# LEC-iMX6R2 # SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex® -A9 # Features ● NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor ● Integrated 2D/3D graphics processors, 3D 1080p video processing, power management ● Onboard DDR3L-1600 system memory from 512 MB to 2 GB ● Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s ● Extreme Rugged operating temperature: -40°C to +85°C (optional) ● 15 year product availability ![Blue printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-imx6r2-20200303/4b1ebae273023849480b54ca7992dd1984d9cb1416426cb744a217b6a5091865.jpg) # Specifications # ● Core System # NXP i.MX6 Solo, DualLite, Dual or Quad processor i.MX6 Quad, 4 cores, 1.2GHz\* MHz, 1 MB L2 cache, 3 displays, 1x SATA i.MX6 Dual, 2 cores, 1.2 GHz\* MHz, 1 MB L2 cache, 3 displays, 1x SATA i.MX6 DualLite, 2 cores, 1GHz\* MHz, 512 kB L2 cache, 1 display, no SATA i.MX6 Solo, 1 core, 1 GHz\* MHz, 512 kB L2 cache, 1 display, no SATA \*Extreme Rugged operating temperature SKUs support 800 GHz CPU clock speed # Memory 512 MB up to 2GB DDR3L memory down # L2 Cache From 512 kB to 1 MB # Security Advanced security support: High Assurance Boot Cryptographic cipher engines Random number generator Tamper detection # . Video # Graphics Support GPU 3D: Vivante GC2000, 200Mtri/s 1000Mpxl/s, OpenGL® ES 3.0 and Halti, CL EP) GPU 2D: Vivante GC355 (Vector Graphics), 300 Mpxl/s, OpenVG™ 1.1 GPU 2D: Vivante GC320 (Composition), 600 Mpxl/s, BLIT Video Decode: 1080p60, H.264 Video Encode: 1080p30, H.264 BP, dual 720p encode # HDMI HDMI 1.4 up to WUXGA (1920x1080), FHD 1080p @ 30fps # LVDS Dual-channel 18/24-bit max, 1600 x 1200 @ 30fps Single-channel 18/24-bit max, 1366 x 768 @ 30fps # ● MIPI DSI # Camera MIPI CSI-2 serial camera port ● Audio Audio Codec Supports SGTL5000 codec ● Dual Ethernet Interface 10/100/1000 GbE Ethernet Phy # ● Expansion Busses PCIe 1x PCI Express x1 Gen2 # USB 4x USB 2.0 host, 1x USB OTG # UART 4x UART interfaces: Tx/Rx/CTS/RTS (SER0, SER2) and Tx/Rx (SER1, SER3) # CAN 2x CAN 2.0B only or mixed CAN 2.0B and CAN FB mode, data bit rate up to 8 Mbps # SPI 2x SPI # I 2 S 3x I2 S interfaces # 3x I2 C interface # GPIO 12x GPIO with interrupt # Specifications # ● System Storage SDIO 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 eMMC 8, 16, or 32 GB (64 GB by build option), compatible with eMMC specification 4.41, 4.51, 5.0, 5.1 # ● SEMA Board Controller Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer # ● Debug Header 30-pin multipurpose flat cable connector for use with optional DB-30 ARM debug module providing JTAG, BMC access, UART, power testpoints, diagnostic LEDs, power, reset, boot configuration # ● Mechanical and Environmental Form Factor SGET SMARC Hardware Specification 2.1 Dimension SMARC short size module, 82 mm x 50 mm Operating Temperature Standard: 0°C to +60°C Extreme Rugged: -40°C to +85°C (optional) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test # ● Operation System Yocto Linux BSP at https://github.com/ADLINK/meta-adlink-nxp Ubuntu 18.04 basic support # Functional Diagram ![**Central Block:**\n* **Main Label:** 'NXP i.MX6'\n* **Variants:** 'Solo', 'Dual Lite', 'Dual', 'Dual Plus', 'Quad', 'Quad Plus'\n* **Standard:** 'SMARC Rev. 2.1'\n\n**Left Side (314-pin Edge Connector):**\n* **Vertical Label:** '314-pin Edge Connector'\n* **Connections (Top to Bottom):**\n * 'Dual Channel LVDS 18/24-bit' / 'Single DSI 2 lane' (Double arrow)\n * 'HDMI 1.4' (Double arrow)\n * 'MIPI CSI 4-lane Camera' (Double arrow)\n * 'LAN GbE' (Arrow pointing left) connected to 'LAN PHY' (box) connected via 'RGMII' (Arrow pointing right) to the Central Block.