# LEC-BW # SMARC ® Short Size Module with Intel ® Pentium™ and Celeron™ # Processor N3000 Series System-on-Chip # Features ● Dual or quad-core Intel® Pentium™ and Celeron™ Processor N3000 Series SoC ● Up to 8 GB DDR3L at 1333/1600 MT/s ● LVDS, HDMI and DP ● 2x camera interfaces, GbE ● 1x SDIO/SD/MMC, 2x SATA3 6Gbit/s, 1x USB 3.0, 2x USB 2.0, 12x GPIO, 2x SPI, 4x I2C ![Green printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-bw-2016-en/60e62d966fb289d1fbc85506d7848a27ae5b15a4e9cbff6c2d551e142e5fa519.jpg) # Specifications # ● Core System Intel® Pentium™ N3710, 4 cores, 1.6GHz, 6W TDP Intel® Celeron™ N3160, 4 cores, 1.6GHz, 6W TDP Intel® Celeron™ N3060, 2 cores, 1.6GHz, 6W TDP Intel® Celeron™ N3010, 2 cores, 1.0GHz, 4W TDP Intel® Atom™ x5-E8000, 4 cores, 1.0GHz, 5W TDP # Memory Up to 8 GB DDR3L at 1333/1600 MT/s single channel, 64bit # Embedded BIOS AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support # Cache 512 kB to 2 MB L2 cache # SEMA Board Controller Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control # . Audio # Chipset Intel® HD Audio integrated in SOC # Ports I²S and HDA for audio codec on carrier # . Ethernet Intel® MAC/PHY 1x Intel® i210IT Ethernet controller # Interface 10/100/1000 GbE # ● Video # GPU Feature Support 8th generation Intel® graphics core architecture with sixteen execution units, supports three independent displays 4K video (up to 3840 x 2160 @ 30fps), 2D and 3D graphics hardware acceleration Support for DirectX 12/11.2, OpenGL 4.2/3.3, OpenCL 1.2 Video decode HW acceleration for H.265, H.264, MPEG2, MVC, VC-1, WMV9, JPEG, VP8 Video encode HW acceleration for H.264, MVC, JPEG # LVDS Single channel 18/24-bit LVDS # HDMI HDMI (3840 x 2160 @ 30Hz) # Custom option 3rd display HDMI/DP, 2nd LVDS channel # ● I/O Interfaces # PCIe 3x PCIe x1 Gen2 # USB 1x USB 3.0 host, 2x USB 2.0 host, 1x USB 2.0 client # SATA 2x SATA3 6 Gbit/s # Flash storage 1x SDIO (4bit), 1x eMMC (8bit) # GPIO 12x GPIO # Camera 2x MIPI CSI 4L/2L # Serial 2x SPI, 4x I²C, 2x UART, 1x SMBus, 1x LPC, 1x DB40 # ● Power Standard Input 3.0 V \~ 5.25 V DC ±5% # Power States Supports C0-C6, S0, S3, S4, S5 # Mechanical and Environmental # Form Factor SMARC Specifications v1.1 # Dimension SMARC short size module, 82 mm x 50 mm # Operating Temperature Standard: 0°C to +60°C # Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # . Operation System # Standard Support Windows 7/8.1/10, Linux, Android # On Request QNX, Android # Intelligent Middleware # SEMA® ![The image displays a logo featuring the text 'SEMA' in large, white, italicized capital letters. The background is a horizontal gradient transitioning from yellow on the left to orange on the right. A white horizontal line runs through the center of the letters.](.lec-bw-2016-en/234e011efecf4fd95f1ddc10a75a4865bd2561c5f19449d7cf1623c6bb7633b2.jpg) Local management, control of embedded computer systems Extended EAPI for monitoring, controlling and analytics applications Multiple OS support and across platforms (x86, ARM) Functional Diagram ![This diagram illustrates the connectivity of an **Intel® Braswell M/D SoC** (System on Chip).\n\n**Labeled Blocks:**\n* **314-pin Golden finger** (Vertical block on the left)\n* **Intel® Braswell M/D SoC** (Central vertical block)\n* **DDR3L Memory down 1/2/4/8GB** (Top right)\n* **PMIC IDT P9180** (Middle right)\n* **Debug Connector for DB40** (Bottom right)\n* **LVDS NXP** (Intermediary block, left side)\n* **GPIO PCA9535A** (Intermediary block, left side)\n* **LAN i211** (Intermediary block, left side)\n* **BMC** (Intermediary block, bottom left)\n* **SPI-BIOS** (Intermediary block, bottom left)\n\n**Connections:**\n\n* **SoC to DDR3L:** Connected via **DDR3L 1600MHz**.\n* **SoC to PMIC:** Direct connection to **PMIC IDT P9180**.\n* **SoC to Debug:** Connected via **LPC, SPI** to **Debug Connector for DB40**.\n* **SoC to 314-pin Golden finger (Direct Lines):**\n * **Custom option: DDI0 (HDMI/DP)**\n * **DDI2 (HDMI)**\n * **HDA**\n * **4x I2C (some reserved)**\n * **PCIe x1, PCIe port 1,2,3**\n * **1x eMMC (8bit)**\n * **2x Camera (MIPI CSI 4L/2L)**\n * **2x UART (1x RTS/CTS)**\n * **1x USB2.0 client**\n * **2x USB2.0 host**\n * **USB3.0 host on AFB**\n * **SATA0**\n * **SATA1 on AFB**\n * **1x SDIO (4bit)**\n * **Power Management**\n * **1x SPI** (Two separate lines at the very bottom)\n* **SoC to 314-pin Golden finger (Via Intermediates):**\n * **LVDS Path:** **LVDS 18/24bit SC/DC** connects the Golden finger to **LVDS NXP**, which connects to the SoC via **DDI1**.\n * **GPIO Path:** **12x GPIO (4x CSI, 1x HDA)** connects the Golden finger to **GPIO PCA9535A**, which connects to the SoC via **SMBus**.\n * **LAN Path:** **GbE** connects the Golden finger to **LAN i211**, which connects to the SoC via **PCIe x1**.\n * **BMC Path:** **BOOT Select** connects the Golden finger to **BMC**, which connects to the SoC via **SMBus**.\n * **SPI-BIOS Path:** **SPI** connects the SoC to **SPI-BIOS**.](.lec-bw-2016-en/1810b9644392ee2b83b0d9bda4f2edf615e11b121bfb19013b2e60c6732160c9.jpg) # Ordering Information ● LEC-BW42-4G-CT SMARC Short Size Module with Intel® Pentium™ N3710, Quad core, 4 GB DDR3L, 0°C to 60°C ● LEC-BW41-4G-CT SMARC Short Size Module with Intel® Celeron™ N3160, Quad core, 4 GB DDR3L, 0°C to 60°C ● LEC-BW21-2G-CT SMARC Short Size Module with Intel® Celeron™ N3010, Dual core, 2 GB DDR3L, 0°C to 60°C ● LEC-BW22-2G-CT SMARC Short Size Module with Intel® Celeron™ N3060, Dual core, 2 GB DDR3L, 0°C to 60°C ● LEC-BW43-4G-CT SMARC Short Size Module with Intel® Atom™ x5-E8000, Quad core, 4 GB DDR3L, 0°C to 60°C . LEC-BW42-8G-CT SMARC Short Size Module with Intel® Pentium™ N3710, Quad core, 8 GB DDR3L, 0°C to 60°C ● LEC-BW-HS Heatspreader for LEC-BW ● LEC-BW-HS2 Passive Heatsink for LEC-BW [🔗 Link to the original document](.lec-bw-2016-en/lec-bw-2016-en.pdf)