# LEC-EL # SMARC 2.1 Short Size Module with intel Atom® series # Features ● Dual or quad-core Intel Atom® Series SMARC revision 2.1.1 compliant ● Up to 16GB LPDDR4 at 4266 MT/s . Dual channel LVDS 918/24-bit) ● DP++, DP++ / HDMI . 1x SATA Gen 3 / onboard eMMC up to 256 GB ● 10 year product availability ● Dual CAN bus ● USB2/ USB 3 interfaces ● Dual 2.5 gigabit ethernet ports ![Close-up of a blue printed circuit board with integrated circuits and components (no readable text or symbols)](.lec-el-datasheet-20241101/8fcc936bb9afc65283be49dea5c1aa05efe324c1afd747d6b76fd9535e013954.jpg) # Specifications # ● Core System # CPU Intel Atom® X6425E,4 cores, 1.8GHz, 12W TDP Intel Atom® X6413,4 cores, 1.5GHz, 9W TDP Intel Atom® X6211E,2 cores, 1.2GHz, 6W TDP Intel Atom® X6200FE,2 cores, 1.0GHz, 4.5W TDP (FUSA) Intel Atom® X6414RE, 4 cores, 1.5GHz, 9W TDP Intel Atom® X6425RE, 4 cores, 1.9GHz, 12W TDP # Memory 2, 4, 8, 16 GB LPDDR4L-4266 (In Band ECC) # Cache 1.5 MB system L2 cache 4MB LLC # Security Intel® Boot Guard Intel® OS Guard Intel® Platform Trust Technology (Intel® PTT) Intel® AES-New Instruction, Intel® SHA Extensions Intel® Secure Key Digital Rights Management HDCP 2.3-Playready 4 SMx Crypto Support Intel® Virtualization Technology (Intel® VT) Intel® Dynamic Application Loader (Intel® DAL) Optional ATECC608 Crypto chip Optional TPM 2.0 module # . Video # GPU Core Gen 11LP 4Kp60 @ 3 displays simultaneous # GPU Feature Support 11th generation Intel® graphics core architecture with up to 32 execution units (selected SKUs) , supports three independent displays 2D and 3D graphics hardware acceleration Support for DirectX 12, OpenGL 4.2, OpenCL 1.2 Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/ MJPEG, VP8, VP9Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MV # HDMI HDMI 2.0b 4K@60 Hz # LVDS Dual Channel LVDS 18/24 bit # ● System Storage # SDIO 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 # eMMC 16, 32, 64 or 128 GB (build option) Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1 # SATA 1x SATA Gen3 # Specifications # ● SEMA® Board Controller Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan Control # Debug Header 30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration # ● Audio # Audio Codec HDA Audio codec (located on carrier) # ● Dual Ethernet # Primary LAN 10/100/1000/ 2.5 Gbit Ethernet # Secondary LAN 10/100/1000/ 2.5 Gbit Ethernet # ● Extension Busses # USB 2x USB 3.0, 4x USB 2.0 # UART Four UART interfaces, SER1 and SER3(CTS/RTS)/SER0 SER2(TX/RX/CTS/RTS) # CAN 2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps # SPI 2x SPI # 2x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support) # I 2 C Four I2C interfaces \- Support for 7-bit and 10-bit address mode \- Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus” # GPIO 14x GPIO with interrupt, one GPIO with PWM # PCIe 4x PCIe x1 Gen3 # ● Power # Input 5Vdc +/- 5% # ● Mechanical and Environmental # Form Factor SGET SMARC Specifications 2.1 # Dimension SMARC short size module 82 mm x 50 mm # Operating Temperature Standard: 0°C to +60°C Rugged: -40°C to +85°C (optional) # 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) # Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D # HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operating systems # Standard Support Windows 10 IoT Enterprise 64-bit, Windows 10 64-bit, Yocto Linux 64-bit, Ubuntu (TBC) # Extended Support (BSP) Yocto project based Linux 64-bit, VxWorks 64-bit (TBC) Functional Diagram ![Based on the provided flowchart, here is an accurate and concise description of the blocks and connections:\n\n**Central Component**\n* A large pink rectangle labeled **'Elkhart Lake SOC'** and **'SMARC 2.1'**.\n\n**Left-Side Interfaces & Intermediate Components (Connecting to SOC)**\n* **Display/Video:**\n * **'4K HDMI / DP'** and **'4K DP++ / HDMI'** connect directly to **'DDI2'** and **'DDI1'**.\n * **'LVDS/DSI/eDP'** connects via a dashed box labeled **'DSI option'** containing **'NXP PTN3460'** to **'DDI0'**.\n* **USB/Storage:**\n * **'USB 0,1,4,5'** and **'USB 2,3'** connect directly to **'USB 2.0 HOST'** and **'USB 3.0 HOST'**.\n * **'SATA Gen3'** connects directly to **'SATA0'**.\n* **Network:**\n * **'LAN0'** connects to **'GPY211'**, which connects to **'SGMII0'**.\n * **'LAN1'** connects to **'GPY211'**, which connects to **'SGMII1'**.\n* **Expansion/Bus:**\n * **'PCle A, B, C, D'** connects directly to **'4x PClex1Gen3'**.