\n * **Optional Block:** 'LAN + USB Hub' (labeled 'optional')\n * Arrows pointing left to connector: 'LAN 10/100', '1x USB 2.0' (x4)\n * Arrow pointing right from Central Block: 'USB 2.0'\n * 'USB0 OTG' (Double arrow)\n * 'PCIe' (Double arrow)\n * 'SATA 3Gb/s' (Double arrow)\n * 'SDIO (4-bit)' (Double arrow)\n * '4x UART (2x 4, 2x 2)' (Double arrow)\n * '2x CAN 2.0' (Double arrow)\n * 'I2S' (Double arrow)\n * 'SPI0 / SPI1' (Double arrow)\n * '12x GPIO' (Double arrow)\n * 'I2C_PM' (Double arrow) with an arrow pointing up to 'PMIC' (box).\n * 'I2C_GP' (Double arrow) with a dotted arrow pointing up to 'Crypto' (dotted box).\n * 'Watchdog / Boot Select / Power Management' (Arrow pointing left to connector, Arrow pointing up to Lite BM C).\n\n**Right Side (Peripherals):**\n* **Memory:** 4 boxes labeled 'Memory DDR3L' (Double arrows connecting to Central Block).\n* **Storage:** 'eMMC 4-64 GB' (Double arrow).\n* **Flash:** 'Flash' (box) connected via 'SPI0' (Arrow pointing right).\n* **Debug:** '30-pin Debug Connector' (Double arrow).\n* **RTC:** 'RTC' (box) connected via double arrow.\n* **Management:** 'Lite BM C' (box) connected via double arrow to the Central Block and double arrow to 'RTC'.](.lec-imx6r2-20200303/f3f39aba1e2f82365cef46957b19983f3ec577e372379bb1d284d0f952463615.jpg) # Ordering Information ● LEC-iMX6R2-DL-512M-16G-CT SMARC Short Size Module with NXP i.MX6, Dual Lite, 512 MB DDR3L and 16 GB eMMC, 0°C to +60°C ● LEC-iMX6R2-DL-512M-16G-ER SMARC Short Size Module with NXP i.MX6, Dual Lite, 512 MB DDR3L and 16 GB eMMC, -40°C to +85°C ● LEC-iMX6R2-D-1G-16G-CT SMARC Short Size Module with NXP i.MX6, Dual, 1 GB DDR3L and 16 GB eMMC, 0°C to +60°C ● LEC-iMX6R2-D-1G-16G-ER SMARC Short Size Module with NXP i.MX6, Dual, 1 GB DDR3L and 16 GB eMMC, -40°C to +85°C ● LEC-iMX6R2-Q-2G-16G-CT SMARC Short Size Module with NXP i.MX6, Quad, 2 GB DDR3L and 16 GB eMMC, 0°C to +60°C ● LEC-iMX6R2-Q-2G-16G-ER SMARC Short Size Module with NXP i.MX6, Quad, 2 GB DDR3L and 16 GB eMMC, -40°C to +85°C ● LEC-iMX6R2-QP-4G-16G-CT SMARC Short Size Module with Quad Plus NXP i.MX6, 4 GB DDR3L and 16 GB eMMC, 0°C to +60°C ● LEC-iMX6R2-QP-4G-16G-ER SMARC Short Size Module with Quad Plus NXP i.MX6, 4 GB DDR3L and 16 GB eMMC, -40°C to +85°C # Accessories # Heat Solutions ● HTS-SiMX6R2-SDL Heat spreader for LEC-iMX6R2 with Solo and DualLite SOCs (standard and Extreme Rugged temperature range) ● HTS-SiMX6R2-DQP Heat spreader for LEC-iMX6R2 with Dual/Quad/DualPlus/ QuadPlus SOCs (standard and Extreme Rugged temperature range) ● THS-SiMX6R2-SDL Low profile heatsink for LEC-iMX6R2 with Solo and DualLite SOCs (standard temperature range) ● THS-SiMX6R2-DQP Low profile heatsink for LEC-iMX6R2 with Dual/Quad/DualPlus/ QuadPlus SOCs (standard temperature range) [🔗 Link to the original document](.lec-imx6r2-20200303/lec-imx6r2-20200303.pdf)