# LEC-IMX8MP

# SMARC 2.1 Short Size Module with NXP i.MX8M Plus

# Features

● NXP i.MX8M Plus with Quad Cortex-A53
● Optional in-SoC 2.3 TOPS NPU
● SMARC revision 2.1 compliant
● LVDS, DSI, HDMI graphic output interfaces
● Dual CAN bus / USB 2.0 / USB 3.0 interfaces
● Dual GbE ports (one TSN capable)
● I2S audio codec interface
● Rugged operating temperature (optional): -40°C to 85°C
15 year product availability

![Close-up of a blue printed circuit board with integrated circuits and gold contacts (no readable text or symbols)](.lec-imx8mp-datasheet-241101/2d6e4e21782c58664474beb9546a9220eac6d7f8af2c4ab1bc9f1192baf8087b.jpg)

# Specifications

# ● Core System

# SoC

NXP i.MX8M Plus with Quad core ARM Cortex-A53

TrustZone technology supports ARMv8 Cryptography Extensions

2.3 TOPS Neural Processing Unit (optional)

# Memory

2/4/8GB LPDDR4L-4266

# L2 Cache

512KB system L2 cache (ECC)

# Security

Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR

Arm® TrustZone® (TZ) architecture: Cortex®-A53 MPCore TrustZone® support

On-chip RAM (OCRAM) secure region protection using OCRAM controller High Assurance Boot (HAB)

Cryptographic Acceleration and Assurance Module (CAAM)

Capable to support Widevine and PlayReady content protection

Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms

Real-time integrity checker (RTIC)

DRM support for RSA, AES, 3DES, DES

Side channel attack resistance

True random number generation (RNG)

Manufacturing protection support / Secure Non-Volatile Storage (SNVS)

# MIPI-DSI

1x MIPI-DSI 4 lanes

# Cameras

1x MIPI-CSI dual lane interface

1x MIPI-CSI quad lane interface

# ● Video

# GPU Core

Integrated in SoC

- GC7000UL 3D graphics with 2 high performance vec4 shaders
- GC520L 2D graphics
- Supports up to 2x 1080p60 or 1x 4kp30 display resolution
- Up to 3 independent displays
- OpenGL ES 2.0/3.0/3.1, Vulkan, OpenCL 1.2

# VPU Feature Support

1080p60 VP9 Profile 0, 2 (10 bit) decoder (Hantro G2),

input video stream can be 10-bit, the output decoded

video is always 8-bit after post-processing in G2 core

1080p60 HEVC/H.265 decoder (Hantro G2)

1080p60 AVC/H.264 Baseline, Main, High decoder (Hantro

G1) 1080p60 VP8 decoder (Hantro G1)

The video encoding features include:

1080p60 AVC/H.264 Encoder

1080p60 HEVC/H.265 Encoder

# HDMI

HDMI 2.0a (2160p30)

# MIPI-DSI

1x MIPI-DSI 4 lanes

# Cameras

MIPI-CSI RX Interface

- Compatible with the MIPI Alliance Interface specification v1.0
- Up to 4 data lanes, 1.0Gbps maximum data rate per lane
- Supports MIPI-HS, MIPI-LP mode

# Specifications

# ● System Storage

1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

eMMC

16, 32, 64 or 128 GB (build option)

Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1

# ● SEMA® Board Controller

Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer

# ● Debug Header

30-pin multipurpose flat cable connector for use with optional DB-30 debug module

Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration

# ● Audio

Audio Codec

I2 S audio codec (located on carrier)

# ● Dual Ethernet

Primary LAN

MAC 10/100/1000 Ethernet Controller on SoC (TSN capable)

Secondary LAN

MAC 10/100/1000 Ethernet Controller on SoC

# ● Wireless Communication

Wi-Fi

IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN

Bluetooth

Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR)

# ● Expansion Busses

PCIe

2x PCIe x1 Gen3

USB

CT 2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG

ER 1x USB 3.0, 1x USB 2.0/OTG

UART

Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS)

CAN

2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

SPI

2x SPI

2x I2 S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

Four I2 C interfaces

\- Support for 7-bit and 10-bit address mode

\- Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

14x GPIO with interrupt, one GPIO with PWM

# ● Storage

1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

# . Power

Input

5Vdc +/- 5%

# ● Mechanical and Environmental

Form Factor

SGET SMARC Specifications 2.1

Dimensions

SMARC short size module 82 mm x 50 mm

Operating Temperature

Standard: 0°C to 60°C

Rugged: -40°C to 85°C (optional)

