# LEC-IMX95

SMARC 2.1 Short Size Module with NXP® i.MX95 Series

![The image displays a blue, horizontally-oriented oval shape containing the word 'Preliminary' written in white, slanted capital letters. The oval has a thin white border. At the bottom right edge, a small portion of another graphic is visible, showing what appears to be part of a yellow circle and some blue squares.](.lec-imx95-prelim-datasheet-250820/7014d79a2e600b83b1490dd7edbc45031428fcdbdd97cc4ef55317efe3151cfe.jpg)

![Close-up of a blue printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-imx95-prelim-datasheet-250820/2068cf8378ccfcb151a6bd50756473cfed8bb33c24acc2ef7f6102ae89e52cca.jpg)

# Features

• i.MX95 series with 2/4/6-core Arm Cortex-A55
• 1x Arm Cortex-M7 core + 1x Arm Cortex-M33 core
• In-SoC eIQ® Neutron NPU, up to 2.0 TOPS
• SMARC Revision 2.1 compliant
• LVDS, DSI, HDMI graphics output (BOM option)
• Rugged operating temperature option: -40°C to 85°C

• Dual CAN bus
• 2x GbE ports, 1x 10GbE port (optional)
• USB2 / USB3.2 Gen1 interfaces
• I2C audio codec interface
• 15 year product availability

# Specifications

<table><tr><td rowspan="4">Processor &amp; System</td><td>SoC</td><td>NXP i.MX 95 series with 2/4/6-core Arm Cortex-A551x Arm Cortex-M7 on flex domain1x Arm-M33 on low-power real-time domainTrustZone technology supporting Arm v8 Cryptography ExtensionsNeural Processing Unit, 2 TOPS</td></tr><tr><td>Memory</td><td>2,4,8 GB LPDDR5</td></tr><tr><td>L2 Cache</td><td>Per core: 32KB I-Cache, 32KB D-Cache, 64KB L2 CacheUnified: 512KB L3 Cache</td></tr><tr><td>Security</td><td>Cryptography ServicesMultiple key storage and user supportKey Type: AES-128/192/256, ECC 256/384Key Import/Creation/Derivation/Update/DeletionSCA-hardened Asymmetric Public Key Cryptography: RSA up to 4096; Elliptic Curve up to P-512 w/NIST curves; Brainpool P-512, P-384SCA-hardened Symmetric Cryptography: AES-128/192/256 Modes: GCM, ECB, CBC, CTR, CCM, XCBC-MAC, KTS (256)</td></tr><tr><td rowspan="7">Video</td><td>GPU Core</td><td>Arm® MaliTM G310</td></tr><tr><td>GPU Feature Support</td><td>Arm Mali-G310 GPU3D GPU supporting 50 GFLOPs, OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0</td></tr><tr><td>VPU Feature Support</td><td>4Kp30 H.265 and H.264 encode and decode1x JPEG Encoder, 1x JPEG Decoder</td></tr><tr><td>HDMI</td><td>HDMI 2.0a (BOM option)</td></tr><tr><td>MIPI DSI</td><td>1x MIPI DSI 4 lanes</td></tr><tr><td>LVDS</td><td>Dual-channel LVDS port 18/24 bit</td></tr><tr><td>Camera</td><td>MIPI CSI RX interfaceCompatible with MIPI Alliance Interface specification v1.0Up to 4 data lanes, 1.0Gbps maximum data rate per laneSupports MIPI-HS, MIPI-LP mode</td></tr></table>