\n * **'CAN0'** and **'CAN1'** connect directly to **'CAN'** and **'CAN'**.\n * **'14x GPIO'** connects to **'SX1509'**, which connects via a line labeled **'INT'** to **'GPIO INT'**.\n * **'SMB'** connects to **'SX1509'**, which connects to **'SMB'**.\n * **'SDIO'** connects directly to **'SDIO'**.\n * **'SER 2/3'** connects directly to **'HSUART'**.\n* **Management/Boot:**\n * **'eSPI'**, **'SER 0/1'**, and **'BOOT Select'** all connect to **'BMC/EC IT5121'**, which connects to **'eSPI'**.\n * **'SPI'** connects to **'SPI BIOS'**, which connects via a line labeled **'SPI'** to **'FSPI'**.\n* **Audio/Bus:**\n * **'4x I2C'**, **'SDIO'**, and **'HDA/I2S'** connect directly to **'I2C'**, **'SDIO'**, and **'HDA/I2S'**.\n* **Power:**\n * **'Power Management'** connects directly to **'PM'**.\n\n**Right-Side Components (Connected to SOC)**\n* Four separate blocks labeled **'LPDDR4 x32'**.\n* One block labeled **'eMMC 16/32/64GB'**.\n* One block labeled **'TPM 2.0'** connected via a line labeled **'SPI'**.\n* One block labeled **'Crypto ATECC608'** connected via a line labeled **'I2C'**.\n* One block labeled **'30-pin debug'**.\n* One block labeled **'Discrete Power'**.](.lec-el-datasheet-20241101/512b8cb7f24b10cee2cfa1712c96966fdc83de1e415ce79171b3ac1abbae1368.jpg) # Ordering Information ● LEC-EL-6211E-2G-32G-CT SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6211E, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6211E-2G-32G-ER SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6211E, 2 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C ● LEC-EL-6211E-4G-32G-CT SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6211E, 4 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6211E-4G-32G-ER SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6211E, 4 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C ● LEC-EL-6413E-2G-32G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6413E, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6413E-2G-32G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6413E, 2 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C ● LEC-EL-6413E-4G-32G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6413E, 4 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6413E-4G-32G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6413E, 4 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C ● LEC-EL-6425E-4G-64G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425E, 4 GB LPDDR4, 64 GB eMMC, 0°C to 60°C ● LEC-EL-6425E-4G-64G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425E, 4 GB LPDDR4, 64 GB eMMC, - 40°C to 85°C ● LEC-EL-6425E-8G-64G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425E, 8 GB LPDDR4, 64 GB eMMC, 0°C to 60°C ● LEC-EL-6425E-8G-64G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425E, 8 GB LPDDR4, 64 GB eMMC, - 40°C to 85°C ● LEC-EL-6200FE-2G-32G-CT SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6200FE, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6200FE-2G-32G-ER SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6200FE, 2 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C LEC-EL-6200FE-4G-64G-CT SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6200FE, 4 GB LPDDR4, 64 GB eMMC, 0°C to 60°C ● LEC-EL-6200FE-4G-64G-ER SMARC 2.1 Short Size Module with dual Core Intel Elkhart Lake x6200FE, 4 GB LPDDR4, 64 GB eMMC, - 40°C to 85°C ● LEC-EL-6414RE-2G-32G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6414RE, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6414RE-2G-32G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6414RE, 2 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C ● LEC-EL-6414RE-4G-32G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6414RE, 4 GB LPDDR4, 32 GB eMMC, 0°C to 60°C ● LEC-EL-6414RE-4G-32G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6414RE, 4 GB LPDDR4, 32 GB eMMC, - 40°C to 85°C . LEC-EL-6425RE-4G-64G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425RE, 4 GB LPDDR4, 64 GB eMMC, 0°C to 60°C . LEC-EL-6425RE-4G-64G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425RE, 4 GB LPDDR4, 64 GB eMMC, - 40°C to 85°C ● LEC-EL-6425RE-8G-64G-CT SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425RE, 8 GB LPDDR4, 64 GB eMMC, 0°C to 60°C ● LEC-EL-6425RE-8G-64G-ER SMARC 2.1 Short Size Module with quad Core Intel Elkhart Lake x6425RE, 8 GB LPDDR4, 64 GB eMMC, - 40°C to 85°C [🔗 Link to the original document](.lec-el-datasheet-20241101/lec-el-datasheet-20241101.pdf)