# LEC-RB5

# SMARC 2.1 Short Size Module with

# Qualcomm® QRB5165 SoC

![Close-up of a blue printed circuit board with various electronic components and gold contacts (no visible text or symbols)](.lec-rb5-datasheet-20230511/1a0ab8b43e2eee1377d3d676e9b1215d05dd558a59a3c36377adf985f441c221.jpg)

# Features

• 8-core Qualcomm® Kryo™ 585 CPU (Arm Cortex-A77)
• 15 TOPS NPU
• SMARC revision 2.1.1 compliant
• Up to 8GB POP LPDDR4 at 4266 MT/s
• DSI up to 1080P
• HDMI up to 4K/60

• 1x onboard UFS up to 256 GB
• Dual GbE ports
• 6x CSI interfaces
• USB3/USB2 interfaces
• 10 year product availability

Specifications

<table><tr><td rowspan="4">Processor &amp; System</td><td>CPU</td><td>KryoTM 585 Octa-core CPU: 1 Kryo Gold Prime @ 2.84 GHZ + 3 Kryo Gold @ 2.42 GHz + 4 Kryo Silver @ 1.81 GHz</td></tr><tr><td>Memory</td><td>4 or 8 GB POP LPDDR4L-4266</td></tr><tr><td>Cache</td><td>Gold Prime core 512 KBGold core 256 KBSilver core 128 KB</td></tr><tr><td>Security</td><td>Qualcomm Secure Processing UnitTPM 2.0 module</td></tr><tr><td rowspan="4">Video</td><td>GPU Core</td><td>AdrenoTM GPU 650, Fmax at 587 MHz – 4K 60 fps or 2X 2K 60 fps</td></tr><tr><td>GPU Feature Support</td><td>OpenGL ES 3.2, Vulkan 1.1, DX12 FL 12_1OpenCL 2.0 full profileSupport for DirectX 12, OpenGL 4.2, OpenCL 1.2 Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9Video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MV</td></tr><tr><td>HDMI</td><td>HDMI 2.0b 4K@60 Hz</td></tr><tr><td>DSI</td><td>4 Lane DSI,Maximum resolution 1K p60 with 24-bit RGB</td></tr><tr><td rowspan="2">System Storage</td><td>SDIO</td><td>1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0</td></tr><tr><td>UFS</td><td>32, 64,128 or 256 GB (build option)Compatible with UFS gear 2.1 or 3.0</td></tr></table>

Specifications

<table><tr><td>SEMA® Board Controller</td><td colspan="2">Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, I2C Bus Control, GPIO Control, Watchdog Timer</td></tr><tr><td>Debug Header</td><td colspan="2">30-pin multipurpose flat cable connector for use with optional DB-30 debug moduleProvides JTAG, BMC access; UART, power testpoints; diagnostic LEDs, Power, Reset, Boot configuration</td></tr><tr><td>Audio</td><td>Audio Codec</td><td>I2S or SWD audio codec located on carrier</td></tr><tr><td rowspan="2">Dual Ethernet</td><td>Primary LAN</td><td>10/100/1000 Mbits Ethernet</td></tr><tr><td>Secondary LAN</td><td>10/100/1000 Mbits Ethernet</td></tr><tr><td rowspan="2">Wireless</td><td>Wi-Fi</td><td>IEEE 802.11 2X2 MU-MIMO ac/a/b/g/n</td></tr><tr><td>Bluetooth</td><td>Bluetooth 5.0</td></tr><tr><td rowspan="8">Extension Busses</td><td>USB</td><td>2x USB 3.0, 4x USB 2.0</td></tr><tr><td>UART</td><td>Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS)</td></tr><tr><td>CAN</td><td>1x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps</td></tr><tr><td>SPI</td><td>2x SPI</td></tr><tr><td>I2S</td><td>1x I2S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)</td></tr><tr><td>I2C</td><td>Three I2C interfaces- Support for 7-bit and 10-bit address mode- Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 Kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus</td></tr><tr><td>GPIO</td><td>14x GPIO with interrupt, one GPIO with PWM</td></tr><tr><td>PCIe</td><td>2x PCIe x2 Gen3</td></tr><tr><td>Power</td><td>Input</td><td>5Vdc +/- 5%</td></tr><tr><td rowspan="6" colspan="2">Mechanical and Environmental Form Factor</td><td>SGET SMARC Specifications 2.1</td></tr><tr><td>Dimension SMARC short size module 82 mm x 50 mm</td></tr><tr><td>Operating Temperature Standard: 0°C to 60°CRugged: -20°C to 85°C (optional)</td></tr><tr><td>Humidity 5-90% RH operating, non-condensing5-95% RH storage (and operating with conformal coating)</td></tr><tr><td>Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-Condition A and Method 214A, Table 214-I, Condition D</td></tr><tr><td>HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test</td></tr><tr><td rowspan="2">Operating Systems</td><td>Standard Support</td><td>Canonical UbuntuYocto Linux</td></tr><tr><td>Extended Support (BSP)</td><td></td></tr></table>