Specifications

<table><tr><td rowspan="2">System Storage</td><td>SDIO</td><td>1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0</td></tr><tr><td>eMMC</td><td>32, 64,128 or 256 GB (build option)Compatible with eMMC specification 4.41, 4.51, 5.0, and 5.1</td></tr><tr><td>SEMA® Board Controller</td><td colspan="2">Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, I2C Bus Control, GPIO Control, Watchdog Timer</td></tr><tr><td>Debug Header</td><td colspan="2">30-pin multipurpose flat cable connector for use with optional DB-30 debug module Provides JTAG, UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration</td></tr><tr><td>Audio</td><td>Audio Codec</td><td>I2S or SWD audio codec located on carrier</td></tr><tr><td rowspan="2">Dual Ethernet</td><td>1st &amp; 2nd LAN</td><td>MAC 10/100/1000 Ethernet port with Time Sensitive Networking</td></tr><tr><td>Tertiary LAN (optional)</td><td>10 Gbps Ethernet port with Time Sensitive Networking</td></tr><tr><td rowspan="2">Wireless</td><td>Wi-Fi</td><td>IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN (BOM option)</td></tr><tr><td>Bluetooth</td><td>Bluetooth 5.0 compliant with Bluetooth 2.1+Enhanced Data Rate (EDR)</td></tr><tr><td rowspan="8">Extension Busses</td><td>USB</td><td>2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG</td></tr><tr><td>UART</td><td>4x UART interfaces SER1,2 (CTS/RTS) / SER0,3 (TX/RX/CTS/RTS)</td></tr><tr><td>CAN</td><td>2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps</td></tr><tr><td>SPI</td><td>2x SPI</td></tr><tr><td>I2S</td><td>1x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)</td></tr><tr><td>I2C</td><td>4x I2C interfaces - Support for 7-bit and 10-bit address mode - Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 Kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus</td></tr><tr><td>GPIO</td><td>14x GPIO with interrupt, one GPIO with PWM</td></tr><tr><td>PCIe</td><td>2x PCIe x1 Gen3</td></tr><tr><td>Power</td><td>Input</td><td>5Vdc +/- 5%</td></tr><tr><td rowspan="6">Mechanical and Environmental</td><td>Form Factor</td><td>SGET SMARC Specifications 2.1</td></tr><tr><td>Dimension</td><td>SMARC short size module 82 mm x 50 mm</td></tr><tr><td>Operating Temperature</td><td>Standard: 0°C to 60°C Rugged: -40°C to 85°C (optional)</td></tr><tr><td>Humidity</td><td>5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration</td><td>IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT</td><td>Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td rowspan="2">Operating Systems</td><td>Standard Support</td><td>Yocto Linux BSP, Android</td></tr><tr><td>Extended Support (BSP)</td><td>VxWorks</td></tr></table>

Ordering Information

<table><tr><td>Part name</td><td>Description/Configuration</td></tr><tr><td>LEC-IMX95-H-4G-32G-CT</td><td>SMARC 2.1 Short Size Module with Hexa core NXP i.MX 95, 4GB LPDDR5, 32GB eMMC, 0°C to 60°C</td></tr><tr><td>LEC-IMX95-H-4G-32G-ER</td><td>SMARC 2.1 Short Size Module with Hexa core NXP i. MX 95, 4GB LPDDR5, 32GB eMMC, -40°C to 85°C</td></tr></table>

