# LEC-PX30

# SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35

# Features

● Rockchip PX30 with Quad-core ARM Cortex-A35
● Cryptography Extensions for end-to-end IoT security
3D Graphics over MIPI DSI 4 lanes or LVDS 24-bit
Camera MIPI CSI 4 lanes
2x 10/100Mbps LAN, 4x USB 2.0 + USB 2.0 OTG
● Optional Rugged operating temperature support: -20°C to 85°C
10 year product availability

![Close-up of a blue printed circuit board with multiple integrated circuits and gold contacts (no readable text or symbols)](.lec-px30-datasheet-20210122/b56df9f4ad6aa1454e8eec260c6ac498d0c64eb259b9a077b36b5ff79637b8a0.jpg)

# Specifications

# ● Core System

#

Rockchip PX30 with Quad-core ARM Cortex-A35 CPU TrustZone technology support ARMv8 Cryptography Extensions”

# Memory

1GB or 2GB DDR3L at 1066/1333 MHz, memory down (non ECC)

# L2 Cache

256KB unified system L2 cache

# IoT security

Cryptographic co-processor with secure hardware-based key storage for sign-verify authentication provides Internet of Things (IoT) Protected Storage for up to 16 keys, certificates or data

ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman NIST standard P256 elliptic curve support

SHA-256 & HMAC hash including off-chip context save/restore AES-128: encrypt/decrypt, galois field multiply for GCM”

# . Video

# GPU Feature Support

GPU Core: Mali-G31

Supports DirectX 11 FL9\_3, OpenGLES 1.1/ 2.0 / 3.2, Vulkan 1.0, OpenCL 2.0 Full Profile

Video decoding:

H.264 up to 1080p@60fps, H.265/HEVC up to 1080p@60fps

MPEG-4, ISO/IEC 14496-2, SP@L0-3, ASP@L0-5, up to 1080p@60fps

VP8, up to 1080p@60fps

Video Encoding:

H.264 video encoder at BP/MP/HP@level 4.2

1920x1080@30fps, 1x 1080p@30fps or 2x 720p@30fps encoding

# MIPI DSI

MIPI DSI 4 lanes at max. 1080p@60fps display output (default)

# LVDS

LVDS single channel 24-bit at max. 1280x800@60fps (build option)

# Camera

MIPI CSI RX Interface

\- Compatible with the MIPI Alliance Interface specification v1.0

\- Up to 4 data lanes, 1.0Gbps maximum data rate per lane

\- Supports MIPI-HS, MIPI-LP mode

# . ● Audio

# Audio Codec

Supports ES8316 codec for high performance and low power multi-bit deltasigma audio ADC and DAC (located on carrier)

# ● Dual Ethernet

# Primary LAN

MAC 10/100 Ethernet Controller on SoC

Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex

# Secondary LAN

MAC/PHY 10/100 Ethernet Controller on LAN9514 via USB 2.0

Supports 10/100-Mbps data transfer rates, both full-duplex and half-duplex

# ● Extension busses

# USB

4x USB 2.0, 1x USB OTG

# UART

Two UART interfaces SER0 and SER2 (TX/X/CTS/RTS)

64-byte FIFO and support for 5-bit, 6-bit, 7-bit, 8-bit data transmit or receive

# CAN bus

Supports CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

# SPI

2x SPI (one occupied by SPI-to-CAN controller )

# I 2 S

2x I2 S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

#

Four I2 C interfaces

\- Support for 7-bit and 10-bit address mode

\- Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

# GPIO

12x GPIO with interrupt, one GPIO with PWM

# Specifications

# ● System Storage

SDIO

1x SDIO (4-bit) compatible with SD3.0, MMC ver. 4.51

eMMC

16, 32 or 64 GB (build option)

Compatible with eMMC specification 4.41, 4.51, 5.0 and 5.1

# ● SEMA® Board Controller

Voltage/current monitoring, boot configuration, logistics and forensic information, flat panel control, watchdog timer

# ● Debug Header

30-pin multipurpose flat cable connector for use with optional DB-30 debug module

Provides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration

# ● Mechanical and Environmental

Form Factor

SGET SMARC Specifications v2.0

Dimension

SMARC short size module, 82mm x 50mm

Operating Temperature

Standard: 0°C to +60°C

Rugged: -20°C to +85°C (optional)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I,

