# LEC-IMX8MM

# SMARC 2.1 Short Size Module with

# NXP i.MX 8M Mini series

![Close-up of a blue printed circuit board with various electronic components and gold contacts (no readable text or symbols)](.lec-imx8mm-datasheet-20220729/4476f88869bdf8e16378238828bcdb9ae23b09f32b667119c377b60f785328e8.jpg)

# Features

• NXP® i.MX 8M Mini series with Dual/Quad-core ARM Cortex-A53
• SMARC revision 2.1 compliant
• LVDS, DSI graphic output interfaces
• -40°C to 85°C rugged operating temperature (standard SKU consumer temp, option)

• 10-year product availability

• CAN bus

• USB 2.0 interfaces

• Dual GbE ports (LAN 2 occupying PCIe)

• i2s audio codec interface

Specifications

<table><tr><td rowspan="4">Processor &amp; System</td><td>SoC</td><td>NXP®i.MX 8M Mini series with Dual/Quad-core ARM Cortex-A53 TrustZone technology for ARMv8 security extensions</td></tr><tr><td>Memory</td><td>1,2,4GB LPDDR4</td></tr><tr><td>L2 Cache</td><td>512KB system L2 cache (ECC)</td></tr><tr><td>Security</td><td>Arm®TrustZone®(TZ) architecture: Cortex®-A53 MPCore TrustZone® supportHigh Assurance Boot (HAB)Cryptographic Acceleration and Assurance Module (CAAM)Widevine and PlayReady content protection support</td></tr><tr><td rowspan="3">Video</td><td>GPU Core</td><td>Vivante GC NanoUltra</td></tr><tr><td>GPU Feature Support</td><td>GC NanoUltra OpenGL ES 2.0Vulkan, OpenCL 1.2; GC320 (2D)</td></tr><tr><td>VPU Feature Support</td><td>1080p60 VP9, H.264, H.265Video encoding includes:1080p60 AVC/H.264 Encoder1080p60 HEVC/H.264 Encoder1080p60 VP8 Encoder</td></tr></table>

Specifications

<table><tr><td rowspan="3">Video</td><td>MIPI DSI</td><td>1x MIPI DSI 4 lanes</td></tr><tr><td>LVDS</td><td>Dual Channel LVDS port 18/24 bit over SN65DSI84ZXHR bridge</td></tr><tr><td>Camera</td><td>MIPI CSI RX InterfaceCompatible with MIPI Alliance Interface specification v1.2Up to 4 data lanes (1.0Gbps per lane)MIPI-HS, MIPI-LP mode support</td></tr><tr><td rowspan="2">System Storage</td><td>SDIO</td><td>1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0</td></tr><tr><td>eMMC</td><td>16 — 128 GB (build option)Compatible with eMMC specification 4.41, 4.51, 5.0, and 5.1</td></tr><tr><td>Debug Header</td><td colspan="2">30-pin multipurpose flat cable connector for DB-30 debug module (option)Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration</td></tr><tr><td>Audio</td><td>Audio Codec</td><td> $I^{2}S$  audio codec (on carrier)</td></tr><tr><td rowspan="2">Dual Ethernet</td><td>Primary LAN</td><td>MAC 10/100/1000 Ethernet Controller on SoC</td></tr><tr><td>Secondary LAN</td><td>PCIe 10/100/1000 Ethernet Controller (option)</td></tr><tr><td rowspan="2">Wireless Communication</td><td>WIFI</td><td>IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN (option)</td></tr><tr><td>Bluetooth</td><td>Bluetooth 5.0, complaint with Bluetooth 2.1 + Enhanced Data Rate (EDR)(option)</td></tr><tr><td rowspan="8">Extension Busses</td><td>USB</td><td>1x USB 2.0, 1x USB 2.0, OTG (optional 4-port USB hub, USB2514B-I/M2)</td></tr><tr><td>UART</td><td>4 UART interfaces: SER1 and SER 2 (CTS/RTS) / SER0 and SER4 (TX/RX/CTS/RTS)</td></tr><tr><td>CAN</td><td>1x CAN2.0B only or mixed CAN2.0B and CAN FD mode; data bit rateup to 8 Mbps (option)</td></tr><tr><td>SPI</td><td>2x SPI</td></tr><tr><td> $I^{2}S$ </td><td>1x  $I^{2}S$  interface with audio resolution from 16 to 32 bits and samplerate up to 192kHz (see Audio Codec support)</td></tr><tr><td> $I^{2}C$ </td><td>4x  $I^{2}C$  interfaces- 7-bit and 10-bit address mode support- Software programmable clock frequency of 100 kbit/s in Standard-mode,400 kbit/s in Fast-mode or 1 Mbit/s in Fast-mode Plus</td></tr><tr><td>GPIO</td><td>14x GPIO with interrupt, one GPIO with PWM</td></tr><tr><td>PCIe</td><td>1x PCIe x1 Gen2</td></tr><tr><td>Power</td><td>Input</td><td>5Vdc +/- 5%</td></tr><tr><td rowspan="6" colspan="2">Mechanical and Environmental Form Factor</td><td>SGET SMARC Specification 2.1</td></tr><tr><td>DimensionSMARC short size module 82 mm x 50 mm</td></tr><tr><td>Operating Temperature Standard: 0°C to 60°CRugged: -40°C to 85°C (option)</td></tr><tr><td>Humidity5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td rowspan="2">Operating systems</td><td>Standard Support</td><td>Yocto Linux BSP, Android</td></tr><tr><td>Extended Support (BSP)</td><td>Vxworks</td></tr></table>