Block diagram

![Based on the provided flowchart/block diagram, here are the labeled blocks and connections:\n\n**Labeled Blocks**\n\n*   **Left Column (External Interfaces):**\n    *   LVDS 1\n    *   LVDS 0 / DSI\n    *   HDMI\n    *   CSIO\n    *   CSI1\n    *   LAN0\n    *   LAN1\n    *   PCleA Gen3 x1\n    *   PCleB Gen3 x1\n    *   USB0 2.0(OTG)\n    *   USB1 2.0\n    *   USB4 2.0\n    *   USB5 2.0\n    *   USB2 3.0 gen1\n    *   USB3 3.0 gen1\n    *   CAN0\n    *   CAN1\n    *   SDIO\n    *   I2S\n    *   14x GPIO\n    *   3x I2C\n    *   SPI0\n    *   SPI1\n    *   SER 0,1,2,3\n    *   PCIe_D\n\n*   **Intermediary Components:**\n    *   DSI to HDMI\n    *   RTL8211 (appears twice, stacked vertically)\n    *   BOM OPTION to CSIO 2L or DSI\n    *   Standard CSI1 4L\n    *   5 port HUB\n    *   MUX\n    *   MCU STM32451\n    *   SER0/2: 4-wire, SER1/3: 2-wire\n    *   SER2 shared with SPI1\n\n*   **Center Column (SoC - i.MX95):**\n    *   i.MX95 (Main Block)\n    *   6X A55 1X M7 1X M33 (Top Inner Block)\n    *   elQ Neutron NPU (Bottom Inner Block)\n    *   **SoC Interface Labels (Left Edge):** LVDS1, LVDS0, DSI/CSIO, CSI1, RGMii (x2), PCle Gen 3 (x2), USB 2.0, USB 3.0 Gen1, CAN (x2), SDIO, I2S, GPIO, I2C, SPI, SPI/UART, UART, 10GBe SERDES\n\n*   **Right Column (Memory & Peripherals):**\n    *   LPDDR5 x32\n    *   eMMC 32~256 GB\n    *   QSPI\n    *   TPM 2.0\n    *   AW-CM276NF WIFI / BT\n    *   PMIC PF0900\n    *   PMIC PF5301\n    *   PMIC PF5302\n    *   DB30 -JTAG\n    *   EEPROM\n    *   **Right Side Connection Labels:** SPI, I2C, SDIO(wifi), UART(bt), PCIe(shared port 8), USB (shared port)\n\n**Connections**\n\n*   **LVDS/DSI:**\n    *   LVDS 1 connects to LVDS1.\n    *   LVDS 0 / DSI connects to LVDS0.\n    *   HDMI connects to **DSI to HDMI**, which connects to DSI/CSIO.\n    *   CSIO connects via a dashed line labeled **BOM OPTION to CSIO 2L or DSI** to DSI/CSIO.\n    *   CSI1 connects via the label **Standard CSI1 4L** to CSI1.\n\n*   **LAN:**\n    *   LAN0 connects to the top **RTL8211**, which connects to RGMii.\n    *   LAN1 connects to the bottom **RTL8211**, which connects to RGMii.\n\n*   **PCIe:**\n    *   PCleA Gen3 x1 connects to PCle Gen 3.\n    *   PCleB Gen3 x1 connects to PCle Gen 3.\n    *   PCIe_D connects to 10GBe SERDES.\n\n*   **USB:**\n    *   USB0 2.0(OTG), USB1 2.0, USB4 2.0, and USB5 2.0 connect to the **5 port HUB**.\n    *   USB 2.0 (from SoC) connects to **MUX**, which connects to the **5 port HUB**.\n    *   USB2 3.0 gen1 and USB3 3.0 gen1 connect to USB 3.0 Gen1.\n\n*   **CAN:**\n    *   CAN0 and CAN1 connect to CAN.\n\n*   **Other Left-Side Interfaces:**\n    *   SDIO connects to SDIO.\n    *   I2S connects to I2S.\n    *   14x GPIO connects to GPIO and to the **MCU STM32451**.\n    *   3x I2C connects to I2C.\n    *   SPI0 and SPI1 connect to SPI.\n    *   SER 0,1,2,3 connects to SPI/UART (accompanied by labels: **SER0/2: 4-wire, SER1/3: 2-wire** and **SER2 shared with SPI1**).\n\n*   **Right-Side Connections:**\n    *   LPDDR5 x32 connects to the **6X A55 1X M7 1X M33** block.\n    *   eMMC 32~256 GB connects to the **6X A55 1X M7 1X M33** block.\n    *   QSPI connects via the SPI line.\n    *   TPM 2.0 connects via the I2C line.\n    *   AW-CM276NF WIFI / BT connects via SDIO(wifi), UART(bt), PCIe(shared port 8), and USB (shared port).\n    *   PMIC PF0900, PMIC PF5301, and PMIC PF5302 connect via I2C lines.\n    *   DB30 -JTAG connects via the SPI/UART line.\n    *   EEPROM connects via the I2C line.](.lec-imx95-prelim-datasheet-250820/12646431276edb6addd0de57b06b12e08bd7108d5c5be44f28c912d5f907db32.jpg)
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