Ordering Information

<table><tr><td>Part name</td><td>Description/Configuration</td></tr><tr><td>LEC-RB5-4G-64G-ER</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 4 GB LPDDR4, 64 GB UFS, -20°C to 85°C</td></tr><tr><td>LEC-RB5-4G-128G-ER</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 4 GB LPDDR4, 128 GB UFS, -20°C to 85°C</td></tr><tr><td>LEC-RB5-8G-128G-ER</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 8 GB LPDDR4, 128 GB UFS, -20°C to 85°C</td></tr><tr><td>LEC-RB5-8G-256G-ER</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 8 GB LPDDR4, 256 GB UFS, -20°C to 85°C</td></tr><tr><td>LEC-RB5-4G-64G-CT</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 4 GB LPDDR4, 64 GB UFS, 0°C to 60°C</td></tr><tr><td>LEC-RB5-4G-128G-CT</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 4 GB LPDDR4, 128 GB UFS, 0°C to 60°C</td></tr><tr><td>LEC-RB5-8G-128G-CT</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 8 GB LPDDR4, 128 GB UFS, 0°C to 60°C</td></tr><tr><td>LEC-RB5-8G-256G-CT</td><td>SMARC 2.1 Short Size Module with Octo core QRB5165, 8 GB LPDDR4, 256 GB UFS, 0°C to 60°C</td></tr></table>

Block diagram

![The diagram illustrates the connectivity of a central system-on-chip, **QRB5165**, with various external interfaces and intermediate components.\n\n**Central Block:**\n*   **QRB5165** (Large pink rectangle)\n    *   Contains **LPDDR4 4GB/8GB POP** (Orange box inside).\n\n**Left Side Connections (External Interfaces to SoC):**\n*   **HDMI** connects to **DSI2HDMI LT9611UXC**, which connects to **DSI0**.\n*   **DSI0** (SoC pin) connects to **Mipi switch**.\n*   **DSI1** (SoC pin) connects to **Mipi switch**.\n*   **DSI0** (External label) connects directly to **DSI0** (SoC pin).\n*   **CSI0** connects to **CSI0 /2L**.\n*   **CSI1** connects to **CSI1 /4L**.\n*   **PCIE Port 0** and **PCIE Port 1** connect to **PCIE_1 GEN3**.\n*   **PCIE Port 2** and **PCIE Port 3** connect to **PCIE_2 GEN3**.\n*   **Ethernet 0** and **Ethernet 1** connect to **LAN7800** blocks, which connect to the **USB HUB Microchip USB5807T/KD**.\n*   **USB2- Port1**, **USB2- Port 4,5**, and **USB3- Port 2,3** connect to **USB1 / 3.1 SS**.\n*   **USB0_OTG** connects to **USB0**.\n*   **SER0** connects to **UART1 / 4W**.\n*   **SER1** connects to **UART3 / 2W**.\n*   **SER2** connects to **UART2 / 4W**.\n*   **SD/SDIO** connects to **SDIO_3.0**.\n*   **SPI 0** and **SPI 1** connect to **SPI_0** and **SPI_1**.\n*   **CAN** connects to **CAN FD MCP2518FDT**, which connects via dashed lines to **SPI 0** / **SPI 1**.\n*   **GPIO x14** connects to **GPIO**.\n*   **I2S_SND** connects to **i2S / SoundWire**.\n*   **I2C x2** connects to **I2C_2/_3**.\n\n**Right Side Connections (SoC to External):**\n*   **Vision connect** connects to **CS12_4L**, **CS13_4L**, **CS14_4L**, and **CS15_4L**.\n*   **USB**, **PCIE**, and **Uart** connect to **BT/Wi-Fi M.2_1216 build option**.\n*   **UFS** connects to **UFS 64/128/256 GB**.\n*   A dashed line connects to **Debug port/console**.\n*   **I2C** connects to **BMC_Lite**.](.lec-rb5-datasheet-20230511/e73d96e129606ecec2292269352ccb3522fcd498c0c08f5a09387443cff1290c.jpg)
[🔗 Link to the original document](.lec-rb5-datasheet-20230511/lec-rb5-datasheet-20230511.pdf)