Ordering Information

<table><tr><td>Part name</td><td>Description/Configuration</td></tr><tr><td>LEC-IMX8MM-Q-1G-32G-ER</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI, 1 GB LPDDR4, 32 GB eMMC, -40°C to 85°C</td></tr><tr><td>LEC-IMX8MM-Q-2G-32G-ER</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI, 2 GB LPDDR4, 32 GB eMMC, -40°C to 85°C</td></tr><tr><td>LEC-IMX8MM-Q-4G-32G-ER</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI, 4 GB LPDDR4, 32 GB eMMC, -40°C to 85°C</td></tr><tr><td>LEC-IMX8MM-Q-1G-32G-CT</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI, 1 GB LPDDR4, 32 GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-IMX8MM-Q-2G-32G-CT</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-IMX8MM-Q-4G-32G-CT</td><td>SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-MINI. 4 GB LPDDR4, 32 GB eMMC, 0°C to 60°C</td></tr></table>

Block Diagram

![The image displays a block diagram centered around a large pink rectangle labeled **'NXP® i.MX 8M Mini'**. This central chip is connected to various peripheral components and interfaces on the left and right sides.\n\n**Left Side Interfaces (Headers):**\nA column of labels on the far left lists various pins and interfaces:\n*   **DSI0, LVDS0, LVDS1**\n*   **CSI1**\n*   **USB0, USB1, USB2, USB3, USB4**\n*   **GbE0, GbE1**\n*   **PCIe0**\n*   **CAN0**\n*   **SPI1, SPI0**\n*   **UART0, UART1, UART2, UART3**\n*   **I²S**\n*   **SDIO**\n*   **GPIO**\n*   **I²C_GP, I²C_PM**\n\n**Central Chip Connections:**\nThe chip itself has labels indicating its internal interfaces:\n*   **DSI 4 lanes**\n*   **MIPI CSI 4-lanes**\n*   **USB 2.0 OTG**\n*   **USB 2.0 Host**\n*   **RGMII**\n*   **1x PCIe x1**\n*   **ESPI CS1**\n*   **ESPI CS0**\n*   **UART x4**\n*   **I²S**\n*   **SDMMC**\n*   **GPIO x13**\n\n**Intermediary Blocks (Between Left Headers and Central Chip):**\nSeveral blocks sit between the left headers and the central chip:\n*   **DSI to LVDS:** A white box connected to **DSI0**, **LVDS0**, **LVDS1** on the left and connecting to **DSI 4 lanes** on the chip via an orange line. (Note: **DSI0** also has a direct blue line to **DSI 4 lanes**).\n*   **USB hub:** A white box positioned over the **USB1-USB4** lines.\n*   **DM9119INX:** A blue box connected to **GbE0** on the left and **RGMII** on the chip.\n*   **RTL8119i-CG:** A white box connected to **GbE1** on the left and connecting to **1x PCIe x1** on the chip via an orange line.\n*   **CAN + FD:** A white box connected to **CAN0** on the left. An orange line connects it upwards to the **ESPI CS1 / ESPI CS0** lines.\n*   **TPM:** A white box connected via an orange line to **I²C_GP / I²C_PM** on the left.\n\n**Right Side Components:**\n*   **LPDDR4 x32:** A blue box at the top right showing **1 / 2 / 4 GB**. Connected to the chip.\n*   **eMCC:** A blue box below LPDDR4 showing **Up to 128GB**. Connected to the chip.\n*   **Wi-Fi / BT:** A white box connected to the chip via an orange line.\n\n**Bottom Components:**\n*   **PMIC:** A blue box at the bottom connected to the chip.\n*   **RTC Crystal + PWR:** A blue box at the bottom right connected to the chip.\n*   Text labels at the very bottom left indicate connections to the PMIC: **Watchdog, Boot Select, Power Control** and **RTC backup power**.](.lec-imx8mm-datasheet-20220729/daad6879a4ac8101351d6ea126157756eec0563a47c8582bb303cae4c2d7cd39.jpg)
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