Condition A and Method 214A, Table 214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

# ● Operating Systems

Standard Support

Yocto Linux BSP, Debian Linux

Extended Support (BSP)

Android 8.1 (by request)

Functional Diagram
![**Central Processor**\n*   **Rockchip PX-30** (containing **Quad-core Cortex A35**)\n\n**Right-Side Components (Memory & Peripherals)**\n*   Four **Memory DDR3L x16** blocks connected to the Rockchip.\n*   **eMMC 8/16/32/64 optional** block connected via dashed line.\n*   **30-pin Debug Connector** block connected to the Rockchip.\n*   **RTC** block connected to the Rockchip.\n*   **Lite BMC** block connected to the Rockchip and RTC.\n*   **Watchdog / Boot Select / Power Management** connects the Lite BMC to the 314-pin Edge Connector.\n\n**Left-Side Interface (314-pin Edge Connector)**\n*   **314-pin Edge Connector** (Vertical block on the far left).\n\n**Connections to 314-pin Edge Connector**\n*   **single channel LVDS 24-bit or MIPI DSI 4 lanes**\n*   **MIPI CSI Camera, 4 lanes** (Input to Rockchip)\n*   **SDIO (4-bit)**\n*   **USB 2.0 OTG**\n*   **LAN 10/100**\n*   **1x USB 2.0** (four instances)\n*   **100Mbps**\n*   **CAN+FD**\n*   **1x SPI** (two instances)\n*   **2x UART (2x 4)** (Input to Rockchip)\n*   **2x I2S** (Input to Rockchip)\n*   **10x GPIO** (Input to Rockchip)\n*   **I2C_PM**\n*   **I2C_GP**\n\n**Intermediate/Hub Blocks**\n*   **LAN + USB Hub**: Connects **LAN 10/100** and four **1x USB 2.0** lines (from Edge Connector) to the Rockchip via **USB 2.0**.\n*   **LAN PHY**: Connects **100Mbps** (from Edge Connector) to the Rockchip via **RGMII**.\n*   **SPI-to-CAN**: Connects **CAN+FD** and **1x SPI** (from Edge Connector) to the Rockchip via **1x SPI**.\n*   **PMIC**: Connected via **I2C_PM**.\n*   **Crypto**: Connected via **I2C_GP**.](.lec-px30-datasheet-20210122/39986310f88f2c55c409aab5da377805bef8529df07f704b2f79f5820e17dbf5.jpg)

# Ordering Information

● LEC-PX30-Q-1G-16G-R
SMARC module with Rockchip PX30K Quad, with 1GB DDR3L and 16 GB eMMC, -20°C to 85°C
● LEC-PX30-Q-2G-16G-R
SMARC module with Rockchip PX30K Quad, with 2GB DDR3L and 16 GB eMMC, -20°C to 85°C
● LEC-PX30-Q-4G-32G-R
SMARC module with Rockchip PX30K Quad, with 4GB DDR3L and 32 GB eMMC, -20°C to 85°C
● LEC-PX30-Q-1G-0G-CT
SMARC module with Rockchip PX30 Quad, with 1GB DDR3L, 0°C to 60°C
● LEC-PX30-Q-1G-16G-CT
SMARC module with Rockchip PX30 Quad, with 1GB DDR3L and 16 GB eMMC, 0°C to 60°C
● LEC-PX30-Q-2G-16G-CT
SMARC module with Rockchip PX30 Quad, with 2GB DDR3L and 16 GB eMMC, 0°C to 60°C
● LEC-PX30-Q-2G-0G-CT
SMARC module with Rockchip PX30 Quad, with 2GB DDR3L and 0 GB eMMC, 0°C to 60°C
● LEC-PX30-Q-4G-32G-CT
SMARC module with Rockchip PX30 Quad, with 4GB DDR3L and 32 GB eMMC, 0°C to 60°C

# Accessories

# Heat Solutions

● HTS-SPX30
Heat spreader for LEC-PX30
● THS-SPX30
Low profile heatsink for LEC-PX30

# Starter Kit

● I-Pi SMARC PX30
Rapid sensor prototyping kit based on MRAA standard
[🔗 Link to the original document](.lec-px30-datasheet-20210122/lec-px30-datasheet-20210122.pdf)