDIO (4-bit)

# Camera

CSI 4L/1L

# Serial

2x SPI, 2x I2C, 1x I2S, Power Management, 2x UART

# MMC

1x MMC interface to carrier

# GPIO

12x GPIO, 5x used for camera, 7x available

# ● Video

# GPU Feature Support

7th generation Intel® graphics core architecture with four execution units, supports two independent displays 2D and 3D graphics hardware acceleration Support for DirectX 11.1, OGLES 2.0, OGL 3.2

Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats

Video encode HW acceleration for H.264, MPEG2 formats

# LVDS

Single channel 18/24-bit LVDS from DDI0

# HDMI/DP++

HDMI 1.4a from DDI1

# ● Power

# Standard Input

3.0 V\~5.25 V DC ±5%

# Power States

C0-C6, S0, S3, S4, S5

# ● Mechanical and Environmental

# Form Factor

SMARC Specifications v1.1

# Dimension

SMARC full size module, 82 mm x 80 mm

# Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged: -40ºC to +85ºC

# Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

# HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operation System

# Standard Support

Linux, VxWorks, Windows 7/8, indows Embedded, Compact 7

# Extended Support (BSP)

QNX, Android

# Intelligent Middleware

# SEMA®

Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM)

![The image displays the word 'SEMA' in bold, white, italicized capital letters. The text is set against a background featuring horizontal stripes of color that transition from yellow on the left to orange and reddish-brown on the right.](.lec-bts-datasheet-en-1/9dc2c57b66d965bc866ceb75403ae4a764dd882bfb38daff91a141437c8aad1b.jpg)

# Functional Diagram

![Based on the provided flowchart, here are the labeled blocks and their connections:\n\n**Labeled Blocks:**\n*   **314-pin Golden finger** (Large vertical block on the left)\n*   **Intel® Bay Trail-I SoC** (Large vertical block in the center)\n*   **LVDS RTD2136** (Top left small block)\n*   **GPIO PCA9535A** (Middle left small block)\n*   **LAN i210IT** (Middle left small block)\n*   **BMC HWM** (Bottom left small block)\n*   **SPI-BIOS** (Bottom left small block, below BMC HWM)\n*   **DDR3L Memory down 2/4 GB** (Top right block)\n*   **PMIC IDTP9145** (Middle right block)\n*   **Debug Connector for DB40** (Bottom right block)\n\n**Connections:**\n\n*   **LVDS RTD2136**: Connected to **314-pin Golden finger** via 'LVDS 18/24bit Single channel' and to **Intel® Bay Trail-I SoC** via 'DDI0'.\n*   **DDI1 (HDMI)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **Audio (HDA or I2S)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **2x I2C (LCD/GP)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **12x GPIO (5x reserved for CSI)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **GPIO PCA9535A**: Connected to **Intel® Bay Trail-I SoC** via 'SMBus' and 'INT'.\n*   **LAN i210IT**: Connected to **Intel® Bay Trail-I SoC** via 'PCIe x1' and to **314-pin Golden finger** via 'GbE'.\n*   **PCIe x1, PCIe port 1,2,3**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **MMC (8bit)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **Camera Support (CSI 4L/1L)**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **2x Serial (incl. RTS/CTS) + PCU-UART**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **USB2.0 port 0: client or host**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **3x USB2.0 host**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **1x USB3.0 host on AFB**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **2x SATA**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **SDIO x4**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **Power Management**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **BMC HWM**: Connected to **314-pin Golden finger** via 'BOOT Select' and '2x I2C'. Connected to **Intel® Bay Trail-I SoC** via 'SMB'.\n*   **SPI-BIOS**: Connected to **BMC HWM**. Connected to **Intel® Bay Trail-I SoC** via 'SPI'.\n*   **1x SPI**: Connects **314-pin Golden finger** and **Intel® Bay Trail-I SoC**.\n*   **DDR3L 1066/1333MHz**: Connects **Intel® Bay Trail-I SoC** and **DDR3L Memory down 2/4 GB**.\n*   **PMIC IDTP9145**: Connected to **Intel® Bay Trail-I SoC** (no text label on the connection line).\n*   **LPC**: Connects **Intel® Bay Trail-I SoC** and **Debug Connector for DB40**.](.lec-bts-datasheet-en-1/99797689fbe27b01b1b5271faa5a12ddbc2701e92e52a1942af5b7e36a5029ce.jpg)

# Ordering Information

● LEC-BTS4-2G-ER

SMARC Short Size Module with Intel Atom™ E3845, quad core, 2 GB DDR3L, -40°C to +85°C

● LEC-BTS2-2G-ER

SMARC Short Size Module with Intel® Atom™ E3826, dual core, 2 GB DDR3L, -40°C to +85°C

● LEC-BTS1-2G-ER

SMARC Short Size Module with Intel Atom™ E3815, single core, 2 GB DDR3L, -40°C to +85°C

● LEC-BTS4-4G-ER

SMARC Short Size Module with Intel Atom E3845, quad core, 4 GB DDR3L, -45°C to 85°C

● LEC-BTS20-2G-ER

SMARC Short Size Module with Intel Atom E3805, dual core, headless, 2 GB DDR3L, -45°C to 85°C

● LEC-BTS21-2G-CT

SMARC Short Size Module with Intel Celeron N2807, dual core, 2 GB DDR3L, 0°C to 60°C

● LEC-BTS-HS

Heatspreader for LEC-BTS

\*other configurations by request
[🔗 Link to the original document](.lec-bts-datasheet-en-1/lec-bts-datasheet-en-1.pdf)