Humidity

10-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# Operating Systems

# ● Standard Support

● Yocto Linux BSP, Android, Windows 10 IoT

# ● Extended Support (BSP)

● VxWorks

# Ordering Information

● LEC-IMX8MP-Q-N-2G-32G-CT
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU , 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-Q-N-2G-32G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU , 2 GB LPDDR4, 32 GB eMMC, -40°C to 85°C
LEC-IMX8MP-Q-N-4G-32G-CT
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU, 4 GB LPDDR4 , 32 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-Q-N-4G-32G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU, 4 GB LPDDR4 , 32 GB eMMC, -40°C to 85°C
● LEC-IMX8MP-Q-2G-32G-CT
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 2 GB LPDDR4, 32 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-Q-2G-32G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 2 GB LPDDR4, 32 GB eMMC, -40°C to 85°C

● LEC-IMX8MP-Q-4G-32G-CT
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-Q-4G-32G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40°C to 85°C
● LEC-IMX8MP-QL-2G-16G-CT
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS Quadlite, 2GB LPDDR4 , 16 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-QL-2G-16G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS Quadlite, 2GB LPDDR4 , 16 GB eMMC, -40°C to 85°C
● LEC-IMX8MP-QL-2G-16G-C
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS Quadlite, 2GB LPDDR4 , 16 GB eMMC, 0°C to 60°C
● LEC-IMX8MP-QL-2G-16G-ER
SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS Quadlite, 2GB LPDDR4 , 16 GB eMMC, -40°C to 85°C

Block diagram
![The diagram illustrates the signal routing and connections for the **NXP i.MX 8M plus** processor.\n\n**Central Processor**\n*   **NXP i.MX 8M plus**\n\n**Left Column (External Signals) -) Middle Column (Intermediaries) -) Processor Connections**\n\n*   **LVDS0 / DSI0** connects to **MIPI MUX**, which connects to **LVDS0** and **DSIO** on the processor.\n*   **LVDS1** connects directly to **LVDS1** on the processor.\n*   **HDMI** connects directly to **HDMI 2.0a** on the processor.\n*   **CSI0** and **CSI1** connect directly to **MIPI CSI 2-lanes** and **MIPI CSI 4-lanes** on the processor.\n*   **USB0** and **USB1** connect to **USB HUB** (**2x USB 3.0/2.0** / **3x USB 2.0**), which connects to **USB1 2.0 (OTG)** on the processor.\n*   **USB2**, **USB3**, **USB4**, and **USB5** connect to **USB HUB**, which connects to **USB2 3.0 (Host)** on the processor.\n*   **GbE0** and **GbE1** connect to **LAN PHY**, which connects to **RGMII0** and **RGMII1** on the processor.\n*   **PCIeA** and **PCIeB** connect to **PCIe Switch**, which connects to **1x PCIe x1** on the processor.\n*   **CAN0** and **CAN1** connect directly to **CAN0** and **CAN1** on the processor.\n*   **SPI0** and **SPI1** connect directly to **ECSP1** and **ECSP2** on the processor.\n*   **UART0**, **UART1**, and **UART2** connect to **UART2**, **UART3**, and **UART4** on the processor.\n*   **I2S0** connects directly to **I2S0** on the processor.\n*   **SDIO** connects to **SDHC2** on the processor.\n*   **I2C_PM**, **I2C_GP**, **I2C_LCD**, **I2C_CAM0**, and **I2C_CAM1** connect to **PMIC**, which connects to **I2C1**, **I2C2**, and **I2C3** on the processor.\n*   **GPIO** connects to **GPIO Expander1**, **GPIO Expander2**, and **LITE BMC**. These expanders connect to **I2C4**, **I2C5**, and **I2C6** on the processor.\n    *   **GPIO Expander1** connects to **TPM** and **Crypto Auth. ATECC608A**.\n    *   **GPIO Expander2** connects to **RTC** and **PCIe CLK**.\n\n**Right Column (External Memories/Peripherals) -) Processor Connections**\n\n*   **LPDDR4 x32** connects to **DRAM** on the processor.\n*   **eMMC 5.1** connects to **SDHC3** on the processor.\n*   **Wifi/BT** connects to **UART1**, **SDIO0**, and **PCM** on the processor.\n*   **30-pin debug** connects to the processor.\n\n**Additional Text in Processor Block**\n*   **USB configuration for ER parts**\n*   **USB0 USB2.0/OTG**\n*   **USB2 USB3.0**\n*   **No USB HUB**](.lec-imx8mp-datasheet-241101/43c15ca20aec3e393988a3084cd1b91dd495a866f38570827d4402b4a427e7a2.jpg)
[🔗 Link to the original document](.lec-imx8mp-datasheet-241101/lec-imx8mp-datasheet-241101.pdf)